108975459/HC006A6A1-S - GE CRITICAL POWER

Data Sheet

October 5, 2009

HC006/010 Series DC-DC Converter Power Modules:

18-36Vdc Input; 3.3V-5Vdc Output; 6.6A-10A Output Current

* UL is a registered trademark of Underwriters Laboratories, Inc.

† CSA is a registered trademark of Canadian Standards Association.

‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

** ISO is a registered trademark of the International Organization of Standards

Document No: DS03-122 ver. 1.45

PDF name: hc006-010_series_ds.pdf

Applications

 Wireless Networks

 Distributed power architectures

 Optical and Access Network Equipment

 Enterprise Networks

 Latest generation IC’s (DSP, FPGA, ASIC)

and Microprocessor powered applications

Options

 Remote On/Off logic (positive or negative)

 Surface Mount (-S Suffix)

 Trimmed leads

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Compliant to ROHS EU Directive 2002/95/EC with

lead solder exemption (non-Z versions)

 Delivers up to 10A Output current

5V (6.6A), 3.3V (10A)

 High efficiency – 90% at 3.3V full load

 Low Output voltage- supports migration to future IC

supply voltages down to 1.0V

 Low output ripple and noise

 Small Size and low profile

47.2mm x 29.5mm x 8.5mm

(1.86 x 1.16 x 0.335 in)

 Surface mount or Through hole (TH)

 Remote On/Off

 Output overcurrent/Over voltage protection

 Over temperature protection

 Single Tightly regulated output

 Output voltage adjustment trim ±10%

 Wide operating temperature range (-40°C to 85°C)

 Meets the voltage insulation requirements for ETSI

300-132-2 and complies with and is Licensed for

Basic Insulation rating per EN 60950

 CE mark meets 73/23/EEC and 93/68/EEC

directives§

 UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-

03 Certified, and VDE‡ 0805:2001-12 (EN60950-1)

Licensed

 ISO** 9001 and ISO 14001 certified manufacturing

facilities

Description

The HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36

Vdc and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity

configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 90%

3.3/10A, 91% at 5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These

open frame modules are available either in surface-mount (-S) or in through-hole form.

RoHS Compliant

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 2

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are

absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in

excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for

extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage All VIN -0.3 50 Vdc

Operating Ambient Temperature All TA -40 85 °C

(see Thermal Considerations section)

Storage Temperature All Tstg -55 125 °C

I/O Isolation Voltage (100% factory tested) All ⎯ ⎯ 1500 Vdc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage HC VIN 18 24 36 Vdc

Maximum Input Current HC IIN,max 3.2 Adc

(VIN=0V to 75V, IO=IO, max)

Inrush Transient All I2t 1 A2s

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 12μH source impedance; VIN=0V to

75V, IO= IOmax ; see Figure 9)

All 3 mAp-p

Input Ripple Rejection (120Hz) All 50 dB

EMC, EN55022 See EMC Considerations section

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an

integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,

however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies

require a fast-acting fuse with a maximum rating of 5A (see Safety Considerations section). Based on the information

provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating

can be used. Refer to the fuse manufacturer’s data sheet for further information.

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 3

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Output Voltage Set-point 3.3V VO, set 3.25 3.3 3.35 Vdc

(VIN=VIN,nom, IO=IO, max, Tref=25°C) 5.0V VO, set 4.92 5.0 5.08 Vdc

Output Voltage All VO -3.0 ⎯ +3.0 % VO, set

(Over all operating input voltage, resistive load,

and temperature conditions until end of life)

Adjustment Range All VO -10.0 +10.0 % VO, set

Selected by external resistor

Output Regulation

Line (VIN=VIN, min to VIN, max) All

⎯ ⎯ 0.1 % VO, set

Load (IO=IO, min to IO, max) All

⎯ ⎯ 10 mV

Temperature (Tref=TA, min to TA, max) All

⎯ 0.2 ⎯ % VO, set

Output Ripple and Noise on nominal output

(VIN=VIN, nom and IO=IO, min to IO, max)

Measured across 10μF tantalum//1μF ceramic

RMS (5Hz to 20MHz bandwidth) All ⎯ 8 20 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidth) All ⎯ 40 75 mVpk-pk

External Load Capacitance 3.3V CO, max 0 ⎯ 1000 μF

5.0V CO, max 0 ⎯ 470 μF

Output Current 3.3V Io 0.05 10 Adc

5.0V Io 0.05 6.6 Adc

(At Io < Io,min the output ripple may exceed the

The max specifications. All modules shall

Operate at no load without damage and without

exceeding 100% of VO, set )

Output Current Limit Inception 3.3V IO, lim ⎯ 12 ⎯ Adc

(Vo = 90% of VO, set) 5.0V IO, lim ⎯ 8 ⎯ Adc

Output Short-Circuit Current 3.3V IO, s/c ⎯ 17 ⎯ Adc

(VO≤250mV) 5.0V IO, s/c ⎯ 13 ⎯ Adc

Efficiency 3.3V η ⎯ 90.0 ⎯ %

VIN=VIN, nom, TA=25°C 5.0V η ⎯ 91.0 ⎯ %

IO=IO, max , VO= VO,set

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 4

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Switching Frequency All fsw ⎯ 285 ⎯ kHz

Dynamic Load Response

(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)

Load Change from Io= 50% to 75% of Io,max

Peak Deviation Vpk ⎯ 200 ⎯ mV

Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs

(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)

Load Change from Io= 75% to 50% of Io,max

Peak Deviation All Vpk ⎯ 200 ⎯ mV

Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs

Isolation Specifications

Parameter Symbol Min Typ Max Unit

Isolation Capacitance Ciso ⎯ 1000 ⎯ pF

Isolation Resistance Riso 10 ⎯ ⎯ MΩ

General Specifications

Parameter Min Typ Max Unit

Calculated MTBF (for HC010A0F1 in accordance with Lucent RIN:

IO=80% of IO, max, TA=25°C, airflow=1m/s) > TBD Hours

Weight ⎯ 13 (0.46) Weight ⎯

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 5

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=VIN, min to VIN, max ; open collector or equivalent,

Signal referenced to VIN- terminal)

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low Specification

Remote On/Off Current – Logic Low All Ion/off ⎯ 0.15 1.0 mA

On/Off Voltage:

Logic Low All Von/off -0.7 ⎯ 1.2 V

Logic High – (Typ = Open Collector) All Von/off ⎯ 15 V

Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 50 μA

Turn-On Delay and Rise Times

(VIN=VIN, nom, IO=IO, max , VO to within ±1% of steady state)

Case 1: On/Off input is set to Logic high and then

input power is applied (delay from instant at

which VI = VI,min until Vo = 10% of Vo, set)

All Tdelay 20 msec

Case 2: Input power is applied for at least one second

and then the On/Off input is set to logic high (delay

from instant at which Von/Off = 0.9V until Vo = 10% of

Vo, set)

All Tdelay 12 msec

Output voltage Rise time (time for Vo to rise from

10% of Vo, set to 90% of Vo, set) All

Trise ― 5 ― msec

Output voltage overshoot

(VIN=VIN, nom, Io = 80% of Io,max, TA=25°C) All ― ― 5

%VO,

set

Output Overvoltage Protection 3.3V VO, limit ⎯ 4.0 4.6 V

5.0V VO, limit ⎯ 6.1 7.0 V

Overtemperature Protection All Tref ⎯ 125 ⎯ °C

(See Feature Descriptions)

Input Undervoltage Lockout

Turn-on Threshold HC ⎯ 16 18 V

Turn-off Threshold HC 13 14 ⎯ V

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 6

Characteristic Curves

The following figures provide typical characteristics for the HC010A0F (3.3V, 10A) at 25ºC. The figures are identical

for either positive or negative Remote On/Off logic.

0246810

VIN = 18V

VIN = 24V

VIN = 36V

20 30 40 50 60 70 80 90

1.0m/s (200 LFM)

0.5m/s (100 LFM)

EFFICIENCY, η (%)

OUTPUT CURRENT, IO (A)

OUTPUT CURRENT, Io (A)

AMBIENT TEMPERATURE, TA OC

Figure 1. Converter Efficiency versus Output Current Figure 4. Derating Output Current versus Local

Ambien t Te mp e rature and Airflow

OUTPUT VOLTAGE,

VO (V) (20mV/div)

TIME, t (1μs/div)

INPUT VOLTAGE OUTPUT VOLTAGE

VIN (V) (20V/div) VO (V) (1V/div)

TIME, t (20ms/div)

Figure 2. Typical Output Ripple and Noise. Figure 5. Typical Start-Up with application of Vin (VIN

=24Vdc, Io = 10A).

OUTPUT CURRENT, OUTPUT VOLTAGE

IO (A) (2A/div) VO (V) (200mV/div)

TIME, t (100μs/div)

On/Off VOLTAGE OUTPUT VOLTAGE

VON/OFF(V) (10V/div) VO (V) (1V/div)

TIME, t (20ms/div)

Figure 3. Trans ient Response to Dynamic Load

Change from 50% to 75% to 50% of full load. Figure 6. Typical Start-Up Using Remote On/Off,

negative logic versi on show n.

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

Characteristic Curves (continued)

The following figures provide typical characteristics for the HC006A6A (5.0V,6.6A) at 25ºC. The figures are identical

for either positive or negative Remote On/Off logic.

70 %

74 %

78 %

82%

86%

90%

94%

0 123456

Vin=18V

Vin=24V

Vin=36V

20 30 40 50 60 70 80 90

1.0m/s (200 LFM)

0.5m/s (100 LFM)

EFFICIENCY, η (%)

OUTPUT CURRENT, IO (A)

OUTPUT CURRENT, Io (A)

AMBIENT TEMPERATURE, TA OC

Figure 7. Converter Efficiency versus Output Current Figure 10. Derati ng Output Current versus Local

Ambien t Te mp e rature and Airflow

OUTPUT VOLTAGE,

VO (V) (20mV/div)

TIME, t (1μs/div)

INPUT VOLTAGE, OUTPUT VOLTAGE

VIN (V) (20V/div) VO (V) (1V/div)

TIME, t (20ms/div)

Figure 8. Typical Output Ripple and Noise (VIN =24Vdc,

Io = 6.6A). Figure 11. Typical Start-Up with application of Vin (VIN

=48Vdc, Io = 6.6A).

OUTPUT CURRENT, OUTPUT VOLTAGE

IO (A) (2A/div) VO (V) (200mV/div)

TIME, t (100μs/div)

On/Off VOLTAGE OUTPUT VOLTAGE

VON/OFF(V) (10V/div) VO (V) (1V/div)

TIME, t (20ms/div)

Figure 9. Trans ient Response to Dynamic Load

Change from 50% to 75% to 50% of full load. Figure 12. Typical Start-Up Using Remote On/Off,

negative logic version show n (VIN =24Vdc, Io = 6.6A).

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Pow e r Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 8

Test Configurations

TO OSCILLOSCOPE CURRENT PROBE

LTEST

12μH

BATTERY

CS 220μF

E.S.R.<0.1Ω

@ 20°C 100kHz

33μF

Vin+

Vin-

NOTE: Measure input reflected ripple current with a simulated

source inductance (LTEST) of 12μH. Capacitor CS offsets

possible battery impedance. Measure current as shown

above.

Figure 13. Input Reflected Ripple Current Test Setup.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

(+)

(

–

)

1uF

RESI STI V E

LO A D

SC O PE

COPPER STRIP

GROUND PLANE

10uF

Figure 14. Output Ripple and Noise Test Setup.

Vout+

Vout-

Vin+

Vin-

RLOAD

Rcontact Rdistribution

Rcontact

Rdistribution

VIN VO

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 15. Ou tput Vol ta ge and Effici en cy Tes t Setup.

η =

VO. IO

VIN. IIN

x 100 %

Efficiency

Design Considerations

Input Source Impedance

The power module should be connected to a low

ac-impedance source. A highly inductive source

impedance can affect the stability of the power module.

For the test configuration in Figure 13, a 33μF

electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted

close to the power module helps ensure the stability of

the unit. Consult the factory for further application

guidelines.

Safety Considerations

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and separation

requirements of the end-use safety agency standard,

i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE

0805:2001-12 (IEC60950-1).

If the input source is non-SELV (ELV or a hazardous

voltage greater than 60 Vdc and less than or equal to

75Vdc), for the module’s output to be considered as

meeting the requirements for safety extra-low voltage

(SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including

the ac mains.

 One VIN pin and one VOUT pin are to be grounded, or both

the input and output pins are to be kept floating.

 The input pins of the module are not operator accessible.

 Another SELV reliability test is conducted on the whole

system (combination of supply source and subject

module), as required by the safety agencies, to verify that

under a single fault, hazardous voltages do not appear at

the module’s output.

Note: Do not ground either of the input pins of the

module without grounding one of the output pins.

This may allow a non-SELV voltage to appear

between the output pins and ground.

The power module has extra-low voltage (ELV) outputs

when all inputs are ELV.

For input voltages exceeding –60 Vdc but less than or

equal to –75 Vdc, these converters have been evaluated

to the applicable requirements of BASIC INSULATION

between secondary DC MAINS DISTRIBUTION input

(classified as TNV-2 in Europe) and unearthed SELV

outputs."All flammable materials used in the

manufacturing of these modules are rated 94V-0 and

UL60950 A.2 for reduced thicknesses. The input to

these units is to be provided with a maximum 3A fast-

acting fuse in the unearthed lead."

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Pow e r Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 9

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic

turns the module on during a logic high voltage on the

ON/OFF pin, and off during a logic low. Negative logic

remote On/Off, device code suffix “1”, turns the module

off during a logic high and on during a logic low.

ON/OFF

VIN

(

)

VIN

(

)

Ion/off

Von/off

COM

Figure 16. Remote On/Off Implementation.

To turn the power module on and off, the user must

supply a switch (open collector or equivalent) to control

the voltage (Von/off) between the ON/OFF terminal and

the VIN(-) terminal. Logic low is –0.7V ≤ Von/off ≤ 1.2V.

The maximum Ion/off during a logic low is 1mA, the switch

should be maintain a logic low level whilst sinking this

current.

During a logic high, the maximum Von/off generated by

the module is 15V, and the maximum allowable leakage

current at Von/off = 15V is 50μA.

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to VIN(-).

Overcurrent Protection

To provide protection in a fault (output overload) condi-

tion, the module is equipped with internal current-limiting

circuitry, and can endure current limiting continuously.

At the instance of current-limit inception, the output

current begins to tail-out. When an overcurrent condition

exists beyond a few seconds, the module enters a

“hiccup” mode of operation, whereby it shuts down and

automatically attempts to restart upon cooling. While the

fault condition exists, the module will remain in this

hiccup mode, and can remain in this mode until the fault

is cleared. The unit operates normally once the output

current is reduced back into its specified range.

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout

limit, the module operation is disabled. The module will

begin to operate at an input voltage above the

undervoltage lockout turn-on threshold.

Over Voltage Protection

The output overvoltage protection clamp consists of

control circuitry, independent of the primary regulation

loop, that monitors the voltage on the output terminals.

This control loop has a higher voltage set point than the

primary loop (See the overvoltage clamp values in the

Feature Specifications Table). In a fault condition, the

overvoltage clamp ensures that the output voltage does

not exceed Vo,ovsd, max. This provides a redundant

voltage-control that reduces the risk of output

overvoltage.

Over Temperature Protection

To provide protection in a fault condition, the unit is

equipped with a thermal shutdown circuit. The unit will

shutdown if the overtemperature threshold of 125 oC is

exceeded at the thermal reference point Tref . Once the

unit goes into thermal shutdown it will then wait to cool

before attempting to restart.

Output Voltage Programming

Trimming allows the output voltage set point to be

increased or decreased, this is accomplished by

connecting an external resistor between the TRIM pin

and either the VO(+) pin or the VO(-) pin (COM pin) .

VO(+)

VOTRIM

COM

Rtrim-down

LOAD

VIN(+)

ON/OFF

VIN(-)

Rtrim-up

Figure 17. Circuit Configuration to Trim Output

Voltage.

Connecting an external resistor (Rtrim-down) between the

TRIM pin and the COM pin decreases the output voltage

set point. The following equation determines the value

of trim-down resistor needed to decrease the output

voltage from Vo,set to Vo:

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Pow e r Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 10

Feature Descriptions (continued)

Output Voltage Programming (continued)

⎥

⎦

⎤

⎢

⎣

⎡−

=− kB

downRtrim %

Rtrim-down is the external resistor in kΩ

Δ% is the % change in output voltage

Values of A & B are provided in Table 1

Table 1

Output Voltage

(V)

A B

3.3V 1690 73.1

5.0V 1690 73.1

Connecting an external resistor (Rtrim-up) between the

TRIM pin and the VO(+) pin increases the output voltage

set point. The relationship between the output voltage

and the trim resistor value for a Δ% increase in output

voltage is:

⎭

⎬

⎫

⎩

⎨

⎧−

⎥

⎦

⎤

⎢

⎣

⎡

−Δ+

=− kC

upRtrim %%100(

Rtrim-up is the external resistor in kΩ

Δ% is the % change in output voltage

Values of A , B and C are provided in Table 2

Table 2

Output Voltage

(V)

A B V

3.3 45.5 1690 73.1

5.0 69.0 1690 73.1

Examples:

To trim down the output of a nominal 5.0V module

(HC006A6A) to 4.90V

Δ% = 2

⎥

⎦

⎤

⎢

⎣

⎡−=− kdownRtrim 1.73

1690

−

kdownRtrim 9.771

To trim up the output of a nominal 3.3V module

(HC010A0F) to 3.63V

Δ% = 10

⎭

⎬

⎫

⎩

⎨

⎧−

⎥

⎦

⎤

⎢

⎣

⎡−+

=− kupRtrim 1.73

10 1690)10100(5.45

Ω=− kupRtrim 4.258

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Pow e r Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 11

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,

module power dissipation, and the need for increased

reliability. A reduction in the operating temperature of the

module will result in an increase in reliability. The

thermal data presented here is based on physical

measurements taken in a wind tunnel.

The thermal reference point, Tref used in the

specifications is shown in Figure 18. For reliable

operation this temperature should not exceed 110 oC

Figure 18. Tref Temperature Measurement Location.

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-

Mounted Power Modules” for a detailed discussion of

thermal aspects including maximum device

temperatures.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating figures showing the

maximum output current that can be delivered by each

module versus local ambient temperature (TA) for natural

convection and up to 3m/s (600 ft./min) are shown in the

respective Characteristics Curves section.

EMC Con s i d er ati o n s

The figure 19 shows a suggested configuration to meet

the conducted emission limits of EN55022 Class B.

Figure 19. Suggested Configuration for EN55022

Class B.

For further information on designing for EMC

compliance, please refer to the FLTR100V10 data sheet

(FDS01-043EPS).

Layout Considerations

The HC power module series are low profile in order to

be used in fine pitch system card architectures. As

such, component clearance between the bottom of the

power module and the mounting board is limited. Avoid

placing copper areas on the outer layer directly

underneath the power module. Also avoid placing via

interconnects underneath the power module.

For additional layout guide-lines, refer to FLTR100V10

data sheet.

Q203

Tref Airflow

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 12

Mechanical Outline for Surface-Mount Module

Dimensions are in millimeters and (inches).

Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [Unless otherwise indicated]

x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)

Top View

Side View

Bottom View

Pin Function

1 Vo(+)

2 Vo(-)

9 Trim

11 On/Off

17 Vin(-)

18 Vin(+)

29.5

(1.16)

47.2

(1.86)

0.06 x 0.06

chamffer

18 17 11

129

2.5

(0.10)

min stand-off

height

0.5

(.020)

max

compliance

8.50

(0.335)

MAX

TRIM

26.16

(1.030)

5.00

(0.197)

35.00

(1.375)

On/Off

3.6

(0.14)

1.7

(0.07)

40.00

(1.575)

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 13

Mechanical Outline for Through Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Top View

Side View

* Optional pin lengths shown in Table 2 Device Options

Bottom Vie w

Pin Function

1 Vo(+)

2 Vo(-)

9 Trim

11 On/Off

17 Vin(-)

18 Vin(+)

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 14

Recommended Pad Layout for Surface Mount and Through Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 15

Packaging Details

The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed

of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel.

Tape Dimensions

Dimensions are in millimeters and (inches).

40.00

(1.575)

4.00

(0.157)

(1.346)

34.20

PICK POINT

(2.692)

68.40

FEED

DIRECTION (2.834)

72.00

9.02

(0.355)

TOP COVER TAPE EMBOSSED CARRIER

NOTE: CONFORMS TO EAI-481 REV. A STANDARD

(2.692)

66.50

Reel Dimensions

Outside diameter: 330.2 mm (13.00”)

Inside diameter: 177.8 mm (7.00”)

Tape Width: 72.00 mm (2.834”)

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 16

Through-Hole Lead-Free Soldering

Information

The RoHS-compliant through-hole products use the

SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. They are designed to be processed

through single or dual wave soldering machines. The

pins have an RoHS-compliant finish that is compatible

with both Pb and Pb-free wave soldering processes.

A maximum preheat rate of 3°C/s is suggested. The

wave preheat process should be such that the

temperature of the power module board is kept below

210°C. For Pb solder, the recommended pot

temperature is 260°C, while the Pb-free solder pot is

270°C max. Not all RoHS-compliant through-hole

products can be processed with paste-through-hole

Pb or Pb-free reflow process. If additional information

is needed, please consult with your Lineage Power

representative for more details.

Surface Mount Information

Pack ag ing Det ails

The surface mount versions of the HC family (suffix –

S) are supplied as standard in the plastic tray shown

in Figure 21. The tray has external dimensions of

136mm (W) x 322.6mm (L) x 18.4mm (H) or 5.35in

(W) x 12.7in (L) x 0.72in (H).

Figure 21. Surface Mount Packaging Tray

Tray Specification

Material Antistatic coated PVC

Max temperature 65oC

Max surface resistivity 1012Ω/sq

Colour Clear

Capacity 15 power modules

Min order quantity 45 pcs (1box of 3 full

trays)

Each tray contains a total of 15 power modules. The

trays are self-stacking and each shipping box will

contain 3 full trays plus one empty hold down tray

giving a total number of 45 power modules.

Pick a nd Pl ace

The HC-S series of DC-to-DC power converters use

an open-frame construction and are designed for

surface mount assembly within a fully automated

manufacturing process.

The HC-S series modules are fitted with a Kapton

label designed to provide a large flat surface for pick

and placing. The label is located covering the Centre

of Gravity of the power module. The label meets all

the requirements for surface-mount processing, as

well as meeting UL safety agency standards. The

label will withstand reflow temperatures up to 300°C.

The label also carries product information such as

product code, date and location of manufacture.

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 17

Surface Mount Information (continued)

21mm

(0.84in)

14mm

(0.57in)

Note: All dimensions in mm.

Figure 22. Pick and Plac e Location.

Z Plan e Height

The ‘Z’ plane height of the pick and place location is

7.50mm nominal with an RSS tolerance of +/-0.25

mm.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, they have a

relatively large mass when compared with

conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and placement

speed should be considered to optimize this process.

The minimum recommended nozzle diameter for

reliable operation is 6mm. The maximum nozzle outer

diameter, which will safely fit within the allowable

component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be

used within the space available.

For further information please contact your local

Lineage Power Technical Sales Representative.

Reflow Soldering Information

The HC family of power modules is available for either

Through-Hole (TH) or Surface Mount (SMT)

soldering. These power modules are large mass, low

thermal resistance devices and typically heat up

slower than other SMT components. It is

recommended that the customer review data sheets

in order to customize the solder reflow profile for each

application board assembly.

The following instructions must be observed when

SMT soldering these units. Failure to observe these

instructions may result in the failure of or cause

damage to the modules, and can adversely affect

long-term reliability.

The surface mountable modules in the HC family use

our newest SMT technology called “Column Pin” (CP)

connectors. Fig 23 shows the new CP connector

before and after reflow soldering onto the end-board

assembly.

HC Board

Insulator

Solder Ball

End assembly PCB

Figure 23. Column Pin Connector Before and After

Reflow Soldering.

The CP is constructed from a solid copper pin with an

integral solder ball attached, which is composed of

tin/lead (Sn/Pb) solder. The CP connector design is

able to compensate for large amounts of co-planarity

and still ensure a reliable SMT solder joint.

Typically, the eutectic solder melts at 183oC, wets the

land, and subsequently wicks the device connection.

Sufficient time must be allowed to fuse the plating on

the connection to ensure a reliable solder joint. There

are several types of SMT reflow technologies

currently used in the industry. These surface mount

power modules can be reliably soldered using natural

forced convection, IR (radiant infrared), or a

combination of convection/IR. For reliable soldering

the solder reflow profile should be established by

accurately measuring the modules CP connector

temperatures.

REFLOW TEMP (°C)

10 0

15 0

200

250

300

Preheat zo ne

max 4

-1

So ak zo ne

30-240s

Heat zone

max 4

-1

Peak Temp 235

Coo ling

zo ne

1- 4

-1

lim

above

205

REFLOW TIME (S)

Figure 24. Recommended Reflow Profile

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

LINEAGE POWER 18

Surface Mount Information (continued)

MAX TEMP SOLDER (°C)

200

205

210

215

220

225

230

235

240

0 102030405060

TIME LIMIT (S)

Figure 25. Time Limit Curve Above 205oC Reflow .

Lead Free Soldering

The SMT modules of the HW/HC series are lead-free

(Pb-free) and RoHS compliant and are both forward

and backward compatible in a Pb-free and a SnPb

soldering process. Failure to observe the instructions

below may result in the failure of or cause damage to

the modules and can adversely affect long-term

reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C

(Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices) for

both Pb-free solder profiles and MSL classification

procedures. This standard provides a recommended

forced-air-convection reflow profile based on the

volume and thickness of the package (table 4-2). The

suggested Pb-free solder paste is Sn/Ag/Cu (SAC).

The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure. 26.

Storage and Handling

The recommended storage environment and handling

procedures for moisture-sensitive surface mount

packages is detailed in J-STD-033 Rev. A (Handling,

Packing, Shipping and Use of Moisture/Reflow

Sensitive Surface Mount Devices). Moisture barrier

bags (MBB) with desiccant are required for MSL

ratings of 2 or greater. These sealed packages

should not be broken until time of use. Once the

original package is broken, the floor life of the product

at conditions of ≤ 30°C and 60% relative humidity

varies according to the MSL rating (see J-STD-033A).

The shelf life for dry packed SMT packages will be a

minimum of 12 months from the bag seal date, when

stored at the following conditions: < 40° C, < 90%

relative humidity.

MSL Rating

The HW/HC series SMT modules have a MSL rating

of 1.

Post Solder Cleaning and Drying

Considerations

Post solder cleaning is usually the final circuit-board

assembly process prior to electrical board testing. The

result of inadequate cleaning and drying can affect

both the reliability of a power module and the

testability of the finished circuit-board assembly. For

guidance on appropriate soldering, cleaning and

drying procedures, refer to Lineage Power Board

Mounted Pow er Module s : Sold ering a nd Clean in g

Application Note (AP01-056EPS).

100

150

200

250

300

Reflow Time (in seconds)

Reflow Temp (° C)

Peak Temp 245° C

Heating Zone

1° C / second

Cooling Zone

4° C / second

* Min. Time Ab ove 235° C

15 seconds

* Time Above 217° C

60 seconds

Per J-STD-020 Rev. C

Figure 26. Recommended linear reflow profile

using Sn/Ag/Cu solder.

Solder Ball and Cleanliness Requirements

The open frame (no case or potting) power module

will meet the solder ball requirements per

J-STD-001B. These requirements state that solder

balls must neither be loose nor violate the power

module minimum electrical spacing.

The cleanliness designator of the open frame power

module is C00 (per J specification).

Data Sheet

October 5, 2009 HC006/010 Series DC-DC Power Module:

18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current

Document No: DS03-122 ver. 1.45

PDF name: hc006-010_series_ds.pdf

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Input Voltage Output

Voltage Output

Current

Remote

On/Off

Logic

Connector

Type Product codes Comcodes

24 (18 – 36) Vdc 3.3 V 10A Negative SMT HC010A0F1-S 108975442

24 (18 – 36) Vdc 3.3 V 10A Negative SMT HC010A0F1-SZ 109100220

24 (18 – 36) Vdc 5.0V 6.6A Negative SMT HC006A6A1-S 108975459

24 (18 – 36) Vdc 5.0V 6.6A Negative SMT HC006A6A1-SZ 109100212

24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A1 108994281

24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A1Z CC109107100

24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A61Z CC109140266

Table 2. Device Options Option Suffix

Negative remote on/off logic 1

Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in) 6

Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8

Tape & Reel -R

Surface mount connections -S

RoHS Compliant -Z

World Wide Headquarters

Lineage Power Cor poration

601 Shiloh Road, Plano, TX 75074, USA

+1-800-526-7819

(Outside U.S.A.: +1-972-244-9428)

www.lineagepower.com

e-mail: techsupport1@lineagepower.com

Asia-Pacific Headquarters

Tel: +65 6593 7211

Europe, Middle-East and Africa H e adquarters

Tel: +49 898 780 672 80

India Headquarter s

Tel: +91 80 28411633

Lineage Power reserves the right to make changes to the product(s) or informat ion conta ined herein without notice. No liability is assumed as a result of their use or

pplication. No rights under any patent accompany the sale of an y such product(s) or inform ation.

Lineage Power DC-DC products are prote cted under various patents. Information on the se patents is available at www.lineagepower.com/patents.

2009 Linea

e Power Cor

oration

(

Plano

Texas

)

All Inte rn ation al Ri

hts Reserved.