Data Sheet
October 5, 2009
HC006/010 Series DC-DC Converter Power Modules:
18-36Vdc Input; 3.3V-5Vdc Output; 6.6A-10A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS03-122 ver. 1.45
PDF name: hc006-010_series_ds.pdf
Applications
Wireless Networks
Distributed power architectures
Optical and Access Network Equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC)
and Microprocessor powered applications
Options
Remote On/Off logic (positive or negative)
Surface Mount (-S Suffix)
Trimmed leads
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Delivers up to 10A Output current
5V (6.6A), 3.3V (10A)
High efficiency – 90% at 3.3V full load
Low Output voltage- supports migration to future IC
supply voltages down to 1.0V
Low output ripple and noise
Small Size and low profile
47.2mm x 29.5mm x 8.5mm
(1.86 x 1.16 x 0.335 in)
Surface mount or Through hole (TH)
Remote On/Off
Output overcurrent/Over voltage protection
Over temperature protection
Single Tightly regulated output
Output voltage adjustment trim ±10%
Wide operating temperature range (-40°C to 85°C)
Meets the voltage insulation requirements for ETSI
300-132-2 and complies with and is Licensed for
Basic Insulation rating per EN 60950
CE mark meets 73/23/EEC and 93/68/EEC
directives§
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-
03 Certified, and VDE‡ 0805:2001-12 (EN60950-1)
Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Description
The HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36
Vdc and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity
configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 90%
3.3/10A, 91% at 5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These
open frame modules are available either in surface-mount (-S) or in through-hole form.
RoHS Compliant
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All VIN -0.3 50 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation Voltage (100% factory tested) All ⎯ ⎯ 1500 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage HC VIN 18 24 36 Vdc
Maximum Input Current HC IIN,max 3.2 Adc
(VIN=0V to 75V, IO=IO, max)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to
75V, IO= IOmax ; see Figure 9)
All 3 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point 3.3V VO, set 3.25 3.3 3.35 Vdc
(VIN=VIN,nom, IO=IO, max, Tref=25°C) 5.0V VO, set 4.92 5.0 5.08 Vdc
Output Voltage All VO -3.0 ⎯ +3.0 % VO, set
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range All VO -10.0 +10.0 % VO, set
Selected by external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All
⎯ ⎯ 0.1 % VO, set
Load (IO=IO, min to IO, max) All
⎯ ⎯ 10 mV
Temperature (Tref=TA, min to TA, max) All
⎯ 0.2 ⎯ % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max)
Measured across 10μF tantalum//1μF ceramic
RMS (5Hz to 20MHz bandwidth) All ⎯ 8 20 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All ⎯ 40 75 mVpk-pk
External Load Capacitance 3.3V CO, max 0 ⎯ 1000 μF
5.0V CO, max 0 ⎯ 470 μF
Output Current 3.3V Io 0.05 10 Adc
5.0V Io 0.05 6.6 Adc
(At Io < Io,min the output ripple may exceed the
The max specifications. All modules shall
Operate at no load without damage and without
exceeding 100% of VO, set )
Output Current Limit Inception 3.3V IO, lim ⎯ 12 ⎯ Adc
(Vo = 90% of VO, set) 5.0V IO, lim ⎯ 8 ⎯ Adc
Output Short-Circuit Current 3.3V IO, s/c ⎯ 17 ⎯ Adc
(VO≤250mV) 5.0V IO, s/c ⎯ 13 ⎯ Adc
Efficiency 3.3V η ⎯ 90.0 ⎯ %
VIN=VIN, nom, TA=25°C 5.0V η ⎯ 91.0 ⎯ %
IO=IO, max , VO= VO,set
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Switching Frequency All fsw ⎯ 285 ⎯ kHz
Dynamic Load Response
(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)
Load Change from Io= 50% to 75% of Io,max
Peak Deviation Vpk ⎯ 200 ⎯ mV
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)
Load Change from Io= 75% to 50% of Io,max
Peak Deviation All Vpk ⎯ 200 ⎯ mV
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso ⎯ 1000 ⎯ pF
Isolation Resistance Riso 10 ⎯ ⎯ MΩ
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (for HC010A0F1 in accordance with Lucent RIN:
IO=80% of IO, max, TA=25°C, airflow=1m/s) > TBD Hours
Weight ⎯ 13 (0.46) Weight ⎯
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low All Ion/off ⎯ 0.15 1.0 mA
On/Off Voltage:
Logic Low All Von/off -0.7 ⎯ 1.2 V
Logic High – (Typ = Open Collector) All Von/off ⎯ 15 V
Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 50 μA
Turn-On Delay and Rise Times
(VIN=VIN, nom, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is set to Logic high and then
input power is applied (delay from instant at
which VI = VI,min until Vo = 10% of Vo, set)
All Tdelay 20 msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic high (delay
from instant at which Von/Off = 0.9V until Vo = 10% of
Vo, set)
All Tdelay 12 msec
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set) All
Trise ― 5 ― msec
Output voltage overshoot
(VIN=VIN, nom, Io = 80% of Io,max, TA=25°C) All ― ― 5
%VO,
set
Output Overvoltage Protection 3.3V VO, limit ⎯ 4.0 4.6 V
5.0V VO, limit ⎯ 6.1 7.0 V
Overtemperature Protection All Tref ⎯ 125 ⎯ °C
(See Feature Descriptions)
Input Undervoltage Lockout
Turn-on Threshold HC ⎯ 16 18 V
Turn-off Threshold HC 13 14 ⎯ V
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 6
Characteristic Curves
The following figures provide typical characteristics for the HC010A0F (3.3V, 10A) at 25ºC. The figures are identical
for either positive or negative Remote On/Off logic.
70
74
78
82
86
90
94
0246810
VIN = 18V
VIN = 24V
VIN = 36V
0
2
4
6
8
10
12
20 30 40 50 60 70 80 90
1.0m/s (200 LFM)
NC
0.5m/s (100 LFM)
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 1. Converter Efficiency versus Output Current Figure 4. Derating Output Current versus Local
Ambien t Te mp e rature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (1V/div)
TIME, t (20ms/div)
Figure 2. Typical Output Ripple and Noise. Figure 5. Typical Start-Up with application of Vin (VIN
=24Vdc, Io = 10A).
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (200mV/div)
TIME, t (100μs/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VON/OFF(V) (10V/div) VO (V) (1V/div)
TIME, t (20ms/div)
Figure 3. Trans ient Response to Dynamic Load
Change from 50% to 75% to 50% of full load. Figure 6. Typical Start-Up Using Remote On/Off,
negative logic versi on show n.
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
7
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC006A6A (5.0V,6.6A) at 25ºC. The figures are identical
for either positive or negative Remote On/Off logic.
70 %
74 %
78 %
82%
86%
90%
94%
0 123456
Vin=18V
Vin=24V
Vin=36V
0
2
3
5
6
8
20 30 40 50 60 70 80 90
1.0m/s (200 LFM)
NC
0.5m/s (100 LFM)
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 7. Converter Efficiency versus Output Current Figure 10. Derati ng Output Current versus Local
Ambien t Te mp e rature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
TIME, t (1μs/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (1V/div)
TIME, t (20ms/div)
Figure 8. Typical Output Ripple and Noise (VIN =24Vdc,
Io = 6.6A). Figure 11. Typical Start-Up with application of Vin (VIN
=48Vdc, Io = 6.6A).
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (200mV/div)
TIME, t (100μs/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VON/OFF(V) (10V/div) VO (V) (1V/div)
TIME, t (20ms/div)
Figure 9. Trans ient Response to Dynamic Load
Change from 50% to 75% to 50% of full load. Figure 12. Typical Start-Up Using Remote On/Off,
negative logic version show n (VIN =24Vdc, Io = 6.6A).
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Pow e r Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 8
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1Ω
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 13. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
1uF
.
RESI STI V E
LO A D
SC O PE
COPPER STRIP
GROUND PLANE
10uF
Figure 14. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 15. Ou tput Vol ta ge and Effici en cy Tes t Setup.
η =
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. A highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 13, a 33μF
electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE
0805:2001-12 (IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One VIN pin and one VOUT pin are to be grounded, or both
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
This may allow a non-SELV voltage to appear
between the output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been evaluated
to the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs."All flammable materials used in the
manufacturing of these modules are rated 94V-0 and
UL60950 A.2 for reduced thicknesses. The input to
these units is to be provided with a maximum 3A fast-
acting fuse in the unearthed lead."
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Pow e r Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 9
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
ON/OFF
VIN
(
+
)
VIN
(
-
)
Ion/off
Von/off
VO
COM
Figure 16. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and
the VIN(-) terminal. Logic low is –0.7V ≤ Von/off ≤ 1.2V.
The maximum Ion/off during a logic low is 1mA, the switch
should be maintain a logic low level whilst sinking this
current.
During a logic high, the maximum Von/off generated by
the module is 15V, and the maximum allowable leakage
current at Von/off = 15V is 50μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Overcurrent Protection
To provide protection in a fault (output overload) condi-
tion, the module is equipped with internal current-limiting
circuitry, and can endure current limiting continuously.
At the instance of current-limit inception, the output
current begins to tail-out. When an overcurrent condition
exists beyond a few seconds, the module enters a
“hiccup” mode of operation, whereby it shuts down and
automatically attempts to restart upon cooling. While the
fault condition exists, the module will remain in this
hiccup mode, and can remain in this mode until the fault
is cleared. The unit operates normally once the output
current is reduced back into its specified range.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
begin to operate at an input voltage above the
undervoltage lockout turn-on threshold.
Over Voltage Protection
The output overvoltage protection clamp consists of
control circuitry, independent of the primary regulation
loop, that monitors the voltage on the output terminals.
This control loop has a higher voltage set point than the
primary loop (See the overvoltage clamp values in the
Feature Specifications Table). In a fault condition, the
overvoltage clamp ensures that the output voltage does
not exceed Vo,ovsd, max. This provides a redundant
voltage-control that reduces the risk of output
overvoltage.
Over Temperature Protection
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. The unit will
shutdown if the overtemperature threshold of 125 oC is
exceeded at the thermal reference point Tref . Once the
unit goes into thermal shutdown it will then wait to cool
before attempting to restart.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (COM pin) .
VO(+)
VOTRIM
COM
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 17. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the COM pin decreases the output voltage
set point. The following equation determines the value
of trim-down resistor needed to decrease the output
voltage from Vo,set to Vo:
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Pow e r Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 10
Feature Descriptions (continued)
Output Voltage Programming (continued)
Ω
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
=− kB
A
downRtrim %
Rtrim-down is the external resistor in kΩ
Δ% is the % change in output voltage
Values of A & B are provided in Table 1
Table 1
Output Voltage
(V)
A B
3.3V 1690 73.1
5.0V 1690 73.1
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) pin increases the output voltage
set point. The relationship between the output voltage
and the trim resistor value for a Δ% increase in output
voltage is:
Ω
⎭
⎬
⎫
⎩
⎨
⎧−
⎥
⎦
⎤
⎢
⎣
⎡
Δ
−Δ+
=− kC
BA
upRtrim %%100(
Rtrim-up is the external resistor in kΩ
Δ% is the % change in output voltage
Values of A , B and C are provided in Table 2
Table 2
Output Voltage
(V)
A B V
3.3 45.5 1690 73.1
5.0 69.0 1690 73.1
Examples:
To trim down the output of a nominal 5.0V module
(HC006A6A) to 4.90V
Δ% = 2
Ω
⎥
⎦
⎤
⎢
⎣
⎡−=− kdownRtrim 1.73
2
1690
Ω
=
−
kdownRtrim 9.771
To trim up the output of a nominal 3.3V module
(HC010A0F) to 3.63V
Δ% = 10
Ω
⎭
⎬
⎫
⎩
⎨
⎧−
⎥
⎦
⎤
⎢
⎣
⎡−+
=− kupRtrim 1.73
10 1690)10100(5.45
Ω=− kupRtrim 4.258
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Pow e r Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 11
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications is shown in Figure 18. For reliable
operation this temperature should not exceed 110 oC
Figure 18. Tref Temperature Measurement Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
EMC Con s i d er ati o n s
The figure 19 shows a suggested configuration to meet
the conducted emission limits of EN55022 Class B.
Figure 19. Suggested Configuration for EN55022
Class B.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
The HC power module series are low profile in order to
be used in fine pitch system card architectures. As
such, component clearance between the bottom of the
power module and the mounting board is limited. Avoid
placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.
Q203
Tref Airflow
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 12
Mechanical Outline for Surface-Mount Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [Unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Top View
Side View
Bottom View
Pin Function
1 Vo(+)
2 Vo(-)
9 Trim
11 On/Off
17 Vin(-)
18 Vin(+)
29.5
(1.16)
47.2
(1.86)
0.06 x 0.06
chamffer
18 17 11
129
2.5
(0.10)
min stand-off
height
0.5
(.020)
max
compliance
8.50
(0.335)
MAX
V
O
+V
O
-
TRIM
26.16
(1.030)
5.00
(0.197)
V
I
+V
I
-
35.00
(1.375)
On/Off
3.6
(0.14)
1.7
(0.07)
40.00
(1.575)
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 13
Mechanical Outline for Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top View
Side View
* Optional pin lengths shown in Table 2 Device Options
Bottom Vie w
Pin Function
1 Vo(+)
2 Vo(-)
9 Trim
11 On/Off
17 Vin(-)
18 Vin(+)
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 14
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 15
Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed
of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel.
Tape Dimensions
Dimensions are in millimeters and (inches).
40.00
(1.575)
4.00
(0.157)
(1.346)
34.20
PICK POINT
(2.692)
68.40
FEED
DIRECTION (2.834)
72.00
9.02
(0.355)
TOP COVER TAPE EMBOSSED CARRIER
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
(2.692)
66.50
Reel Dimensions
Outside diameter: 330.2 mm (13.00”)
Inside diameter: 177.8 mm (7.00”)
Tape Width: 72.00 mm (2.834”)
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 16
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Surface Mount Information
Pack ag ing Det ails
The surface mount versions of the HC family (suffix –
S) are supplied as standard in the plastic tray shown
in Figure 21. The tray has external dimensions of
136mm (W) x 322.6mm (L) x 18.4mm (H) or 5.35in
(W) x 12.7in (L) x 0.72in (H).
Figure 21. Surface Mount Packaging Tray
Tray Specification
Material Antistatic coated PVC
Max temperature 65oC
Max surface resistivity 1012Ω/sq
Colour Clear
Capacity 15 power modules
Min order quantity 45 pcs (1box of 3 full
trays)
Each tray contains a total of 15 power modules. The
trays are self-stacking and each shipping box will
contain 3 full trays plus one empty hold down tray
giving a total number of 45 power modules.
Pick a nd Pl ace
The HC-S series of DC-to-DC power converters use
an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The HC-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick
and placing. The label is located covering the Centre
of Gravity of the power module. The label meets all
the requirements for surface-mount processing, as
well as meeting UL safety agency standards. The
label will withstand reflow temperatures up to 300°C.
The label also carries product information such as
product code, date and location of manufacture.
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 17
Surface Mount Information (continued)
X
21mm
(0.84in)
14mm
(0.57in)
Note: All dimensions in mm.
Figure 22. Pick and Plac e Location.
Z Plan e Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Reflow Soldering Information
The HC family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
The surface mountable modules in the HC family use
our newest SMT technology called “Column Pin” (CP)
connectors. Fig 23 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
HC Board
Insulator
Solder Ball
End assembly PCB
Figure 23. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4
o
Cs
-1
So ak zo ne
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Coo ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 24. Recommended Reflow Profile
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
LINEAGE POWER 18
Surface Mount Information (continued)
MAX TEMP SOLDER (°C)
200
205
210
215
220
225
230
235
240
0 102030405060
TIME LIMIT (S)
Figure 25. Time Limit Curve Above 205oC Reflow .
Lead Free Soldering
The SMT modules of the HW/HC series are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 26.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
MSL Rating
The HW/HC series SMT modules have a MSL rating
of 1.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Pow er Module s : Sold ering a nd Clean in g
Application Note (AP01-056EPS).
0
50
100
150
200
250
300
Reflow Time (in seconds)
Reflow Temp (° C)
Peak Temp 245° C
Heating Zone
1° C / second
Cooling Zone
4° C / second
* Min. Time Ab ove 235° C
15 seconds
* Time Above 217° C
60 seconds
Per J-STD-020 Rev. C
Figure 26. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module
will meet the solder ball requirements per
J-STD-001B. These requirements state that solder
balls must neither be loose nor violate the power
module minimum electrical spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
Data Sheet
October 5, 2009 HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Document No: DS03-122 ver. 1.45
PDF name: hc006-010_series_ds.pdf
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Voltage Output
Voltage Output
Current
Remote
On/Off
Logic
Connector
Type Product codes Comcodes
24 (18 – 36) Vdc 3.3 V 10A Negative SMT HC010A0F1-S 108975442
24 (18 – 36) Vdc 3.3 V 10A Negative SMT HC010A0F1-SZ 109100220
24 (18 – 36) Vdc 5.0V 6.6A Negative SMT HC006A6A1-S 108975459
24 (18 – 36) Vdc 5.0V 6.6A Negative SMT HC006A6A1-SZ 109100212
24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A1 108994281
24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A1Z CC109107100
24 (18 – 36) Vdc 5.0V 6.6A Negative TH HC006A6A61Z CC109140266
Table 2. Device Options Option Suffix
Negative remote on/off logic 1
Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in) 6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8
Tape & Reel -R
Surface mount connections -S
RoHS Compliant -Z
World Wide Headquarters
Lineage Power Cor poration
601 Shiloh Road, Plano, TX 75074, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-244-9428)
www.lineagepower.com
e-mail: techsupport1@lineagepower.com
Asia-Pacific Headquarters
Tel: +65 6593 7211
Europe, Middle-East and Africa H e adquarters
Tel: +49 898 780 672 80
India Headquarter s
Tel: +91 80 28411633
Lineage Power reserves the right to make changes to the product(s) or informat ion conta ined herein without notice. No liability is assumed as a result of their use or
a
pplication. No rights under any patent accompany the sale of an y such product(s) or inform ation.
Lineage Power DC-DC products are prote cted under various patents. Information on the se patents is available at www.lineagepower.com/patents.
©
2009 Linea
g
e Power Cor
p
oration
,
(
Plano
,
Texas
)
All Inte rn ation al Ri
g
hts Reserved.
