ADM3058EBRIZ - ANALOG DEVICES

5.7 kV rms, Signal Isolated, High Working Voltage,

CAN FD Transceiver with ±15kV IEC ESD

Data Sheet ADM3058E

Rev. A Document Feedback

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice.

No license is granted by implication or otherwise under any patent or patent rights of Analog

Devices. Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Technical Support www.analog.com

FEATURES

5.7 kV rms signal isolated CAN FD transceiver

1500 V peak and dc working voltage to DIN VDE 0884-11

1.7 V to 5.5 V supply and logic side levels

4.5 V to 5.5 V supply on bus side

ISO 11898-2:2016-compliant CAN FD

Data rates up to 12 Mbps for CAN FD

Low maximum loop propagation delay: 155 ns

Extended common-mode range: ±25 V

Bus fault protection (CANH, CANL): ±40 V

ESD protection on the CANH and CANL bus pins

≥±8 kV IEC 61000-4-2 contact discharge

≥±15 kV IEC 61000-4-2 air discharge

Passes EN 55022, Class B by 6 dB

Safety and regulatory approvals (pending)

UL: 5700 V rms for 1-minute per UL 1577

CSA Component Acceptance 5A at 5.7 kV rms

IEC 60601 and IEC 61010

VDE Certificates of Conformity

DIN VDE V 0884-11 (VDE V 0884-11):2017-01

VIORM = 1500 V peak

High common-mode transient immunity: >50 kV/μs

Industrial operating temperature range: −40°C to +125°C

APPLICATIONS

CANOpen, DeviceNet, and other CAN bus implementations

Industrial automation

Process control and building control

Transport and infrastructure

FUNCTIONAL BLOCK DIAGRAM

DOMINANT

TIMEOUT

CAN

TRANSCEIVER

CANH

CANL

TXD

GND

ADM3058E

THERMAL

SHUTDOWN

DIGITAL ISOLATOR

DD1

DD2

20135-001

Figure 1.

GENERAL DESCRIPTION

The ADM3058E is a 5.7 kV rms isolated controller area

network (CAN) physical layer transceiver with a high perfor-

mance, basic feature set. The ADM3058E fully meets the CAN

flexible data rate (CAN FD) ISO 11898-2:2016 requirements and is

further capable of supporting data rates as high as 12 Mbps.

The device employs Analog Devices, Inc., iCoupler® technology

to combine a 2-channel isolator and a CAN transceiver into a

single small outline integrated circuit (SOIC) surface-mount

package. The ADM3058E is a fully isolated solution for CAN

and CAN FD applications. The ADM3058E provides isolation

between the CAN controller and physical layer bus. Safety and

regulatory approvals (pending) for a 5.7 kV rms withstand voltage

and a 1500 V peak working voltage ensure that the ADM3058E

meets application isolation requirements.

Low loop propagation delays and the extended common-mode

range of ±25 V support robust communication on longer bus

cables. Dominant timeout functionality protects against bus

lock up in a fault condition, and current limiting and thermal

shutdown features protect against output short circuits. The

CAN bus input and output pins are protected to ±40 V against

accidental connection to a +24 V bus supply. The device is fully

specified over the −40°C to +125°C industrial temperature range.

ADM3058E Data Sheet

Rev. A | Page 2 of 18

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ...................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications .................................................................................... 3

Timing Specifications .................................................................. 5

Insulation and Safety Related Specifications ............................ 6

Package Characteristics ............................................................... 6

Regulatory Information ............................................................... 6

DIN V VDE V 0884-11 (VDE V 0884-11) Insulation

Characteristics (Pending) ............................................................ 7

Absolute Maximum Ratings ........................................................... 8

Thermal Resistance ...................................................................... 8

Electrostatic Discharge (ESD) Ratings ...................................... 8

ESD Caution.................................................................................. 8

Pin Configuration and Function Descriptions ............................ 9

Typical Performance Characteristics ........................................... 10

Test Circuits .................................................................................... 12

Terminology .................................................................................... 13

Theory of Operation ...................................................................... 14

CAN Transceiver Operation .................................................... 14

Signal Isolation ........................................................................... 14

Integrated and Certified IEC Electromagnetic Compatibility

(EMC) Solution .......................................................................... 14

±40 V Miswire Protection ......................................................... 14

Dominant Timeout .................................................................... 14

Fail-Safe Features ....................................................................... 14

Thermal Shutdown .................................................................... 15

Applications Information ............................................................. 16

Radiated Emissions and PCB Layout ...................................... 16

PCB Layout ................................................................................. 16

Thermal Analysis ....................................................................... 16

Insulation Lifetime ..................................................................... 16

Surface Tracking ......................................................................... 16

Insulation Wear Out .................................................................. 16

Calculation and Use of Parameters Example ......................... 17

Outline Dimensions ....................................................................... 18

Ordering Guide .......................................................................... 18

REVISION HISTORY

8/2020—Rev. 0 to Rev. A

Changes to Data Sheet Title and Features Section ...................... 1

6/2020—Revision 0: Initial Version

Data Sheet ADM3058E

Rev. A | Page 3 of 18

SPECIFICATIONS

All voltages are relative to their respective ground, 1.7 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless

otherwise noted. Typical specifications are at VDD1 = VDD2 = 5 V and TA = 25°C, unless otherwise noted.

Table 1.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

SUPPLY CURRENT

Bus Side IDD2

Recessive State 5.3 7 mA TXD high, load resistance (RL) = 60 Ω

Dominant State 63 75 mA Limited by transmit dominant timeout (tDT),

see the Theory of Operation section, RL = 60 Ω

70% Dominant/30% Recessive Worst case, see the Theory of Operation section,

RL = 60 Ω

1 Mbps 45 58 mA

5 Mbps 49 60 mA

12 Mbps 58 65 mA

Logic Side iCoupler Current IDD1 5.5 mA TXD high, low, or switching

DRIVER

Differential Outputs See Figure 17

Recessive State Voltage TXD high, RL, and common-mode filter

capacitor (CF) open

CANH, CANL VCANL,

VCANH

2.0 3.0 V

Differential Output VOD −500 +50 mV

Dominant State Voltage TXD low, CF open

CANH VCANH 2.75 4.5 V 50 Ω ≤ RL ≤ 65 Ω

CANL VCANL 0.5 2.0 V 50 Ω ≤ RL ≤ 65 Ω

Differential Output VOD 1.5 3.0 V 50 Ω ≤ RL ≤ 65 Ω

1.4 3.3 V 45 Ω ≤ RL ≤ 70 Ω

1.5 5.0 V RL = 2240 Ω

Output Symmetry (VDD2 − VCANH to

VCANL)

VSYM −0.55 +0.55 V RL = 60 Ω, CF = 4.7 nF

Short-Circuit Current |ISC| RL open

Absolute

CANH 115 mA VCANH = −3 V

CANL 115 mA VCANL = 18 V

Steady State

CANH 115 mA VCANH = −24 V

CANL 115 mA VCANL = 24 V

Logic Input TXD

Input Voltage

High VIH 0.65 ×

VDD1

Low VIL

0.35 ×

VDD1

Complementary Metal-Oxide

Semiconductor (CMOS) Logic Input

Currents

|IIH|, |IIL| 10 μA Input high or low

RECEIVER

Differential Inputs

Differential Input Voltage Range VID

See Figure 18, RXD capacitance (CRXD) open,

−25 V < VCANL, VCANH < +25 V

Recessive −1.0 +0.5 V

Dominant 0.9 5.0 V

ADM3058E Data Sheet

Rev. A | Page 4 of 18

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

Input Voltage Hysteresis VHYS 150 mV

Unpowered Input Leakage Current |IIN (OFF)| 10 μA VCANH, VCANL = 5 V, VDD2 = 0 V

Input Resistance

CANH, CANL RINH, RINL 6 25 kΩ See Figure 21

Differential RDIFF 20 100 kΩ See Figure 20

Input Resistance Matching mR −0.03 +0.03 mR = 2 × (RINH − RINL)/(RINH + RINL)

Input Capacitance

CANH, CANL CINH, CINL 35 pF See Figure 21

Differential CDIFF 12 pF See Figure 20

Logic Output (RXD)

Output Voltage

Low VOL 0.2 0.4 V Output impedance (IOUT) = 2 mA

High VOH VDD1 −

0.2

V IOUT = −2 mA

Short-Circuit Current IOS 7 85 mA Output voltage (VOUT) = GND1 or VDD1

COMMON-MODE TRANSIENT IMMUNITY1 Common-mode voltage (VCM) ≥ 1 kV, transient

magnitude ≥ 800 V

Input High, Recessive |CMH| 50 100 kV/μs

Input voltage (VIN) = VDD1 (TXD) or CANH/CANL

recessive

Input Low, Dominant |CML| 50 100 kV/μs VIN = 0 V (TXD) or CANH/CANL dominant

1 |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining CANH/CANL recessive or RXD ≥ VDD1 − 0.2 V. |CML| is the maximum

common-mode voltage slew rate that can be sustained while maintaining CANH/CANL dominant or RXD ≤ 0.4 V. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADM3058E

Rev. A | Page 5 of 18

TIMING SPECIFICATIONS

All voltages are relative to their respective ground, 1.7 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless

otherwise noted. Typical specifications are at VDD1 = VDD2 = 5 V and TA = 25°C, unless otherwise noted.

Table 2.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DRIVER See Figure 2 and Figure 17, tBIT_TXD1 = 200 ns, RL = 60 Ω,

load capacitance (CL) = 100 pF

Maximum Data Rate 12 Mbps

Propagation Delay from TXD to Bus

Recessive to Dominant tTXD_DOM 35 60 ns

Dominant to Recessive tTXD_REC 45 70 ns

Transmit Dominant Timeout tDT 1175 4000 μs TXD low, see Figure 3

RECEIVER See Figure 2 and Figure 19, tBIT_TXD = 200 ns, RL = 60 Ω,

CL = 100 pF, CRXD = 15 pF

Loop Propagation Delay

Falling Edge (TXD to RXD) tLOOP_FALL 155 ns

Rising Edge (TXD to RXD) tLOOP_RISE 155 ns

Loop Delay Symmetry (Minimum

Recessive Bit Width)

tBIT_RXD

2 Mbps 450 550 ns tBIT_TXD = 500 ns

5 Mbps 160 220 ns tBIT_TXD = 200 ns

8 Mbps 85 140 ns tBIT_TXD = 125 ns

12 Mbps 50 91.6 ns tBIT_TXD = 83.3 ns

1 tBIT_TXD is the bit time at the TXD pin as transmitted by the CAN controller.

Timing Diagrams

TXD

0.3VDD1 0.3VDD1

0.3VDD1

0.7

DD1

0.5V 0.9V

VDD1

5 × tBIT_TXD

tTXD_REC tTXD_DOM

tBIT_BUS

tBIT_RXD

tBIT_TXD

tLOOP_FALL

tLOOP_RISE

RXD

OD/VID

0.7VDD1

20135-002

Figure 2. Transceiver Timing Diagram

TXD

20135-003

Figure 3. Dominant Timeout, tDT

ADM3058E Data Sheet

Rev. A | Page 6 of 18

INSULATION AND SAFETY RELATED SPECIFICATIONS

For additional information, see www.analog.com/icouplersafety.

Table 3.

Parameter Symbol Value Unit Test Conditions/Comments

Rated Dielectric Insulation Voltage 5700 V rms 1-minute duration

Minimum External Air Gap (Clearance) L (I01) 8.3 mm min Measured from input terminals to output terminals, shortest

distance through air

Minimum External Tracking (Creepage) L (I02) 8.3 mm min Measured from input terminals to output terminals, shortest

distance path along body

Minimum Clearance in the Plane of the

Printed Circuit Board (PCB) Clearance

L (PCB) 8.3 mm min Measured from input terminals to output terminals, shortest

distance through air, line of sight, in the PCB mounting plane

Minimum Internal Gap (Internal

Clearance)

40 μm min Insulation distance through insulation

Tracking Resistance (Comparative

Tracking Index)

CTI >600 V DIN IEC 112/VDE 0303 Part 1

Material Group I Material group (DIN VDE 0110, 1/89, Table 1)

PACKAGE CHARACTERISTICS

Table 4.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

Resistance (Input to Output)1 R

I-O 1013 Ω

Capacitance (Input to Output)1 CI-O 0.9 pF f = 1 MHz

Input Capacitance2 C

I 4.0 pF

1 The device is considered a 2-terminal device: Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together.

2 Input capacitance is from any input data pin to ground.

REGULATORY INFORMATION

See Table 10 and the Insulation Lifetime section for the recommended maximum working voltages for specific cross isolation waveforms

and insulation levels. The ADM3058E is pending approval by the organizations listed in Table 5.

Table 5.

UL (Pending) CSA (Pending) VDE (Pending) CQC (Pending)

UL1577 Component

Recognition Program1

Approved under CSA Component

Acceptance Notice 5A

DIN V VDE V 0884-11

(VDE V 0884-11):2017-012

Certified under CQC11-

471543-2012

Single Protection, 5.7 kV rms

Isolation Voltage

CSA 60950-1-07+A1+A2 and

IEC 60950-1, second edition, +A1+A2:

Reinforced insulation,

1500 V peak, VIOTM = 8000 V

GB4943.1-2011

Basic insulation at 830 V rms (1137 V peak) Basic insulation at 830 V rms

(1137 V peak)

Reinforced insulation at 415 V rms

(587 V peak)

Reinforced insulation at

415 V rms (587 V peak)

IEC 60601-1 Edition 3.1:

Reinforced insulation (2 means of patient

protection (MOPP)), 261V rms (291 V dc)

CSA 61010-1-12 and IEC 61010-1 third edition:

Basic insulation at: 300 V rms mains, 830 V

secondary (1174 V peak)

Reinforced insulation at: 300 V rms mains,

415 V secondary (587 V peak)

File E214100 File 205078 File 2471900-4880-0001 File (pending)

1 In accordance with UL 1577, each ADM3058E is proof tested by applying an insulation test voltage ≥ 6840 V rms for 1 sec.

2 In accordance with DIN V VDE V 0884-11, each product is proof tested by applying an insulation test voltage ≥ 2813 V peak for 1 sec (partial discharge detection limit =

5 pC). The * marking branded on the component designates DIN V VDE V 0884-11 approval.

Data Sheet ADM3058E

Rev. A | Page 7 of 18

DIN V VDE V 0884-11 (VDE V 0884-11) INSULATION CHARACTERISTICS (PENDING)

These isolators are suitable for reinforced electrical isolation only within the safety limit data. Protective circuits ensure the maintenance

of the safety data.

Table 6. ADM3058E VDE Characteristics

Description Test Conditions/Comments Symbol Characteristic Unit

Installation Classification per DIN VDE 0110

For Rated Mains Voltage ≤ 150 V rms I to IV

For Rated Mains Voltage ≤ 300 V rms I to IV

For Rated Mains Voltage ≤ 600 V rms I to IV

Climatic Classification 40/125/21

Pollution Degree per DIN VDE 0110, Table

Maximum Working Insulation Voltage

Reinforced VIORM 1500 V peak

Basic, DC Working Voltage See the Absolute Maximum Ratings section and Table 10

for the maximum continuous working voltage for ac

bipolar, ac unipolar, and dc voltages, basic and

reinforced insulation, and 50-year lifetime to 1% failure

VIORM 1500 V peak

Input to Output Test Voltage, Method B1 VIORM × 1.875 = Vpd (m), 100% production test, tini = tm =

1 sec, partial discharge < 5 pC

Vpd (m) 2813 V peak

Input to Output Test Voltage, Method A Vpd (m)

After Environmental Tests Subgroup 1 VIORM × 1.5 = Vpd (m), tini = 60 sec, tm = 10 sec,

partial discharge < 5 pC

2250 V peak

After Input and/or Safety Test

Subgroup 2 and Subgroup 3

VIORM × 1.2 = Vpd (m), tini = 60 sec, tm = 10 sec,

partial discharge < 5 pC

1800 V peak

Highest Allowable Overvoltage VIOTM 8000 V peak

Impulse 1.2 μs rise time, 50 μs, 50% fall time in air to the

preferred sequence

VIMPULSE 8000 V peak

Surge Isolation Test Voltage Peak voltage (VPEAK) = 12.8 kV, 1.2 μs rise time, 50 μs, and

50% fall time

VIOSM 8000 V peak

Safety Limiting Values Maximum value allowed in the event of a failure (see

Figure 4)

Maximum Junction Temperature TS 150 °C

Total Power Dissipation at 25°C PS 1.28 W

Insulation Resistance at TS Test voltage = 500 V RS >109 Ω

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 50 100 150 200

SAFE LIMITING POWER (W)

AMBIENT TEMPERATURE (°C)

20135-004

Figure 4. Thermal Derating Curve, Dependence of Safety Limiting Values

with Ambient Temperature per DIN V VDE V 0884-11 (See the Thermal

Resistance Section for Additional Information)

ADM3058E Data Sheet

Rev. A | Page 8 of 18

ABSOLUTE MAXIMUM RATINGS

Pin voltages with respect to GND1/GND2 are on same side,

unless otherwise noted.

Table 7.

Parameter Rating

VDD1, VDD2 −0.5 V to +6 V

Logic Side Input and Output: TXD, RXD −0.5 V to VDD1 + 0.5 V

CANH, CANL −40 V to +40 V

Temperature

Industrial Operating Range −40°C to +125°C

Storage Range −65°C to +150°C

Maximum Junction (TJ) 150°C

Moisture Sensitivity Level (MSL) 3

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required.

θJA is the natural junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

Table 8. Thermal Resistance

Package Type1 θ

JA Unit

RI-8-1 97 °C/W

1 The thermocouple is located at the center of the package underside, and the

test was conducted on a 4-layer board with thin traces. See the Thermal

Analysis section for the thermal model definitions.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of

ESD sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

International Electrotechnical Commission (IEC) electromagnetic

compatibility: Part 4-2 (IEC) per IEC 61000-4-2.

ESD Ratings for ADM3058E

Table 9. ADM3058E, 8-Lead SOIC_IC

ESD Model Withstand Threshold (V) Class

HBM1 ±4 kV 3A

IEC2 ±8 kV (across isolation barrier with

respect to GND1

Level 4

IEC3 ±8 kV (contact discharge with respect to

GND2)

Level 4

±15 kV (air discharge with respect to

GND2

Level 4

1 All pins, 1.5 kΩ, 100 pF.

2 Across the isolation barrier, GND2 to GND1.

3 CANH/CANL.

ESD CAUTION

Table 10. Maximum Continuous Working Voltage1

Parameter Insulation Rating (20-Year Lifetime)2 VDE 0884-11 Lifetime Conditions Fulfilled

AC Voltage

Bipolar Waveform

Reinforced Insulation 1060 V peak Lifetime limited by insulation lifetime per VDE-0884-11

DC Voltage

Basic Insulation 1660 V peak Lifetime limited by package creepage per IEC 60664-1

Reinforced Insulation 830 V peak Lifetime limited by package creepage per IEC 60664-1

1 The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for

more details.

2 Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components

soldered to a PCB (assumes Material Group I up to 1250 V rms), or by the SOIC_IC package creepage of 8.3 mm, when considering rms voltages for Material Group II.

Data Sheet ADM3058E

Rev. A | Page 9 of 18

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

DD1 1

TXD

RXD

GND

DD2

CANH

CANL

GND

20135-005

ADM3058E

(Not to Scale)

TOP VIEW

Figure 5. Pin Configuration

Table 11. Pin Function Descriptions

Pin No. Mnemonic Description

1 VDD1 Power Supply, Logic Side, 1.7 V to 5.5 V. VDD1 requires a 0.1 μF decoupling capacitor.

2 TXD Driver Input Data.

3 RXD Receiver Output Data.

4 GND1 Ground, Logic Side.

5 GND2 Ground, Bus Side.

6 CANL CAN Low Input and Output.

7 CANH CAN High Input and Output.

8 VDD2 Power Supply, Bus Side, 4.5 V to 5.5 V. VDD2 requires a 0.1 μF decoupling capacitor.

Table 12. Operational Truth Table

VDD1 V

DD2 TXD Mode RXD CANH or CANL

On On Low Normal Low Dominant (limited by tDT)

On On High Normal High per bus Recessive and set by bus

Off On Don’t care Normal Indeterminate Recessive and set by bus

On Off Don’t care Transceiver off High High-Z

ADM3058E Data Sheet

Rev. A | Page 10 of 18

TYPICAL PERFORMANCE CHARACTERISTICS

0123456789101112131415

SUPPLY CURRENT, I

DD2

(mA)

DATA RATE (Mbps)

DD2

= 4.5V

DD2

= 5V

DD2

= 5.5V

20135-007

Figure 6. Supply Current (IDD2) vs. Data Rate

100

110

120

130

140

150

160

170

180

–55 –35 –15 5 25 45 65 85 105 125

RECEIVER INPUT HYSTERESIS (mV)

TEMPERATURE (°C)

20135-008

Figure 7. Receiver Input Hysteresis vs. Temperature

–55 –35 –15 5 25 45 65 85 105 125

TXD_DOM

(ns)

TEMPERATURE (°C)

DD1

= 5.0V

DD1

= 3.3V

DD1

= 2.5V

DD1

= 1.8V

20135-009

Figure 8. tTXD_DOM vs. Temperature

–55 –35 –15 5 25 45 65 85 105 125

TEMPERATURE (°C)

TXD_REC

(ns)

DD1

= 1.8V

DD1

= 2.5V

DD1

= 3.3V

DD1

= 5.0V

20135-010

Figure 9. tTXD_REC vs. Temperature

–55 –35 –15 5 25 45 65 85 105 125

TEMPERATURE (°C)

LOOP_RISE (ns)

100

105

110

115

120

125

130

135

VDD1 = 1.8V

VDD1 = 2.5V

VDD1 = 3.3V

VDD1 = 5.0V

20135-011

Figure 10. tLOOP_RISE vs. Temperature

–55 –35 –15 5 25 45 65 85 105 125

TEMPERATURE (°C)

tLOOP_FALL

(ns)

100

105

110

115

120

125

DD1

= 1.8V

DD1

= 2.5V

DD1

= 3.3V

DD1

= 5.0V

20135-012

Figure 11. tLOOP_FALL vs. Temperature

Data Sheet ADM3058E

Rev. A | Page 11 of 18

2.14

2.16

2.18

2.20

2.22

2.24

2.26

2.28

2.30

2.32

2.34

–55 –5 45 95

DIFFERENTI

L OUTPUT V

LTAGE (V)

TEMPERATURE (°C)

20135-013

Figure 12. Differential Output Voltage vs. Temperature, RL = 60 Ω

1.5

1.7

1.9

2.1

2.3

2.5

2.7

4.5 4.7 4.9 5.1 5.3 5.5

DIFFERENTIAL OUTPUT VOLTAGE (V)

SUPPLY VOLTAGE, V

DD2

(V)

20135-014

Figure 13. Differential Output Voltage vs. Supply Voltage (VDD2), RL = 60 Ω

1.4

1.6

1.8

2.0

2.2

2.4

2.6

2.8

–55 –35 –15 5 25 45 65 85 105 125

SUPPLY CURRENT, I

DD1

(mA)

TEMPERATURE (°C)

DD1

= 1.8V

DD1

= 2.5V

DD1

= 3.3V

DD1

= 5.0V

20135-015

Figure 14. Supply Current (IDD1) vs. Temperature

–55 –35 –15 5 25 45 65 85 105 125

TEMPERATURE (°C)

32.5

33.0

33.5

34.0

34.5

35.0

35.5

36.0

SUPPLY CURRENT, IDD2 (mA)

20135-016

Figure 15. Supply Current (IDD2) vs. Temperature

2100

2200

2300

2400

2500

2600

2700

2800

2900

–55 –35 –15 5 25 45 65 85 105 125

DOMINANT TIMEOUT,

(µs)

TEMPERATURE (°C)

20135-017

Figure 16. Dominant Timeout (tDT) vs. Temperature

ADM3058E Data Sheet

Rev. A | Page 12 of 18

TEST CIRCUITS

GND

CANH

CANL

20135-018

Figure 17. Driver Voltage Measurement

CRXD

RXD

GND1GND2

CANH

CANL

VID

20135-019

Figure 18. Receiver Voltage Measurement

RXD

GND

TXD

CANH

CANL

NOTES

1. 1% TOLERANCE FOR ALL RESISTORS AND CAPACITORS.

20135-020

Figure 19. Switching Characteristics Measurements

DIFF

GND

CANH

CANL

20135-021

Figure 20. RDIFF and CDIFF Measured in Recessive State, Bus Disconnected

INH

INL

GND

CANH

CANL

20135-022

Figure 21. Input Resistance (RINx) and Input Capacitance (CINx) Measured in

Recessive State, Bus Disconnected

Data Sheet ADM3058E

Rev. A | Page 13 of 18

TERMINOLOGY

IDD1

IDD1 is the current drawn by the VDD1 pin.

IDD2

IDD2 is the current drawn by the VDD2 pin.

VOD and VID

VOD and VID are the differential voltages from the transmitter or

at the receiver on the CANH and CANL pins.

tTXD_DOM

tTXD_DOM is the propagation delay from a low signal on TXD to

transition the bus to a dominant state.

tTXD_REC

tTXD_REC is the propagation delay from a high signal on TXD to

transition the bus to a recessive state.

tLOOP_FALL

tLOOP_FALL is the propagation delay of a low signal on the TXD pin to

the bus dominant. tLOOP_FALL transitions low on the RXD pin.

tLOOP_RISE

tLOOP_RISE is the propagation delay of a high signal on TXD to the

bus recessive. tLOOP_RISE transitions high on the RXD pin.

tBIT_TXD

tBIT_TXD is the bit time at the TXD pin as transmitted by the CAN

controller. See Figure 2 for level definitions.

tBIT_BUS

tBIT_BUS is the bit time as transmitted by the transceiver to the

bus. When compared with a given tBIT_TXD, a measure of bit

symmetry from the TXD digital isolation channel and CAN

transceiver can be determined. See Figure 2 for level definitions.

tBIT_RXD

tBIT_RXD is the bit time on the RXD output pin, which can be

compared with tBIT_TXD for a round trip measure of pulse width

distortion through the TXD digital isolation channel, the CAN

transceiver, and back through the RXD isolation channel.

ADM3058E Data Sheet

Rev. A | Page 14 of 18

THEORY OF OPERATION

CAN TRANSCEIVER OPERATION

The ADM3058E facilitates communication between a CAN

controller and the CAN bus. The CAN controller and the

ADM3058E communicate with standard 1.8 V, 2.5 V, 3.3 V,

or 5.0 V CMOS levels. The internal transceiver translates the

CMOS levels to and from the CAN bus.

The CAN bus has two states: dominant and recessive. The

recessive state is present on the bus when the differential voltage

between CANH and CANL is less than 0.5 V. In the recessive

state, both the CANH pin and CANL pin are set to high

impedance and are loosely biased to a single-ended voltage of

2.5 V. A dominant state is present on the bus when the

differential voltage between CANH and CANL is greater than

1.5 V. The transceiver transmits a dominant state by driving the

single-ended voltage of the CANH line to 3.5 V and the CANL

pin to 1.5 V. The recessive and dominant states correspond to

CMOS high and CMOS low, respectively, on the RXD pin and

TXD pin.

A dominant state from another node overwrites a recessive

state on the bus. A CAN frame can be set for higher priority by

using a longer string of dominant bits to gain control of the

CAN bus during the arbitration phase. While transmitting, a

CAN transceiver also reads back the state of the bus. When a

CAN controller receives a dominant state while transmitting a

recessive state during arbitration, the CAN controller surrenders

the bus to the node still transmitting the dominant state. The node

that gains control during the arbitration phase reads back only

its own transmission. This interaction between recessive and

dominant states allows competing nodes to negotiate for

control of the bus while avoiding contention between nodes.

Industrial applications can have long cable runs. These long

runs may have differences in local earth potential. Different

sources may also power nodes. The ADM3058E transceiver

has a ±25 V common-mode range (CMR) that exceeds the

ISO11898-2 requirement and further increases the tolerance

to ground variation.

See the AN-1123 Application Note for additional information

on CAN.

SIGNAL ISOLATION

The ADM3058E device provides galvanic signal isolation imple-

mented on the logic side of the interface. The RXD and TXD

channels are isolated using a low propagation delay on/off

keying (OOK) architecture with iCoupler digital isolation

technology.

The low propagation delay isolation, quick transceiver

conversion speeds, and integrated form factor are critical for

longer cable lengths, higher data speeds, and reducing the total

solution board space. The ADM3058E isolated transceiver

reduces solution board space while increasing data transfer

rates over discrete optocoupler and transceiver solutions.

INTEGRATED AND CERTIFIED IEC

ELECTROMAGNETIC COMPATIBILITY (EMC)

SOLUTION

Typically, designers must add protections against harsh operating

environments while also making the product as small as possible.

To reduce the board space and the design efforts needed to meet

system level ESD standards, the ADM3058E isolated transceiver

has robust protection circuitry on chip for the CANH and

CANL lines.

±40 V MISWIRE PROTECTION

High voltage miswire events commonly occur when the system

power supply is connected directly to the CANH and the CANL

bus lines during assembly. Supplies can also be shorted by

accidental damage to the field bus cables while the system is

operating. Accounting for inductive kick and switching effects,

the ADM3058E isolated transceiver CAN bus lines are protected

against these miswire or shorting events in systems with up to

nominal 24 V supplies. The CANH and CANL signal lines can

withstand a continuous supply short with respect to GND2 or

between the CAN bus lines without damage. This level of

protection applies when the device is either powered or

unpowered.

DOMINANT TIMEOUT

The ADM3058E features a dominant timeout (tDT in Figure 3). A

TXD line shorted to ground or malfunctioning CAN controller

are examples of how a single node can indefinitely prevent further

bus traffic. tDT limits how long the dominant state can transmit

to the CAN bus by the transceiver. The TXD function restores

when the line is presented with a logic low.

The tDT minimum also inherently creates a minimum data rate.

Under normal operation, the CAN protocol allows five consecutive

bits of the same polarity before stuffing a bit of opposite polarity

into the transmitting bit sequence. When an error is detected, the

CAN controller purposely violates the bit stuffing rules by

producing six consecutive dominant bits. At any given data rate,

the CAN controller must transmit as many as 11 consecutive

dominant bits to effectively limit the ADM3058E minimum

data rate to 9600 bps.

FAIL-SAFE FEATURES

In cases where the TXD input pin is allowed to float to prevent

bus traffic interruption, the TXD input channel has an internal

pull-up to the VDD1 pin. The pull-up holds the transceiver in the

recessive state.

Data Sheet ADM3058E

Rev. A | Page 15 of 18

THERMAL SHUTDOWN

The integrated transceiver is designed with thermal shutdown

circuitry to protect the device from excessive power dissipation

during fault conditions. Shorting the driver outputs to a low

impedance source can result in high driver currents. The thermal

sensing circuitry detects the increase in die temperature under

this condition and disables the driver outputs. The circuitry

disables the driver outputs when the die temperature reaches

175°C. The drivers are enabled after the die has cooled.

ADM3058E Data Sheet

Rev. A | Page 16 of 18

APPLICATIONS INFORMATION

RADIATED EMISSIONS AND PCB LAYOUT

The ADM3058E isolated CAN transceivers with integrated

dc-to-dc converters pass EN 55022, Class B by 6 dB on a simple

2-layer PCB design. Neither stitching capacitance nor high

voltage surface-mount technology (SMT) safety capacitors are

required to meet this emission level.

PCB LAYOUT

The ADM3058E isolated CAN transceiver requires no external

interface circuitry for the logic interfaces. Power supply

bypassing is required at the logic input supply (VDD1), and the

shared CAN transceiver and digital isolator supply pin (VDD2).

The recommended bypass capacitor value is 0.1 μF. Note that

low effective series resistance (ESR) bypass capacitors are

required and must be placed as close to the chip pads as possible.

The total lead length between both ends of the capacitor and

the input power supply pin must not exceed 10 mm.

In applications involving high common-mode transients,

minimize board coupling across the isolation barrier. Design

the board layout so that any coupling that does occur equally

affects all pins on a given component side. Failure to ensure this

equal coupling can cause voltage differences between pins

exceeding the absolute maximum ratings of the device, thereby

leading to latch-up or permanent damage.

0.1µ

TXD2

RXD3

GND1

VDD1 VDD2 8

CANH 7

CANL 6

GND25

20135-023

ADM3058E

Figure 22. Recommended PCB Layout

THERMAL ANALYSIS

The ADM3058E device consists of three internal die attached to a

split lead frame. For the purposes of thermal analysis, the die are

treated as a thermal unit, with the highest junction temperature

reflected in the θJA value from Table 8. The θJA value is based on

measurements taken with the devices mounted on a JEDEC

standard, 4-layer board with fine width traces and still air.

INSULATION LIFETIME

All insulation structures eventually break down when subjected

to voltage stress over a sufficiently long period of time. The rate

of insulation degradation is dependent on the characteristics of

the voltage waveform applied across the insulation as well as on

the materials and material interfaces.

The two types of insulation degradation of primary interest are

breakdown along surfaces exposed to air and insulation wear

out. Surface breakdown is the phenomenon of surface tracking

and is the primary determinant of surface creepage

requirements in system level standards. Insulation wear out

is the phenomenon where charge injection or displacement

currents inside the insulation material cause long-term

insulation degradation.

SURFACE TRACKING

Surface tracking is addressed in electrical safety standards by

setting a minimum surface creepage based on the working

voltage, the environmental conditions, and the properties of the

insulation material. Safety agencies perform characterization

testing on the surface insulation of components, allowing the

components to be categorized in different material groups.

Lower material group ratings are more resistant to surface

tracking and can therefore provide adequate lifetime with

smaller creepage. The minimum creepage for a given working

voltage and material group is in each system level standard and

is based on the total rms voltage across the isolation, pollution

degree, and material group.

The material group and creepage for the ADM3058E isolator is

listed in Table 3 for the 8-lead, wide body SOIC package.

INSULATION WEAR OUT

The lifetime of insulation caused by wear out is determined by

its thickness, material properties, and the voltage stress applied.

It is important to verify that the product lifetime is adequate at

the application working voltage. The working voltage supported by

an isolator for wear out may not be the same as the working

voltage supported for tracking. The working voltage applicable

to tracking is specified in most standards.

Testing and modeling have shown that the primary driver of

long-term degradation is displacement current in the polyimide

insulation causing incremental damage. The stress on the

insulation can be broken down into broad categories, such as

dc stress, which causes little wear out because there is no

displacement current, and an ac component time varying voltage

stress, which causes wear out.

The ratings in certification documents are usually based on

60 Hz sinusoidal stress because this reflects isolation from line

voltage. Many practical applications have combinations of 60 Hz

ac and dc across the barrier, as shown in Equation 1. Because

only the ac portion of the stress causes wear out, the equation

can be rearranged to solve for the ac rms voltage, as shown in

Equation 2. For insulation wear out with the polyimide materials

used in this product, the ac rms voltage determines the product

lifetime.

RMS AC RMS DC

VV V

(1)

DCRMSRMSAC VVV



(2)

where:

VRMS is the total rms working voltage.

VAC RMS is the time varying portion of the working voltage.

VDC is the dc offset of the working voltage.

Data Sheet ADM3058E

Rev. A | Page 17 of 18

CALCULATION AND USE OF PARAMETERS

EXAMPLE

The following example frequently arises in power conversion

applications. Assume that the line voltage on one side of the

isolation is 240 V ac rms and a 400 V dc bus voltage is present

on the other side of the isolation barrier. The isolator material

is polyimide. To establish the critical voltages in determining

the creepage, clearance, and lifetime of a device, see Figure 23

and the following equations.

ISOLATION VOLTAGE

TIME

AC RMS

RMS

PEAK

20135-024

Figure 23. Critical Voltage Example

The working voltage across the barrier from Equation 1 is

RMS AC RMS DC

VV V

22 400240 

RMS

VRMS = 466 V

This VRMS value is the working voltage used together with the

material group and pollution degree when looking up the creepage

required by a system standard.

To determine if the lifetime is adequate, obtain the time varying

portion of the working voltage. To obtain the ac rms voltage,

VAC RMS, use Equation 2.

DCRMSRMSAC VVV 

22 400466 

RMSAC

VAC RMS = 240 V rms

In this case, VAC RMS is simply the line voltage of 240 V rms. This

calculation is more relevant when the waveform is not sinusoidal.

The value is compared to the limits for working voltage in Table 10

for the expected lifetime, which is less than a 60 Hz sine wave,

and is well within the limit for a 50-year service life.

Note that the dc working voltage limit is set by the creepage of

the package as specified in IEC 60664-1. This value can differ

for specific system level standards.

ADM3058E Data Sheet

Rev. A | Page 18 of 18

OUTLINE DIMENSIONS

09-17-2014-B

SEATING

PLANE

COPLANARITY

0.10

1.27 BSC

1.04

BSC

6.05

5.85

5.65

7.60

7.50

7.40

2.65

2.50

2.35

0.75

0.58

0.40

0.30

0.20

0.10

2.45

2.35

2.25

10.51

10.31

10.11

0.51

0.41

0.31

PIN 1

MARK

8°

0°

0.33

0.27

0.20

0.75

0.50

0.25

45°

Figure 24. 8-Lead Standard Small Outline Package, with Increased Creepage [SOIC_IC]

Wide Body

(RI-8-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option

ADM3058EBRIZ −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_IC] RI-8-1

ADM3058EBRIZ-RL −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_IC] RI-8-1

EVAL-ADM3058EEBZ Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D20135-8/20(A)