Ver 201207
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
10 1.6
±0.15 0.8
±0.15 0.6±0.15,
0.8±0.15 0.3
±0.2
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For EMI
EMIEMI
EMI Suppression
SuppressionSuppression
Suppression
RECOMMENDED LAND PATTERN
CIS10P Series (1608/ EIA 0603)
Smallest beads used in high current.
CIS series is used for high current. (~ 6A)
Part No. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIS10P260AC 0.6±0.15 26 0.007 6000
CIS10P300AC 0.6±0.15 30 0.01 6000
CIS10P700AC 0.6±0.15 70 0.02 4000
CIS10P101AC 0.6±0.15 100 0.03 3000
CIS10P121AC 0.6±0.15 120 0.03 3000
CIS10P181AC 0.6±0.15 180 0.04 2500
CIS10P221NC 0.8±0.15 220 0.05 2500
CIS10P301NC 0.8±0.15 300 0.07 2000
CIS10P331NC 0.8±0.15 330 0.07 1700
CIS10P391NC 0.8±0.15 390 0.10 1200
CIS10P471NC 0.8±0.15 470 0.13 1500
CIS10P601NC 0.8±0.15 600 0.15 1300
Noise Suppression in power line
0.6~0.8mm
0.6~0.8mm 0.6~0.8mm
0.6~0.8mm
Ver 201207
CHARACTERISTIC DATA
Ver 201207
CI S 10 P 300 A C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) Ultra high current (~6A)
(3) Dimension (4) Material Code
(5) Nominal impedance (300:30Ω, 121:120Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
REFLOW SOLDERING FLOW SOLDERING
