High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: C
REV DATE: MAY 31, 2016
PAGE NO.: 1 OF 5
Specification Status: Released
PIN CONFIGURATION AND DESCRIPTION:
Pth
P Arm
P1
D2 хххх
Note: D2 is product code
xxxx is Batch code
TABLE 1. DIMENSIONS:
A
B
C
D
E
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
mm
11.35
11.85
3.00
3.70
5.70
6.40
7.90
8.40
1.30
1.60
in:
(0.447)
(0.467)
(0.118)
(0.146)
(0.224)
(0.252)
(0.311)
(0.331)
(0.051)
(0.063)
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: C
REV DATE: MAY 31, 2016
PAGE NO.: 2 OF 5
TABLE 2. ABSOLUTE MAX RATINGS:
Absolute Max Ratings
Max
Units
Conditions
Max DC Open Voltage 1
16
VDC
Max DC Interrupt Current 1
500
A
@ 16 VDC
ESD rating (Human Body Model)
25
KV
Max Reflow Temperature (pre-arming)
260
°C
Operating temperature limits, Junction
(Pth) and Storage Temperature
-55
150
°C
175
°C
10A, 100 h
1. Performance capability at these conditions can be influenced by board design. Performance should be
verified in the user’s system.
TABLE 3. PERFORMANCE CHARACTERISTICS (Typical unless otherwise specified):
Resistance and Open Characteristics
P1 to PTH
Min
Typ
Max
Units
RPP (Resistance from P1 to PTH)
@ 23+/-3°C
100
150
µΩ
@ 150+/-3°C
150
250
Operating Voltage
16
VDC
Open Temperature, post-arming
IPP = 0
202
210
218
°C
Installation dependent Operating Current, post-
arming 2
@ 23+/-3°C
90
A
@ 140+/-3°C
45
Moisture Sensitivity Level Rating 3
1
2. Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with 4.0 oz Copper trace.
RTP device pad connection of:
- 283 sq. mm 4.0 oz copper heat spreader connected to I P1 pad.
- 237 sq. mm 4.0 oz copper heat spreader connected to I PTH pad.
Results are highly installation-dependent. Users should confirm for their own applications.
3. As per JEDEC J-STD-020C
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: C
REV DATE: MAY 31, 2016
PAGE NO.: 3 OF 5
TABLE 4. ARMING CHARACTERISTICS:
Arming Characteristics
ARM
Min
Typ
Max
Units
Arming Type
Electronically Armed
RARM (Resistance from ARM to P1 or PTH)
Pre-Arming
500
mΩ
Post-Arming
10
KΩ
Arming Current (IARM) 4
@ 23 +/-3°C
2
5
A
Arming Time (@23 +/-3°C) 4
@ 2A
0.020
Sec
@ 5A
0.005
4. Results obtained on 44.4mm x 57.2mm x 1.6mm of 2-sided FR4 board T4350 with 4.0 oz Copper trace.
RTP device pad connection of:
- 283 sq. mm 4.0 oz copper heat spreader connected to I P1 pad.
- 237 sq. mm 4.0 oz copper heat spreader connected to I PTH pad.
Solder Reflow Recommendation:
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: C
REV DATE: MAY 31, 2016
PAGE NO.: 4 OF 5
Recommended Pad Layout (dimensions in mm):
Package Information (dimensions are in mm):
High Current Reflowable
Thermal Protection Device
PRODUCT: RTP200HR010SA
DOCUMENT: SCD28246
REV LETTER: C
REV DATE: MAY 31, 2016
PAGE NO.: 5 OF 5
B
W1
W2 Max
mm
(inch)
102.0 ± 2.0
(4.0 ± 0.079)
24
(0.945)
29
(1.14)
Precedence: This specification takes precedence over documents referenced herein.
Effectivity: Reference documents shall be the issue in effect on the date of invitation for bid.
Important Installation Instructions:
Note 1: RTP200HR010SA devices are to be board-mounted using only solder pastes referenced in Engineering Report: Q40213
Note 2: RTP200HR010SA devices are not compatible with conformal coating. If selective coatings are used, avoid covering the
RTP200HR010SA device.
MATERIALS INFORMATION
RoHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
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HF
