1. General description
The TFA9810 is a two-channel power comparator for high-efficiency class D audio
amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive
logic, protection control logic and full differential input comparators. By using this power
comparator a compact closed-loop self-oscillating digital amplifier system or open-loop
system can be built. The TFA9810 does not require a heat sink and operates using an
asymmetrical supply voltage.
2. Features
nStereo full-bridge power comparator for class D audio amplifier applications
nNo external heat sink required
nOperating voltage range: asymmetrical from 8 V to 20 V
nThermally protected
nZero dead-time switching
nCurrent-limiting (no audible interruptions)
3. Applications
nSelf-oscillating or open-loop class D audio amplifier applications
nFlat-panel television sets
nFlat-panel monitors
nMultimedia systems
nWireless speakers
nHigh-end CRT television sets
4. Quick reference data
TFA9810
Stereo full-bridge audio amplifier 2 x 12 W
Rev. 03 — 20 February 2008 Product data sheet
Table 1. Quick reference data
T
amb
= 25
°
C; V
P
= 12 V; f
osc
= 550 kHz; Figure 33 unless otherwise specified
Symbol Parameter Condition Min Typ Max Unit
VPsupply voltage VP = VDDPx − VSSPx 81220V
Ioff off-state current off mode - 110 200 µA
Iqquiescent current with load, filter and
snubbers connected -3545mA
ηpo output power
efficiency output power
2 x 9 W into 8 Ω;
Po=P
o(nom)
87 89 - %
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 2 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
5. Ordering information
Po(RMS) RMS output power RL = 8 Ω; VP = 12 V;
THD = 10 %;Twochannel
driven; no heat sink
required.
- 9.5 - W
Pooutput power VP = 12 V; RL = 8 Ω----
THD = 10 % 8.5 9.5 - W
THD = 1 % 6.5 7.5 - W
VP = 14 V; RL= 8 Ω;
THD = 10 %; thermally
limited
-15-W
VP = 16 V; RL= 8 Ω;
THD = 10 %; thermally
limited
-15-W
VP = 12 V; RL= 6 Ω;
THD = 10 %; thermally
limited
-12-W
VP = 12 V; RL = 4 Ω;
THD = 10 %; thermally
limited
-15-W
Table 1. Quick reference data
…continued
T
amb
= 25
°
C; V
P
= 12 V; f
osc
= 550 kHz; Figure 33 unless otherwise specified
Symbol Parameter Condition Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TFA9810T SO32 SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 3 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
6. Block diagram
Fig 1. Block diagram
27
26
25
30
29
28
VDDP1
VSSP1
22
BOOT1P
VDDP1
OUT1P
VSSP1
BOOT1N
OUT1N
STAB1
BOOT2P
STABI1
CONTROL
LOGIC 23
24
19
DRIVER
HIGH
20
21
VDDP2
VSSP2
VDDP2
OUT2P
VSSP2
BOOT2N
OUT2N
STAB2
STABI2
VDDA1
IN1P
IN1N
VSSA1
VDDA2
IN2P
IN2N
VSSA2
REFERENCE
PROTECTION
OVP
UVP
OCP
OTP
ODP
WP
HEATSPREADER
COMPARATOR 1
COMPARATOR 2
SO/OL
ENABLE
CDELAY
DIAG
TEST 11
4
2
3
5
10
6
7
8
13
15
14
12
1161732
VSSD(HW)
9
n.c.
TFA9810
010aaa016
CONTROL
LOGIC
DRIVER
HIGH
DRIVER
LOW
DRIVER
LOW
CONTROL
LOGIC
CONTROL
LOGIC
DRIVER
HIGH
DRIVER
LOW
DRIVER
HIGH
DRIVER
LOW
18
31
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 4 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
7. Pinning information
7.1 Pinning
The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally
connected to the die pad and must be connected to VSSA in the application. Together with
the applied copper area on the Printed Circuit Board (PCB) these leads determine the
ambient temperature, which affects the thermal resistance of the junction.
7.2 Pin description
Fig 2. Pin configuration
TFA9810
SO32
VSSD(HW) VSSD(HW)
IN1P STAB1
IN1N VSSP1
VDDA1 BOOT1N
VSSA1 OUT1N
SO/OL BOOT1P
ENABLE OUT1P
CDELAY VDDP1
n.c. VDDP2
DIAG OUT2P
TEST BOOT2P
VSSA2 OUT2N
VDDA2 BOOT2N
IN2N VSSP2
IN2P STAB2
VSSD(HW) VSSD(HW)
010aaa017
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
18
17
20
19
22
21
24
23
26
25
32
31
30
29
28
27
Table 3. Pin description
Symbol Pin Description
VSSD(HW) 1, 16, 17,
32 Negative digital supply voltage and handle wafer
IN1P 2 Positive input comparator channel 1
IN1N 3 Negative input comparator channel 1
VDDA1 4 Positive analog supply voltage channel 1
VSSA1 5 Negative analog supply voltage channel 1
SO/OL 6 SO/OL input enables self-oscillating / open-loop configuration
ENABLE 7 Enable input to switch between SLEEP and OPERATING
CDELAY 8 CDELAY input determines the switch on/off timing
n.c. 9 Not connected
DIAG 10 Diagnostic output; open drain
TEST 11 Test signal input; for testing purposes only
VSSA2 12 Negative analog supply voltage channel 2
VDDA2 13 Positive analog supply voltage channel 2
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 5 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
8. Functional description
8.1 General
The TFA9810 is a dual-switching power comparator. It is the main building block for a
stereo high-efficiency Class D audio power amplifier system. It contains two full-bridge
BTL power stages, drive logic, protection-control logic and full differential input
comparators and references (see Figure 1). By using this power comparator a compact
closed-loop self-oscillating digital amplifier system or open-loop system can be built. A
second-order low-pass filter converts the Pulse Width Modulation (PWM) output signal
into an analog audio signal across the speaker.
8.2 Interfacing
The pins ENABLE and SO/OL control the operating mode of the TFA9810. Both the
ENABLE and the SO/OL pins refer to VSSD(HW).
When the SO/OL pin is connected to VSSA the TFA9810 is in self-oscillating mode: when
the SO/OL pin is floating the TFA9810 is in open-loop mode.
The TEST pin needs to be connected to VDDA in both situations.
The device has two modes: SLEEP and OPERATING.
IN2N 14 Negative input comparator channel 2
IN2P 15 Positive input comparator channel 2
STAB2 18 Decoupling of internal 11 V regulator for channel 2 drivers
VSSP2 19 Negative power-supply voltage channel 2
BOOT2N 20 Bootstrap high-side driver negative output channel 2
OUT2N 21 Negative output channel 2
BOOT2P 22 Bootstrap high-side driver positive output channel 2
OUT2P 23 Positive output channel 2
VDDP2 24 Positive supply voltage power channel 2
VDDP1 25 Positive power supply voltage channel 1
OUT1P 26 Positive output channel 1
BOOT1P 27 Bootstrap high-side driver positive output channel 1
OUT1N 28 Negative output channel 1
BOOT1N 29 Bootstrap high-side driver negative output channel 1
VSSP1 30 Negative supply voltage power channel 1
STAB1 31 Decoupling of internal 11 V regulator for channel 1 drivers
Table 3. Pin description
…continued
Symbol Pin Description
Table 4. SO/OL connections
Interfacing
SO/OL connected to Configuration
VSSD(HW) Self-oscillating
Open Open-loop
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 6 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
In SLEEP mode the TFA9810 is not biased and has a very low supply current.
When the TFA9810 is set to OPERATING mode the device is started via the start-up
sequence, which provides a pop-free start-up behavior. After start-up the reference
voltages STAB are present and the outputs start switching.
8.3 Input comparators
The input stages have a differential input and are optimized for low noise and low offset.
This results in maximum flexibility in the application.
8.3.1 Operating in self-oscillating configuration
The inputs (IN1P, IN1N, IN2P, IN2N) of the comparators are internally set to a voltage level
of 0.5VP, but only during the start-up sequence. In operating mode the inputs are
high-ohmic.
8.3.2 Operating in open-loop configuration
No internal voltages are applied to the inputs. The input pins (IN1P, IN1N, IN2P, IN2N) are
pulled down to VSSA level by internal resistors.
8.4 Diagnostic
The DIAG output is an open-drain output. The maximum current is 2 mA. Whenever one
of the protections is triggered the DIAG output is activated low. The DIAG output refers to
VSSD.
8.5 Protections
Overtemperature, overcurrent, overvoltage, undervoltage, overdissipation sensors, and
window protection are included in the TFA9810. When one of these sensors exceeds its
threshold level either the output power stage is switched off and the outputs (OUT1N,
OUT1P, OUT2N, OUT2P) become floating, or the TFA9810 shuts down and starts up
immediately.
•OverTemperature Protection (OTP)
If the junction temperature (Tj) exceeds a threshold level of about 150 °C then the
outputs become floating. The device will start switching again after 5 µs and when the
temperature is below 150 °C. This is thermal limitation without audible interruptions.
•OverCurrent Protection (OCP)
If the output current exceeds the maximum output current threshold level the output
becomes floating. The device will start switching again after 5 µs. This is current
limitation without audible interruptions.
Table 5. Start-up
Interfacing
ENABLE [V] Mode
ENABLE < 0.8 V SLEEP
ENABLE > 3 V OPERATING
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 7 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
•OverVoltage Protection (OVP)
When the supply voltage applied to the TFA9810 exceeds the maximum supply
voltage threshold level the device will shut down. The device will restart when the
supply voltage is within the operating range.
•UnderVoltage Protection (UVP)
When the supply voltage applied to the TFA9810 falls below the minimum supply
voltage threshold level the device will shut down. The device will restart when the
supply voltage is within the operating range.
•OverDissipation Protection (ODP)
The ODP in the TFA9810 is a combination of two protections. Exceeding a
temperature threshold level of 135 °C an internal pre-warning is generated. When an
overcurrent is detected during the pre-warning the device will shut down. When the
ENABLE pin is high the TFA9810 will restart automatically. The restart sequence
(switch-off → switch-on) will take 200 ms to 500 ms.
•Window Protection (WP)
During start-up, if one of the outputs is shorted to VSS or VDD the device will not start.
This is an effective measure to protect the device against shorts between the outputs
(before the filter) and the ground or supply lines. The supply must be switched off prior
to removing any short. The WP protects the device against failure during board
assembly.
Table 6. Overview protections
Protections
Symbol Condition DIAG Outputs Recovering
OTP Tj > 150 °C LOW Floating Automatic, after 5 µs and Tj < 150 °C
OCP IO > IORM LOW Floating Automatic, after 5 µs and IO < IORM
OVP VP > 20 V LOW Floating Restart (switch-off → switch-on when VP< 20 V)
UVP VP < 8 V LOW Floating Restart (switch-off → switch-on when VP> 8 V)
ODP Tj > 135 °C and IO > IORM LOW Floating Restart (switch-off → switch-on when
Tj< 135 °CorI
O<I
ORM)
WP OUTX > VDDA - 1 V or
OUTX < VSSA + 1 V LOW
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 8 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
8.6 Start-up sequence
9. Internal circuitry
Fig 3. Start-up sequence
SLEEP START-UP OPERATING FAULT RESTART OPERATING SHUT-DOWN SLEEP
FLOATING
AUDIO
PWM
010aaa018
AUDIO
PWM
FLOATING
VP
ENABLE
STAB1
CDELAY
V IN x
OUT x
AUDIO
DIAG
Fig 4. Internal circuitry 0001
22 V
VDDA
VSSA
1,16, 17, 32
010aaa024
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 9 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 5. Internal circuitry 0002
Fig 6. Internal circuitry 0003
Fig 7. Internal circuitry 0004
hvp VSSA
135 kΩ
135 kΩ
5.5 V
5.5 V
VSSA1
VDDA1
2
3
010aaa025
22 V
4
5
010aaa026
110 kΩ
6
VSSA
010aaa027
VDDA1
VSSA1
VDDA1
50 µA
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 10 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 8. Internal circuitry 0005
Fig 9. Internal circuitry 0006
Fig 10. Internal circuitry 0007
3 kΩ
VSSA
250 nA
7
VDDA1
010aaa028
8
VDDA1
DISCHARGE
VSSA1
010aaa029
2 nA
200 nA 5 kΩ
VDDA1
VSSA1 V
SSD
10
010aaa030
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 11 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 11. Internal circuitry 0008
Fig 12. Internal circuitry 0009
Fig 13. Internal circuitry 0010
Fig 14. Internal circuitry 0011
VDDA1
VSSA1
11
010aaa031
13 kΩ
VSSA2
VDDA2
14
15
hvp
130 kΩ
130 kΩ
VSSA2
010aaa033
5.5 V
5.5 V
VSSD
100 mA
18
VDDA2
12 V
010aaa034
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 12 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 15. Internal circuitry 0012
Fig 16. Internal circuitry 0013
Fig 17. Internal circuitry 0014
Fig 18. Internal circuitry 0015
19
24
23.5 V
010aaa035
12 V
OUT2N
20
010aaa036
VDDP2
21
VSSP2
010aaa037
12 V
OUT2P
22
010aaa038
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 13 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 19. Internal circuitry 0016
Fig 20. Internal circuitry 0017
Fig 21. Internal circuitry 0018
Fig 22. Internal circuitry 0019
VDDP2
23
VSSP2
010aaa039
23.5 V
25
30
010aaa040
VDDP1
26
VSSP1
010aaa041
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 14 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
10. Limiting values
Fig 23. Internal circuitry 0020
Fig 24. Internal circuitry 0021
Fig 25. Internal circuitry 0022
VDDP1
28
VSSP1
010aaa043
12 V
OUT1N
29
010aaa044
VSSD
100 mA
31
VDDA1
12 V
010aaa045
Table 7. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VPsupply voltage asymmetrical −0.3 +23 V
IORM repetitive peak output current 3 - A
Tjjunction temperature - +150 °C
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Pmax maximum power dissipation - 2.5 W
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 15 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
11. Thermal characteristics
[1] Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.
[2] Strongly depends on where the measurement is taken on the case.
12. Characteristics
12.1 Static characteristics
Vxvoltage on pin x DIAG VSS − 0.3 +12 V
IN1P - IN1N −12 +12 V
IN2P - IN2N −12 +12 V
all other pins VSS − 0.3 VDD + 0.3 V
Vesd electrostatic discharge voltage VINX with
respect to
other pins
−1500 +1500 V
all other pins −2000 +2000 V
Table 7. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 8. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance
from junction to
ambient
SO32. JEDEC test board
SO32. Two-layer application
board
[1] -
-41
44 44
-K/W
K/W
Ψj-lead thermal
characterization
parameter from
junction to lead
SO32 [1] 30 K/W
Ψj-top thermal
characterization
parameter from
junction to top of
package
SO32 [1] [2] 4 8 K/W
Table 9. Static characteristics
T
amb
= 25
°
C; V
P
= 12 V; f
osc
= 550 kHz; Figure 33 unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Supply voltage
VPsupply voltage VP = VDDPx − VSSPx 8 1220V
Ioff off-state current off mode - 110 200 µA
Iqquiescent current with load, filter, and snubbers
connected - 3545mA
ENABLE input
VIL LOW-level input voltage with respect to VSSD −0.3 - +0.8 V
VIH HIGH-level input voltage with respect to VSSD 3- V
PV
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 16 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
[1] Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop.
12.2 Dynamic characteristics
IIinput current VI = 5 V - 1 20 µA
SO/OL input
VIL LOW-level input voltage with respect to VSSD - - 0.4 V
VIH HIGH-level input voltage with respect to VSSD 3 4 4.5 V
STABI
VSTABI voltage on pin STABI with respect to VSS 10 11 12 V
Comparator full-differential input stage
Voffset(i)(eq) equivalent input offset
voltage --1mV
20 Hz < f < 20 kHz - - 15 µV
Vcm common mode voltage VSSA + 3 - VDDA −1V
IIB input bias current - - 1 µA
OverTemperature Protection (OTP)
Tprot protection temperature 150 - - °C
OverVoltage Protection (OVP)
Vth(ovp) overvoltage protection
threshold voltage level internal fixed 20 21.5 23 V
UnderVoltage Protection (UVP)
VP(uvp) undervoltage protection
supply voltage level internal fixed 7 7.5 8 V
OverCurrent Protection (OCP)
IO(ocp) overcurrent protection
output current [1] 3 3.5 - A
Window Protection (WP)
VOoutput voltage high level - VDDA − 1- V
low level - VSSA + 1 - V
Table 9. Static characteristics
…continued
T
amb
= 25
°
C; V
P
= 12 V; f
osc
= 550 kHz; Figure 33 unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Table 10. Dynamic characteristics
T
amb
= 25
°
C; V
P
= 12 V; R
L
= 8
Ω
;Figure 33 unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
PWM output
trrise time - 10 - ns
tffall time - 10 - ns
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 17 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
[1] High-side and low-side power switch have the same series resistance.
[2] Output power measured across the loudspeaker load. Output power is measured indirectly via RDSon.
12.3 AC characteristics measured in a typical application
tresp response time transition PWM output from
LOW to HIGH
VI = 70 mV
VI = 3.3 V
-
-60
50 -
-ns
ns
transition PWM output from
HIGH to LOW
VI = 70 mV
VI = 3.3 V
-
-60
50 -
-ns
ns
tw(min) minimum pulse width PWM output - 60 - ns
RDSon drain-source on-state
resistance [1] - 0.28 0.35 Ω
ηpo output power
efficiency output power 2x9Winto 8 Ω.
Po= Po(nom)
[2] 87 89 - %
Table 10. Dynamic characteristics
…continued
T
amb
= 25
°
C; V
P
= 12 V; R
L
= 8
Ω
;Figure 33 unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 11. AC characteristics measured in typical application
T
amb
= 25
°
C; V
P
= 12 V; R
L
= 8
Ω;
f
osc
= 550 kHz; Figure 33 unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VPsupply voltage VP= VDDPx − VSSPx 8 1220V
Po(RMS) RMS output power RL = 8 Ω; VP = 12 V;
THD = 10 %; Two channel
driven; no heat sink required.
- 9.5 - W
Pooutput power VP= 12 V; RL= 8 Ω
THD = 10 % 8.5 9.5 - W
THD = 1 % 6.5 7.5 - W
VP = 14 V; RL= 8 Ω;
THD = 10 %; thermally limited -12-W
VP= 16 V; RL = 8 Ω;
THD = 10 %; thermally limited -15-W
VP = 12 V; RL = 6 Ω;
THD = 10 %; thermally limited -12-W
VP = 12 V; RL = 4 Ω;
THD = 10 %; thermally limited -15-W
THD+N total harmonic
distortion-plus-noise Po is 1 W; f = 1 kHz; AES17
brick-wall filter - 0.04 0.1 %
ηpo output power
efficiency Po = 9 W 87 89 - %
Gv(cl) closed-loop voltage
gain VI = 100 mV (RMS); fi= 1 kHz 19 19.7 21 dB
Vn(o) output noise voltage Inputs shorted;
AES17 brick-wall filter - 150 - µV
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 18 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
[1] Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling −1 %.
13. Quality specification
In accordance with SNW-FQ-611-E, ‘if this type is used as an audio amplifier’. The
number of the quality specification can be found in the Quality Reference Handbook. The
handbook can be ordered using the code 9398 510 63011.
14. Application information
14.1 Output power estimation
For BTL configuration the output power just before clipping can be estimated using
Equation 1:
(1)
Where,
•VP= supply voltage (VDDPx −VSSPx) [V]
•RL = load resistance [Ω]
•RDSon = drain-source on-state resistance [Ω]
•Rs = series resistance [Ω]
•Po0.5 % = output power at the THD level of 0.5 % [W]
The output power at 10 % THD can be estimated by using Equation 2:
(2)
Figure 26 and Figure 27 below show the estimated output power at THD = 0.5 % and
THD = 10 % as a function of the BLT supply voltage for different load impedances.
S/N signal-to-noise ratio Vo= 10 V (RMS); gain 20 dB - 96 - dB
SVRR supply voltage ripple
rejection Vripple = 2 V(p-p); fi= 1 kHz [1] 34 45 - dB
αcs channel separation Po = 1 W; fi = 1 kHz 55 70 - dB
Table 11. AC characteristics measured in typical application
…continued
T
amb
= 25
°
C; V
P
= 12 V; R
L
= 8
Ω;
f
osc
= 550 kHz; Figure 33 unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
BTL : Po0.5 %
RL
RL2+RDSon Rs
+()×
------------------------------------------------------VP
×2
2R
L
×
---------------------------------------------------------------------------------
=
Po10 % 1.25 P×o0.5 %
=
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 19 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
14.2 Output current limiting
The peak output current is internally limited above a level of 3 A minimum. During normal
operation the output current should not exceed this threshold level of 3 A, otherwise the
output signal will be distorted. The peak output current in BTL can be estimated using
Equation 3:
(3)
Where:
•VP = supply voltage (VDDPx −VSSPx) [V].
(1) RL = 4 Ω
(2) RL = 6 Ω
(3) RL= 8 Ω
Fig 26. BTL output power as function of supply voltage: THD = 0.5 %. 3 A
(1) RL = 4 Ω
(2) RL = 6 Ω
(3) RL = 8 Ω
Fig 27. BTL output power as function of supply voltage: THD = 10 %. 3 A
(1)
(2)
(3)
VP (V)
8 201612
010aaa019
10
15
5
20
25
Po
(W)
0
(1)
(2)
(3)
VP (V)
8 201612
010aaa020
10
20
30
Po
(W)
0
IOmax VP
RL2R
DSon Rs
+()×+
------------------------------------------------------3 A≤≤
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 20 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
•RL = load resistance [Ω].
•RDSon = drain-source on-state resistance [Ω].
•Rs = series resistance [Ω].
Example:
A 4 Ω speaker in BTL configuration can be used up to a supply voltage of 12 V without
running into current limiting. Current limiting (clipping) will avoid audio holes, but it causes
a sound distortion similar to voltage clipping.
14.3 Speaker configuration and impedance
For a flat-frequency response (second-order Butterworth filter) it is necessary to change
the low-pass filter components LLC and CLC according to the speaker configuration and
impedance. Table 12 shows the practical required values:
14.4 Differential input
For a high common-mode rejection ratio and a maximum of flexibility in the application,
the audio inputs of the application are fully differential.
The input configuration for a differential-input application is illustrated in Figure 28.
14.5 Single-ended input
When using an audio source with a single-ended ‘out’, it is important to connect the IN1N
from the application board to the VSS/GND of the audio source (e.g. Audio DSP).
The input configuration for single-ended ‘in’ application is illustrated in Figure 29.
Table 12. Filter component values
Configuration Impedance [Ω] LLC [µF] CLC [nF]
BTL 4 10 1500
6 16 1000
8 22 680
Fig 28. Input configuration for differential input
IN1P
IN1N
AUDIO
DSP
OUT1P
OUT1N
010aaa021
+
−
VSS
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 21 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
14.6 Curves measured in a typical application
Fig 29. Input configuration for single-ended input
IN1P
IN1N
AUDIO
DSP
OUT1P
OUT1N
010aaa022
+
−
VP= 12 V, Vi = 100 mV
(1) OUT1
(2) OUT2
Fig 30. Gain as a function of frequency
(2)
(1)
010aaa197
fi (Hz)
10−2102
1010−11
+20
+15
+25
+30
Gv
(dB)
+10
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 22 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
14.7 Typical application diagram TFA9810
The typical application diagram with the TFA9810 supplied from an asymmetrical supply is
shown in Figure 33.
VP=12V,R
L=8Ω,P
o=1W
(1) OUT1
(2) OUT2
Fig 31. Total harmonic distortion + noise as a function of frequency
VP=12V,R
L=8Ω, fi= 1 kHz
(1) OUT1
(2) OUT2
Fig 32. Total harmonic distortion as a function of output power
010aaa195
fi (Hz)
10 105
104
102103
1
10−1
10
THD+N
(%)
10−2
(1)
(2)
010aaa196
Po (W)
10−210110−1
1
10−1
10
THD+N
(%)
10−2
(1)
(2)
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TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 23 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 33. Typical application diagram TFA9810
VDDA1 n.c
IN1P
IN1N
CDELAY
SO/OL
IN2P
IN2N
OUT1P
BOOT1P
BOOT1N
OUT1N
STABI1
STABI2
OUT2P
BOOT2P
BOOT2N
OUT2N
VSSA1 VSSA2 VSSDVSSD VSSDVSSDVSSP1VSSP2
VDDA2 VDDP1 VDDP2
010aaa023
C12
680 nF
C27
470 pF
C13
680 nF
C28
470 pFGND GND
2
1
J3
OUT1
C9
220 nF
C14
220 nF
R27
10 Ω
R28
10 Ω
C20
680 nF
C29
470 pF
C23
680 nF
C30
470 pF GND GND
2
1
J6
OUT2
C19
220 nF
C25
220 nF
R29
10 Ω
R30
10 Ω
L3
22 µH
L4
22 µH
L5
22 µH
L6
22 µH
C16
1µF
C17
1µFGND
GND
26
27
29
28
31
18
23
22
21
20
OUT1+
OUT1−
OUT2+
OUT2−
C31
100 nF
C1
220 µF
C3
100 nF
C4
100 nF
C2
220 µF
C5
100 nF
GND
GND
GND
R3
10 ΩL2
BEAD
L1
BEAD
12 V
C8
220 pF
R6
10 kΩ
C6
1 µFR7
10 kΩ
R10
10 kΩ
GND R11
10 kΩ
C11
47 pF
GND
1
2
J4
C21
220 pF
R19
10 kΩ
R17
100 kΩ
C18
1 µF
C26
1 µF
R18
10 kΩ
R22
10 kΩ
GND
R23
10 kΩ
C22
68 pF
OUT2−
GND
1
2
J7
C15
330 nF
GND
C24
220 pF
C10
220 pF
ENABLE
DIAG
VDDA2
4 13 9 25 24
5 12 1 16 17 32 30 19
GND
VP J1
GND
1
2
C32
220 µFC33
100 nF
12 V 12 V
SW1
ENABLE
2
3
8
6
7
10
11, TEST
15
14
IN1
J2
TFA9810
R32
10 kΩ
R31
10 kΩ
C7
1 µF
R26
100 kΩ
OUT2+
R5
100 kΩ
OUT1−
R14
100 kΩ
OUT1+
R33
10 kΩ
R34
10 kΩ
IN2
J5
GND
Snubber network
(Optional)
R100
22 Ω
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 24 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
Fig 34. Typical application diagram TFA9810 with externally adjusted switch-on time
VDDA1 n.c
IN1P
IN1N
CDELAY
SO/OL
IN2P
IN2N
OUT1P
BOOT1P
BOOT1N
OUT1N
STAB1
STAB2
OUT2P
BOOT2P
BOOT2N
OUT2N
VSSA1 VSSA2 VSSDVSSD VSSDVSSDVSSP1VSSP2
VDDA2 VDDP1 VDDP2
010aaa431
C12
680 nF
C27
470 pF
C13
680 nF
C28
470 pFGND GND
2
1
J3
OUT1
C9
220 nF
C14
220 nF
R27
10 Ω
R28
10 Ω
C20
680 nF
C29
470 pF
C23
680 nF
C30
470 pF GND GND
2
1
J6
OUT2
C19
220 nF
C25
220 nF
R29
10 Ω
R30
10 Ω
L3
22 µH
L4
22 µH
L5
22 µH
L6
22 µH
C16
1µF
C17
1µFGND
GND
26
27
29
28
31
18
23
22
21
20
OUT1+
OUT1−
OUT2+
OUT2−
C31
100 nF
C1
220 µF
C3
100 nF
C4
100 nF
C2
220 µF
C5
100 nF
GND
GND
GND
R3
10 ΩL2
BEAD
L1
BEAD
12 V
C8
220 pF
R6
10 kΩ
C6
1 µFR7
10 kΩ
R10
10 kΩ
GND R11
10 kΩ
C11
47 pF
GND
1
2
J4
C21
220 pF
R19
10 kΩ
R17
100 kΩ
C18
1 µF
C26
1 µF
R18
10 kΩ
R22
10 kΩ
GND
R23
10 kΩ
C22
68 pF
OUT2−
STAB1
GND
1
2
J7
C15
4.7 µF
GND
C24
220 pF
C10
220 pF
ENABLE
DIAG
VDDA2
4 13 9 25 24
5 12 1 16 17 32 30 19
GND
VP J1
GND
1
2
C32
220 µFC33
100 nF
12 V 12 V
SW1
ENABLE
2
3
8
6
7
10
11
15
14
IN1
J2
TFA9810
R32
10 kΩ
R31
10 kΩ
C7
1 µF
R26
100 kΩ
OUT2+
R5
100 kΩ
OUT1−
R14
100 kΩ
OUT1+
R33
10 kΩ
R34
10 kΩ
IN2
J5
R35
200 kΩ
GND
Snubber network
(Optional)
R100
22 Ω
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 25 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
14.8 Typical application: bill of materials
14.9 Snubber network
15. Test information
General Quality Specification for General Applications, Power management and
RF Power. Document SNW-FQ-611 refers.
Table 13. Typical application: bill of materials
Item Quantity Reference Part Description
1 2 C1, C2. 220 µF/35 V General purpose 85 °C, diameter 8 mm
2 5 C3, C4, C5, C31, C33. 100 nF/50 V SMD 0805 X7R
3 2 C16, C17. 1 µF/50 V SMD 1206 X7R
4 4 C6, C7, C18, C26 1 µF/25 V MKT
5 4 C8, C10, C21, C24. 220 pF/25 V SMD 0402 NP0
6 4 C9, C14, C19, C25. 220 nF/25 V SMD 0805 X7R
7 1 C11 47 pF/25 V SMD 0402 NP0
8 4 C12, C13, C20, C23. 680 nF/25 V MKT
9 1 C15 330 nF/25 V SMD 0805 X7R
10 1 C22. 68 pF/25 V SMD 0402 NP0
11 1 C32 1000 µF/25 V CE12-02R
12 3 J1, J3, J6. Screw terminal Two pins
13 2 J2, J5. CINCH CINCH
14 2 J4, J7 Jumper Closed on demo board only
15 2 L1, L2. BEAD SMD 1206 Würth Elektronik
DC < 0.5 Ω10 MHz > 80 Ω
16 4 L3, L4, L5, L6. 22 µH 8RDY TOKO A7040HN-220M,
11RHBP TOKO A7503CY-220M or Sagami
7311NA-220M
17 5 R3 10 / 0.25 W / 5 % SMD 1206
18 4 R5, R14, R17, R26. 100 k / 0.1 W /
1 % for 20 dB
200 k / 0.1 W /
1 % for 26 dB
SMD 0603
19 12 R6, R7, R10, R11, R18,
R19, R22, R23, R31, R32,
R33, R34.
10 k / 0.1 W / 1 % SMD 0603
20 1 SW1 PCB switch Secme 090320901
21 1 U1 TFA9810T SOT287-1 (SO32) NXP Semiconductors
Table 14. Snubber network: bill of materials
Item Quantity Reference Part Footprint
1 4 C27, C28, C29, C30 470 pF, 25 V SMD 0805 X7R
2 4 R27, R28, R29, R30 10 / 0.25 W /
5 % SMD 1206
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 26 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
16. Package outline
Fig 35. Package outline SOT287-1 (SO23)
UNIT A
max. A1A2A3bpcD
(1) E(1) eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.1
0.25
0.01
1.4
0.055
0.3
0.1 2.45
2.25 0.49
0.36 0.27
0.18 20.7
20.3 7.6
7.4 1.27 10.65
10.00 1.2
1.0 0.95
0.55 8
0
o
o
0.25 0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT287-1 MO-119
(1)
0.012
0.004 0.096
0.089 0.02
0.01 0.05 0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007 0.037
0.022
0.010.01
0.043
0.016
wM
bp
D
HE
Z
e
c
vMA
X
A
y
32 17
16
1
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
E
pin 1 index
0 5 10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm SOT287-1
00-08-17
03-02-19
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 27 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
17. Revision history
Table 15. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TFA9810_3 20080220 Product data sheet - TFA9810_2
Modifications: •Figure 33 has been updated.
•Figure 34 has been added.
TFA9810_2 20070831 Preliminary data sheet - TFA9810_1
TFA9810_1 20070815 Preliminary data sheet - -
TFA9810_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 20 February 2008 28 of 29
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
18. Legal information
18.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors TFA9810
Audio amplifier 2 x 12 W
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 February 2008
Document identifier: TFA9810_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Interfacing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Input comparators. . . . . . . . . . . . . . . . . . . . . . . 6
8.3.1 Operating in self-oscillating configuration. . . . . 6
8.3.2 Operating in open-loop configuration . . . . . . . . 6
8.4 Diagnostic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.5 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.6 Start-up sequence . . . . . . . . . . . . . . . . . . . . . . 8
9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
11 Thermal characteristics. . . . . . . . . . . . . . . . . . 15
12 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 15
12.1 Static characteristics. . . . . . . . . . . . . . . . . . . . 15
12.2 Dynamic characteristics . . . . . . . . . . . . . . . . . 16
12.3 AC characteristics measured in a typical
application. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Quality specification . . . . . . . . . . . . . . . . . . . . 18
14 Application information. . . . . . . . . . . . . . . . . . 18
14.1 Output power estimation. . . . . . . . . . . . . . . . . 18
14.2 Output current limiting. . . . . . . . . . . . . . . . . . . 19
14.3 Speaker configuration and impedance. . . . . . 20
14.4 Differential input . . . . . . . . . . . . . . . . . . . . . . . 20
14.5 Single-ended input . . . . . . . . . . . . . . . . . . . . . 20
14.6 Curves measured in a typical application. . . . 21
14.7 Typical application diagram TFA9810. . . . . . . 22
14.8 Typical application: bill of materials. . . . . . . . . 25
14.9 Snubber network. . . . . . . . . . . . . . . . . . . . . . . 25
15 Test information. . . . . . . . . . . . . . . . . . . . . . . . 25
16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 27
18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28
18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28
19 Contact information . . . . . . . . . . . . . . . . . . . . 28
20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
