AP9870GH-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET Simple Drive Requirement D Lower Gate Charge Fast Switching Characteristic RoHS Compliant & Halogen-Free BVDSS 60V RDS(ON) 42m ID G 18A S Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. G D S TO-252(H) The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 60 V VGS Gate-Source Voltage +20 V ID@TC=25 Continuous Drain Current, V GS @ 10V 18 A ID@TC=100 Continuous Drain Current, V GS @ 10V 11.5 A 60 A 27.8 W 1 IDM Pulsed Drain Current PD@TC=25 Total Power Dissipation TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case Maximum Thermal Resistance, Junction-ambient (PCB mount) Data and specifications subject to change without notice 3 Value Units 4.5 /W 62.5 /W 1 200907281 AP9870GH-HF o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 60 - - V RDS(ON) Static Drain-Source On-Resistance 2 VGS=10V, ID=12A - - 42 m VGS=4.5V, ID=8A - - 60 m V VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 VDS=10V, ID=15A - 18 - S gfs Forward Transconductance IDSS Drain-Source Leakage Current VDS=60V, VGS=0V - - 25 uA IGSS Gate-Source Leakage VGS= +20V, VDS=0V - - +100 nA ID=15A - 8 12.8 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=48V - 2 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 5 - nC 2 td(on) Turn-on Delay Time VDS=30V - 6 - ns tr Rise Time ID=15A - 23 - ns td(off) Turn-off Delay Time RG=3.3,VGS=10V - 16 - ns tf Fall Time RD=2 - 3.6 - ns Ciss Input Capacitance VGS=0V - 545 870 pF Coss Output Capacitance VDS=25V - 75 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 55 - pF Min. Typ. IS=12A, VGS=0V - - 1.3 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 2 2 Test Conditions Max. Units trr Reverse Recovery Time IS=15A, VGS=0V - 29 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 30 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 2 3.Surface mounted on 1 in copper pad of FR4 board THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP9870GH-HF 50 10V 7.0V 6.0V 5.0V T C = 150 o C ID , Drain Current (A) 40 ID , Drain Current (A) 40 10V 7.0V 6.0V 5.0V T C = 25 o C 30 V GS =4.0V 20 30 V GS =4.0V 20 10 10 0 0 0 2 4 6 8 10 0 12 Fig 1. Typical Output Characteristics 4 6 8 10 Fig 2. Typical Output Characteristics 2.4 60 I D =12A V G =10V I D =8A o T A =25 C 2.0 Normalized RDS(ON) RDS(ON) (m) 2 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) 50 40 1.6 1.2 0.8 0.4 30 2 4 6 8 -50 10 50 100 150 T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 1.6 Normalized VGS(th) (V) 16 12 IS(A) 0 o V GS ,Gate-to-Source Voltage (V) T j =150 o C T j =25 o C 8 1.2 0.8 0.4 4 0 0.0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP9870GH-HF 10 f=1.0MHz 1000 V DS =30V V DS =36V V DS =48V 8 800 600 6 C (pF) VGS , Gate to Source Voltage (V) I D = 15 A C iss 4 400 2 200 C oxx C rss 0 0 0 4 8 12 1 16 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 Operation in this area limited by RDS(ON) 100us ID (A) 10 1ms 10ms 100ms DC 1 o T c =25 C Single Pulse Normalized Thermal Response (Rthjc) 100 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 0.1 1 10 100 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4