HT2MOA4S20/E/3/RJ - NXP SEMICONDUCTORS

1. General description

HITAG 2 based transponders are highly integrated and do not need any additional

components beside the HITAG 2 transponder IC and the external coil. Data are

transmitted bidirectionally, in half duplex mode, between Read Write Device (RWD) and

HITAG transponder IC. To achieve a main stream security, data may be transmitted

enciphered. HITAG 2 transponder IC offer a memory of 256 bit.

Custom specific configuration of th e tra nspo nde r IC is possible by using th e con figur ation

page. The configuration page allows the selection of different modes and access

possibilities and also the configuration of the memory. The pages of the memory can be

protected against read or write access by setting corresponding memory flags.

The HITAG 2 transponder IC pro vides - besides pa ssword and crypto mode - the fo llowing

three standard read only modes, that can be configured using the configuration byte:

•public-mode A

•public-mode B (animal identification, according to ISO 11784 and ISO 11785)

•public-mode C (PIT compatible mode PCF793x)

2. Features and benefits

Identification transponder for use in contactless applications

Operating frequency 125 kHz

Data transmission and energy supply via RF link, no internal battery

Reading distance same as writing distance

Non-volatile memory of 256 bits (128-bit user data and 128-bit control data/secret

memory) organized in 8 pages, 4 bytes each

10 years non-volatile data retention

100000 erase/write cycles

Selective read/write protection of memory content

Two coding schemes for read operation: Biphase and Manchester coding

Effective communication protocol with outstanding data integrity check

Mutual authentication function

Read/write mode allows:

Plain data transmission (password mode)

Encrypted data transmission (crypto mode)

In read/write mode multi-tag operation possible because of special HALT-function

Emulation of standard industrial read-only transponders:

HT2x

HITAG 2 transponder IC

Rev. 3.1 — 3 November 2014

210431 Product short data sheet

COMPANY PUBLIC

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 2 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

public-mode A (MIRO and transponders from EM (H400x))

public-mode B (according to ISO 11784 and ISO 11785 for animal identification)

public-mode C (PIT compatible mode)

3. Applications

Logistics

Livestock tracking

Asset tracking

Gas cylinder ID

Casino - gambling

Industrial automation

4. Quick reference data

5. Ordering information

[1] This package is also known as MOA4.

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Wafer EEPROM characteristics

tret retention time Tamb 55 C10--year

Nendu(W) write endurance 100000 - - cycle

Interface characteristics

Ciinput capacitance between LA and LB

HT2ICS2002W/V6F/R 189 210 231 pF

Table 2. Ordering information

Type number Package

Name Description Version

HT2ICS2002W/V6F/R Wafer sawn wafer on FFC, 150 m, 8 inch, UV, inkless -

HT2MOA4S20/E/3/R PLLMC plastic leadless module carrier package; 35 mm

wide tape SOT500-2[1]

HT2DC20S20/F/R PLLMC plastic leadless module carrier package SOT385-1

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 3 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

6. Block diagram

The HITAG 2 transp onder IC require s no external power supp ly. The cont actless interface

generates the power supply and the system clock via the resonant circuitry by inductive

coupling to the RWD. The interface also demodulates data transmitted from the RWD to

the HITAG 2 transponder IC, and modula tes the mag netic field for data transm ission from

the HITAG 2 transponder IC to the RWD.

Data are stored in a non-volatile memory (EEPROM). The memory has a capacity of

256 bit and is organized in pages.

Fig 1. Block diagram of HITAG 2 transponder IC

001aao244

CLK

MOD

DEMOD

VREG

VDD

data

out

clock

R/W

ANALOGUE

RF INTERFACE

PAD

RECT

Cres

DIGITAL CONTROL

TRANSPONDER

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

EEPROM

SEQUENCER

CHARGE PUMP

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 4 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

7. Functional description

7.1 Overview of transponder

7.2 Memory map

The 256 bit memory area of the HITAG 2 transponder IC is divided into 8 pages. Each

page has a size of 32 bits.

Depending on the operation mode (crypto mode/password mode) the memory is

organized as described in the following:

Table 3. Overview of transponders

Parameter Description Unit

carrier frequency 125 kHz

coding read Manchester/Biphase -

coding write Pulse duration -

modulation ASK (amplitude shift keying) -

total memory size 256 bit

user memory read/write 128 bit

read only serial number 32 bit

data re te nt io n 10 year

data security encryption, authentication, passwords -

data integrity half-duplex handshake, reverse data transmission -

Table 4. Memory map in Crypto Mode

Page Content Access

0 serial number ro

1 secret key low (32 bit) r/w or 0

2 secret key high (16 bi t)

reserved bit (14 bit) r/w or ro

3 configuration (8 bit)

password tag (24 bit) r/w or ro

4 usable memory page r/w or ro

5 usable memory page r/w or ro

6 usable memory page r/w or ro

7 usable memory page r/w or ro

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 5 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

8. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

9. Abbreviations

Table 5. Memory map in Password Mode

Page Content Access

0 serial number ro

1 password RWD r/w or 0

2 reserved for future use r/w or 0

3 configuration (8 bit)

password tag (24 bit) r/w or ro

4 usable memory page r/w or ro

5 usable memory page r/w or ro

6 usable memory page r/w or ro

7 usable memory page r/w or ro

Table 6. Limiting values - HT2ICS2002W/V6F/R[1]

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.5 +6.5 V

VESD electrostatic discharge voltage MIL-STD 883D, Method

3015.7, Human Body 2- kV

Ilu latch-up current MIL-STD 883D, Method 3023 100 - mA

Ii(max) maximum input current IN1-IN2 - 30 mA

Tjjunction temperature 55 +140 C

Table 7. Limiting values - HT2DC20S20/F/R (SOT 385-1)/ HT2MOA4S20/ E /3/R (SOT500-2)[1]

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature 55 +125 C

Table 8. Abbreviations

Acronym Description

EEPROM Electrically Erasable Programmable Read-Only Memory

IC Integrated Circuit

RF Radio Frequency

RWD Read Write Device

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 6 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

10. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

HT2X_SDS v.3.1 20141103 Product short data sheet - HT2X_SDS v.3.0

Modifications: •Section 11 “Legal information”: License statement “ICs with HITAG functionality” removed

•Section 5 “Ordering information”: updated

•Table 7: Title updated

HT2X_SDS v.3.0 20110916 Product short data sheet - -

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 7 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liabili ty towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Te rms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cust omer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product short data sheet

COMPANY PUBLIC Rev. 3.1 — 3 November 2014

210431 8 of 9

NXP Semiconductors HT2x

HITAG 2 transponder IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims result ing from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

11.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

HITAG — is a trademark of NXP Semiconductors N.V.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors HT2x

HITAG 2 transponder IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 3 November 2014

210431

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Overview of transponder . . . . . . . . . . . . . . . . . 4

7.2 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9