(2)
3M™ Thermally Conductive Silicone Interface Pads 5591 and 5591S
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not
be used for specification purposes.
Property Value Method
Product Number
1
3M™ Thermally Conductive Silicone Interface Pads 5591 and 5591S
3M Test Method
Thermal Conductivity (W/m-K) 1.0 W/m-K with low pressure
(<10 psi)
Operating Temperature Range
2
-60°C to 130/140°C Long Term (Weeks-Months) 3M Test Method
-60°C to 160/180°C Short Term (Hours-Days)
Shore 00 results depend on test method and thickness of the
Modified
Hardness Shore 00
3
sample tested. Typical results are in the 10-15 Shore 00
ASTM D2240
range @ 6 mm test thickness without the PET film.
Ask 3M for more details on pad softness.
Dielectric Breakdown 200 V/mil AC (3M pad 5591S tested) 3M TM
(ASTM D149)
Volume Resistivity 2 x 10
12
Ohms (3M pad 5591S tested) ASTM D257
3M pad 5591 has not been tested for UL N/A
Flammability Rating 3M pad 5591S tested: UL 94 V-1 (0.5mm) and UL-94
UL 94 V-1 (1.0mm - 5.0mm)
Notes:
1 3M pad 5591S has a 12 micrometer PET Film added to provide for a non-tacky surface, increased puncture resistance, and ease of handling and rework.
2 Potential Operating Temperature Range (°C). End use application testing will determine final temperature range based on final design and other
environmental conditions. Suggested temperature range is based on a 3M Test Method.
3 3M pad 5591S tested with-out PET film on product.
Application Guidelines
Substrate surfaces should be clean and dry prior to the thermal pad application to help ensure best thermal performance. A clean
surface can improve the thermal performance of an application.
1) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination
such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily components. Allow
the surface to dry for several minutes before applying the thermal pad. More aggressive solvents (such as acetone, methyl
ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but
should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
2) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to
help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner before
application.
3) Assemble the part by applying compression to the substrates to help ensure a good wetting of the substrate surfaces with
the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat.
Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because one of
the flexible substrate can conform to the other substrates during application.