P-TCO-N350/12-2 - BOURNS - Product.Network

P-TCO-N Series - Polymeric Thermal Cutoff Device

* RoHS Directive 2015/863, Mar 31, 2015 and Annex.

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)

and Chlorine (Cl) content is 1500 ppm or less.

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Electrical Characteristics

Model Vmax Imax Ihold Thermal Cutoff Max. Time To Trip Resistance Certications

at 23 °C at 3 A at 2 A at 23 °C Ohms at 23 °C cUL TÜV

Volts Amps Amps °C °C Amps Seconds RMin. R1Max. E174545 R50405491

P-TCO-N350/12 12 50 3.5 75 ±20 90 ±15 8.0 5.0 0.002 0.022 3 3

P-TCO-N400/12 12 50 4.0 80 ±15 95 ±15 10.0 5.0 0.002 0.018 3 3

P-TCO-N450/12 12 50 4.5 85 ±15 100 ±10 22.5 2.0 0.002 0.014 3 3

Environmental Characteristics

Operating Temperature ......................................... -40 °C to +85 °C

Storage Condition

Before Opening ............................................... +40 °C max. / 70 % RH max.

After Opening................................................... +40 °C max. / 10 % RH max.

Floor Condition After Opening .............................. Consumption within 4 weeks at oor condition +30 °C max. / 60 % RH max.

Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change

Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change

Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change

Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change (marking still legible)

Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change (Rmin<R<R1max)

Condition A

Moisture Sensitivity Level (MSL) .......................... See Note

ESD Classication - HBM ..................................... 6

Test Procedures and Requirements

Test Test Conditions Accept/Reject Criteria

Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description

Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max

Time to Trip ........................................................... At specied current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)

Hold Current ......................................................... 30 min. at Ihold ...................................................... No trip

Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles.......................................... No arcing or burning

Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning

Solderability .......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage

*RoHS COMPLIANT

LEAD FREE

*RoHS COMPLIANT

**HALOGEN FREE

LEAD FREE

VERSIONS ARE

RoHS COMPLIANT*

Features

n Compact, space-saving 1206 footprint

n Low profile and symmetrical design

n Small size promotes fast response time

to thermal runaway events

n Ultra-low resistance

n RoHS compliant*

n Agency recognition:

Applications

n Thermal protection for USB-C 2.0, 3.0

and 3.1 cables and ports

n Mobile device fast charging port protection

WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov

Asia-Pacic: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com

EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com

The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com

www.bourns.com

MF-NSMF Series - PTC Resettable Fuses

Product Dimensions

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

P-TCO-N Series - Polymeric Thermal Cutoff Device

Terminal material:

ENIG-plated terminals

Recommended Pad Layout

1.6 ± 0.1

(.063 ± .004)

2.0 ± 0.1

(.079 ± .004)

1.0 ± 0.05

(.039 ± .002)

1.0 ± 0.05

(.039 ± .002)

Bottom View

D E

Top View Side View

Thermal Derating Table - Ihold (Amps)

Model Ambient Operating Temperature

-40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C

P-TCO-N350/12 5.15 4.66 4.13 3.50 2.98 2.71 2.49 2.00 1.65

P-TCO-N400/12 5.80 5.25 4.65 4.00 3.40 3.10 2.65 2.20 1.80

P-TCO-N450/12 6.10 5.40 4.70 4.50 3.60 3.15 2.70 2.25 1.85

Typical Part Marking

Represents total content. Layout may vary.

3500 pcs. per reel

How to Order

P-TCO - N 350 / 12 - 2

Polymeric

Thermal Cutoff

Device

N = 1206 footprint

Surface Mount Component

Hold Current, Ihold

350 - 450 (3.50 Amps - 4.50 Amps)

Maximum Voltage, Vmax

12 = 12 Volts

Packaging

-2 = Tape and Reel

Packaged per EIA 481

PART IDENTIFICATION:

P-TCO-N350/12 = S12

P-TCO-N400/12 = U12

P-TCO-N450/12 = X12

MANUFACTURING DATE CODE IS

LOCATED ON PACKING LABEL.

S12

Model A B C D E

Min. Max. Min. Max. Min. Max. Min. Min. Max.

P-TCO-N350/12

3.00

(0.118)

3.50

(0.138)

1.40

(0.055)

1.80

(0.071)

0.60

(0.024)

1.10

(0.043)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

P-TCO-N400/12

P-TCO-N450/12

Packaging Quantity

DIMENSIONS: MM

(INCHES)

3312 - 2 mm SMD Trimming Potentiometer

P-TCO-N SERIES, REV. A, 02/19

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

P-TCO-N Series - Polymeric Thermal Cutoff Device

Solder Reow Recommendations

Packaging Specications

Notes:

• P-TCO-N models cannot be wave soldered or hand soldered.

Please contact Bourns for soldering recommendations.

• All temperatures refer to topside of the package, measured on the

package body surface.

• If reow temperatures exceed the recommended prole, devices may

not meet the published specications.

• Compatible with Pb and Pb-free solder reow proles.

• Excess solder may cause a short circuit, especially during hand

soldering. Please refer to the Polymeric Thermal Cutoff Soldering

Recommendation guidelines.

Temperature of Lead/Pad Junction

Process Materials Temperature Time

Description Interval

1. Apply solder paste to •Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature

test board (8 - 10 mil thick) Alloy water soluble or no

clean solder paste

(see note 1)

•single sided epoxy glass

(G10) (UL approved)

•PC board approx. 4x4x.06 in.

2. Place test units onto board 6 units/board

3. Ramp up Convection oven (see note 2) 2.5 °C ± 0.5 °/sec.

4. Preheat (TS.ces03±09C°091otC°051)

5. Time above liquidus (TL.ces09-06C°022)

6. Peak temperature (TP°5-/°0+C°052)

10-20 sec. within

5 °C of peak

.ces/C°5.0±C°3erutarepmetmooRnwodpmaR.7

(see note 2)

8. Cleaning water clean profile High pressure deionized 72 °F to 160 °F As required

water 65 PSI max. (22 °C to 71 °C)

Inspect solder joint to determine if solder joint is

acceptable (i.e. exhibits wetting of joint’s surface).

Use the following criteria (ref. acceptability of printed

board assemblies, IPC-A-610):

A) Acceptable (see Figure 1)

(1) The solder connection wetting angle (solder to

component and solder to PCB termination)

does not exceed 90 °.

(2) Solder balls that do not violate minimum

electrical clearances and are attached

(soldered) to a metal surface.

B) Unacceptable (see Figure 2)

(1) Solder connection wetting angle exceeding

90 °.

(2) Incomplete reflow of solder paste.

(3) Dewetting.

If unacceptable, determine cause and correct prior to

next run.

NOTES:

1. Water soluble solder paste only above 100K.

2. Refer to ref. temperature profile. Temperature at

lead/pad junction with “K” type thermocouple.

3. Units that are board mounted for environmental

testing must see a peak temperature in the reflow

zone, as specified. This is to ensure that all test

units will see “worst case conditions”.

4. Ramp down rate to be measured from 245 °C to

150 °C.

5. Process Description 8 does not apply to open

frame trimmers.

(Derived using 6-zone Convection Oven)

T TO

RAMP-UP L

Ts max

Ts min

PREHEAT

Temperature

Time

CRITICAL ZONE

RAMP-DOWN

t 25 °C TO PEAK

Prole Feature Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max.

PREHEAT:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (Tsmin to Tsmax) (ts)

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

Temperature (TL)

Time (tL)

217 °C

60~150 seconds

Peak Temperature (Tp) 260 °C

Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds

Ramp-Down Rate 6 °C / second max.

Time 25 °C to Peak Temperature 8 minutes max.

12.0 ± 0.30

(.472 ± .012)

1.10 ± 0.10

(.043 ± .004)

4.0 ± 0.10

(.157 ± .004)

2.0 ± 0.05

(.079 ± .002)

15.4*

(.606)

(1.97)

MIN.

HUB DIA.

1.75 ± 0.10

(.069 ± .004)

4.0 ± 0.10

(.157 ± .004)

1.90 ± 0.10

(.075 ± .004)

10.25

(.404)

390

(15.35)

3.50 ± 0.10

(.138 ± .004)

5.50 ± 0.05

(.216 ± .002)

4.5

(.177) MAX.

0.6

(.024) MAX.

0.1

(.004) MAX.

COVER

TAPE

1.50 +0.1 / -0

(.059 +.004 / -0) DIA.

TYP.

MAX.

185

(7.283) MAX.

*MEASURED AT HUB

LEADER MIN.

160

(6.30)

TRAILER MIN.

12.4 +1 / -0*

(.488 +.039 / -0)

P-TCO-N Series per EIA 481

DIMENSIONS: MM

(INCHES)

MF-NSMF Series - PTC Resettable Fuses

Bourns® Polymeric Thermal Cutoff Devices (P-TCO)

Application Notice

Users are responsible for independent and adequate evaluation of Bourns® Polymeric Thermal Cutoff (P-TCO) devices in the user’s

application, including the P-TCO device characteristics stated in the applicable data sheet.

• Polymeric Thermal Cutoff devices must not be allowed to operate beyond their stated maximum ratings. Inadequate adherence

to such maximum ratings could result in damage to the P-TCO device and lead to electrical arcing and/or re. Circuits with

inductance may generate a voltage above the rated voltage of the P-TCO devices and should be thoroughly evaluated within the

user’s application during the P-TCO selection and qualication process.

• Polymeric Thermal Cutoff devices are intended to protect against adverse effects of temporary overtemperature conditions and

are not intended to serve as protective devices where such conditions are expected to be repetitive or prolonged.

• As a normal function of operation, Polymeric Thermal Cutoff devices experience thermal expansion under fault conditions.

Thus, a P-TCO device must be protected against mechanical stress, and must be given adequate clearance within the user’s

application to accommodate such thermal expansion. Rigid potting materials or xed housings or coverings that do not provide

adequate clearance should be thoroughly examined and tested by the user, and may result in the malfunction of P-TCO devices

if the thermal expansion is inhibited.

• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely

affect the performance of Polymeric Thermal Cutoff devices.

• Aggressive solvents may adversely affect the performance of Polymeric Thermal Cutoff devices. Conformal coating,

encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and

toluene, which are known to cause adverse effects on the performance of P-TCO devices. Such aggressive solvents must be

thoroughly cured or baked to ensure complete removal from P-TCO devices to minimize the possible adverse effect on the

device.

• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet

and on the Polymeric Thermal Cutoff Device Moisture/Reow Sensitivity Classication (MSL) note: https://www.bourns.com/

docs/RoHS-MSL/msl_ptco.pdf

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Asia-Paciﬁc: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com

EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com

The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com

www.bourns.com

Legal Disclaimer Notice

This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and

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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change

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The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and

statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical

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the user’s sole risk.

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Users shall not sell, transfer, export or re-export any Bourns®WYVK\J[ZVY[LJOUVSVN`MVY\ZLPUHJ[P]P[PLZ^OPJOPU]VS]L[OL

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