INTEGRATED CIRCUITS DATA SEE TDA5051 Home automation modem Preliminary specification 1997 Mar 11 File under Integrated Circuits, 1011 Philips Semiconductors PHILIPSPhilips Semiconductors Preliminary specification Home automation modem TDA5051 FEATURES Full digital carrier generation and shaping Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator High clock rate of 6 bits D/A (Digital to Analog) converter for rejection of aliasing components Fully integrated output power stage with overload protection Automatic gain control ak receiver input 8-bit A/D and narrow digital filtering Digital demodulation delivering baseband data Compliance with IEC801 EMC/ESD protection standards Easy compliance with EN50065-1 with simple coupling network Few external components for low cost applications. 3016 plastic package. QUICK REFERENCE DATA APPLICATIONS Home appliance control (air conditioning, shutters, lighting, alarms and so on) Energy/heating control ASK (Amplitude Shift Keying) data transmission using the home power network. GENERAL DESCRIPTION The TDA5051 is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 or 1200 Baud data rate. li operates from a single 5 V supply. SYMBOL PARAMETER CONDITIONS MIN. TYP. | MAX. | UNIT Vop supply voltage 475 | 5.0 5.25 |V lbp total supply current 8.48 MHz clock frequency receptian made - - 30 mA transmission made Zload = 30 0 - - 50 mA power down mode - - 19 mA Tamb ambient temperature 0 - 70 C for carrier frequency 97 - 146 kHz fose oscillator frequency 6.208 |- 9.344 | MHz Vows) output carrier voltage on 30 Q load - - 122 dBuVv (RMS value) Vierms) input signal (RMS value) 66 - 122 dBiV THD total harmonic distortion on CISPR16 - 55 - dB load with coupling network Zioad output load 1 30 - Q BR baud rate - 600 1200 | bits/s ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION TDASO51 S016 plastic small outline package: 16 leads, body width 7.6 mm SOT162-1 1997 Mar 11 2Preliminary specification Philips Semiconductors Home automation modem TDA5051 BLOCK DIAGRAM DGND AGND VDDA Yppp VDDAP | | | | 15 I12 113 13 1 meted powen Tr DRIVE TX ROM 6 DA WITH OUT PROTECTION DAG clock 93 | APGND 10 DATA 1, CONTROL LOGIC s TDASOS1 15 4 filter clock F PD CLKguT + 7 osci > OSCILLATOR [+ +2 OSGe DIGITAL 14 _ 2 DIGITAL DATA, 7 4 41 BANDPASS AD IRXiny OUT DEMODULATOR FILTER 8 5 AY Ue PEAK . u/D DETECT | ~ DY COUNT L| | 16 | 6 MG Koo | TEST1 SCANTEST Fig.1 Black diagram. 1997 Mar 11Philips Semiconductors P reliminary specification Home automation modem TDA5051 PINNING SYMBOL PIN DESCRIPTION DATAIN 1 | digital data input (active LOW) DATAout 2 digital data output (active LOW) Vopp 3 | digital supply voltage _ 'S) CLK our 4 clock output earn a re me DGND 5 | digital ground PATA 2 | 15] po SCANTEST | 6 _ | test input (LOW in application) Vopo [3] 4] Ax OSCi 7 | oscillator input cLKour L4] TDASOS1 13] Vopa OSc2 8 | oscillator output penp [6 | 12] AGND APGND 9 analog ground for power amplifier SCANTEST [| 7] Vopap TXout 10 | analog signal output osc 7 HO] TXqur Vopap 11 ony supply for power amplifier osce [3] ra] Pano AGND 12. | analog ground MGKOOS Vppa 13 | analog supply voliage RXin 14 | analog signal input PD 15 | power-down input (active HIGH) Fig.2. Pin configuration. TEST1 16 | test input (HIGH in application} 1997 Mar 11Philips Semiconductors Preliminary specification Home automation modem TDA5051 FUNCTIONAL DESCRIPTION Both transmission and reception stages are controlled either by the master clock of the microcontroller, or by the on-chip reference oscillator connected to a crystal. This holds for the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The interface with the power network is made by means of a LC network (see Fig.18). The device includes a power output stage able to feed a 120 dBuV (RMS) signal on a typical 30 load. To reduce power consumption, the IC is disabled by a power down input: in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLKourt. For low-power operation in reception made, this pin can be dynamically controlled by the microcontroller (see Section Power-dawn mode). When the circuit is connected to an external clock generator (see Fig.6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open. Use of the on-chip clock circuitry is shown in Fig.7. All logic inputs and outputs are compatible with TTLYCMOS levels, providing an easy connection to a standard microcontroller I/O port. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open in functional mode (correct levels are internally defined by pull-up/down resistors). Transmission mode The carrier frequency is generated by the scanning of a ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator, thus providing strict stability with respect to environmenial conditions. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied thraugh pin DATAiy and smoothly applied by specific digital circuitry to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN 50065-1 recommendations). A 55 dB total harmonic distortion is reached when using the typical LC coupling network (or an equivalent filter). 1997 Mar 11 The D/A converter and the power stage are set in order to provide a maximum signal level of 122 dBuV (RMS) at the output. The output of the power stage (TXout) always has to be connected to a decoupling capacitor, because of a DC level of 2.5Vpp at this pin, present even when the device is not transmitting. This pin also has to be protected against overvoltage and negative transient signals. The DC level of TXout can be used to bias an unipolar transient suppressor, as shown in the application diagram. Direct connection to the mains is done through a LC network (see Fig.18) for low-cost applications. However, a HF signal transformer could be used when power-line insulation has to be performed. CAUTION In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this made, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set te -6 dB as long as DATA), is LOW. Then, the cld gain setting is automatically restored. Receiving mode The input signal received by the modem is applied to a wide range input amplifier with Automatic Gain Control (-6 dB to +31 dB). This is basically for noise performance improvement and signal level adjustment that ensures a maximum sensitivity of the A/D converter. Then an 8 bit A/D conversion is performed, followed by digital bandpass filtering, in order to meet the CISPR normalization and to comply with some additional limitations encountered in current applications. After digital demodulation, the baseband data signal is made available after pulse shaping. The signal pin (RXjx) is a high-impedance input, which has to be protected and DC decoupled for the same reasons as with pin TXourt. The high sensitivity (66 dBuV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network) also used as an anti-aliasing filter for the internal digital processing (see Fig. 18).Philips Semiconductors Preliminary specification Home automation modem TDA5051 Data format TRANSMISSION MODE The data input (DATA) is active LOW: this means that a burst is generated on the line (pin TXgy 7) when pin DATA is LOW. Pin TXgyr is in high-impedance state as long as the device is not transmitting. Successive logic 1's are treated in a NRZ mode (see pulse shape description in Figs 8 and 9). LIMITING VALUES RECEIVING MODE The data output (pin DATAgut} is active LOW; this means that the data output is LOW when a burst is received. Pin DATAgut remains LOW as long as a burst is received. Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimal when pin PD is HIGH. All functions, except clack generation, are disabled then. In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT Vop supply voltage A5 5.5 V fose oscillator frequency - 15 MHz Tstg storage temperature -50 +150 C Tamb ambient temperature 0 +85 C Tj junction temperature - 125 C HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. 1997 Mar 11Philips Semiconductors Preliminary specification Home automation modem TDA5S051 CHARACTERISTICS Vopp = Vppa = 5 V 5%3 Tamb = 0 to +70 C; Vopp connected to Vppa; DGND cannected to AGND. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX, UNIT Supply Vop supply voltage 4.75 5 5.25 V IppraxTxaoy | total analog + digital supply | Vpp = 5 V t5% - - 35 mA current; TX or RX made lpp(epy fot) total analog + digital supply | Vpp2 5 V 5%; - - 25 mA current; power-down mode | power-down > 2.4 V Ipo(PAMP\(max) | Power amplifier supply Von 25 V t5%; - - 30 mA current in transmission Zload = 30 Q; mode DATAin = LOW Ipp(PAMP)max) | Maximum power amplifier Vpp 2 & V 5%: - - 75 mA supply current in Aioad = 1 Q; transmission mode DATA = LOW DATA input, PD input: DATAgyt7 output, CLK our output Vin HIGH level inpui voltage 0.2Vpp + 0.9 | - Vop + 0.5 V Vit LOW level input voltage -0.5 - 0.2Vpp - 0.1) V Vou HIGH level output volkage lon = -1.6 mA 24 - - V VoL LOW level ouiput voltage lo. = 1.6 mA - - 0.45 Vv O$C1 input, OSC2 output (OSC2 only used for driving external quartz crystal; must be left open when using an external clock generator) Vin HIGH level inpui voltage 0.7Vpp - Vop + 0.5 V Vit LOW level input voltage -0.5 - 0.2Vpp - 0.1) V Vou HIGH level output voltage lou =-1.6 mA 2.4 - - V VoL LOW level ouiput voltage lo. = 1.6 mA - - 0.45 Vv Clock fose oscillator frequency 6.208 - 9.344 MHz f ratio between oscillator and - 64 - 7 carrier frequency cr Foose ratio between oscillator and - 2 - i... clock-out output clk(out) 1997 Mar 11 7Philips Semiconductors Preliminary specification Home automation modem TDA5051 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Transmission mode for carrier frequency fose = 8.48 MHz = 132.5 |- kHz tsu set-up time of the shaped fosc = 8.48 MHz; - 180 - Ls burst see Fig.8 th hold time of the shaped fosc = 8.48 MHz; - 180 - Ls burst see Fig.8 twoonamin) minimum pulse width of fosc = 8.48 MHz; - 190 - Ls DATAin signal see Fig.8 Vocrms) output carrier signal (RMS _ | Zioaq = 30 Q; 121 = 122 dBiVv value) DATAin = LOW lognax) power amplifier maximum Zioad = 1.0; - 200 - mA output current (peak value) | DATA; y = LOW Zo output impedance of the - 5 - Q power amplifier Vo output DC level at TX, - 2.5 - V THD total harmonic distortion on | Vogms) = 122 dBhV on | - -55 - dB CISPR16 load with the CISPR16 load; coupling network fosc = 8.48 MHz; DATA iy = LOW (no modulation); (see Figs 3 and 16} B_oa dB bandwicth of the shaped Vowms) = 122 dBuV on |- 3000 | - Hz output signal (at -20 dB) on | CISPR16 load; CISPR16 load with the fose = 8.48 MHz; coupling network DATAIn = 300 Hz; duty-cycle = 50%; see Fig.4 Reception mode Vierms) analog input signal (RMS 66 - 122 dBLV value} Vv DC level at pin RXin - 2.0 - Vv Z RX in input impedance - 50 - kQ Racc automatic gain coniral - 36 - dB range tefage) automatic gain coniral time | fggo = 8.48 MHz; - 296 - Ls constant see Fig.5 td(dem)(su) demodulation delay set-up | fosc = 8.48 MHz; - 410 460 Ls time see Fig.15 tdidem)h) demodulation delay hald fosc = 8.48 MHz; - 330 380 Ls time see Fig.15 Baet detection bandwidth fosc = 8-48 MHz - 3 - kHz BER bit error rate fose = 8.48 MHz; - 1 - 1x 10-4 600 baud; S/N = 10 dB; see Fig.17 1997 Mar 11Philips Semiconductors Preliminary specification Home automation modem TDA5S051 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Power-up timing ta(puy(TX) delay between power-up XTAL = 8.48 MHz; 1 = - ms and DATAw in transmission | C1 = C2 = 27 pF; mode Rp = 2.2 MQ; see Fig.10 td(puy(RX) delay between power-up XTAL = 8.48 MHz - - 1 ms and DATAourt in reception C1 = C2 = 27pF mode Rp = 2.2 MQ frxin = 132.5 kHz 20 dBLV sinewave; see Fig.11 Power-down mode timing td(pd)(TX) delay between power-up fosc = 8.48 MHz; see 10 - - Ls and DATA in transmission | Fig.12 mode ta(pa}(RX) delay between PD =0 and = | fose = 8.48 MHz; - = 500 Ls DATAgut in reception mode | frxiy = 182.5 kHz; 120 dBLV sinewave; see Fig.13 bwake(min) minimum wake-up time fosc = 8.48 MHz; 1 - - ms with T= 10 msin reception | frxiy = 182.5 kHz; mode 120 dBhV sinewave; see Fig. 14 1997 Mar 11 9Philips Semiconductors Preliminary specification Home automation modem TDA5051 MBHE3 at 132.5 Hz Voirms) {dBV) VA LAT Vaan allan inl alameda 10 20 50 f (MHz) 107 Scale 10 dB/DIV; Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBaV (RMS); marker at -5 dBV (RMS) = 115 dBaV (RMS); the GISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBhV (RMS). Fig.3 Carrier spectrum. 1997 Mar 11 10Philips Semiconductors Preliminary specification Home automation modem TDA5051 Semen -a 1500 Hz MBH64 -10 dBV (RMS) -60 117.5 132.5 { (kHz) 147.5 Resolution bandwidth = 100 Hz ; B_zg = 3000 Hz (2 x 1500 Hz). Fig.4 Shaped signal spectrum. VRXIN modulated sinewave 122 dBuV amplitude o) 0 t Gage +30 dB 1 | 8.68 dB , 4 AGC range | -_ - - -6 dB - ' Iefage) 7 WG KOT (AGG time constant) Fig.6 AGC time constant definition (nat to scale). 1997 Mar 11 11Philips Semiconductors Preliminary specification Home automation modem TDA5051 TIMING Configurations for clock ATAL C_i For parameter description see Table 1. CLKouT MIGRO- CONTROLLER GND Osc1 osc DGND TDASOS1 Fig.6 External Clock. MGKOO7 CLKyiy CLKOUT MIGRO- CONTROLLER osc? 2 DGND GND For parameter description see Table 1. osce Gt 8 1 TDASOS1 1 Rp CeIXTAL c2 Osct 7 Ik wr mG Kooe Fig.7 Typical configuration for on-chip clock circuit. Table 1 Clock oscillator parameters fose fer ltose OSCILLATOR CARRIER CLOCK OUTPUT EXTERNAL COMPONENTS FREQUENCY FREQUENCY FREQUENCY 6.208 MHz to 9.344 MHz 97 kHz to 146 kHz 3.104 MHz to 4.672 MHz Rp = 2.2 lo 4.7 MQ; C1 = Ce = 27 to 47 pF; XTAL = standard quarliz crystal 1997 Mar 11 12Philips Semiconductors Preliminary specification Home automation modem TDA5051 Table 2. Calculation of parameters depending of the clock frequency (2) trx = twyolyemin) (3) trx < twiolyminy: Wrong Operation Fig.8 Relationship between DATA), and TXour (see Table 3). SYMBOL PARAMETER CONDITIONS UNIT fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz; with Hz external clack: frequency of the signal applied at OSC1 fotkcout) CLK_OUT frequency ose Hz 2 for carrier frequency / digital filter fose Hz tuning frequency 64 tsu set-up time of the shaped burst | 24 1536 s or for lose th hald time of the shaped burst a4 1536 s For fose tw(Diyminy | Minimum pulse width of DATAjy be 1 s signal et fer bweburst)(min) minimum burst time of Voyoc} twphmin) + th 3 signal befage} AGC time constant 2514 s osc tsu(demod) | demodulation set-up time 3100 (=max.) s fose thidemod) demedulation hold time 3500 (=max.) s lose TROUT st fW(burst) ~tW(burst)(min) Veypc) 0 DATAIN TY f \ \ \ / L__A _/ (1) trx > tweoryminy m wee wl Sie MaKo09 1997 Mar 11 13Philips Semiconductors Preliminary specification Home automation modem TDA5051 Table 3 Relationship between DATAiny and TXourt PD DATAin TXout 1 don't care high impedance 0 1 high impedance (after t,) 0 0 active with DC offset }* Wburst) *| me! iggy [* hy 100% MGHOTO Fig.9 Pulse shape characteristics. 1997 Mar 11 14Philips Semiconductors Preliminary specification Home automation modem TDA5051 Timing diagrams 90% Yop Vpp CLKguT NOT DEFINED CLOCK STABLE DATA TXOUT dpuyeT x) Manors DATAis an edge-sensitive input and must be HIGH before starting a transmission. Fig.10 Timing diagram during power-up in transmission mode. 90% Vpp Yop cLKogut NOT DEFINED GLOGK STABLE XIN DATAQUT NOT DEFINED HIGH apuy(Ax) dem)h) MGKOT6 Fig.11 Timing diagram during power-up in reception mode. 1997 Mar 11 15Philips Semiconductors Preliminary specification Home automation modem TDA5051 PD " j \ / N paar = Oti<<s~=SstCSS DATA h TXour ag =) lagpdy(Tx) - normal operation ele wrong operation Le rxour delayed by PD _, MGKOI7 Fig.12 Power-down sequence in transmission mode. / \ PD h AXIN DATAguT \ \ | \. td(dem)(su) | a td(pd} (RX) | LL td(pd)(RX) ~* DATAgyT delayed by PD | MGKOTE Fig.13 Power-down sequence in reception mode. \ PD | , / RXin DATAguT \ -twake(min) T IDDERX) lbp / \ / \ IDDPD) 0 Fig.14 Power saving by dynamic control of power-down. MGKO19 1997 Mar 11 16Philips Semiconductors Preliminary specification Home automation modem TDA5051 TEST INFORMATION aan 1pF DATA TXOUT IN}, 10 HK pulse generator TDAS5051 300 Hz DATA (to be tested) DATA 10 nF 50% OUT! 4 RAIN ik 30.0. i v2 | XTAL f OSCILLOSCOPE ose , DATAIN h / TXour/RXIN DATAgQUT | faa al tddem)(su) ta(dem)h) MGKOT2 Fig.15 Test set-up for measuring demodulation delay. 1997 Mar 11 17Philips Semiconductors Preliminary specification Home automation modem TDA5051 COUPLING GISPR16 NETWORK NETWORK} f ~ 7+ f a * TXqut 10 pF 33nF 47pH 19 |-________] 250 nF = TDASOS1 33 nF 47 nH Tl 5.6 & 12,5, g| AGND. DGND, APGND 60 uH 1 13, 3,11 I Joon 50 DATAIN =a DDA, DDD, YDDAP 250 nF (1) 2) +5 V POWER SUPPLY 50 nH SPECTRUM ANALYSER 52 50 O MG Kot 3 (1) Square wave TTL signal 300 Hz duty cycle = 0.5 for measuring signal bandwidth (see spectrum Fig.3). (2) DATA), = LOW for measuring total harmonic distortion (see spectrum Fig.3). (3) The GISPR16 network provides a -6 dB attenuation. Fig.16 Test set-up for measuring THD and bandwidth of the TXour signal. 1997 Mar 11 18Philips Semiconductors Preliminary specification Home automation modem . 10 OUT > in out > 500 COUPLING TDASO51 NETWORK SPECTRUM 12,] AGND, DGND, APGND (1) ANALYSER 5, _ 43 + 1 | DATAy | OSC 4H OSGe 4 out XTAL = 8.48 MHz GENERATOR osc ct A Osc 7 8 14 RXin out in COUPLING roaeost 4 NETWORK PARAMETERS (tobe tested) 42 | aGND, DGND, APGND (1) 600 BAUD 5, PSEUDO RANDOM SEQUENCE: 2 9 on 512 BITS LONG DATAQYUT DATAIN > m RXD V24/TTL V24 SERIAL DATA DATAQUT INTERFACE ANALYSER 4 ] TxD on > MGHOi4 (1) See Fig.16. Fig.17 Test set-up for measuring bit error rate (BER). 1997 Mar 11 19Philips Semiconductors Preliminary specification Home automation modem TDA5051 APPLICATION INFORMATION +5 V Cc . 250 V (AG) T 100 mA max L TNAG 391 250 rv (AC) a7 WH 68O 33 nF (2 W) 250 V (AG) 33 nF +5 V 3 1N4006 47 pH 78L05 * . i 2 + 7V5 1 470 pF iN4006 I (6 V) (1.3 W) t 10 pF (eV) L +L 10 pF + 47 "T T" 6 Vj Vopp |Yopar |pbA DATAW 3 11 13 - ' RXin 10nF DATASUT 14 i MIGRO- 2 CONTROLLER TDASO51 1 CLKouT 49 L2OUT Pol. P6KEBV8 - 7 8 5 9 12 osc OSCz2 |DGND | APGND | AGND 2.2 MO oe }# XTAL 8.48 MHz + oT 27 pF 5227 pr 1 1 MGKO20 Fig.18 Application diagram. 1997 Mar 11 20Philips Semiconductors Preliminary specification Home automation modem TDA5051 MBH907 10 Z input Q) 10 10 107 10 102 108 107 108 108 i (Hz) Main features of the coupling network: 50 Hz rejection > 80 dB; Anti-aliasing for the digital filler > 50 dB at the sampling frequency ("4fosc); Input impedance always higher than 10 Q. Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (f,, = 132.5 KHz}. MBHS0E 130 Vo (dBpV) 120 Zine @) Fig.20 Output voltage versus line impedance (with coupling network). 1997 Mar 11 21Philips Semiconductors Preliminary specification Home automation modem TDA5051 250 V (AG) T 100 mA max TNRAG 391 OS w) tro nF . = n 250 V (AC) TOKO t T1002 4 at 6 ay +5 V 3)/n=4]n=1]1 6.8 2 1 nF 78L065 3.3 H 2 33 B ey = + L470 47 nF L +L 10 pF nF J re V) Vopp |poap |pba +o DATAIN 3 11 13 1 PXIN DATAQUT 5 14 MIGRO- TDASOSI1 CONTROLLER ClKoyt to TXout 4 4 PD 15 7 8 5 9 12 / mH osc2 |DGND | APGND | AGND P6KE6VS Be. TF XTAL 8.48 MHz +I baa 27 pF 27 pF I T MaKOz Fig.21 Application diagram with power line insulation. 1997 Mar 11 22Philips Semiconductors Home automation modem Preliminary specification TDA5051 PACKAGE OUTLINE $016: plastic small outline package; 16 leads; body width 7.5 mm $0T162-1 D +e +a] | x I ro 7 a" J i_ SL i = = Cc x. r| ar ly! He t=] v ao] A ler 16 9 I \ 2 hae _ _ _ _ Ag A Lf | nN in 1 index { pl j 79 ri ~ Lp | yo ' | 8 [elle el, ie] 0 5 10 mm L L L } scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT | ax.) Ar | Az | As | bp c pM | gM] 2 He L Lo a v w y 2 | 9 0.30 | 245 049 | 0.32 | 105] 7.6 10.65 14 14 09 mm | 285 | oto | 225 | *5 | oae | 023) 101) 74 | 1? | to00] 1 | o4 | to | %25] 925] Ot | ga | go oO . 0.012 | 0.096 0.019 | 0.013 | 0.44 | 0.30 0.42 0.043 | 0.043 0.035; 9 inches | 0.19 | 9594 | 0.089 | 2-91 | o.014| 0.009 0-40 | 0.29 | 9-999} 9.39 | 9-98 | o.o16 | o.0a9 | 9-01 | 9-01 | 0.004 |g o46 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES VERSION PROJECTION | [SSUE DATE IEC JEDEC EIAJ ate SOT162-1 075E03 MS-013AA } on at oA 23 1997 Mar 11Philips Semiconductors Preliminary specification Home automation modem TDA5051 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounied ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives avery brief insight to a complex technology. Amore in-depth account cf soldering ICs can be found in our"IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied ta the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range fram 215 to 250 C, Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45C. 1997 Mar 11 24 Wave soldering Wave soldering techniques can be used for all SO packages if the following cancitions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to & seconds between 270 and 320.Philips Semiconductors Preliminary specification Home automation modem TDA5051 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for praduct development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134}. Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, itis advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Mar 11 25Philips Semiconductors Preliminary specification Home automation modem TDA5051 NOTES 1997 Mar 11 26Philips Semiconductors Preliminary specification Home automation modem TDA5051 NOTES 1997 Mar 11 27Philips Semiconductors Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 101, Fax. +43 160101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Lid., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMIGONDUGTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Ghee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombla: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN , Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-O2630 ESPOO, Tel. +358 9615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 140 99 6161, Fax. +33 1 40 99 6427 Germany: HammerbrookstraBe 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +301 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worlil, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore lreland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3645 0444, Fax. +972 3649 1007 Italy: PHILIPS SEMIGONDUGTORS, Piazza I Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +813 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy For all other countries apply to: Philips Semiconductors, Marketing & Sales Gommunications, a worldwide company Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.0. Box 1041, AUCKLAND, Tel. +64 9 649 4160, Fax. +649 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: UI. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Ply Lid., 195-215 Main Road Marlindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Ruado Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARGELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, $-16485 STOCKHOLM, Tel, +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Gad. No. 5, 80640 GULTEPEASTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Lid., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8471 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: htip:/Awww.semiconductors.philips.com Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1997 SGCA53 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/01 /pp28 Philips Semiconductors Date of release: 1997 Mar a] Document order number: 9397 750 01538 2 = fs 2 fw : = & = ee = & & oc = a a, oat ah Bot ae BS ee ee an ESS os Bs oo? SB Shahkhoot Gah he Ge tha a oer ate cot ER ah ie, 2 fees BASUCS. TROLS SOS ie iottta SRA PAS Se Ber ee, -