MS5611-01BA03 Barometric Pressure Sen so r, with st ain l ess st eel cap
DA5611-01BA03_011 www.meas-spec.com Oct. 26, 2012
000056111624 ECN1742 1/20
• High resolution module, 10 cm
• Fast conversion down to 1 ms
• Low power, 1 µA (standby < 0.15 µA)
• QFN package 5.0 x 3.0 x 1.0 mm3
• Supply voltage 1.8 to 3.6 V
• Integrated digital pressure sensor (24 bit ΔΣ ADC)
• Operating range: 10 to 1200 mbar, -40 to +85 °C
• I2C and SPI interface up to 20 MHz
• No external components (Internal oscillator)
• Excellent long term stability
DESCRIPTION
The MS5611-01BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI
and I2C bus interface. This barometric pressure sensor is optimized for altimeters and variometers with an
altitude r esol uti on of 10 cm. The sensor m odule inc lud es a hig h line ar ity pressure s ens or and a n ul tr a low power
24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and
temperature value and different operation modes that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output allows the implementation of an
altimeter/thermometer function without any additional sensor. The MS5611-01BA can be interfaced to virtually
any microcontroller. The communication protocol is simple, without the need of programming internal registers in
the device. Small dimensions of only 5.0 mm x 3.0 mm and a height of only 1.0 mm allow for integration in
mobile devices. This new sensor module generation is based on leading MEMS technology and latest benefits
from MEAS Switzerland proven experience and know-how in high volume manufacturing of altimeter modules,
which have been widely used for over a decade. The sensing principle employed leads to very low hysteresis
and high stability of both pressure and temperature signal.
FEATURES
FIELD OF APPLICATION TECHNICAL DATA
• Mobile altimeter / barometer systems Sensor Performances (VDD = 3 V)
•
Bike computers
Pressure
Min
Typ
Max
Unit
•
Variometers
Range 10 1200 mbar
•
Height sensing for medical alarms
ADC 24 bit
• Indoor navigation
Resolution (1)
mbar
FUNCTIONAL BLOCK DIAGRAM
VDD
GND
PS
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
Accuracy 25°C, 750 mb ar -1.5 +1.5 mbar
Error band, -20°C to +85°C
450 to 1100 mbar (2)
-2.5 +2.5 mbar
Response time (1)
ms
Long term stabilit y ±1 mbar/yr
Temperature Min Typ Max Unit
Range -40 +85 °C
Resolution <0.01 °C
Accuracy -0.8 +0.8 °C
Notes: (1) Oversampling Rat i o: 256 / 512 / 1024 / 2048 / 4096
(2) With autozero at one pressure point
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PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Supply voltage
VDD
-0.3
+4.0
V
Storage temperature
TS
-40
+125
°C
Overpressure
Pmax
6
bar
Maximum Soldering
Temperature
Tmax 40 sec max 250 °C
ESD rating
Human Body
Model
-4 +4 kV
Latch up
JEDEC standard
No 78
-100 +100 mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Operating Supply voltage
VDD
1.8
3.0
3.6
V
Operating Temperature
T
-40
+25
+85
°C
Supply current
(1 sample per sec.) IDD
OSR 4096
2048
1024
512
256
12.5
6.3
3.2
1.7
0.9
µA
Peak supply current
during conversion
1.4
mA
Standby supply current
at 25°C
0.02
0.14
µA
VDD Capacitor
From VDD to GND
100
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output Word
24
bit
Conversion time tc
OSR 4096
2048
1024
512
256
7.40
3.72
1.88
0.95
0.48
8.22
4.13
2.08
1.06
0.54
9.04
4.54
2.28
1.17
0.60
ms
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PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
450
1100
mbar
Extended Pressure Range Pext
Linear Range of
ADC
10 1200 mbar
Total Error Band, no autozero
at 25°C, 700. .110 0 mbar
at 0..50°C, 450..1100 mbar
at -20..85°C, 450..1100 mbar
at -40..85°C, 450..1100 mbar
-1.5
-2.0
-3.5
-6.0
+1.5
+2.0
+3.5
+6.0
mbar
Total Error Band, autozero at
one pressure poi nt
at 25°C, 700..1100 mbar
at 10..50°C, 450..1100 mbar
at -20..85°C, 450..1100 mbar
at -40..85°C, 450..1100 mbar
-0.5
-1.0
-2.5
-5.0
+0.5
+1.0
+2.5
+5.0
mbar
Maximum error with supply
voltage
VDD = 1.8 V … 3.6 V ±2.5 mbar
Long-term stability
±1
mbar/yr
Recovering time after reflow (1)
7
days
Resolution RMS
OSR 4096
2048
1024
512
256
0.012
0.018
0.027
0.042
0.065
mbar
(1) Time to recovering at least 66% of the reflow impact
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Absolute Accuracy
at 25°C
-20..85°C
-40..85°C
-0.8
-2.0
-4.0
+0.8
+2.0
+4.0
°C
Maximum error with supply
voltage
VDD = 1.8 V … 3.6 V ±0.5 °C
Resolution RMS
OSR 4096
2048
1024
512
256
0.002
0.003
0.005
0.008
0.012
°C
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PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS (CSB, I2C, DIN, SCLK)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Serial data cloc k
SCLK
SPI protocol
20
MHz
Input high volta ge
VIH
Pins CSB
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage cur rent Ileak25°C
Ileak85°C
at 25°C 0.15 µA
PRESSURE OUTPUTS (I2C, DOUT)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output high voltage
VOH
Isource = 1. 0 mA
80% VDD
100% VDD
V
Output low voltage
V
OL
I
sink
= 1.0 mA
0% V
DD
20% V
DD
V
Load capacitan ce
CLOAD
16
pF
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FUNCTIONAL DESCRIPTION
VDD
GND
PS
SCLK
SDO
SDI/SDA
Meas. MUX
ADC
Digital
Interface
Memory
(PROM)
128 bits
SENSOR
SGND
+IN
-IN
dig.
Filter
Sensor
Interface IC
PGA
CSB
Figure 1: Block diagr am of MS5611-01BA
GENERAL
The MS5611-01BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5611-01BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every m odule is indi viduall y factor y calibrat ed at two t em peratures and two pres sures . As a result, 6 c oeff icients
necessary to compensate for process variations and temperature variations are calculated and stored in the
128-bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
SERIAL INTERFACE
The MS5611-01BA has built in two t ypes of serial interfaces : SPI and I 2C. Pulling the Protocol Select pin PS to
low selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
Pin PS
Mode
Pins used
High
I2C
SDA
Low
SPI
SDI, SDO, CSB
SPI MODE
The ext ernal m icrocontroll er clock s in the data throu gh the i nput S CLK (S erial CL ocK) and SDI (Ser ial Data I n).
In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor
responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the
interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the
command is sent or after the end of the command execution (for example end of conversion). The best noise
perform ance from the m odule is obtained w hen the SPI bus is idle and witho ut comm unication to other dev ices
during the ADC conversion.
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I2C MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta).
The sens or res ponds on th e sam e pin SDA wh ich is bidirec tiona l for the I2C bus i nterfac e. So th is inter fac e type
uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space. In
I2C-Mode the com plement of the pin CSB (Chip Select) represents the LSB of the I2C address. It is possible to
use two sensors with two different addresses on the I2C bus. The pin CSB shall be connected to VDD or GND
(do not leave unconnected!).
COMMANDS
The MS5611-01BA has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
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PRESSURE AND TEMPERATURE CALCULATION
Size
[1]
[bit] min max
C1
Pressure sensitivity | SENS
T1
unsigned int 16 16 065535 40127
C2
Pressure offset | OFF
T1
unsigned int 16 16 065535 36924
C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 065535 23317
C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 065535 23282
C5
Reference temperature | T
REF
unsigned int 16 16 065535 33464
C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 065535 28312
D1
Digital pressure value unsigned int 32 24 016777216 9085466
D2
Digital temperature value unsigned int 32 24 016777216 8569150
dT
Difference between actual and reference temperature
[2]
dT = D2 - T
REF
= D2 - C5 * 2
8
signed int 32 25 -16776960 16777216 2366
2007
= 20.07 °C
OFF
Offset at actual temperature
[3]
OFF
=
OFF
T1
+
TCO
*
dT =
C2
*
2
16
+
(C4
*
dT)
/
2
7
signed int 64 41 -8589672450 12884705280 2420281617
SENS
Sensitivity at actual temperature
[4]
SENS
=
SENS
T1
+
TCS
*
dT
=
C1 * 2
15
+
(C3
*
dT)
/
2
8
signed int 64 41 -4294836225 6442352640 1315097036
100009
= 1000.09 mbar
Notes
[1]
[2]
[3]
[4]
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
120000
1000
58
P
Recommended
variable type
Descript ion | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP
=
20°C
+
dT
*
TEMPSENS
=
2000
+
dT
*
C6
/
2
23
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (10…1200mbar with
0.01mbar resolution)
P = D1 * SENS - OFF = (D1 * SENS / 2
21
- OFF) / 2
15
min and max have to be defined
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Start
Maximum values for calculation results:
P
MIN
= 10mbar P
MAX
= 1200mbar
T
MIN
= -40°C T
MAX
= 85°C T
REF
= 20°C
Read calibration data (factory calibrated) from PROM
Read digital pressure and temperature data
Calculate temperat ure
Calculate temperat ure compensated pressure
Display pressure and t em perature value
Figure 2: Flow chart for pressure and temperature reading and software compensation.
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SECOND ORDER TEMPERATURE CO MPENS ATIO N
Yes
No
SENS2 = 5 ⋅ (T EMP – 2000)
2
/ 2
2
SENS2 = 0
SENS = SENS - SENS2
TEMP<20°C
Low temperature
T2 = dT
2
/ 2
31
OFF2 = 0
T2 = 0
OFF2 = 5 ⋅ (TEMP – 2000)
2
/ 2
1
OFF = OFF - OFF2
TEMP = TEMP - T2
Low temperature
High temperature
Calculate pressure and temperature
TEMP<-15°C
No
Yes
SENS2 = SENS2 + 11 ⋅ (TEMP + 1500)
2
/ 2
1
Low temperature
OFF2 = OFF2 + 7 ⋅ (TEMP + 1500)
2
Very low temperature
Figure 3: Flow chart for pressure and temperature to the optimum accuracy.
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SPI INTERFACE
COMMANDS
Size of each c ommand is 1 byte (8 bits ) as described in the tab le below. After AD C read commands the device
will return 24 bit result and after the PRO M read 16bit result. The address of the PROM is embedded inside of
the PROM read command using the a2, a1 and a0 bits .
Command by te
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name
PR
M
COV
-
Typ
Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read
1
0
1
0
Ad2
Ad1
Ad0
0
0xA0 to
0xAE
Figure 4: Command structure
RESET SEQUENCE
The Res et s e que nce s ha ll be s en t o nc e af ter po wer -on to make sur e that th e c a li bratio n PRO M ge ts lo ad ed into
the internal register. It can be also used to reset the device ROM from an unknown condition
Figure 5: Reset command sequenc e SPI mode 0
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Figure 6: Reset command sequence SPI mode 3
CONVERSION SEQUENC E
The conver sion com m and is used to init iate uncom pens ated press ure (D1) or uncom pens ated tem peratur e (D 2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the con version, using ADC read comm and the result is clock ed out with the MSB f irst. If the convers ion is
not execut ed bef ore the ADC r ead comm and, or the A DC read c omm and is r epeated, it wil l give 0 as the o utput
result. If the ADC read c ommand is s ent during c onversion the r esult will be 0, the con version will not stop and
the final resu lt will be wrong. Convers ion sequenc e sent duri ng the alread y starte d conversi on process will yield
incorrect result as well.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
8.22ms ADC CONVERSION
Figure 7: Conversion out sequence, Typ=d1, OSR = 4096
Figure 8: ADC Read sequence
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibrati on PROM and to c alculate the calibration coefficients. T here are in tota l 8 address es resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 conta ins t he s erial co de and CRC. T he com m and sequence is 8 bits l ong with a 16 bit resul t wh ich is
clocked with the MSB first.
0 1 2 3 4 5 6 7
SCLK
CSB
SDI
SDO
PS
2.8ms RELOAD
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Figure 9: PROM Read sequence, address = 011 (Coefficient 3).
I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5611-01BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
not have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The res et c an be s e nt at a n y t ime. In the e vent that ther e is n ot a s uc c ess f ul po we r on r eset t h is may be caused
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5611-01BA to
function is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1
1
1
0
1
1
CSB
0
0
0
0
0
1
1
1
1
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Condition
R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
Figure 10: I2C Reset Command
PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
Figure 11: I2C Command to read memory address= 011 (Coefficient 3)
1
1
1
0
1
1
CSB
1
0
1
1
0
0
X
X
X
X
0
X
X
X
X
X
X
X
X
0
S
R
A
A
N
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Conditi on
R = Read
N = Not Acknowledge
data
data
Device Address
Memory bit 15 - 8
Memory bit 7 - 0
Device Address
Figure 12: I2C answer from MS5611-01BA
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CONVERSION SEQUENC E
A convers ion can be started b y sendin g the comm and to MS5611-01BA. W hen command is sent to the s ystem
it stays bus y unti l con vers io n is done. When c onvers io n is f inis he d the d ata c a n b e ac ces s ed b y sendi ng a R ead
command, when an ack nowledge appears from the MS5611-01BA, 24 SCLK cycles m ay be sent to receive all
result bits. Every 8 bit the system waits for an acknowledge signal.
1
1
1
0
1
1
CSB
0
0
0
1
0
0
1
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Conditi on
R = Read
N = Not Acknowledge
command
cmd byte
Device Address
Device Address
Figure 13: I 2C Command to initiate a pressure conv er sion (OSR =4096, ty p=D 1)
1
1
1
0
1
1
CSB
0
0
0
0
0
0
0
0
0
0
0
S
W
A
A
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Conditi on
R = Read
N = Not Acknowledge
command
Device Address
Device Address
cmd byte
Figure 14: I 2C ADC read sequence
1
1
1
0
1
1
CSB
1
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
S
R
A
A
A
N
P
From Master
S = Start Condition
W = Write
A = Acknowledge
From Slave
P = Stop Conditi on
R = Read
N = Not Acknowledge
data
data
data
Device Address
Device Address
Data 23-16
Data 7 - 0
Data 8 - 15
Figure 15: I 2C answer from MS5611-01BA
CYCLIC REDUNDANCY CHECK (CRC)
MS5611-01BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
A
d
d
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
16 bit reserved for manufacturer
1
Coefficient 1 (16 bit unsigned)
2
Coefficient 2 (16 bit unsigned)
3
Coefficient 3 (16 bit unsigned)
4
Coefficient 4 (16 bit unsigned)
5
Coefficient 5 (16 bit unsigned)
6
Coefficient 6 (16 bit unsigned)
7
CRC
Figure 16: Memory PROM mapping
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APPLICATION CIRCUIT
The MS5611-01BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter
applicat ions. It is desig ne d for low-voltage systems with a supply voltage of 3 V.
Figure 17: Typical application circuit with SPI / I2C proto col comm uni cat ion
MS5611-01BA
MS5611-01BA
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PIN CONFIGURATION
Pin
Name
Type
Function
1
VDD
P
Positive supply voltage
2 PS I
Protocol sele ct
PS high (VDD) I2C
PS low (GND)
SPI
3 GND G Ground
4
CSB I Chip select (active low),
internal connection
5
6
SDO
O
Serial data output
7 SDI /
SDA I / IO Serial data input /
I2C data IO
8
SCLK
I
Serial data cloc k
DEVICE PACKAGE OUTLINE
Figure 18: MS5611-01BA03 package outline
MS5611-01BA03 Barometric Pressure Sen so r, with st ain l ess st eel cap
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RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5611-01BA soldered onto printed circuit board.
SHIPPING PAC KA GE
Reserved area:
Please do not route
tracks between pads
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MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering issues.
MOUNTING
The MS5611-01BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacu um. Due to the l o w str ess as sembl y the sens or does not show pressur e hyst eres is ef fects.
It is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important
for applications in watches and other special devices.
CLEANING
The MS5611-01BA has been manufactured under cleanroom conditions. It is therefore recommended to
assem ble the sens or under class 10 ’000 or b etter co nditions. Should this not be poss ible, it is recomm ended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The
MS5611-01BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used
during the assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor
must be placed as close as possible to the MS5611-01BA VDD pin. This capacitor will stabilize the power
supply during data conversion and thus, provide the highest possible accuracy.
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ADC-value D1 vs Pressure (typical)
3000000
4000000
5000000
6000000
7000000
8000000
9000000
10000000
0100 200 300 400 500 600 700 800 900 1000 1100
Pressure (mbar)
ADC-value D1 (LSB)
-40°C
20°C
85°C
TYPICAL PERFORMANCE CHARACTERISTICS
ADC - value D2 vs Temperatur e ( typical)
4000000
5000000
6000000
7000000
8000000
9000000
10000000
11000000
12000000
-40 -20 020 40 60 80 100 120
Temperature (°C)
ADC-value D2 (LSB)
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Ab solute Pressure Accuracy after C alibration, 2nd order compensation
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
300 400 500 600 700 800 900 1000 1100
Pressure (mbar)
Pressure error (mbar)
85°C
60°C
20°C
0°C
-40°C
Poly. (85°C)
Poly. (60°C)
Poly. (20°C)
Poly. (0°C)
Poly. (-40°C)
Pressure Error Accuracy vs temperature (typical)
-4
-2
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
-40 -20 020 40 60 80
Temperature (°C)
Pressure error (mbar)
Perror(1000,1st order)
Perror(1000,2nd order)
Perror(800,1st order)
Perror(800,2nd order)
Perror(450,1st order)
Perror(450,2nd order)
Temperature Error Accuracy vs temperature (typical)
-5
0
5
10
15
-40 -20 020 40 60 80 100 120
Temperatur e ( °C)
Temperature error (°C)
Temperature error (standard
calculation)
Temperature error (with 2nd
order calculation)
TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)
85°C
60°C
20°C
0°C
-40°C
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TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED)
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ORDERING I NFORMATION
Product Code
Product
Art. No
Delivery Form
MS5611-01BA03 Ba rometric Pressure Sensor
Thin Metal Cap
MS561101BA03-00 Waffle pack
MS5611-01BA03
Barometric Pressure Sensor
Thin Metal Cap
MS561101BA03-50 Tape and reel
FACTORY CONTACT S
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
e-mail: pfg.cs.amerameas-spec.com
Website: www.meas-spec.com
MEAS Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: + 41 32 847 9569
e-mail: sales.chameas-spec.com
Website: www.meas-spec.com
Measurement Specialties (China), Ltd.
No. 26 Langshan Road
Shenzhen High-Tech Park (North)
Nanshan District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asiaameas-spec.com
Website: www.meas-spec.com
The information i n this sheet has been carefully reviewed and is believed to be accurate; however, no respons i bi lit y is assumed for
inaccuracies. Furtherm ore, this i nformation does not convey to the purchaser of such devices any license under the patent rights to the
manufacturer. Measurement Specialti es, Inc. reserves the right to make changes without furt her notice to any product herein. Measurement
Specialti es, Inc. makes no warranty, represent ation or guarant ee regarding the sui t abi lit y of its product for any particular purpose, nor does
Measurement Specialti es, Inc. assume any liabilit y arising out of the applicat i on or use of any product or circuit and specifically disclaims
any and all liabilit y, includi ng without limitation consequential or incidental damages. Typical paramet ers can and do vary in different
applicat i ons. All operat i ng parameters must be validated for each customer applic at i on by customer’s technical experts. Meas urem ent
Specialti es, Inc. does not convey any lic ense under its patent rights nor the rights of others.