Features of Enhanced Single-Phase RPM Architectures
High performance RPM control system
Ultralow offset IOUT monitor
Dynamic VID feed-forward
Programmable droop gain
Zero droop capable
Thermal monitor
Ultra-sonic operation
Digitally controlled operating frequency
Features of Multi-Phase Dual Edge Architecture
Current-mode dual-edge modulation for fast initial response to transient loading
High-performance operational error amplifier
Accurate total summing current amplifier
High-impedance differential voltage and total current sense amplifiers
Phase-to-phase dynamic current balancing
“Lossless” DCR current sensing for current balancing
Dual-Edge & RPM Modulation Vcore Controllers
for IMVP8 Designs
Page 2 Computing Solutions
Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases
Integrated
Drivers Interface Package
NCP81201 Tablet Controller VR12.1 RPM 1 1 SVID QFN-28
NCP81111 Microserver Controller VR12.5 Hybrid 1 1/2/3 SVID QFN-32
NCP81203 Desktop Controller IMVP8 Dual Edge 23/2/1+2/1 SVID QFN-52
NCP81203P Notebook Controller IMVP8 Dual Edge 23/2/1+2/1 SVID QFN-52
NCP81205 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 SVID QFN-52
NCP81216 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5 V SVID QFN-52
NCP81236 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1/2+1+1 3 x 5 V SVID QFN-52
NCP81218 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 SVID QFN-48
NCP81210 Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40
Please contact ON Semiconductor for product datasheets.
Desktop Solutions
Ultrabook Solution Notebook Solutions
Microserver Solutions
NCP81203 3+2 Phase Controller
Dual Edge for fast transient response
Constant on-time for light load efficiency
Supports all MLCC output capacitor solutions
IMVP8 compliant
NCP81218 1+2+1 Phase Controller
Dual Edge & DCR current sensing for fast transient response
EN RPM for fast transition between DCM and CCM mode
True Differential Current Balancing
IMVP8 compliant
NCP81205 3+3+1 Phase Controiler
Dual Edge & DCR current sensing for fast transient response
EN RPM for fast transition between DCM and CCM mode
True Differential Current Balancing
IMVP8 compliant
NCP81111 3-Phase Digital Controller
Optimised to operate at 5MHz using DrMOS
Can operate as general purpose I2C controller regulator
Internal compensation using GUI interface
VR12.5/6 compliant
+12 V
RAIL1
RAIL2
+12 V
+12 V
+12 V
+12 V
NCP81203
3+2
Phase
Controller
CPU
NCP81161
12 V Driver
NCP81161
12 V Driver
NCP81161
12 V Driver
NCP81161
12 V Driver
NCP81161
12 V Driver
+20 V
RAIL1
RAIL2
RAIL3
+20 V
+20 V
+20 V
+20 V
+20 V
+20 V
NCP81205
3+3+1
Phase
Controller
CPU
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81253
5 V Driver
RAIL1
NCP81381
DrMOS
NCP81111
3
Phase
Controller
CPU
NCP81381
DrMOS
NCP81381
DrMOS
RAIL1
RAIL2
NCP81382
DrMOS
NCP81382
DrMOS
RAIL3
NCP81382
DrMOS
NCP81218
1+2+1
Phase
Controller
CPU
NCP81382
DrMOS
Page 3ON Semiconductor
Page 4 Computing Solutions
IMVP8 Multiphase Controllers for Embedded Applications
NCP81245 3+3+1 Phase Controller
Dual Edge & DCR current sensing for fast transient response
EN RPM for fast transition between DCM and CCM mode
True Differential Current Balancing
IMVP8 compliant
+20 V
RAIL1
RAIL2
RAIL3
+20 V
+20 V
+20 V
+20 V
+20 V
+20 V
NCP81245
3+3+1
Phase
Controller
CPU
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81151
5 V Driver
NCP81253
5 V Driver
Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases
Integrated
Drivers Interface Package
NCP81243 Desktop Controller IMVP8 Dual Edge 23/2/1+2/1 SVID QFN-52
NCP81245 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 SVID QFN-52
NCP81246 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5 V SVID QFN-52
NCP81248 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 - SVID QFN-48
NCP81255 Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40
NCP81145 Ultrabook & Notebook 5 V Driver for Dual Edge Rail DFN-8
NCP81146 Desktop 12 V Driver for Dual Edge Rail DFN-8
NCP81253 Ultrabook & Notebook 5 V Driver for EN RPM rail DFN-8
System Power
System power management devices provide additional rails in computing applications, beyond Vcore and graphics. They are available
with single or dual channel operation, and also in multi-phase configurations.
BOOT
UG
LX
VCC
GND
FB
VOS
LG
PGOOD
VIN = 2.5 V 13.2 VVCC = 4.5 V 13.2 V
0.1 F
4.7nF
2x1800 F
2.2
1 H
1500 F
1.02k
R4
3.878k
C3
0.014 F
1.02k
R3
74.2
R1
4.12k
C2
0.007 F
R2
17.08k
C1
0.0015 F
1F
COMP/EN
ROCSET
NTD4806 NTD4809
3x22 F
1500 F
2x0.22 F
VBST = 4.5 V 15 V
GND
VOUT
1.65 V
R9 R10
Device Description Topology
VCC Min
(V)
VCC Max
(V)
fSW Typ
(kHz) Package
NCP1579 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 275 SOIC-8
NCP1587 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 250 - 300 SOIC-8
NCP1587A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 180 - 220 SOIC-8
NCP1589A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 DFN-10
NCP1589D Snychronous Buck Controller Step-Down 4.5 13.2 DFN-10
NCP1589L Synchronous Buck Controller, Low Voltage, with Light Load Efficiency and Transient Enhancement Step-Down 4.5 13.2 DFN-10
NCP5212 Single Synchronous Step Down Controller Step-Down 4.5 27 300 QFN-16
NCP5217 Synchronous Buck Controller, Single Step-Down 4.5 27 300 QFN-14
NCP5230 Low Voltage Synchronous Buck Controller Step-Down 4.5 13.2 QFN-16
NCP5269 System Agent Controller with 2-bit VID Step-Down 3.3 28 300 - 600 QFN-20
NCP3231 25 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 4.5 18 500 TQFN-40
NCP3232N 15 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 4.5 21 500 TQFN-40
NCP3133A 3 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 2.9 5.5 1100 QFN-16
NCP3135 5 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 2.9 5.5 1100 QFN-16
Page 5ON Semiconductor
NCP1589A Application Diagram
Thermal Management
Extensive Portfolio
Remote Sensors provide temperature information
of a transistor located at a different position on the
board; also includes local sensor capability
Fan Controllers integrate the temperature sensor
with a fan controller/monitor
System Monitors integrate combinations of
remote and/or local temperature sensing, voltage
monitoring, fan control & monitoring, reset control,
and GPIO functions
System
Voltages +12 V
+5 V
+3.3 V
+2.5 V
+1.8 V
+1.5 V
+1.25 V
+0.9 V
VBatt
Chassis Intrusion
ALERT O/P
Bi-directional
THERM Pins
TDM3
TDM1
TDM2
8 GPIOs
SMBus Interface
RESET I/O
Fan Drive and Control
• 4 PWM Fan Drive Outputs
• 8 Tach Inputs
4 PWM O/Ps
8 Tach Inputs
Fan2Max
Temperature
• Measures 4 Temp Zones
1 Local
3 Remote
THERM I/O
Device
Supply
Range
(V)
Temperature
Range
(°C )
Local
Accuracy
(°C) Interface
Number
of
Addresses
SRC
(Ω)
Remote
Accuracy
Remote
Channels
Fan
Channels
TACH
Channels
Voltage
Monitoring
Channels GPIOs Package
System
Monitors
ADM1026 3 - 5.5 -40 to +120 ±3 I2C/SMBUS 3 ±3 2 8 8 19 17 LQFP-48
ADT7462 3 - 5.5 -40 to +125 ±2.25 I2C/SMBUS 2 2 k ±2.25 3 4 8 13 8 LFCSP-32
NCT80 2.8 - 5.75 -40 to +125 ±2 I2C/SMBUS 8 2 7 1 TSSOP-24
ADT7476 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 ±1.5 2 3 4 5 QSOP-24
Fan
Controllers
ADT7473 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 3 k ±1.5 234 QSOP-16
ADT7475 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 1 ±1.5 234 QSOP-16
Remote
Sensors
NCT72 2.8 - 3.6 -40 to +125 ±1 I2C/SMBUS 21.5 k ±1 1DFN-8, WDFN-8
NCT218 1.4 - 2.75 -40 to +125 ±1.75 I2C/SMBUS 2150 ±1 1WDFN-8, WLCSP-8
ADM1032 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 ±1 1SOIC-8, MSOP-8
ADT7461 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 3 k ±1 1SOIC-8, MSOP-8
ADT7481 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 2 ±1 2MSOP-10
ADT7483 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 9 ±1 2QSOP-16
Page 6 Computing Solutions
Integrated MOSFET and Drivers
Drivers for Discrete MOSFET Implementations
Features
Integrated high- and low-side MOSFETs
Integrated bootstrap diode
Matched of driver and MOSFETs optimize switching performance
Higher switching frequency enables use of smaller inductor and output capacitors
Low-side MOSFET diode emulation mode provides asynchronous operation
65% lower BOM; 45% smaller footprint and simplified layout versus discrete solutions
VIN
2-Phase
Driver
Driver
VIN
IA Rail
GT Rail
3-Phase Driver
Driver
2-Phase
IA Rail
GT Rail
3-Phase
DrMOS
DrMOS
DrMOS
DrMOS
Drivers specifically designed to work with controller solutions, and optimized for 5 V or 12 V gate applications.
Page 7ON Semiconductor
Discrete Integratedversus
Device PWM Input VIN Max (V) Freq Max (MHz) IOUT Continuous Max (A) Package
NCP5369 5 V Tri-state 25 140 QFN-40
NCP81381 5 V Tri-state 30 225 QFN-32
NCP81382 5 V Tri-state 30 235 QFN-28
Device Drivers VCC Typ (V) Integrated Bootstrap Diode Zero Crossover Detection Package
NCP5901 Single 12 N Y DFN-8
NCP5901B Single 12 Y Y DFN-8
NCP81161 Single 12 Y Y DFN-8
NCP81151 Single 5 Y Y DFN-8
NCP81253 Single 5 Y N DFN-8
NCP81061 Dual 12 Y Y QFN-16
NCP81152 Dual 5 Y Y QFN-16
High Performance Dual MOSFETs (Power Clip)
Page 8 Computing Solutions
Features
Co-packaged high-side & low-side MOSFETs reduces board space
Optimized for low Figure-of-Merit = RDS(ON) x Qg
Improved clip for faster switching & improved efficiency
Flipped low-side MOSFET improves thermal performance
Parasitic inductance loops minimized for improved efficiency
Specific Applications
GPU rails in VGA cards and gaming motherboards
Vcore & system rails in notebooks
Device Package
Imax
(A)
BVDSS
(V)
VGS Max
(V)
RDS(ON) Max @ VGS= 4.5 V
(mΩ)
Qg Typ @ VGS= 4.5 V
(nC)
Coss Typ
(pF)
High Side Low Side High Side Low Side Low Side
FDPC8012S
Power Clip 33
15-20 25 12 72.2 825 885
FDPC8013S 10-15 30 20 9.6 2.7 621 997
FDMC2D2N025DSD* 15-20 25 16 72.2 515 886
FDMC2D3N03DSD* 15-20 30 16 72.4 515 1063
FDPC3D5N025X9D 10 25 12 3.7 3.7 17 17 612
FDPC8900* Power Clip 35 14 30 12 56.5 12 8.8 356
FDPC8016S
Power Clip 56
20-30 25 12 4.7 1.7 11 31 1195
FDPC8014S >30 25 12 4.7 1.4 11 43 1720
FDPC8014AS >30 25 12 4.7 1.2 11 44 2170
FDMS001N025DSD >30 25 16 41.1 10 35 1810
FDMS1D2N03DSD* >30 30 16 41.2 11 39 1845
FDPC5018SG 25 30 12 6.5 2 8 28 1210
FDPC5030SG 20 30 12 6.5 3 8 18 801
NTMFD4H088NF*
Power Phase 56
25 30 12 11.3 2 3 21 1530
NTMFD4C85N* >30 30 20 4.3 1.2 15 45 3660
NTMFD4C86N* >30 30 20 8.1 3.4 11 22 1650
* Pending 2Q18.
High Frequency Switching Loop Size Reduction
2 x Discrete
1 x Power Clip
Asymetric Dual MOSFETs
30 V P-Channel MOSFETs
Dual N-Channel MOSFETs
Common Drain FDPC4044
30 V, 27 A
Max rS1S2(on) = 4.3 mΩ at VGS = 10 V, IS1S2 = 27 A
MLP 33 package
Specific Applications
VBUS back-back protection switch for USB Type-C
Replace two discrete back-back MOSFETs with single
compact solution
Common Source FDMD8630
30 V, 167 A
Max rDS(on) = 1 mΩ
PQFN-8 package
Specific Applications
Synchronous Rectification
Synchronous buck for ~50% duty cycle (12 V to 5 V)
Page 9ON Semiconductor
Device Package
Imax
(A)
BVDSS
(V)
VGS Max
(V)
RDS(ON) Max @ VGS= 4.5 V
(mΩ)
Qg Typ @ VGS= 4.5 V
(nC)
Coss Typ
(pF)
High Side Low Side High Side Low Side Low Side
FDMS3620S
Power 56 Dual
>30A
25 12
5.2mΩ1.2mΩ12 50 1828
FDMS3622S 25-30A 5.7mΩ1.6mΩ12 40 1405
FDMS3624S 20-25A 5.7mΩ2.2mΩ12 27 946
FDMS3626S 15-20A 5.7mΩ3.2mΩ12 19 716
NTMFD4901NF
SO8-FL Dual
25-30A
30
20
10.0mΩ3.5mΩ10 20 1100
NTMFD4902NF 25-30A 10.0mΩ6.2mΩ10 12 813
NTMFD4C20N 25-30A 10.8mΩ5.2mΩ913 990
FDMC007N30D Power 33 Dual <13A 12 13.3mΩ7.0mΩ6.4 14 413
FDMC8200S <6A 20 32.0mΩ13.5mΩ3.1 7.2 373
Device Package Configuration
Breakdown VDS/VGS
(V)
RDS(ON) Max @ VGS= 4.5 V
(mΩ)
FDMC013P030Z
MLP 33
Single P-Channel 30/25 13.2
FDMC6675BZ Single P-Channel 30/25 27
FDMC6679AZ Single P-Channel 30/25 18
FDMA6676PZ MLP 22 Single P-Channel 30/25 27
FDMA530PZ Single P-Channel 30/25 65
N-Channel MOSFETs
Maximum Ratings
Qg
(nC)
Qgd
(nC)
Ciss
(pF)
Crss
(pF)
RG
(Ω)
VDS
(V)
VGS
(V)
RDS(ON) (mΩ)
Device Package Polarity
VGS=
10 V
VGS=
4.5 V Applications
NTMFS4C020N
SO-8FL
N-Channel 30 20 0.7 163 13 10144 148 1HPPC
NTMFS4C01N N-Channel 30 20 0.9 1.2 65 18 9200 231 1HPPC
NTMFS4C022N N-Channel 30 20 1.7 2.4 20.8 4.7 3071 67 1 HPPC
NTMFS4C03N N-Channel 30 20 2.3 3.3 19.8 5.3 2789 71 1HPPC
NTMFS4C024N N-Channel 30 20 2.8 414 51972 59 1Synchronous Side
NTMFS4C35N N-Channel 30 20 3.2 4.2 15 5.5 2300 46 1Synchronous Side
NTMFS4C025N N-Channel 30 20 3.4 4.9 11.6 41683 40 1Synchronous Side
NTMFS4C05N N-Channel 30 20 3.4 513 31950 50 1Synchronous Side
NTMFS4C06N N-Channel 30 20 4 6 14.5 5.5 1988 71 1Synchronous Side
NTMFS4C028N N-Channel 30 20 4.7 710.9 5.4 1252 126 1Synchronous Side
NTMFS4C08N N-Channel 30 20 5.8 8.5 8.7 2.8 1100 38 1Synchronous Side
NTMFS4C09N N-Channel 30 20 68.8 10.9 5.4 1252 126 1Control Side
NTMFS4C029N N-Channel 30 20 5.9 99.7 4.8 987 162 1Control Side
NTMFS4C10N N-Channel 30 20 710.8 9.3 4.2 970 125 1Control Side
NTMFS4C032N N-Channel 30 20 7.4 11.1 7.8 3.7 770 127 1Control Side
NTMFS4C13N N-Channel 30 20 9.1 13.8 6.6 2.7 720 95 1Control Side
NTTFS4C02N
µ8-FL
N-Channel 30 20 2 3 20 72800 66 0.8 HPPC
NTTFS4C05N N-Channel 30 20 3.6 5.1 13 31950 50 1Synchronous Side
NTTFS4C06N N-Channel 30 20 4 6 14.5 5.5 1988 71 1Synchronous Side
NTTFS4C08N N-Channel 30 20 5.8 8.5 8.7 2.8 1100 38 1Synchronous Side
NTTFS4C10N N-Channel 30 20 7.4 11 9.3 4.2 970 125 1Control Side
NTTFS4C13N N-Channel 30 20 9.1 13.8 6.6 2.7 720 95 1Control Side
NTTFS4C25N N-Channel 30 20 17 26.5 41.3 455 60 1Control Side
ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook
computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0.
Switching Devices
Processor
Gigabit LAN
Transceiver
Internal
Graphics
Processor
External
Graphics
Processor
North Bridge
(ICH)
South Bridge
(MCH)
VGA Switch
Docking Station Connector
PCIe
Switch
HDMI/DVI
Switch
LAN Switch
USB Power/
Data Switch
Codec
Stereo Switch
Mic Switch
TMDS
DisplayPort
Switch
2nd LCD
Display
LCD
Panel
Audio
Amp
Device Interface Data Rate
No
Channels
Quiescent
Current
NCN2612B PCIe 2.0, DisplayPort 1.1 5 Gb/s 12
250 µA
NCN1188 USB 2.0 / MHL 2.25 Gb/s 2
21 µA
NS5S1153 USB 2.0 480 Mb/s 2
21 µA
NLAS7242 USB 2.0 480 Mb/s 2
1 µA
NLAS52231 Audio 36 MHz 2
1 µA
NLAS4684 Audio 9.5 MHz 2
180 nA
Page 10 Computing Solutions
Page 11ON Semiconductor
Copackaged MOSFET plus CMOS controllers – value-added features plus high performance
Monolithic CMOS smart load switches – value added features, low cost
Discrete MOSFETs – simple, high performance
ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees.
NCP45xxx Integrated Load Switch Feature
Simple/clean design
No current consumption in standby power mode
Small PCB footprint
Low RDS(ON) due to charge pump driving NMOS
Adjustable soft-start time (SR)
Adjustable integrated discharge
Fault protection
Power rail monitoring & sequencing
Thermal,
Undervoltage
&
Short-Circuit
Protection
Control
Logic
Bandgap
&
Biases
Delay and
Slew Rate
Control
Charge
Pump
VIN
VOUTBLEEDGNDSR
PGENVCC
Type Device
ron
(mΩ)
I Max
(A)
VI Min
(V)
VI Max
(V)
IQ
(
m
A) Discharge
Slew Rate
(
m
s) Features Package(s)
Smart Load Switch
NCP330 26 at 3.3 V 3 1.8 5.5 100 - 2000 Reverse blocking TDFN-4
NCP333 55 at 3.3 V 1.5 1.2 5.5 1Auto 95 - WLCSP-4
NCP334 47 at 3.3 V 2 1.2 5.5 1 - 71 - WLCSP-4
NCP335 47 at 3.3 V 2 1.2 5.5 1Auto 71 - WLCSP-4
NCP336 23 at 3.3 V 3 1.2 5.5 1 - 810 - WLCSP-6
NCP337 23 at 3.3 V 3 1.2 5.5 1Auto 810 - WLCSP-6
NCP338 27 at 1.8 V 2 1 3.6 0.6 Auto 20 - WLCSP-6
NCP339 26 at 3.3 V 3 1.2 5.5 2 - 2700 Reverse blocking WLCSP-6
NCP432 50 at 1.8 V 1.5 13.6 0.6 - 20 - WLCSP-4
NCP433 50 at 1.8 V 1.5 13.6 0.6 Auto 20 - WLCSP-4
NCP434 43 at 1.8 V 2 1 3.6 0.6 - 61 - WLCSP-4
NCP435 43 at 1.8 V 2 1 3.6 0.6 Auto 61 - WLCSP-4
NCP436 23 at 1.8 V 3 1 3.6 1 - 27 - WLCSP-6
NCP437 23 at 1.8 V 3 1 3.6 1Auto 27 - WLCSP-6
ecoSWITCH™ Integrated
Load Switch
NCP45524 18.0 60.5 13.5 -Adj - Power good DFN-8
NCP45525 18.0 60.5 13.5 -Adj Adj -DFN-8
NCP45560 2.4 24 0.5 13.5 -Adj Adj Power good; Fault DF N-12
NCP45540 3.3 20 0.5 13.5 -Adj Adj Power good; Fault DFN-12
NCP45541 3.3 20 0.5 13.5 -Adj Adj Power good DFN-12
NCP45520 9.5 10.5 0.5 13.5 -Adj - Power good; Fault DFN-8
NCP45521 9.5 10.5 0.5 13.5 -Adj Adj Fault DFN-8
Advanced Load Switches
Device
Number
of Inputs Input Type
fin Typ
(MHz)
Number
of Outputs
Output
Type
fout Typ
(MHz)
Spread Spectrum
Outputs Package
NB3N3002 1Crystal; LVCMOS; LVTTL 25 1HCSL 25; 100; 125; 200 No TSSOP-16
NB3N5573 1Crystal; LVCMOS; LVTTL 25 2HCSL 25; 100; 125; 200 No TSSOP-16
NB3N51032 1Crystal; LVCMOS; LVTTL 25 2HCSL 25; 100; 125; 200 Yes TSSOP-16
NB3N51034 1Crystal; LVCMOS; LVTTL 25 4HCSL 100: 200 Yes TSSOP-20
NB3N51044 2Crystal; LVCMOS; LVTTL 25 4HCSL 100: 125 No TSSOP-28
NB3N51054 1Crystal; LVCMOS; LVTTL 25 4HCSL 100 Yes TSSOP-24
Page 12 Computing Solutions
Phase
Detector
Charge
Pump HSCL
Output
M
Clock Buffer
Crystal Oscillator
CLK0
CLK0
X1/CLK
X2
VCO
25 MHz Clock or
Crystal
GND
VDD
S0 S1 OE IREF
HSCL
Output CLK1
CLK1
NB3N5573 Simplified Logic Diagram
Clock Synthesizers for High Performance Computing
Features
Uses 25 MHz fundamental mode parallel resonant crystal
PCI-e Gen 1, 2, 3, and 4 jitter complaint HCSL differential outputs
NB3N50134 features configurable spread spectrum outputs
NB3N51044 features individual OE control signal for each output, PLL bypass
mode and an Input multiplexer
NB3N51054 features I2C interface for OE control and configurable spread
spectrum outputs
3.3 V supply
Device Ratio
Additive
tJitter(RMS) Typ
(ps)
tskew(o-o) Max
(ps)
tpd Typ
(ns)
tR & tF Max
(ps)
fmaxClock Typ
(MHz) Package
NB3L202K 1:2 0.046 30 1125 350 QFN-16
NB3L204K 1:4 0.046 30 1125 350 QFN-24
NB3N106K 1:6 0.1 100 0.8 400 400 QFN-24
NB3L208K 1:8 0.046 30 1125 350 QFN-32
NB3N108K 1:8 0.1 100 0.8 400 400 QFN-32
NB3N111K 1:10 0.1 100 0.8 400 400 QFN-32
NB4N111K 1:10 <1 100 0.8 700 400 QFN-32
NB3N121K 1:21 0.1 100 0.8 700 400 QFN-52
NB4N121K 1:21 <1 50 0.8 700 200 QFN-52
NB3M8T3910G 3:1:10 0.05 50 1300 1400 QFN-48
Q0
Q0
Q1
Q1
Q19
Q19
Q20
Q20
CLK
CLK
VCC
GND RREF
IREF
VTCLK
VTCLK
Page 13ON Semiconductor
NB3N121K Logic Diagram
Fanout Buffers for High Performance Computing
Features
DC up to 400 MHz
Accepts LVPECL, LVDS, HCSL, and single-ended inputs
Typical input clock frequencies: 100, 133, 156.25, 166, 322.26, or 400 MHz
Typical propagation delay: 800 ps
HCSL differential outputs
Integrated 50 Ω input termination resistors
IREF pin enables setting of output drive
Additive phase jitter 0.1 ps typical @ 100 MHz; PCI-e Gen 3 jitter complaint
Additive phase jitter 80 fs maximum @ 156.25 MHz with NB3L208K, NB3L204K,
NB3L202K; DB800H, DB400H, DB200H compliant
Page 14 Computing Solutions
Computing Clock for Graphics
P1P8160A Features
Provides reference clock to the GPU & reduces EMI in the GDDR interface
Input frequency 27 MHz; crystal or reference clock
Output frequency 100 MHz spread spectrum clock; 27 MHz RefOUT
Two tri-level logic pins for selecting eight frequency deviations along with SSOFF
Modulation rate at 100 MHz: 32 kHz
Low cycle-cycle & long term jitter
Supply voltage: 3.3 V ±10%
WDFN-10 package
NB3N51054 Features
Uses 25 MHz Fundamental Crystal or Reference Clock Input
Four Low Skew HCSL or LVDS Outputs
I2C Support with Read Back Capability
Spread of −0.35%, −0.5% and No Spread
Individual Output Enable/Disable Control through I2C
PCIe Gen 1, Gen 2, Gen 3, Gen 4 Compliant
Typical Phase Jitter @ 100 MHz (Integrated 12 kHz to 20 MHz): 0.5 ps
Typical Cycle−Cycle Jitter @ 100 MHz (10k cycles): 20 ps
Operating Power Supply: 3.3 V ± 5%
D-Sub D-Sub D-Sub D-Sub
SS_clock
SS_clock
Non_SS_clock
27 MHz
27 MHz
100 MHz_SS_clock
DDR
Controller
GPU
Core
Radeon HD 6000/5000 Series
PLL P1P8160A
P1P8160A for AMD Graphics Card Application
Page 15ON Semiconductor
NB3N1200K Simplified Block Diagram
IREF**
FB_OUT*
DIF_[11:0]
Control
Logic
CLK_IN
SSC Compatible
PLL
12
SA_0
SA_1
SDA
SCL
MUX
* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L
** IREF pin is for NB3N1200K only; it is NC for NB3W1200L
100M_133M#
PWRGD/PWRDN#
HBW_BYPASS_LBW#
OE_[11:0]#
CLK_IN#
DIF_[11:0]#
RREF
FB_OUT#*
Device Ratio Output
tJitter(Cy-Cy) Typ
(ps)
tskew(I-o) Max
(ps)
tskew(o-o) Max
(ps)
Edge Rate Max
(V/ns) Package
NB3W800L 1:8 Low power NMOS push-pull 34 ±100 50 4QFN-48
NB3N1200K 1:12 HCSL 50 ±100 50 4QFN-64
NB3W1200L 1:12 Low power NMOS push-pull 50 ±100 50 4QFN-64
NB3N1900K 1:19 HCSL 50 ±100 65 4QFN-72
NB3W1900L 1:19 Low power NMOS push-pull 50 ±100 85 4QFN-72
Zero Delay Buffers Compliant with DB Specifications
Features
Differential SRC clock support
NB3N1900K, NB3N1200K: DB1900Z and DB1200Z compliant with 19 and 12 HCSL output pairs respectively
NB3W1900L, NB3W1200L, NB3W800L: DB1900ZL, DB1200ZL, and DB800ZL compliant with 19, 12, and 8 low power
NMOS push-pull output pairs respectively
Optimized for 100 MHz and 133 MHz to meet PCIe Gen 2, Gen 3, Gen 4, and Intel QPI and UPI phase jitter specifications
Spread spectrum compatible for low EMI
Pseudo-external fixed-feedback for low input-to-output delay variation
Individual OE control pin for each output
SMBUS programmability for power down mode, PLL BW modes, PLL/Bypass mode & frequency selection
Page 16 Computing Solutions
EEPROMs for Configuration and Calibration
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
Features
Broad density range: 1 kb to 2 Mb
Wide operating Vcc range: 1.7 V to 5.5 V
High endurance: 1 million program/erase cycles
Wide temperature range: industrial and extended
EEPROMs
Data
Transmission
Standard Density Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz) Package(s)
I2C
1 Mb 128k x 8
1.7, 1.8 5.5 0.4, 1 US8, SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5, WLCSP-8
512 kb 64k x 8
256 kb 32k x 8
128 kb 16k x 8
64 kb 8k x 8
32 kb 4k x 8
16 kb 2k x 8
8 kb 1k x 8
4 kb 512 x 8
2 kb 256 x 8
SPI
2 Mb 256k x 8
1.7, 1.8 5.5 10, 20 SOIC-8, TSSOP-8, UDFN-8
1 Mb 128k x 8
512 kb 64k x 8
256 kb 32k x 8
128 kb 16k x 8
64 kb 8k x 8
32 kb 4k x 8
16 kb 2k x 8
8 kb 1k x 8
4 kb 512 x 8
2 kb 256 x 8
1 kb 128 x 8
Microwire
16 kb 2k x 8 / 1k x 16
1.65, 1.8 5.5 2, 3, 4 SOIC-8, TSSOP-8, UDFN-8
16 kb 2k x 8 / 1k x 16
8 kb 1k x 8 / 512 x 16
8 kb 1k x 8 / 512 x 16
4 kb 512 x 8 / 256 x 16
2 kb 256 x 8 / 128 x 16
1 kb 128 x 8 / 64 x 16
1 kb 128 x 8 / 64 x 16
* Organization for Microwire devices is selectable.
Page 17ON Semiconductor
USB-C for PC/Laptop
Power Port
Function Device Description
Power
Regulation
NCP1342 Quasi-Resonant Flyback Controller with Valley Lock-Out Switching
NCP4305 Secondary Side Synchronous Rectification Driver for High Efciency SMPS
Topologies
NCP4306 Secondary Side Synchronous Rectification Driver for High Efficiency SMPS
Topologies
NCP43080 Synchronous Rectifier Controller with LLD Function
Power MUX
FPF2595UCX Load Switch, Over-Voltage, Over-Current Protection with Adjustable Current-Limit
Control, IntelliMAX™ 28 V
FPF2895CUCX Current Limit Load Switch with OVP and TRCB, 28 V, 5 A
Data Path
Function Device Description
Data
Redriver
NB7NPQ7021M USB 3.1 Dual Channel Linear Redriver, 3.3 V
NB7NPQ701M USB 3.1 Single Channel Redriver, 3.3 V
NB7NPQ702M USB 3.1 Dual Channel Redriver, 3.3 V
NB7VPQ701M USB 3.1 Single Channel Redriver, 1.8 V
NB7VPQ702M USB 3.1 Dual Channel Redriver, 1.8 V
SuperSpeed
Mux FUSB340TMX USB 3.1 SuperSpeed Switch, 10 Gbps
Alt Mode
MUX FSA4476UCX Analog Audio Switch with Protection
Function, USB Type-C
Control
Function Device Description
Port Control
FUSB302TMPX Programmable USB Type-C Controller with
PD (Default SRC)
FUSB303TMX Autonomous USB Type-C Controller with I2C
and GPIO Control
FUSB307BMPX USB Type-C Port Controller with USB-PD
PC/Laptop form factors are getting smaller, thinner, and lighter with the adaptation of the USB Type-C connectors.
ON Semiconductor offers multiport solutions compatible with the USB Type-C Port Controller Protocol and Power Delivery 3.0.
Block Diagram
System Devices
Voltage
Regulation
Protection
Sensors
Port Power
Power
Regulation
Power MUX
Power
Switch
Data Path
Data
Redrvicer
SuperSpeed
MUX
Alt Mode
MUX
Control
Controllers
Port
Control
Policy
Engine
System Devices
Function Device Description
Voltage
Regulation NCP81231 Buck Controller, USB Power Delivery and Type-C Applications
Protection
ESD8704 High Speed Data Line Protection, Unidirectional (3.3 V – USB 3.x)
ESDL2011 High Speed Data Line Protection, Bidirectional (1 V – Thunderbolt 3.0), 0.2 pF
ESDM3551 ESD Protection Diode, CC and SBU Protection (5.5 V – USB 3.x), 21 pF
NSPM2052 ESD and Surge Protection Device, Vbat and Vbus Applications, 5 V
NIS5452 Electronic Fuse, 5 V
NCS210 Current Sense Amplifier, Bidirectional Zero-Drift, 1% Max. Gain Error, 60 µV Offset
NCS211 Current Sense Amplifier, Bidirectional Zero-Drift, 1% Max. Gain Error, 60 µV Offset
NCS213 Current Sense Amplifier, Bidirectional Zero-Drift, 1% Max. Gain Error, 100 µV
Offset
NCS214 Current Sense Amplifier, Bidirectional Zero-Drift, 1% Max. Gain Error, 60 µV Offset
FUSB252UMX High Speed Digital (HSD) Port Protection Switch with Type-C CC
FSUSB242UCX USB Type-C Port Protection Switch
Page 18 Computing Solutions
USB 3.x Type A Connector
Two SuperSpeed Pairs, One High Speed Pair, VCC, Low Capacitance ESD Protection
Key Requirement
Cap < 0.7 pF
Features
0.35 pF
Flow through routing
Industry leading low clamping voltage
versus competitors
Device Interface Data Lines
Capacitance
(pF) Package
Size
(mm)
ESD8704 USB 3.x 2 Pair (Tx, Rx) 0.35 UDFN-10 2.5 x 1.0
ESD7L USB 3.x 1 Pair (D+/-) 0.5 SOT-723 1.2 x 1.2
ESD8504 USB 3.0 2 Pair (Tx, Rx) 0.4 UDFN-10 2.5 x 1.0
ESD8104 USB 3.0 2 Pair (Tx, Rx) 0.3 UDFN-10 2.5 x 1.0
ESD8116 USB 3.0 3 Pair (Tx, Rx, D+/-) 0.3 UDFN-8 2.0 x 1.2
ESD8011 USB 3.x Single Line 0.10 X3DFN-2 0.62 x 0.32
ESD8101 USB 3.x Single Line 0.20 DSN-2 0.43 x 0.23
ESD8111 USB 3.x Single Line 0.20 WLCSP-2 0.6 x 0.3
ESD8006 USB 3.0 3 Pair (Tx, Rx, D+/-)
0.25
UDFN-8 3.3 x 1.0
ESD8116
StdA_SSTX+
StdA_SSTX-
GND_DRAIN
StdA_SSRX+
StdA_SSRX-
Connector
GND
D-
D+
D-
D+
Vbus
Vbus
StdA_SSTX+
D-
StdA_SSTX-
D+
GND_DRAIN
GND
StdA_SSRX+
StdA_SSRX-
ESD8704
ESD7L5.0
Top layer
Other layer
USB 3.0/3.1 Type A
Connetcor
ESD8704 — 0.35 pF, 2 Layer Routing
(ESD8704; ESD7L5.0 for D+, D- Lines)
ESD8116 — 0.30 pF, 1 Layer Routing
USB 3.0 @ 5 Gb/s
Without ESD With ESD
=
I/O
1
I/O
N
I/O
2
I/O
3. . . . . I/O
(N-2)
I/O
(N-1)
Page 19ON Semiconductor
USB 2.0
One High Speed Pair, VCC, Low Capacitance ESD Protection
Key Requirement
Cap < 5 pF
Features
0.35 - 3.0 pF
Multi-part solutions available
Industry leading low clamping voltage
Device Data Lines
Capacitance
(pF) Package
Size
(mm)
NUP2114UPX 1 Pair (D+/-) + Vbus 0.8 SOT-553 1.2 x 1.6
NUP2114UCM 1 Pair (D+/-) + Vbus 0.8
TSOP-6 3.0 x 2.75
NUP4114UPX 2 Pair (D+/-) + Vbus 0.5
SOT-563 1.6 x 1.6
NUP4114UCL 2 Pair (D+/-) + Vbus 0.5
SC-88 2.0 x 2.1
NUP4114H 2 Pair (D+/-) + Vbus 0.5
TSOP-6 3.0 x 2.75
ESD7L5.0 20.5
SOT-723 1.2 x 1.2
ESD8351MUT 1
0.37
X3DFN-2 0.6 x 0.3
ESD8351P2T 1
0.37
SOD-923 1.0 x 0.6
ESD9L5.0 1
0.5
SOD-923 1.0 x 0.6
I/O 1 I/O 2
=
I/O 3 I/O 4
One High Speed Pair, VCC, Common Mode Filter + ESD Protection
Key Requirement
Cap < 5 pF
Common Mode Filtering
Features
0.5 - 0.8 pF
Integrated EMI suppression with ESD protection
Industry leading low clamping voltage
Device Pairs
Capacitance
@ 2.5 V (pF)
CM Attenuation
@ 800 MHz (–dB)
DM Bandwidth
F3dB (GHz) Package
Size
(mm)
EMI2121 1
0.9 –25 2.5
WQFN 2.2 x 2.0 x 0.75
USB 2.0 @ 480 Mb/s
D+
D-
VBUS
Top layer
Other layer
ID
GND
Micro USB
Connector
EMI2121
-35
-30
-25
-20
-15
-10
-5
0
1.E+06 1.E+07 1.E+08 1.E+09
dB
Frequency
Common
Mode
Differential
Mode
Suppresses Common Mode Noise
Deeper than Competing Passive Solution
VBUS
D+
D-
Gnd
VBUS
D+
D-
Gnd
NUP4114
USB
Host
Controller
VBUS
D+
D-
Gnd
NUP2114
USB
Host
Controller
Page 20 Computing Solutions
ESD8116
CONFIG1
CONFIG2
GND
Aux+
Aux–
Thunderbolt Connetctor
Bottom Layer
Thunderbolt Connetctor
Top Layer
GND
ML3–
ML3+
Hot Plug Detect
PWR
ML1+
ML1–
ML0+
ML0–
ML2+
ML2–
Top layer
Bottom layer
ESD8116
ESD9X
ESD9X
GND
GND
GND
GND
Key Requirement
Capacitance < 0.4 pF
Features
Capacitance of 0.35 pF or lower
Integrated solution in 2.0 x 1.2 mm package
Grounds between pairs to reduce cross-talk
Flow-through routing
Industry leading clamping voltage
Thunderbolt
Four High Speed Pairs, up to Six Additional Lines, Low Capacitance ESD
Thunderbolt @ 10 Gb/s
=
I/O
1
I/O
8
I/O
2
I/O
7
I/O
4
I/O
5
Common GND = Pins 2, 3
Device Data Lines
Capacitance
(pF) Package
Size
(mm)
ESD8006 3 Pair 0.25 UDFN-8 3.3 x 1.0
ESD8116 3 Pair 0.30 UDFN-8 2.0 x 1.2
ESD8011 Single Line 0.10 X3DFN-2 0.62 x 0.32
ESD8101 Single Line 0.20 DSN-2 0.43 x 0.23
Without ESD8116 With ESD8116
Page 21ON Semiconductor
HDMI, Display Port
Four High Speed Pairs, Up to Six Additional Interface Lines, Low Capacitance ESD
Key Requirement
Cap < 0.5 pF
Features
0.3 pF ESD protection
Flow through routing in high speed lines
Industry leading low clamping voltage
NUP4114
ESD8118
HEC DATA
CEC
SCL
SDA
5 V
HPD
D2+
HDMI Type-A
Connector
D2-
GND
D1+
D1-
GND
D0+
D0-
GND
CLK+
CLK-
GND
GND
ESD8118
Device Data Lines
Capacitance
(pF) Package
Size
(mm)
ESD8104 4 (TMDS) 0.3 UDFN-10 2.5 x 1.0
ESD8118 8 (TMDS) 0.3 UDFN-10 3.2 x 1.2
ESD8040 14 (TMDS + Low Speed + Power) 0.3 UDFN-18 5.5 x 1.5
NUP4114UPX 5 (4 Low Speed + Power) 0.5 SOT-563 1.6 x 1.6
NUP4114UCL 5 (4 Low Speed + Power) 0.5 SC-88 2.0 x 2.1
NUP4114H 5 (4 Low Speed + Power)
0.5
TSOP-6 3.0 x 2.75
I/O
1
=
I/O
N
I/O
2
I/O
3. . . . . I/O
(N-2)
I/O
(N-1)
HDMI 2.0 Eye Diagram with and without ESD8104. 6 Gb/s
Without ESD With ESD
D2+
D2-
GND
D1+
D1-
GND
D0+
D0-
GND
CLK+
CLK-
GND
Top layer
Other layer
ESD8040
HDMI Type-A Connector
N/C (or HEC_DAT - HDMI1.4)
CEC
SCL
SDA
5 V
HPD (and HEC_DAT - HDMI1.4)
GND
ESD8040
MediaGuard fully integrated solution
Includes ethernet protection (HDMI1.4)
Backdrive current protection
Page 22 Computing Solutions
Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit
Four Pairs, Low Capacitance Surge and ESD Protection
Line-to-Line Surge
Line Side : LC03-6 (optional)
Transformer Side: TVS8818
Protection against metallic (transverse) strikes
Typical Application
Features
Line-to-line capacitance < 3 pF
Vclamp (25 A surge) < 11 V
IEC 61000-4-2 rating > 30 kV
No latching danger
Surge rating maintained to 125°C
Benefits
Compatible with Gb Ethernet and beyond
Enhanced protection for downstream electronics
Accommodates operating transients above 3.3 V
Small form-factor allows integration into connectors
The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and
lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
C5VDD
C1
C2
TVS8818
LC03
C3
C4
C6VDD
LC03
C7VDD
LC03
C8VDD
LC03
TPOPA
TPONA
TPOPB
TPONB
TPOPC
TPONC
TPOPD
TPOND
A+
A-
B+
B-
C+
C-
D+
D-
1000BASE-T
ETHERNET TRANSCEIVER
TRANSFORMER
RJ45
1
8
1
8
1
8
1
8
-10 0
0
5
10
15
20
25
30
10 20 30
Time (μs)
Voltage (V), Current (A)
40 50 60
8/20 μs
Surge Current
ON Semiconductor
Voltage
Competitor
Voltage
1
2
3
4
5
6
7
8
RJ-45 Connector
Flow Through
Routing
TVS8818
Surge Protection Devices
Device
VDC Max
(V)
Line
Transient
Max
(V)
Surge IPP,
8/20 ms
(A)
Typical
Line-Line
Capacitance
(pF)
ESD
Contact
Rating
(kV) Package
LC03-6 6.7 7.0 100 8.0 ±30 SOIC-8
NSP4201 5.0 6.0 25 1.5 ±30 TSOP-6
NSP8814 3.0 3.2 35 1.5 ±30 UDFN-8
NSP8818 3.0 3.2 35 1.5 ±30 UDFN-10
NUP4114H 5.0 5.0 12* 0.4 ±13 TSOP-6
SRDA3.3 3.3 5.0 25 4.0 ±8 SOIC-8
SRDA05 5.0 7.0 23 5.0 ±8 SOIC-8
* On Pin 5.
Page 23ON Semiconductor
Electronic Fuses
3 – 12 V Power Bus Hot Plug Protection
Charge
Pump
Enable
Enable/
Fault
GND
Source
ILimit
dV/dt
Current
Limit
Voltage
Clamp
dV/dt
Control
Thermal
Shutdown
UVLO
VCC
Typical Feature Set for eFuse
Current (A) / Torque (ft * lb)
Voltage
(V)
Angular Vel.
(RPM)
Permanent
Magnet
DC motor
Fan Blade
Aerodynamic Load
Peak
Current
Nominal
Current
Overcurrent / Overheat
conditions
eFuse Prevents
Overcurrent
DC Motor I/V Characteristics
Features
Low RDS(ON), high operating and trip currents
(IOP, ITRIP)
Overvoltage protection
Precise ITRIP control
Slew rate control
Thermal shut-down
EN pin for synchronizing multiple eFuses
Outperforms poly-fuses:
Tighter spec tolerances
Lower resistance
Shorter trip-time
Superior repeatability
High efficiency with high current capability
eFuses in parallel achieve practically any desired level of
IOP and ITRIP
* Pending 1Q18. ** Auto-retry available on NIS5132MN2.
Device
Nominal Voltage
(V)
Input Voltage
(V)
Vclamp
(V)
Continuous
Current
(A)
Trip Current
(A)
RDS(ON)
(mΩ)Auto-Retry Latch Package
NIS5431 3.3 -0.6 to 14 3.85 5Adjustable 35 3 3 WDFN-10
NIS5452 5 -0.6 to 14 5.85 5Adjustable 35 3 3 WDFN-10
NIS5232 12 -0.6 to 18 15 4.2 Adjustable 44 ** 3DFN-10
NIS5820* 12 -0.3 to 22 14 8Adjustable 24 3 3 WDFN-10
NIS5020* 12 -0.3 to 22 14 10 Adjustable 14 3 3 WDFN-10
NIS5021* 12 -0.3 to 22 14 12 Adjustable 14 3 3 WDF N-10
Typical Application Block Diagram
eFuse
NISxxxx
L-C
Low Pass Filter
DC Motor’s Noise Filter
Vin
Input Filter
Capacitor
Transient
Overshoot
Suppression
BRD8025/D
BRD8025-13 PRINTED IN USA 2/18 IRONWOOD XXXX 500
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents,
trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further
notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product
or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations
and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended
for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor
was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada.
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
PUBLICATION ORDERING INFORMATION
Sales and Design Assistance from ON Semiconductor
AMERICAS REP FIRMS
Alabama Huntsville e-Components (256) 533-2444
Brazil Countrywide Ammon & Rizos (+55) 11-4688-1960
California Bay Area Electec (408) 496-0706
Canada Eastern Canada Astec (905) 607-1444
Connecticut Statewide Paragon Electronic Systems (603) 645-7630
Florida Statewide e-Components (888) 468-2444
Georgia Atlanta e-Components (888) 468-2444
Illinois Statewide Matrix – Design Technology (952) 400-1070
Indiana Fishers Bear VAI (317) 570-0707
Iowa Statewide Matrix – Design Technology (319) 362-6824
Maine Statewide Paragon Electronic Systems (603) 645-7630
Maryland Columbia Mechtronics Sales (410) 309-9600
Massachusetts Statewide Paragon Electronic Systems (603) 645-7630
Mexico Countrywide Ammon & Rizos (+55) 11-4688-1960
Michigan St. Joseph Bear VAI (440) 526-1991
Minnesota Eden Prairie Matrix – Design Technology (952) 400-1070
Missouri Belton Matrix – Design Technology (816) 589-2308
Nebraska Statewide Matrix – Design Technology (816) 589-2308
New Hampshire Statewide Paragon Electronic Systems (603) 645-7630
New Jersey Statewide S.J. Metro (516) 942-3232
New York Binghamton TriTech - Full Line Rep (607) 722-3580
Jericho S.J. Metro (516) 942-3232
Rochester TriTech - Full Line Rep (585) 385-6500
North Carolina Raleigh e-Components (888) 468-2444
North Dakota Statewide Matrix – Design Technology (952) 400-1070
Ohio Brecksville Bear VAI Technology (440) 526-1991
Puerto Rico Countrywide e-Components (888) 468-2444
Rhode Island Statewide Paragon Electronic Systems (603) 645-7630
South Dakota Statewide Matrix – Design Technology (952) 400-1070
Vermont Statewide Paragon Electronic Systems (603) 645-7630
Wisconsin Statewide Matrix – Design Technology (952) 400-1070
ON Semiconductor Distribution Partners
Allied Electronics www.alliedelec.com (800) 433-5700
ALTIMA Company, Macnica, Inc. www.alt.macnica.co.jp/about/english.html (81) 45 476 2155
Arrow Electronics www.arrow.com (800) 777-2776
Avnet www.em.avnet.com (800) 332-8638
Daiwa Distribution Ltd. www.daiwahk.com (852) 2341 3351
Digi-Key www.digikey.com (800) 344-4539
EBV Elektronik www.ebv.com/en/locations.html (49) 8121 774-0
Future & FAI Electronics www.futureelectronics.com/contact 1-800-FUTURE1 (388-8731)
Mouser Electronics www.mouser.com (800) 346-6873
Newark/Farnell www.farnell.com/onsemi (800) 4-NEWARK
OS Electronics Co., Ltd. www.oselec.com Japanese: (81) 3 3255 5985
Other Languages: (81) 3 3255 6066
Promate Electronic Co. www.promate.com.tw (886) 2 2659 0303
Ryoden Corporation www.ryoden.co.jp/en (81) 3 5396 6310
Ryosan Company, Limited www.ryosan.co.jp/eng (81) 3 3862 2635
RS Components www.rs-components.com (44) 153 644 4414
Segyung Britestone Co. www.britestone.com (82) 2 3218 1511
Serial Microelectronics, HK www.serialsys.com.hk (852) 2790 8220
World Peace Industries Co. www.wpi-group.com (852) 2365 4860
WT Microelectronics Co. www.wtmec.com (852) 2950 0820
Yosun Electronics www.yosun.com.tw (886) 2 2659 8168
ON SEMICONDUCTOR INTERNATIONAL SALES OFFICES
GREATER CHINA Beijing 86-10-8577-8200
Hong Kong 852-2689-0088
Shenzhen 86-755-8209-1128
Shanghai 86-21-5131-7168
Taipei, Taiwan 886-2-2377-9911
FRANCE Paris 33 (0)1 39-26-41-00
GERMANY Munich 49 (0) 89-93-0808-0
INDIA Bangalore 91-98-808-86706
ISRAEL Raanana 972 (0) 9-9609-111
ITALY Milan 39 02 9239311
JAPAN Tokyo 81-3-6880-1777
KOREA Seoul 82-31-786-3700
MALAYSIA Penang 60-4-6463877
SINGAPORE Singapore 65-6484-8603
SLOVAKIA Piestany 421 33 790 2450
UNITED KINGDOM Maidenhead 44 (0) 1628 244326
www.onsemi.com/support
ON Semiconductor Technical Support For a comprehensive listing of
ON Semiconductor Sales Offices, Distributors,
and Rep Firms, please visit:
Americas & EMEA: www.onsemi.com/sales
China: www.onsemi.cn/sales
Japan: www.onsemi.jp/sales
Dec-17
Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the EU and/or elsewhere. All other brand names and product names appearing in this document are trademarks of their respective holders.