NCP153MX330180TCG - ON SEMICONDUCTOR

September, 2019 − Rev. 2

1Publication Order Number:

NCP153/D

NCP153

LDO Regulator - Dual,

Low IQ

130 mA

The NCP153 is 130 mA, Dual Output Linear Voltage Regulator that

provides a very stable and accurate voltage with very low noise and

high Power Supply Rejection Ratio (PSRR) suitable for RF

applications. In order to optimize performance for battery operated

portable applications, the NCP153 employs the Adaptive Ground

Current Feature for low ground current consumption during light−load

conditions. Device also incorporates foldback current protection to

reduce short circuit current and protect powered devices.

Features

•Operating Input Voltage Range: 1.9 V to 5.25 V

•Two Independent Output Voltages:

(for details please refer to the Ordering Information section)

•Very Low Dropout: 130 mV Typical at 130 mA

•Low IQ of typ. 50 mA per Channel

•High PSRR: 75 dB at 1 kHz

•Two Independent Enable Pins

•Over Current Protection: 165 mA Typical

•Foldback Short Circuit Protection

•Thermal Shutdown

•Stable with a 0.22 mF Ceramic Output Capacitor

•Available in XDFN6 1.2 x 1.2 mm Package

•Active Output Discharge for Fast Output Turn−Off

•These are Pb−Free Devices

Typical Applications

•Smartphones, Tablets, Wireless Handsets

•Wireless LAN, Bluetooth®, ZigBee® Interfaces

•Other Battery Powered Applications

EN1

EN2

OUT2

OUT1

GND

NCP153

VOUT2

VOUT1

COUT2

0.22 mF

COUT1

0.22 mF

CIN1

0.22 mF

VIN1

Figure 1. Typical Application Schematic

XDFN6, 1.2x1.2

CASE 711AT

MARKING

DIAGRAM

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See detailed ordering and shipping information on page 13 of

this data sheet.

ORDERING INFORMATION

XDFN6

(Top view)

OUT1 EN1

PIN CONNECTIONS

OUT2

GND

EN2

GND

GA = Specific Device Code

M = Date Code

GA M

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Figure 2. Simplified Schematic Block Diagram

GND

EN2

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

ACTIVE

DISCHARGE

EN1

ENABLE

LOGIC

EN1

OUT1

IN DISCHARGE

ACTIVE

EN2

ENABLE

LOGIC

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

OUT2

BANDGAP

REFERENCE

PIN FUNCTION DESCRIPTION

Pin No.

XDFN6

Name Description

1 OUT1 Regulated output voltage of the first channel. A small 0.22 mF ceramic capacitor is needed from this pin to

ground to assure stability.

2 OUT2 Regulated output voltage of the second channel. A small 0.22 mF ceramic capacitor is needed from this pin

to ground to assure stability.

3 GND Power supply ground. Soldered to the copper plane allows for effective heat dissipation.

4 EN2 Driving EN2 over 0.9 V turns−on OUT2. Driving EN below 0.4 V turns−off the OUT2 and activates the active

discharge.

5 IN Input pin common for both channels. It is recommended to connect 0.22 mF ceramic capacitor close to the

device pin.

6 EN1 Driving EN1 over 0.9 V turns−on OUT1. Driving EN below 0.4 V turns−off the OUT1 and activates the active

discharge.

−EP Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.

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ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 1) VIN −0.3 V to 6 V V

Output Voltage VOUT1,

VOUT2

−0.3 V to VIN + 0.3 V or 6 V V

Enable Inputs VEN1,

VEN2

−0.3 V to 6 V V

Output Short Circuit Duration tSC Indefinite s

Maximum Junction Temperature TJ(MAX) 150 °C

Storage Temperature TSTG −55 to 150 °C

ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V

ESD Capability, Machine Model (Note 2) ESDMM 200 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Machine Model tested per EIA/JESD22−A115

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

THERMAL CHARACTERISTICS (Note 3)

Rating Symbol Value Unit

Thermal Characteristics, XDFN6 1.2 x 1.2 mm,

Thermal Resistance, Junction−to−Air

Thermal Characterization Parameter, Junction−to−Lead (Pin 2)

qJA

qJL

170

°C/W

3. Single component mounted on 1 oz, FR4 PCB with 645mm2 Cu area.

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ELECTRICAL CHARACTERISTIC

−40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; VEN = 0.9 V, IOUT = 1 mA, CIN = COUT = 0.22 mF. Typical

values are at TJ = +25°C. Min/Max values are specified for TJ = −40°C and TJ = 85°C respectively. (Note 4)

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 1.9 5.25 V

Output Voltage Accuracy

−40°C ≤ TJ ≤ 85°C

VOUT > 2 V VOUT −2 +2 %

VOUT ≤ 2 V −60 +60 mV

Line Regulation VOUT + 0.5 V or 2.5 V ≤ VIN ≤ 5 V RegLINE 0.02 0.1 %/V

Load Regulation IOUT = 1 mA to 130 mA, TJ = +25°C RegLOAD 15 50 mV

Dropout Voltage (Note 5) IOUT = 130 mA, TJ = +25°C

VOUT(nom) = 1.8 V

VDO

265 280

VOUT(nom) = 3.3 V 130 150

Output Current TJ = +25°C IOUT 130 mA

OCP Level VOUT = 90% VOUT(nom), TJ = +25°C IOCP 135 165 195 mA

Short Circuit Current VOUT = 0 V, TJ = +25°C ISC 55 mA

Quiescent Current IOUT = 0 mA, EN1 = VIN, EN2 = 0 V or EN2 = VIN,

EN1 = 0 V

IQ50 100 mA

IOUT1 = IOUT2 = 0 mA, VEN1 = VEN2 = VIN IQ85 200 mA

Shutdown Current (Note 6) VEN ≤ 0.4 V, VIN = 5.25 V IDIS 0.1 1 mA

EN Pin Threshold Voltage

High Threshold

Low Threshold

VEN Voltage increasing

VEN Voltage decreasing

VEN_HI

VEN_LO

0.9

0.4

EN Pin Input Current VEN = VIN = 5.25 V IEN 0.3 1.0 mA

Power Supply Rejection Ratio VIN = VOUT+1 V for VOUT > 2 V, VIN =

2.5 V, for VOUT ≤ 2 V, IOUT = 10 mA

f = 1 kHz PSRR 75 dB

Output Noise Voltage f = 10 Hz to 100 kHz VN75 mVrms

Active Discharge Resistance VIN = 4 V, VEN < 0.4 V RDIS 50 W

Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C

Thermal Shutdown Hysteresis Temperature falling from TSD TSDH −20 −°C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA

= 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.

5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.

6. Shutdown Current is the current flowing into the IN pin when the device is in the disable state.

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TYPICAL CHARACTERISTICS

Figure 3. Output Voltage vs. Temperature –

VOUT = 1.8 V

Figure 4. Output Voltage vs. Temperature –

VOUT = 3.3 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550205−10−25−40

1.75

1.76

1.78

1.80

1.81

1.82

1.84

1.85

806550205−10−25−40

3.25

3.26

3.28

3.29

3.31

3.32

3.34

3.35

Figure 5. Ground Current vs. Output Current –

One Output Load

Figure 6. Ground Current vs. Output Current –

Different Load Combinations

IOUT

, OUTPUT CURRENT (mA) IOUT

, OUTPUT CURRENT (mA)

1001010.1 10000.010.001

100

200

250

300

400

450

11710478653926130

150

300

450

525

675

750

Figure 7. Quiescent Current vs. Input Voltage

– Both Outputs ON

Figure 8. Line Regulation vs. Temperature −

VOUT = 1.8 V

VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)

5.04.03.53.02.01.00.50

100

806550205−10−25−40

−0.05

−0.04

−0.01

0.01

0.02

0.03

0.05

VOUT

, OUTPUT VOLTAGE (V)

VOUT

, OUTPUT VOLTAGE (V)

IGND, GROUND CURRENT (mA)

IQ, QUIESCENT CURRENT (mA)

REGLINE, LINE REGULATION (%/V)

35 95

1.77

1.79

1.83

IOUT = 1 mA

IOUT = 130 mA

VIN = 2.8 V

VOUT = 1.8 V

CIN = 0.22 mF

COUT = 0.22 mF

IOUT = 1 mA

IOUT = 130 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

3.27

3.30

3.33

150

350

VIN = 4.3 V

VOUT = 3.3 V

VEN1 = VEN2 = VIN

CIN = 0.22 mF

COUT = 0.22 mF

TJ = 85°C

TJ = 25°C

TJ = −40°C

225

375

600

52 91 130

VIN = 2.5 V to 5.25 V

VOUT = 1.8 V

IOUT = 1 mA

CIN = 0.22 mF

COUT = 0.22 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

VEN1 = VEN2 = VIN,

OUT1−LOAD

OUT2−LOAD

VEN1 = VEN2 = VIN,

OUT1−LOAD

VEN1 = 0 V, VEN2 = VIN,

OUT1−LOAD

1.5 2.5 4.5 5.5

80 −40°C

85°C

25°C

35 95

−0.02

−0.03

0.04

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TYPICAL CHARACTERISTICS

Figure 9. Line Regulation vs. Temperature −

VOUT = 3.3 V

Figure 10. Load Regulation vs. Temperature −

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550355−10−25−40

−0.05

−0.04

−0.02

−0.01

0.01

0.02

0.05

806550355−10−25−40

Figure 11. Load Regulation vs. Temperature −

VOUT = 3.3 V

Figure 12. Dropout Voltage vs. Output Current

– VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C) IOUT

, OUTPUT CURRENT (mA)

806550355−10−25−40

11710478523926130

120

180

210

270

300

Figure 13. Dropout Voltage vs. Output Current

– VOUT = 3.3 V

Figure 14. Dropout Voltage vs. Temperature –

VOUT = 1.8 V

IOUT

, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C)

13011778655226130

120

140

180

200

8065503520−10−25−40

105

140

210

280

315

350

REGLINE, LINE REGULATION (%/V)

REGLOAD, LOAD REGULATION (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VDROP

, DROPOUT VOLTAGE (mV)

VIN = 4.3 V to 5.25 V

VOUT = 3.3 V

IOUT = 1 mA

CIN = 0.22 mF

COUT = 0.22 mF

0.03

0.04

−0.03

20 95

VIN = 2.5 V

VOUT = 3.3 V

IOUT = 1 mA to 130 mA

CIN = 0.22 mF

COUT = 0.22 mF

20 95

VIN = 4.3 V

VOUT = 3.3 V

IOUT = 1 mA to 130 mA

CIN = 0.22 mF

COUT = 0.22 mF

TJ = 85°C

TJ = 25°C

TJ = −40°C

VIN = 2.8 V

VOUT = 1.8 V

CIN = 0.22 mF

COUT = 0.22 mF

65 91

150

240

130

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

TJ = 85°C

TJ = 25°C

TJ = −40°C

100

160

39 10491

IOUT = 0 mA

IOUT = 75 mA

VIN = 2.8 V

VOUT = 1.8 V

CIN = 0.22 mF

COUT = 0.22 mF

245

175

IOUT = 130 mA

5 95

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TYPICAL CHARACTERISTICS

Figure 15. Dropout Voltage vs. Temperature –

VOUT = 3.3 V

Figure 16. Current Limit vs. Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

8065503520−10−25−40

100

140

160

200

806550355−10−25−40

120

180

210

270

300

Figure 17. Short Circuit Current vs.

Temperature

Figure 18. Current Foldback Protection − 3.3 V

TJ, JUNCTION TEMPERATURE (°C) IOUT

, OUTPUT CURRENT (mA)

806550205−10−25−40

100

1801601201008040200

0.4

0.8

1.6

2.4

2.8

3.6

4.0

Figure 19. Current Foldback Protection − 1.8 V

TJ, JUNCTION TEMPERATURE (°C)

806550205−10−25−40

120

140

180

200

VDROP

, DROPOUT VOLTAGE (mV)

ICL, CURRENT LIMIT (mA)

ISC, SHORT CIRCUIT CURRENT (mA)

VOUT

, OUTPUT VOLTAGE (V)

IDIS, DISABLE CURRENT (nA)

IOUT = 0 mA

IOUT = 75 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mFIOUT = 130 mA

120

180

95 20 95

150

240

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

VIN = 4.3 V

VOUT = 0 V

CIN = 0.22 mF

COUT = 0.22 mF

35 95

TJ = 85°C

TJ = −40°C

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

1.2

2.0

3.2

60 140 200

VIN = 5.5 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

35 95

100

160

TJ = 25°C

Figure 20. Disable Current vs. Temperature

IOUT

, OUTPUT CURRENT (mA)

1801601201008040200

0.2

0.4

0.8

1.2

1.4

1.8

2.0

VOUT

, OUTPUT VOLTAGE (V)

TJ = 85°C

TJ = −40°C

VIN = 2.8 V

VOUT = 1.8 V

CIN = 0.22 mF

COUT = 0.22 mF

0.6

1.0

1.6

60 140 200

TJ = 25°C

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TYPICAL CHARACTERISTICS

IOUT

, OUTPUT CURRENT (mA)

1179178655226130

0.01

0.1

100

ESR (W)

39 104 13

Unstable Operation

Stable Operation

VOUT = 3.3 V

VOUT = 1.8 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550205−10−25−40

150

200

300

350

450

500

806550205−10−25−40

FREQUENCY (Hz) FREQUENCY (Hz)

10M1M100K10K1K100

100

10M1M100K10K1K100

100

IEN, CURRENT TO ENABLE PIN (nA)

RDIS, DISCHARGE RESISTANCE (W)

RR, RIPPLE REJECTION (dB)

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

35 95

100

250

400

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

35 95

VIN = 2.8 V

VOUT = 1.8 V

CIN = none

COUT = 0.22 mF

1 mA

10 mA

100 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = none

COUT = 0.22 mF

1 mA

10 mA

100 mA

Figure 21. Enable Voltage Threshold vs.

Temperature

TJ, JUNCTION TEMPERATURE (°C)

806550205−10−25−40

0.1

0.2

0.4

0.6

0.7

0.9

1.0

VEN, ENABLE VOLTAGE (V)

0.3

0.5

0.8

35 95

ON −> OFF

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

OFF −> ON

Figure 22. Stability vs. ESR

Figure 23. Current To Enable Pin vs.

Temperature

Figure 24. Discharge Resistance vs.

Temperature

Figure 25. Power Supply Rejection Ratio,

VOUT = 1.8 V, COUT = 0.22 mF

Figure 26. Power Supply Rejection Ratio,

VOUT = 3.3 V, COUT=0.22 mF

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TYPICAL CHARACTERISTICS

Figure 27. Output Voltage Noise Spectral

Density for VOUT = 1.8 V, COUT = 220 nF

FREQUENCY (Hz)

1M100K10K1K10010

100

10K

Figure 28. Output Voltage Noise Spectral

Density for VOUT = 3.3 V, COUT = 220 nF

FREQUENCY (Hz)

1M100K10K1K10010

100

10K

OUTPUT VOLTAGE NOISE (nV/√Hz)OUTPUT VOLTAGE NOISE (nV/√Hz)

VIN = 2.8 V

VOUT = 1.8 V

CIN = 0.22 mF

COUT = 0.22 mF

MLCC, X7R,

1206 size

1 mA

10 mA

100 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = 0.22 mF

COUT = 0.22 mF

MLCC, X7R,

1206 size

1 mA

10 mA

100 mA

10 Hz − 100 kHz 100 Hz − 100 kHz

1 mA 68.07 67.07

10 mA 67.30 66.31

100 mA 68.31 67.35

IOUT

RMS Output Noise (mV)

10 Hz − 100 kHz 100 Hz − 100 kHz

1 mA 108.34 106.75

10 mA 107.18 105.56

100 mA 109.12 107.54

IOUT

RMS Output Noise (mV)

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TYPICAL CHARACTERISTICS

Figure 29. Enable Turn−on Response –

VR1 = 10 mA, VR2 = Off

Figure 30. Enable Turn−on Response –

VR1 = 10 mA, VR2 = 1 mA

40 ms/div 40 ms/div

Figure 31. Line Transient Response – Rising

Edge, VEN1 = VEN2 = VIN, VOUT1 = 3.3 V,

IOUT1 = 10 mA

Figure 32. Line Transient Response – Falling

Edge, VEN1 = VEN2 = VIN, VOUT1 = 3.3 V,

IOUT1 = 10 mA

2 ms/div 2 ms/div

Figure 33. Load Transient Response – Rising

Edge, IOUT = 1 mA to 130 mA – 3.3 V

Figure 34. Load Transient Response– Falling

Edge, IOUT = 130 mA to 1 mA – 3.3 V

4 ms/div 4 ms/div

500 mV/div

50 mA/div

VIN = 3.8 V

VOUT1 = 3.3 V

VOUT2 = disable

IOUT1 = 10 mA

COUT1 = COUT2 = 1 mF

1 V/div 1 V/div500 mV/div

20 mV/div

VEN

IIN

VOUT1

VOUT2

VIN

VOUT1

VOUT2

VOUT1

VOUT2

IOUT1

50 mA/div50 mV/div20 mV/div

tRISE = 1 ms

VIN = 3.8 V to 4.8 V

IOUT2 = 10 mA

tRISE = 1 ms

COUT1 = 220 nF

COUT2 = 220 nF

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT2 = 0 mA

50 mA/div50 mV/div20 mV/div 500 mV/div20 mV/div

VOUT1

VOUT2

IOUT1

tFALL = 1 ms

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT2 = 0 mA

500 mV/div1 V/div 1 V/div

50 mA/div 20 mV/div

VEN

IIN

VOUT1

VOUT2

VIN = 4.3 V

VOUT1 = 3.3 V

IOUT2 = 1 mA

COUT1 = COUT2 = 1 mF

VOUT2 = 1.8 V

IOUT1 = 10 mA

VIN

VOUT1

VOUT2

tFALL = 1 ms

VIN = 4.8 V to 3.8 V

IOUT2 = 10 mA

COUT1 = 220 nF

COUT2 = 220 nF

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TYPICAL CHARACTERISTICS

Figure 35. Load Transient Response – Rising

Edge, IOUT = 1 mA to 130 mA – 1.8 V

Figure 36. Load Transient Response – Falling

Edge, IOUT = 130 mA to 1 mA – 1.8 V

4 ms/div 4 ms/div

Figure 37. Load Transient Response – Rising

Edge, IOUT = 0.1 mA to 130 mA

Figure 38. Load Transient Response – Falling

Edge, IOUT = 130 mA to 0.1 mA

4 ms/div 4 ms/div

Figure 39. Turn−on/off − Slow Rising VIN Figure 40. Enable Turn−off

20 ms/div 200 ms/div

50 mA/div

VOUT1

VOUT2

IOUT2

tRISE = 1 ms

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT1 = 0 mA

20 mV/div50 mV/div50 mA/div20 mV/div50 mV/div500 mV/div

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT1 = 0 mA

VOUT1

VOUT2

IOUT2

tRISE = 1 ms

VOUT1

VOUT2

VIN

VIN = 4.3 V

VOUT1 = 3.3 V

VOUT2 = 1.8 V

IOUT1 = 10 mA

IOUT2 = 10 mA

CIN = COUT1 =

COUT1 = 220 nF

VOUT1

VOUT2

IOUT2

tFALL = 1 ms

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT1 = 0 mA

50 mA/div20 mV/div50 mV/div

VOUT1

VOUT2

IOUT2

tFALL = 1 ms

VIN = 4.3 V

VOUT1 = 3.3 V

COUT1 = 220 nF

COUT2 = 220 nF

VOUT2 = 1.8 V

IOUT1 = 0 mA

50 mA/div20 mV/div50 mV/div

VIN = 4.3 V

VOUT1 = 3.3 V

VOUT2 = 1.8 V

500 mV/div1 V/div

VOUT1

VEN tFALL = 1 ms

COUT = 4.7 mF

COUT = 1 mF

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APPLICATIONS INFORMATION

General

The NCP153 is a dual output high performance 130 mA

Low Dropout Linear Regulator. This device delivers very

high PSRR (75 dB at 1 kHz) and excellent dynamic

performance as load/line transients. In connection with low

quiescent current this device is very suitable for various

battery powered applications such as tablets, cellular

phones, wireless and many others. Each output is fully

protected in case of output overload, output short circuit

condition and overheating, assuring a very robust design.

The NCP153 device is housed in XDFN−6 1.2 mm x

1.2 mm package which is useful for space constrains

application.

Input Capacitor Selection (CIN)

It is recommended to connect at least a 0.22 mF Ceramic

X5R or X7R capacitor as close as possible to the IN pin of

the device. This capacitor will provide a low impedance path

for unwanted AC signals or noise modulated onto constant

input voltage. There is no requirement for the min. or max.

ESR of the input capacitor but it is recommended to use

ceramic capacitors for their low ESR and ESL. A good input

capacitor will limit the influence of input trace inductance

and source resistance during sudden load current changes.

Larger input capacitor may be necessary if fast and large

load transients are encountered in the application.

Output Decoupling (COUT)

The NCP153 requires an output capacitor for each output

connected as close as possible to the output pin of the

regulator. The recommended capacitor value is 0.22 mF and

X7R or X5R dielectric due to its low capacitance variations

over the specified temperature range. The NCP153 is

designed to remain stable with minimum effective

capacitance of 0.15 mF to account for changes with

temperature, DC bias and package size. Especially for small

package size capacitors such as 0201 the effective

capacitance drops rapidly with the applied DC bias.

There is no requirement for the minimum value of

Equivalent Series Resistance (ESR) for the COUT but the

maximum value of ESR should be less than 2 W. Larger

output capacitors and lower ESR could improve the load

transient response or high frequency PSRR. It is not

recommended to use tantalum capacitors on the output due

to their large ESR. The equivalent series resistance of

tantalum capacitors is also strongly dependent on the

temperature, increasing at low temperature.

Enable Operation

The NCP153 uses the dedicated EN pin for each output

channel. This feature allows driving outputs separately.

If the EN pin voltage is <0.4 V the device is guaranteed to

be disabled. The pass transistor is turned−off so that there is

virtually no current flow between the IN and OUT. The

active discharge transistor is active so that the output voltage

VOUT is pulled to GND through a 50 W resistor. In the

disable state the device consumes as low as typ. 10 nA from

the VIN.

If the EN pin voltage >0.9 V the device is guaranteed to

be enabled. The NCP153 regulates the output voltage and

the active discharge transistor is turned−off.

The both EN pin has internal pull−down current source

with typ. value of 300 nA which assures that the device is

turned−off when the EN pin is not connected. In the case

where the EN function isn’t required the EN should be tied

directly to IN.

Foldback Short Circuit Protection

The internal foldback limits short circuit current to typical

55 mA and protects powered device against overheating.

Maximum output current is internaly limited to 165 mA

(typ). The current limit and short circuit protection will work

properly over whole temperature range and also input

voltage range. There is no limitation for the short circuit

duration. Thess protections are independent for each

channel. Short circuit on the one channel do not influence

second channel which will work according to specification.

Thermal Shutdown

When the die temperature exceeds the Thermal Shutdown

threshold (TSD − 160°C typical), Thermal Shutdown event

is detected and the affected channel is turn−off. Second

channel still working. The channel which is overheated will

remain in this state until the die temperature decreases below

the Thermal Shutdown Reset threshold (TSDU − 140°C

typical). Once the device temperature falls below the 140°C

the appropriate channel is enabled again. The thermal

shutdown feature provides the protection from a

catastrophic device failure due to accidental overheating.

This protection is not intended to be used as a substitute for

proper heat sinking. The long duration of the short circuit

condition to some output channel could cause turn−off other

output when heat sinking is not enough and temperature of

the other output reach TSD temperature.

Power Dissipation

As power dissipated in the NCP153 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

ambient temperature affect the rate of junction temperature

rise for the part.

The maximum power dissipation the NCP153 can handle

is given by:

PD(MAX) +ƪ125°C*TAƫ

qJA

(eq. 1)

The power dissipated by the NCP153 for given

application conditions can be calculated from the following

equations:

NCP153

www.onsemi.com

PD[VIN IGND )IOUT1ǒVIN *VOUT1Ǔ(eq. 2)

)IOUT2ǒVIN *VOUT2Ǔ

Figure 41. qJA vs. Copper Area (XDFN−6)

0.25

0.50

0.75

1.00

1.25

100

120

140

160

180

200

220

240

0 100 200 300 400 500 600 700

COPPER HEAT SPREADER AREA (mm2)

qJA, JUNCTION−TO−AMBIENT

THERMAL RESISTANCE (°C/W)

PD(MAX), MAXIMUM POWER

DISSIPATION (W)

PD(MAX), TA = 25°C, 2 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

qJA, 1 oz Cu

qJA, 2 oz Cu

Reverse Current

The PMOS pass transistor has an inherent body diode

which will be forward biased in the case that VOUT > VIN.

Due to this fact in cases, where the extended reverse current

condition can be anticipated the device may require

additional external protection.

Power Supply Rejection Ratio

The NCP153 features very good Power Supply Rejection

ratio. If desired the PSRR at higher frequencies in the range

100 kHz − 10 MHz can be tuned by the selection of COUT

capacitor and proper PCB layout.

Turn−On Time

The turn−on time is defined as the time period from EN

assertion to the point in which VOUT will reach 98% of its

nominal value. This time is dependent on various

application conditions such as VOUT(NOM), COUT, TA.

PCB Layout Recommendations

To obtain good transient performance and good regulation

characteristics place input and output capacitors close to the

device pins and make the PCB traces wide. In order to

minimize the solution size, use 0402 capacitors. Larger

copper area connected to the pins will also improve the

device thermal resistance. The actual power dissipation can

be calculated from the equation above (Equation 2). Expose

pad should be tied the shortest path to the GND pin.

ORDERING INFORMATION

Device

Voltage Option*

(OUT1/OUT2) Marking

Marking

Rotation Package Shipping†

NCP153MX330180TCG 3.3 V/1.8 V GA 0°XDFN-6

(Pb-Free)

5000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*Contact factory for other voltage options. Output voltage range 1.0 V to 3.3 V with step 50 mV.

NCP153

www.onsemi.com

PACKAGE DIMENSIONS

XDFN6 1.20x1.20, 0.40P

CASE 711AT

ISSUE C

ÍÍ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO THE PLATED

TERMINALS.

4. COPLANARITY APPLIES TO THE PAD AS

WELL AS THE TERMINALS.

SEATING

PLANE

DIM

MIN TYP

MILLIMETERS

0.30 0.37

A1 0.00 0.03

b0.13 0.18

PIN ONE

REFERENCE

0.05 C

NOTE 3

MOUNTING FOOTPRINT*

0.15 0.20

BOTTOM VIEW

DIMENSIONS: MILLIMETERS

0.37

0.24

1.40

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

E2 0.20 0.30

TOP VIEW

SIDE VIEW

NOTE 4

RECOMMENDED

0.10 BC

PACKAGE

OUTLINE

D2 0.84 0.94

1.20

0.40 BSC

0.05

1.08

0.40

DETAIL A

MAX

0.45

0.05

0.23

0.25

0.40

1.04

1.15 1.25

0.00 0.10

DETAIL A

OPTIONAL

CONSTRUCTION

NCP153/D

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