
Thermal-Overload Protection
Thermal-overload protection limits total power dissipation
in the MAX1658/MAX1659. When the junction temperature
exceeds TJ = +165°C, the pass transistor deactivates,
allowing the IC to cool. Once it has cooled by 10°C, the
control logic enables operation. Under thermal overload,
the output of the device pulses as the die heats up and
then cools to operational levels. Prolonged operation
under these conditions is not recommended.
Operating Region and Power Dissipation
Maximum power dissipation of the MAX1658/MAX1659
depends on the thermal resistance of the package and
circuit board, the temperature difference between the
die and ambient air, and the rate of air flow. The power
dissipation by the device is P = IOUT (VIN - VOUT). The
maximum power dissipation is:
( )
( )
JA
MAX JB BA
T T
P
−
=
θ +θ
where (TJ - TA) is the temperature difference between
MAX1658/MAX1659 die junction and the surrounding air,
θJB is the thermal resistance of the package, and θBA is
the thermal resistance through the printed circuit board,
copper traces, and other materials to the surrounding
air. The 8-pin SO package for the MAX1658/MAX1659
features a special lead frame with a lower thermal
resistance and higher allowable power dissipation than
a standard 8-pin SO package. The thermal resistance
of this package is θJB = 69°C/W, compared with θJB =
170°C/W for a standard 8-pin SO package.
The IN pins of the MAX1658/MAX1659 package perform
the dual function of providing an electrical connection to
IN and channeling heat away. Connect all IN pins to the
input voltage using a large pad or power plane on the
surface. Where this is impossible, connect to a copper
plane on an adjacent layer. The pad should meet the
dimensions specified in Figure 4.
Figure 4 assumes the IC is soldered directly to the pad,
has a +125°C maximum junction temperature and a +25°C
ambient air temperature, and has no other heat sources.
Use larger pad sizes for lower junction temperatures,
higher ambient temperatures, or conditions where the IC
is not soldered directly to a heat-sinking IN pad.
The MAX1658/MAX1659 can regulate currents up to
350mA and operate with input voltages up to 16.5V,
but not simultaneously. High output currents can only
be sustained when input-output differential voltage is
low, as shown in the following equation. Maximum
power dissipation depends on packaging, board layout,
temperature, and air flow. The maximum output current is:
( )
( )
MAX A
OUT(MAX) IN OUT
P 125 C T
I V V 100 C
× °−
=− ×°
where PMAX is derived from the TJ = 125°C curve of
Figure 4.
Reverse-Battery Protection
The MAX1658/MAX1659 feature reverse-battery
protection. Under normal operation, a p-channel MOSFET
connects the substrate of the device to IN. When the input
voltage falls below ground (implying reverse-battery
conditions), the p-channel switch turns off and
disconnects the substrate from IN, disabling the device.
The maximum reverse-battery voltage allowed is -17V.
SHDN also withstands reverse-battery conditions and
can be connected directly to IN with no loss of protection.
Polarized input bypass capacitors become damaged
under reverse-battery conditions. To ensure circuit
reliability, use a nonpolarized capacitor at the input.
The MAX1658/MAX1659 do not provide reverse-current
protection. If VOUT is greater than VIN by more than
300mV, reverse current flows. Reverse-current protection
can be added by connecting a Schottky diode in series
with IN.
Figure 4. Typical Maximum Power Dissipation vs. Ground Pad
Area
1600
1400
1200
1000
800
600
400
0.1
0.65
1
6.5
COPPER GROUND PAD AREA
10 (in2)
65 (cm2)
POWER DISSIPATION (mW)
Tj = +125°C
Tj = +85°C
SINGLE-SIDED 1oz. COPPER
TA = +25°C, STILL AIR
MAX1658/MAX1659 350mA, 16.5V Input,
Low-Dropout Linear Regulators
www.maximintegrated.com Maxim Integrated
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