Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 FEATURES Fixed 10 V, 100 mA regulator with enable function Supply voltage range up to 33 V (45 V) Very low quiescent current of 15 pA (typical value) Very low dropout voltage High ripple rejection Very high stability: Electrolytic capacitors: Equivalent Series Resistance (ESR) < 38 Q at Ipeg < 25 MA Other capacitors: 100 nF at 200 WA < Ipeg < 100 mA. Pin compatible family TDA3672 to TDA3676 Protections: Reverse polarity safe (down to 25 V without high reverse current) Negative transient of 50 V (Rg = 10 Q, t < 100 ms) QUICK REFERENCE DATA Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) ESD protected for all pins DC short-circuit safe to ground and Vp of the regulator output Temperature protection at Tj > 150 C. GENERAL DESCRIPTION The TDA3676 is a fixed 10 V voltage regulator with very low dropout voltage and quiescent current, which operates over a wide supply voltage range. The IC is available as: TDA3676T: Vp < 33 V, 40 C < Tamb < +85 C and SO8 package (non-automotive) TDA3676AT: Vp < 45 V, 40 C < Tamp $ +125 C and SO8 package (automotive). SYMBOL PARAMETER CONDITIONS MIN. | TYP. | MAX. | UNIT Supply Vp supply voltage regulator on TDA3676T 3 14.4 33 Vv TDA3676AT 3 14.4 145 Vv Iq quiescent supply current Vp = 14.4 V; IREG = 0 mA; - 15 30 HA Vien) = 5 V Regulator output VREG regulator output voltage Vien) = 5 V 13 V< Vp < 22 V; Ipcg = 0.5 mA| 9.6 10 10.4 |V 13 V< Vp <45 V; Ipcg = 0.5 mMA| 9.5 10 105 |V Vp = 14.4 V; 9.5 10 105 |V 0.5 mA < IREg < 100 mA VREG(drop) dropout voltage Vp = 9.5 V; IREg = 50 MA - 0.18 0.3 V ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION TDA3676T S08 plastic small outline package; 8 leads; body width 3.9 mm SOTQ96-1 TDA3676AT S08 plastic small outline package; 8 leads; body width 3.9 mm SOTQ96-1 2000 Feb 01Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current ; TDA3676 10 V voltage regulator with enable BLOCK DIAGRAM Vp_[8 | REGULATOR Ky H REG En+~|Banp Gap THERMAL TDA3676 PROTECTION 2,3,6,7 > MGL836 GND Fig.1 Block diagram. PINNING SYMBOL PIN (SO8) DESCRIPTION REG 1 regulator output GND 2,3, 6and 7 | ground; note 1 n.c. 4 not connected EN 5 enable input Vp 8 supply voltage Note REG [1 | [8] Vp 1. All GND pins are connected to the lead frame and can anp [2 | [7] GND also be used to reduce the total thermal resistance TDA3676 Rthi-a) by soldering these pins to a ground plane. _np [3 | [6 | GND The ground plane on the top side of the Printed-Circuit nc. | 4 5 | EN Board (PCB) acts like a heat spreader. MGL837 Fig.2 Pin configuration. 2000 Feb 01 3Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 FUNCTIONAL DESCRIPTION The TDA3676 is a fixed 10 V regulator which can deliver output currents up to 100 mA. The regulator is available in an SO8 package with fused centre pins connected to the lead frame. The regulator is intended for portable, mains, telephone and automotive applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. The regulator remains operating down to very low supply voltages and below this voltage it switches off. LIMITING VALUES A temperature protection circuit is included, which switches off the regulator output at a junction temperature above 150 C. A new output circuit guarantees the stability of the regulator for a capacitor output circuit with an ESR up to 20 . If only a 100 nF capacitor is used, the regulator is fully stable when IReG > 200 mA. This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required). In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Vp supply voltage TDA3676T - 33 Vv TDA3676AT - 45 Vv Ve(rp) reverse polarity supply voltage non-operating - 25 Vv Prot total power dissipation temperature of PCB ground |- 4.1 W plane is 25 C Tstg storage temperature non-operating 55 +150 C Tamb ambient temperature operating TDA3676T 40 +85 C TDA3676AT 40 +125 C Tj junction temperature operating 40 +150 C THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rih(j-a) thermal resistance from junction to ambient in free air; soldered 125 KAW Rih(-c) thermal resistance from junction to case to centre pins; soldered 30 KW QUALITY SPECIFICATION In accordance with SNW-FQ-611E. 2000 Feb 01Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 CHARACTERISTICS Vp = 14.4 V; Tamb = 25 C; Vien) = 5 V; measured in test circuit of Fig.3; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. | TYP. | MAX. UNIT Supply voltage: pin Vp Vp supply voltage regulator operating; note 1 TDA3676T 3 14.4 | 33 V TDA3676AT 3 14.4 | 45 Vv Iq quiescent current Vp = 14.4 V; IREg = 0 mA; - 4 15 HA Vien) = 0 V Vp =144V; IREG =OmA; _ 15 30 HA Vien) = 5 V 11.5 V < Vp <22 V; Ipcg = 10 MA - 0.2 |05 |mA 11.5 V < Vp < 22 V; Ippg = 50 MA - 1.4 2.5 mA Enable input: pin EN VEN) enable input voltage enable off; Vaeg < 0.8 V -1.00 |- +1.0 |V enable on; Vraeg = 9.5 V 3.0 - 18 V I(EN) enable input current Vien = 5 V - 0.3 - HA Regulator output: pin REG; note 2 VREG output voltage 13 V<Vp<22V; IRppg =0.5 mA 9.6 10 10.4 |V 11V<Vp <45 V; Ipq = 0.5 mA; 95 |10 10.5 |V Tamb < 125 C 0.5 MA < InFq < 100 mA; 95 |10 10.5 |V Tamb < 125 C VreGidrop) | dropout voltage Vp = 9.5 V; IREg = 50 mA; - 0.18 |03 V Tamb < 85 C Vregistab) | long-term stability voltage - 20 - mvV/1000 h AVreGiline) | line input regulation voltage | 13 V< Vp < 16 V; IReg = 0.5 mA - 1 10 mV 12 V<Vp<22V; Ippg =0.5 MA - 1 30 mV 12 V<Vp<45V; Tamb $ 125 C - 1 50 mV AVREG(load) | oad output regulation 0.5 mA < IpEG < 50 mA; - 10 50 mV voltage Tamb < 125 C SVRR supply voltage ripple fj = 120 HZ; Vicrippley = 1 V (RMS); 50 60 - dB rejection IREG = 0.5 mA IREG(crl) current limit Vreg > 9.5 V 0.17 |0.25 |- A lLowp) output leakage current at Vp =-15 V; Vaeg < 0.3 V - 1 500 HA reverse polarity Notes 1. The regulator output will follow Vp if Vp < Vreg + VReGidrop)- 2. Limiting values as applicable for device type: a) TDA3676T: Vp < 33 V, -40 C < Tamb < +85 C. b) TDA3676AT: Vp < 45 V, 40 C < Tamb S$ +125 C. 2000 Feb 01Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 TEST AND APPLICATION INFORMATION Vi(EN) (1) C1 is optional (to minimize supply noise only). ool 1 wT TDA3676 YUEN) * 3, 6,7 th MGL838 =5V. Fig.3 Test circuit. 1 VreG=10V +L ce 2 Mr MDAg61 102 ESR (Q) stable 10-1 1 10 102 (1) Maximum ESR at 200 A < IReg < 100 mA. (2) Minimum ESR only when Ipeg < 200 LA. Fig.4 Graph for selecting the value of the output capacitor. Noise The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz (see Table 1). Table 1 Noise figures OUTPUT NOISE FIGURE (iV) CURRENT IRE (mA) C2=10uF | C2=47 uF | C2 = 100 wF 0.5 550 320 300 50 650 400 400 Stability The regulator is stabilized with an external capacitor connected to the output. The value of this capacitor can be selected using the diagrams shown in Figs 4 and 5. The following four examples show the effects of the stabilization circuit using different values for the output capacitor. 2000 Feb 01 1 03 MDA962 ESR (Q) 102 22 region 1 10 102 108 IREG (mA) Fig.5 ESR as a function of Irpeg for selecting the value of the output capacitor.Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 EXAMPLE 1 The regulator is stabilized with an electrolytic capacitor of 68 WF (ESR = 0.5 Q). At Tamb = 40 C, the capacitor value is decreased to 22 uF and the ESR is increased to 3.5 Q. The regulator will remain stable at a temperature of Tamb = 40 C. EXAMPLE 2 The regulator is stabilized with an electrolytic capacitor of 10 uF (ESR = 3.3 Q). At Tamb = 40 C, the capacitor value is decreased to 3 uF and the ESR is increased to 20 Q. The regulator will remain stable at a temperature of Tamb = 40 C. EXAMPLE 3 The regulator is stabilized with a 100 nF MKT capacitor connected to the output. Full stability is guaranteed when the output current is larger then 200 WA. Because the thermal influence on this capacitor value is almost zero, the regulator will remain stable at a temperature of Tamb = 40 C. EXAMPLE 4 The regulator is stabilized with a 100 nF capacitor in parallel with a electrolytic capacitor of 10 uF connected to the output. The regulator is now stable under all conditions and independent of: The ESR of the electrolytic capacitor The value of the electrolytic capacitor The output current. Application circuits The maximum output current of the regulator equals: 150 Tomb Riya) * (Vp Vaca) 150 T = amb (mA) 100 x (Vp 10) IpEGcmax) = When Tamb = 21 C and Vp = 19 V, the maximum output current equals 140 mA. 2000 Feb 01 For successful operation of the IC (maximum output current capability) special attention has to be given to the copper area required as heatsink (connected to all GND pins), the thermal capacity of the heatsink and its ability to transfer heat to the external environment. It is possible to reduce the total thermal resistance from 125 to 50 K/W. APPLICATION CIRCUIT WITH BACKUP FUNCTION Sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even -1 V). This function can easily be built with the TDA3676 by using an output capacitor with a large value. When the supply voltage is 0 V (or -1 V), only a small current will flow into pin REG from this output capacitor (a few pA). The application circuit is given in Fig.6. Pool | | deer C2 1 uF Z TDA3676 YEN) . 2,3,6,7 oh MGL839 Vi(EN) =5V. (1) C1 is optional (to minimize supply noise only). (2) C2<4700 uF. Fig.6 Application circuit with backup function.Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 Additional application information This section gives typical curves for various parameters measured on the TDA3676AT. Standard test conditions are: Vp = 14.4 V; Tamb = 25 C. MDA947 IREG =OmA. Fig.7 Quiescent current as a function of the MDA949 Fig.8 Quiescent current as a function of high 40 0 40 80 120 160 Tj CC) (1) 1, at 50 mA load. (2) |, at 10 mA load. Fig.9 Quiescent current as a function of the junction temperature. supply voltage. supply voltage. MDA951 MDA948 0.48 | q \ (mA) N\ 0.40 SS N 0.36 IREG =10mA. Fig.10 Quiescent current as a function of the supply voltage. 2000 Feb 01Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current TDA3676 10 V voltage regulator with enable 2 MDA950 4 MDA952 \ Iq 4G ' N (mA) m \ 3 Z \ YY 1.8 N 4 \ . YY 1.6 A 1 fh NK YY > LA 1a Lz 5 10 15 20 25 0 20 40 60 80 100 Vp) IREG (mA) IREG =50mA. Fig.11 Quiescent current as a function of the Fig.12 Quiescent current as a function of the load Fig.13 Output voltage as a function of the junction temperature. supply voltage. current. MGL840 MGL841 10.2 12 VREG 1 VREG (V) ) v) 10.1 8 10 y 4 J 9.9 0 -50 0 50 100 150 200 -50 0 50 100 150 200 Tj CC) Tj CC) IREG =OmA. IREG =OmA. Fig.14 Output voltage thermal protection as a function of the junction temperature. 2000 Feb 01Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current TDA3676 10 V voltage regulator with enable 500 MDA957 12 MGL842 Vv ro neat P) / "REG J 400 / 300 J 200 100 0 40 80 120 IREG (mA) Fig.15 Dropout voltage as a function of the output current. 0 100 200 300 IREG (mA) Vp = 11.5 V with pulsed load. Fig.16 Fold back protection mode. MDA956 (1) lREG = 10 mA; C2 = 10 uF. (1) SVRR at R, = 1009. (2) SVRR at R, = 500 Q. (3) SVRR at RL= 10 kQ. Fig.17 SVRR as a function of the ripple frequency. 2000 Feb 01 10Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current P gerquie TDA3676 10 V voltage regulator with enable PACKAGE OUTLINE $O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 - | f LT be 1 | H H. lL lle 0 2.5 5mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) unit | 4 Ai | Az | Az | bp e | DO] E@ | e HE L Lp Q v w y zM |] 6 max. 0.25 | 1.45 049 | 025 | 50 | 40 62 10 | 07 07 mm | 175) o40 | 125 | 5) 036] 019] 48 | 38 | 127 | 58 | 1] o4 | of | 97 | 975} 1 | o3 | go oO 0.010 | 0.057 0.019 0.0100] 0.20 | 0.16 0.244 0.039 | 0.028 0.028] 0 inches | 0.069 | 9 g94 | 0.049 | 9" | 0.014 |0.0075| 0.19 | 0.15 | 9 | o.208 | 9-941 | o.016 | 0.004 | 9-01 | 9-01 | 0.004 | 4 oi, Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES EUROPEAN OUTLINE PROJECTION VERSION IEC JEDEC EIAJ SOT96-1 076E03 MS-012 f-} Seteor ISSUE DATE 2000 Feb 01 11Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook !1C26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 2000 Feb 01 12 e Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.Philips Semiconductors Preliminary specification Low dropout voltage/quiescent current 10 V voltage regulator with enable TDA3676 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE REFLOW) BGA, SQFP not suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS | not suitable) suitable PLCC), SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended(3)(4) suitable SSOP, TSSOP, VSO not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Feb 01 13