DESCRIPTION
Document No. 480 7116-001.B00 04/22/15 Page 1
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX324C11SR/4
4GB (4GB 512M x 64-Bit)
DDR3-2400 CL11 240-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX324C11SR/4 is a 512M x 64-bit (4GB) DDR3-2400
CL11 SDRAM (Synchronous DRAM) 1Rx8, memory module,
based on eight 512M x 8-bit FBGA components per module.
Each module supports Intel® XMP (Extreme Memory
Profiles). Each module has been tested to run at DDR3-2400
at a low latency timing of 11-13-14 at 1.65V. The SPDs are
programmed to JEDEC standard latency DDR3-1600
timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and
mechanical specifications are as follows:
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal banks
• Programmable CAS latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write (either on the fly using A12 or
MRS)
• Bi-directional Differential Data Strobe
• Internal (self) calibration: Internal self calibration through ZQ
pin (RZQ: 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°Cº
• Asynchronous Reset
• Height 1.311” (33.30mm), w/heatsink, single sided component
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command T ime (tRFCmin)
Row Active T ime (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
11 cycles
48.125ns(min.)
260ns(min.)
35ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
XMP TIMING PARAMETERS
•JEDEC: DDR3-1600 CL11-11-11 @1.5V
•XMP Profile #1: DDR3-2400 CL11-13-14 @1.65V
•XMP Profile #2: DDR3-2133 CL11-13-13 @1.6V
Document No. 4807116-001.B00 Page 2
continued HyperX
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
kingston.com/hyperx
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
MODULE DIMENSIONS
MODULE WITH HEAT SPREADER
7.9 mm
133.35 mm
33.3 mm
