SFR16S, SFR25, SFR25H
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Revision: 12-Aug-16 7Document Number: 28722
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TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• EN 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out in accordance with IEC 60068-2-xx
test method and under standard atmospheric conditions in
accordance with IEC 60068-1, 5.3.
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31. In test procedures and requirements table, only the
tests and requirements are listed with reference to the
relevant clauses of IEC 60115-1 and IEC 60068-2-xx test
methods. A short description of the test procedure is also
given.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (Rmax.)
4.5 - Resistance - ± 5 %; ± 1 %
4.8 - Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 155 / 20) °C ± 250 ppm/K; ± 100 ppm/K
4.12 - Noise IEC 60195
< 68 k68 k to
100 k
> 100 k to
1 M> 1 M
SFR16S ≤ 0.1 μV/V ≤ 0.5 μV/V ≤ 1.5 μV/V ≤ 1.5 μV/V
SFR25,
SFR25H ≤ 0.1 μV/V ≤ 0.1 μV/V ≤ 0.1 μV/V ≤ 1.5 μV/V
4.13 - Short time
overload
Room temperature;
P = 6.25 x Pn;
(voltage not more than 2 x
limiting voltage); 5 s
± (0.25 %R +0.05)
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations Tensile, bending, and torsion ± (0.25 % R + 0.05 )
4.17 20 (Ta) Solderability
at +235 °C; 2 s;
solder bath method;
SnPb40 Good tinning (≥ 95 % covered); no damage
at +245 °C; 3 s;
solder bath method;
SnAg3Cu0.5
4.18 20 (Tb) Resistance to
soldering heat
Unmounted components
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change of
temperature
30 min at -55 °C and
30 min at +155 °C;
5 cycles
± (0.25 % R + 0.05 )
4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions;
40 g ± (0.25 % R + 0.05 ); no damage
4.22 6 (Fc) Vibration
10 sweep cycles per direction;
10 Hz to2000 Hz
1.5 mm or 200 m/s2
± (0.25 % R + 0.05 ); no damage
4.23 Climatic
sequence:
4.23.2 2 (Ba) Dry heat 155 °C; 16h
4.23.3 30 (Db) Damp heat,
cyclic
55 °C; 24h;
90% to100%RH; 1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2h
4.23.5 13 (M) Low air pressure 8.5kPa; 2h; 15 °Cto35 °C
4.23.6 30 (Db) Damp heat,
cyclic
55°C; 5days;
95 %to100%RH; 5 cycles SFR16S,
SFR25,
SFR25H
± (1 %R +0.05 ); no visible damage
± (1 %R +0.05 ); no visible damage
± 2 %R; no visible damage
4.23.7 DC load apply rated power for 1 min