A294
High Speed, Matched-Impedance, Parallel Board-to-board Connector
IT1 Series
Features
1. Impedance Matching using a 4-Layer Board
The innovative transmission module uses PC boards
with a strip line design of transmission lines, providing
matched impedance of 50 ohms, for standard product.
2. Supports Multiple Connectors per board
Designed with a tolerance of +/- 0.2mm for both the X
and Y-axis. The three-piece structure and the +/- 0.2mm
tolerance allows 3 or more IT1’s to be mounted on a
single board.
3. Customized Board-to-Board Distance
Board-to-board distance can be customized, from 16mm
to 40mm.
Ground lines or additional traces can be added to
support high level, high speed transmission or mixed
power/signal applications.
4. Signal to Ground Ratio
The standard signal-to-ground ratio is 10:2, which makes
reliable matching of the characteristic impedance of each
transmission line. This ratio also can be customized.
5. Contact Reliability
Use of double contact points on each of the contacts
assures highly reliable performance. Applications
Routers, servers, base stations and other
telecommunication equipment.
IT1 Series Outline
High-speed matched-impedance parallel board-to-board
connector designed for applications requiring board-to-
board spacing with transmission speeds exceeding
1GHz. The connection system has matched impedance
of 50 ohm or can be customized. Contacts are on 0.5mm
pitch.
4-Layer board
(Impedance matching)
2-Point contact
2-Point contact
(0.65) : Wipe
Receptacle
Transmission Module
Receptacle
Connection Cross-Sectional Diagram
Receptacle (2 required)
Transmission Module
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A295
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
Measured at 100V DC
150 V AC/one minute
Measured at 100 mA
Frequency of 10 to 55 Hz, 0.75mm single amplitude, for 10
cycles in each of 3 directions
Acceleration of 490 m/s2, 11 ms duration, sine half-wave
waveform, 3 cycles in each of the 3 axis.
96 hours/40ç/ humidity of 90% to 95%
Temperature: -55ç/+15çto +35ç/+85ç/+15çto +35ç
Duration: 30 /2 to 3 /30 /2 to 3 (Minutes)
5 cycles
20 cycles
Reflow: At the recommended temperature profile
Manual soldering: 350
ç
for 3 seconds
100 M ohms min.
No flashover or insulation breakdown
100 m ohms max.
No electrical discontinuity of 1 μs or more.
No damage, cracks, or parts dislocation.
No electrical discontinuity of 1 μs. min.
No damage, cracks, or parts dislocation
Contact resistance: 110 m ohms max.
Insulation resistance: 100 M ohms min.
No damage, cracks, or parts dislocation
Contact resistance: 110 m ohms max.
Insulation resistance: 100 M ohms min.
No damage, cracks, or parts dislocation
Contact resistance: 110 m ohms max.
No damage, cracks, or parts dislocation.
No deformation of components affecting performance.
1.
Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Shock
6.
Humidity
7. Temperature cycle
8. Durability
(insertion/ withdrawal)
9.
Resistance to
9.
Soldering Heat
Rating 0.4 A (Note 1)
50V AC
Operation Temperature
Range
Operation Humidity
Range
Current
rating
Voltage
rating
-55ç to +85ç
Relative humidity 95% max.
(No condensation)
Storage Temperature
Range
Storage Humidity
Range
-10
ç
to +60
ç
(Note 2)
40% to 70% (Note 2)
Product Specifications
Item Specification Conditions
Note1:
If the connector is going to be used at a current in excess of the 0.4 A, please contact your Sales Representative.
Note2:
The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
Note3:
Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and
specifications for a specific part number shown.
Series name : IT1
Locating Post type
Blank : With Locating Post
A : Without Locating Post
Number of contacts : 168, 252
Connector S : Receptacle Socket
P:
Transmission Plug Module
Lead
SV : Straight SMT
Packaging
Blank : Tray
(25) : Tray(connectors with attached tape
for a vacuum board placement)
Number of ground contacts : 28, 44
Board-to-board Distance
: 19mm,23mm,30mm
1
2
3
4
5
6
7
8
IT 1 - *P / *-*H
IT 1 #-*S - SV (* *)
Material
Ordering information
1 2 3 4 5 6
1 4 7 8
Part
Insulator
Contacts
Metal fittings
Material Finish Remarks
LCP
Phosphor bronze
Phosphor bronze
Color : Beige
Gold plating
Tin plating
UL94V-0
----------
----------
Receptacles
Transmission Module
Part
Insulator
Board
Material Finish Remarks
PBT
FR-4 Color : Black
Contact portion : Gold plating UL94V-0
----------
Receptacles
Transmission Module
3
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A296
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
Not required for products without Locating Post.
1
Receptacles - 168 Contacts
BRecommended PCB mounting pattern
A
1
2-(Ø1.5 mm): Locating Post
0.2 ±0.05
60.7 ±0.5
2±0.2
8.8 ±0.5
6 ±0.5( 0.6)
60.7±0.5
(52) (3.55)
20.5
20.5
0.5 0.5
1.5 1.5
b1b2
a1
a2
b84
a84
∞168
(=0.5∞41)
(=0.5∞41)
a1
b1
0.2 A
A
0.5 0.5
b 1b 2
a 1
a 2
b 84
a 84
3+0.1
0
56.9 0
-0.1
61.7 +0.1
0
3.55 ±0.05
6.6 0
-0.1
9.4 +0.1
0
0.3 ±0.02
52 ±0.05
1.5 1.5 20.5
20.5
0.06 A
2-Ø1.7±0.05
∞168
( =0.5∞41)
( =0.5∞41)
1
A
Part Number CL No. Locating Post Type RoHS
IT1-168S-SV
IT1A-168S-SV
641-0002-0
641-0012-4 With Locating Post
Without Locating Post YES
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A297
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
Receptacles - 252 Contacts
BRecommended PCB mounting pattern
)
a1
b1
A
A
6±0.5( 0.6 )
C1.5
2±0.2
8.8 ±0.5
0.2 ±0.05
3
20.5
84.2 ±0.5
( 75.5
1.5 20.5
1.5
20.5
0.5 0.5 b1
b2
a1
a2
b126
a126
2-(Ø1.5 mm): Locating Post
( 3.55 )
84.2 ±0.5
(=0.5∞41)
∞252
(=0.5∞41)
(=0.5∞41)
0.2 A
49.5
3+0.1
0
20.5
20.5 20.5
a 1
a 2
b 126
a 126
80.4 0
-0.1
85.2 +0.1
0
3.55
6.6 0
-0.1
9.4 +0.1
0
0.5
3
0.3 ±0.02
26
2- Ø1.7 ±0.05
0.5
(=0.5∞41)
( =0.5∞41)
252
(=0.5∞41)
1
A
B
0.06 A
0.1 A.B
1.5 1.5
.
b 1b 2
Part Number CL No. Locating Post Type RoHS
IT1-252S-SV
IT1A-252S-SV
641-0003-3
641-0013-7 With Locating Post
Without Locating Post YES
Not required for products without locating Post.
1
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A298
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
Transmission Module - 168 Contacts
Connection Table
19
168
(4.2)
57±0.5
55±0.3
7.8 ±0.5
a row
b row
8.4 ±0.3 8.4 ±0.3
5.8 ±0.35.8 ±0.3
6.6 ±0.5
Locking Protrusion
(2 Sides) 56±0.3
Mating side
Board Mounting side
1
A
1
Fig. 1
The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1.
a row
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
a01 - a84
a02 - a83
a03 - a82
a04 - a81
a05 - a80
a06 - a79
a07 - a78
a08 - a77
a17 - a68
a18 - a67
a19 - a66
a20 - a65
a29 - a56
a30 - a55
a31 - a54
a32 - a53
a41 - a44
a42 - a43
a43 - a42
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
α -β
a44 - a41
a53 - a32
a54 - a31
a55 - a30
a56 - a29
a65 - a20
a66 - a19
a67 - a18
a68 - a17
a77 - a08
a78 - a07
a79 - a06
a80 - a05
a81 - a04
a82 - a03
a83 - a02
a84 - a01
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
b row
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
b01 - b84
b02 - b83
b03 - b82
b04 - b81
b05 - b80
b06 - b79
b07 - b78
b08 - b77
b17 - b68
b18 - b67
b19 - b66
b20 - b65
b29 - b56
b30 - b55
b31 - b54
b32 - b53
b41 - b44
b42 - b43
b43 - b42
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
α -β
b44 - b41
b53 - b32
b54 - b31
b55 - b30
b56 - b29
b65 - b20
b66 - b19
b67 - b18
b68 - b17
b77 - b08
b78 - b07
b79 - b06
b80 - b05
b81 - b04
b82 - b03
b83 - b02
b84 - b01
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Part Number
IT1-168P/28-19H
CL No.
641-0192-8
Board-to-board Distance
19mm
A
18.4
B
18.4
CRoHS
16.6 YES
IT1-168P/28-30H 641-0303-7 30mm 13.9 13.9 17.6
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A299
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
Transmission Module - 252 Contacts
2-row type
Connection Table
The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1.
b row
a row
(4.2)
7.8±0.5
80.5 ±0.5
78.5 ±0.3
79.5 ±0.3
23
252
10.410.4 ±0.3 ±0.3
10.6 ±0.5 5.8±0.35.8±0.3
Mating side
Board Mounting side
2
1
A
Locking Protrusion
(2 Sides)
a row
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
a01 - a126
a05 - a122
a06 - a121
a07 - a120
a08 - a119
a17 - a110
a18 - a109
a19 - a108
a20 - a107
a29 - a98
a30 - a97
a31 - a96
a32 - a95
a41 - a86
a42 - a85
a43 - a84
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
a44 - a83
a53 - a74
a54 - a73
a55 - a72
a56 - a71
a62 - a65
a63 - a64
a64 - a63
a65 - a62
a71 - a56
a72 - a55
a73 - a54
a74 - a53
a83 - a44
a84 - a43
a85 - a42
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
α -β
a86 - a41
a95 - a32
a96 - a31
a97 - a30
a98 - a29
a107 - a20
a108 - a19
a109 - a18
a110 - a17
a119 - a08
a120 - a07
a121 - a06
a122 - a05
a126 - a01
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
b row
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
b01 - b126
b05 - b122
b06 - b121
b07 - b120
b08 - b119
b17 - b110
b18 - b109
b19 - b108
b20 - b107
b29 - b98
b30 - b97
b31 - b96
b32 - b95
b41 - b86
b42 - b85
b43 - b84
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
Ground
α -β
b44 - b83
b53 - b74
b54 - b73
b55 - b72
b56 - b71
b62 - b65
b63 - b64
b64 - b63
b65 - b62
b71 - b56
b72 - b55
b73 - b54
b74 - b53
b83 - b44
b84 - b43
b85 - b42
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Signal
Signal
Signal
Signal
Ground
Ground
Ground
α -β
b86 - b41
b95 - b32
b96 - b31
b97 - b30
b98 - b29
b107 - b20
b108 - b19
b109 - b18
b110 - b17
b119 - b08
b120 - b07
b121 - b06
b122 - b05
b126 - b01
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
ıı
Fig.1
Part Number
IT1-252P/44-23H
IT1-252P/44-30H
CL No.
641-0231-8
641-0304-0
Board-to-board Distance
23mm
A
10.4
B
10.4
CRoHS
10.6 YES
30mm 13.9 13.9 17.6
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A300
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
BIT1 Series Extraction Tool
Part Number CL No. Remarks RoHS
IT1-PICKER(1)641-1001-3 2-piece Package YES
(Ø2.5)
(6)
(6)(1.25)
(42)
(3)
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A301
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
1. System Components .......................................................... A302
¡Receptacles
¡Transmission Module Assembly
¡Extraction Tool
2. Recommended Design Guidelines ................................ A303
2-1 Recommended Solder Land Pattern
2-2 Board-to-Board Spacer Heights
3. Connector Placement ......................................................... A304
3-1 Receptacle Packaging Types
3-2 Receptacle Vacuum Pick-and-Place Areas
3-3 Receptacle Board Placement
3-4 Recommended Reflow Conditions
3-5 Solder Repairs
4. Mating Procedure ................................................................ A307
5. Un-mating of Connectors .................................................. A308
6.
Removal of the Transmission Module from the stationary side.
..A309
7. Precautions When Mounting Multiple Connectors .. A310
¡Allowable Amount of Misalignment
¡Recommended Positional Location
Table of Contents
Installation and Use Instruction Manual
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A302
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
BConnector Handling Precautions
1. System components
Receptacles
¡Contacts
¡Row A and row B contacts are arranged alternately starting
with No.1 in row B. Placement on board is polarized.
¡Metal Fittings
¡Permanently inserted to provide lock with the Transmission
Module and additional solder areas with the PCB.
¡Insulator body.
¡Injection molded single unit provides protection and correct
self-alignment of all components.
Transmission Module Assembly
¡Each Module has stationary side and a mating/un-mating
side.
¡When mounting multiple connectors, please keep uniform
orientation of the stationary side.
¡Transmission printed circuit boards used in the module are
based on JIS standards and quality standards applicable to
memory modules.
Guide frame
Transmission
boards.
Mating/
un-
mating
side
Stationary
side
Mating/
un-mating
side
(Short)
Stationary
side
(Longer)
Even numbered row: A contacts
Odd numbered row: B contacts
Insulator body
Metal fittings
Receptacles
Transmission
module
assembly
Extraction Tool
¡Used to release the transmission module from the
stationary receptacle. Extraction Tool
(2 required)
Fully Connected Condition
The interconnection package consists of 3 main sub-assemblies: Two receptacles and the Transmission Module.
The transmission module, held securely by the guide frame has a mating/un-mating side and a stationary side.
Once the stationary side is inserted in the receptacle, it can not be removed without the use of extraction tool.
The mating/un-mating side allows repeated re-insertion of the receptacle on this side only.
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A303
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
2. Recommended Design Guidelines
2-1 Solder Land Pattern
When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the
correct diameters of the holes (Fig. 1) are through the entire thickness of the board.
SLocating post hole diameterS
The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance
of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2).
Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies.
Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground
connection diagram of the transmission module.
2-2 Board-to-Board Spacer heights
The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them.
Fig. 3 indicates the connector height tolerance and the spacer’s height.
When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features,
which may affect the full mating of the connector.
Fig. 3 indicates design dimensions for the 19 mm board-to-board distance.
Automatic placement /(Locating post hole diameter) C dimension: 1.7 mm
Manual placement /(Locating post hole diameter) C dimension: 1.6 mm
/A position accuracy of +
-
0.03 should be exercised from the
center of the hole to contact Number 84.
Fig. 2 Cross section of IT1 receptacle
Fig. 1 IT1-168S-SV Recommended Solder Land Pattern
(mm)
Fig. 3
(mm)
Contact_A Contact_B
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A304
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
3. Connector Placement
3-1 Packaging Types
¡Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for
their automatic placement machines.
* Refer to the separate drawings for the detailed dimensions of the trays.
3-2 Automatic placement - Vacuum Pick-and-Place Areas
¡Specify "Vacuum Pick-up Tape Specification".
¡The area and position of the pick-and-place surface are indicated in the diagrams below.
¡Semi-hard tray packaging
168 contacts receptacle: 40 pieces per tray
252 contacts receptacle: 30 pieces per tray
¡Hard tray packaging
168 contacts receptacle: 24 pieces per tray
252 contacts receptacle: 16 pieces per tray
(mm)
(mm)
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A305
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
3-3 Receptacle Board Placement
¡When using automatic placement equipment, verify the packaging type and the Pick-and-place areas.
¡When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4.
* When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment.
SPrecautions for Manual PlacementS
The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board.
The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1.
3-4 Recommended Reflow Conditions
Fig. 4-1 = Correct Fig. 4-2 = Incorrect Fig. 4-3 = Incorrect
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A306
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
3-5 Solder Repairs
Assure that flux is not reaching the contact areas of the connector.
Wash the assembly as recommended below.
SCleaning ConditionsS
<Organic Solvent Cleaning>
<Water Based Cleaning>
When using water based cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers, which describes its effects on metals and resins. Care should be taken
not to leave moisture on the connectors.
<Cleaning Precautions>
Residual flux or cleaning agent remaining on the connectors when cleaning with organic solvents or water based cleaners
may cause deterioration of the electrical performance. It is important to check that a thorough washing has been performed.
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A307
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
4. Mating Procedure
Follow the procedure described below.
Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board.
¡The Transmission Module cannot be exposed to heat temperatures of the soldering process.
Step 1
Receptacle Placement on the board –
stationary side
Assure that the orientation posts are aligned
with the holes on the board.
When specifying receptacle assemblies without
the orientation posts exercise extra caution to
assure correct orientation and connection with
the solder pads.
Step 2
Insertion of the Transmission Module
Fully insert the Transmission Module in the
board-installed receptacle assembly.
It is critical that the insertion is done straight
and uniformly.
Step 3
Mating/un-mating
Assure that the receptacle assembly is correctly
aligned with the Transmission Module.
Fully insert the receptacle assembly on the
Transmission Module.
It is critical that the insertion is done straight
and uniformly.
Step 4 Connection completed
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A308
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
5. Un-mating of Connectors
Recommended Method
¡Pull uniformly straight up.
Prohibited un-mating Methods
Nov.1.2019Copyright2019HIROSEELECTRICCO.,LTD.AllRightsReserved.
A309
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
6. Removal of the Transmission Module - stationary side
¡Requires use of dedicated extraction tool. Two are required.
Step 1 ¡Fully insert the tools into each end of the receptacle assembly (Fig.
1) assuring that they will be over the hold areas of the Transmission
Module frame. Ref. Fig. 2
Step 2 Pull out the transmission module holding the tools straight.
extraction tool Insertion Area
Fig. 1
Fig. 2
Inappropriate area
Insertion area
Nov.1.2019Copyright2019HIROSEELECTRICCO.,LTD.AllRightsReserved.
A310
IT1 SeriesHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
7. Precautions When Mounting Multiple Connectors
Note: Observe the requirements as listed in paragraph 7-1 and 7-2.
The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for
mating / un-mating of multiple connector assemblies in a single operation.
7-1 Allowable Amount of Misalignment
Maximum allowable misalignment in X and Y directions is ±0.2 mm total.
Refer to the drawings below.
7-2 Recommended Connector Placement
It is recommended to leave min. of 30 mm space between the adjacent connector assemblies.
7-3 Examples of Prohibited Placement Positions
To assure reliability of solder joints and mating/ un-mating without damage,
DO NOT PLACE MULTIPLE CONNECTORS as illustrated below.
Length Orientation X1-X2=+
-
0.2 Width Orientation Y1-Y2=+
-
0.2
Nov.1.2019Copyright2019HIROSEELECTRICCO.,LTD.AllRightsReserved.