DATA SHEET
ICS8745BYI REVISION D JUNE 11, 2009 1 ©2009 Integrated Device Technology, Inc.
1:5 Differential-to-LVDS Zero Delay
Clock Generator
ICS8745BI
General Description
The ICS8745BI is a highly versatile 1:5 LVDS Clock
Generator and a member of the HiPerClockS™ family
of High Performance Clock Solutions from IDT. The
ICS8745BI has a fully integrated PLL and can be
configured as zero delay buffer, multiplier or divider,
and has an output frequency range of 31.25MHz to 700MHz. The
Reference Divider, Feedback Divider and Output Divider are each
programmable, thereby allowing for the following output-to-input
frequency ratios: 8:1, 4:1, 2:1, 1:1, 1:2, 1:4, 1:8. The external
feedback allows the device to achieve “zero delay” between the input
clock and the output clocks. The PLL_SEL pin can be used to
bypass the PLL for system test and debug purposes. In bypass
mode, the reference clock is routed around the PLL and into the
internal output dividers.
Features
Five differential LVDS outputs designed to meet
or exceed the requirements of ANSI TIA/EIA-644
Selectable differential clock inputs
CLKx, nCLKx pairs can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
Output frequency range: 31.25MHz to 700MHz
Input frequency range: 31.25MHz to 700MHz
VCO range: 250MHz to 700MHz
External feedback for “zero delay” clock regeneration
with configurable frequencies
Programmable dividers allow for the following output-to-input
frequency ratios: 8:1, 4:1, 2:1, 1:1, 1:2, 1:4, 1:8
Cycle-to-cycle jitter: 30ps (maximum)
Output skew: 40ps (maximum)
Static phase offset: 25ps ± 125ps
Full 3.3V supply voltage
-40°C to 85°C ambient operating temperature
Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
HiPerClockS
ICS
ICS8745BI
32-Lead LQFP 7mm x 7mm x 1.4mm
package body
Top View
Block Diagram
PLL_SEL
CLK0
nCLK0
CLK1
nCLK1
CLK_SEL
FB_IN
nFB_IN
SEL0
SEL1
SEL2
SEL3
MR
Q0
nQ0
Q1
nQ1
Q2
nQ2
Q3
nQ3
Q4
nQ4
0
1
PLL
8:1, 4:1, 2:1, 1:1,
1:2, 1:4, 1:8
0
1
÷1, ÷2, ÷4, ÷8,
÷16, ÷32, ÷64
Pullup
Pullup
Pulldown
Pullup
Pulldown
Pullup
Pulldown
Pulldown
Pullup
Pulldown
Pulldown
Pulldown
Pulldown
Pulldown
Pulldown
Pin Assignment
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
SEL0
SEL1
CLK0
nCLK0
CLK1
nCLK1
CLK_SEL
MR
Q3
nQ3
V
DDO
Q2
nQ2
GND
Q1
nQ1
V
DD
nFB_IN
FB_IN
SEL2
GND
nQ0
Q0
V
DDO
PLL_SEL
V
DDA
SEL3
V
DDO
Q4
nQ4
GND
V
DD
ICS8745BYI REVISION D JUNE 11, 2009 2 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Table 1. Pin Descriptions
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Number Name Type Description
1, 2,
12, 29
SEL0, SEL1,
SEL2 SEL3 Input Pulldown Determines output divider values in Table 3. LVCMOS / LVTTL interface levels.
3 CLK0 Input Pulldown Non-inverting differential clock input.
4 nCLK0 Input Pullup Inverting differential clock input.
5 CLK1 Input Pulldown Non-inverting differential clock input.
6 nCLK1 Input Pullup Inverting differential clock input.
7 CLK_SEL Input Pulldown Clock select input. When HIGH, selects CLK1,nCLK1. When LOW, selects CLK0,
nCLK0. LVCMOS / LVTTL interface levels.
8 MR Input Pulldown
Active HIGH Master Reset. When logic HIGH, the internal dividers are reset
causing the true outputs Qx to go low and the inverted outputs nQx to go high.
When logic LOW, the internal dividers and the outputs are enabled.
LVCMOS / LVTTL interface levels.
9, 32 VDD Power Core supply pins.
10 FBIN Input Pullup Inverting differential feedback input to phase detector for regenerating clocks with
“Zero Delay.”
11 FBIN Input Pulldown Non-inverted differential feedback input to phase detector for regenerating clocks
with “Zero Delay.”
13, 19, 25 GND Power Power supply ground.
14, 15 nQ0/Q0 Output Differential output pair. LVDS interface levels.
16, 22, 28 VDDO Power Output supply pins.
17, 18 nQ1/Q1 Output Differential output pair. LVDS interface levels.
20, 21 nQ2/Q2 Output Differential output pair. LVDS interface levels.
23, 24 nQ3/Q3 Output Differential output pair. LVDS interface levels.
26, 27 nQ4/Q4 Output Differential output pair. LVDS interface levels.
30 VDDA Power Analog supply pin.
31 PLL_SEL Input Pullup PLL select. Selects between the PLL and reference clock as the input to the
dividers. When LOW, selects reference clock. LVCMOS/LVTTL interface levels.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
CIN Input Capacitance 4pF
RPULLUP Input Pullup Resistor 51 k
RPULLDOWN Input Pulldown Resistor 51 k
ICS8745BYI REVISION D JUNE 11, 2009 3 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Function Tables
Table 3A. Control Input Function Table
*NOTE: VCO frequency range for all configurations above is 250MHz to 700MHz.
Inputs Outputs
PLL_SEL = 1
PLL Enable Mode
SEL3 SEL2 SEL1 SEL0 Reference Frequency Range (MHz)* Q[0:4], nQ[0:4]
0z 0 0 0 250 - 700 ÷1
0001 125 - 350 ÷1
0010 62.5 - 175 ÷1
0011 31.25 - 87.5 ÷1
0100 250 - 700 ÷2
0101 125 - 350 ÷2
0110 62.5 - 175 ÷2
0111 250 - 700 ÷4
1000 125 - 350 ÷4
1001 250 - 700 ÷8
1010 125 - 350 x2
1011 62.5 - 175 x2
1100 31.25 - 87.5 x2
1101 62.5 - 175 x4
1110 31.25 - 87.5 x4
1111 31.25 - 87.5 x8
ICS8745BYI REVISION D JUNE 11, 2009 4 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Table 3B. PLL Bypass Function Table
Inputs Outputs
PLL_SEL = 0
PLL Bypass Mode
SEL3 SEL2 SEL1 SEL0 Q[0:4], nQ[0:4]
0z000 ÷4
0001 ÷4
0010 ÷4
0011 ÷8
0100 ÷8
0101 ÷8
0110 ÷16
0111 ÷16
1000 ÷32
1001 ÷64
1010 ÷2
1011 ÷2
1100 ÷4
1101 ÷1
1110 ÷2
1111 ÷1
ICS8745BYI REVISION D JUNE 11, 2009 5 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
DC Electrical Characteristics
Table 4A. LVDS Power Supply DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = -40°C to 85°C
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°°C
Item Rating
Supply Voltage, VDD 4.6V
Inputs, VI-0.5V to VDD + 0.5V
Outputs, IO
Continuos Current
Surge Current
10mA
15mA
Package Thermal Impedance, θJA 47.9°C/W (0 lfpm)
Storage Temperature, TSTG -65°C to 150°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VDD Core Supply Voltage 3.135 3.3 3.465 V
VDDA Analog Supply Voltage 3.135 3.3 3.465 V
VDDO Output Supply Voltage 3.135 3.3 3.465 V
IDD Power Supply Current 128 mA
IDDA Analog Supply Current 18 mA
IDDO Output Supply Current 62 mA
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VIH Input High Voltage 2 VDD + 0.3 V
VIL Input Low Voltage -0.3 0.8 V
IIH Input High Current
CLK_SEL,
SEL[0:3], MR VDD = VIN = 3.465V 150 µA
PLL_SEL VDD = VIN = 3.465V 5 µA
IIL Input Low Current
CLK_SEL,
SEL[0:3], MR VDD = 3.465V, VIN = 0V -5 µA
PLL_SEL VDD = 3.465V, VIN = 0V -150 µA
ICS8745BYI REVISION D JUNE 11, 2009 6 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Table 4C. Differential DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = -40°C to 85°C
NOTE 1: VIL should not be less than -0.3V
NOTE 2: For single-ended applications, the maximum input voltage for CLKx, nCLKx is VDD + 0.3V.
Table 4D. LVDS DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = -40°C to 85°C
Table 5. Input Frequency Characteristics, VDD = VDDO = 3.3V ± 5%, TA = -40°C to 85°C
Symbol Parameter Test Conditions Minimum Typical Maximum Units
IIH Input High Current
CLK0, CLK1,
FB_IN VDD = VIN = 3.465V 150 µA
nCLK0, nCLK1,
nFB_IN VDD = VIN = 3.465V 5 µA
IIL Input Low Current
CLK0, CLK1,
FB_IN
VDD = 3.465V,
VIN = 0V -5 µA
nCLK0, nCLK1,
nFB_IN
VDD = 3.465V,
VIN = 0V -150 µA
VPP Peak-to-Peak Voltage; NOTE 1 0.15 1.3 V
VCMR Common Mode Input Voltage; NOTE 1, 2 GND + 0.5 VDD – 0.85 V
Symbol Parameter Test Conditions Minimum Typical Maximum Units
VOD Differential Output Voltage 320 440 550 mV
VOD VOD Magnitude Change 0 50 mV
VOS Offset Voltage 1.05 1.2 1.35 V
VOS VOS Magnitude Change 25 mV
Symbol Parameter Test Conditions Minimum Typical Maximum Units
FIN Input Frequency CLK0/nCLK0,
CLK1/nCLK1
PLL_SEL = 1 31.25 700 µA
PLL_SEL = 0 700 V
ICS8745BYI REVISION D JUNE 11, 2009 7 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
AC Electrical Characteristics
Table 6. AC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = -40°C to 85°C
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions..
NOTE 1: Measured from the differential input crossing point to the differential output crossing point.
NOTE 2: Defined as the time difference between the input reference clock and the averaged feedback input signal across all conditions, when
the PLL is locked and the input reference frequency is stable.
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential
cross points.
NOTE 4: Phase jitter is dependent on the input source used.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 6: Characterized at VCO frequency of 622MHz.
NOTE 7: Measured from the 20% to 80% points. Guaranteed by characterization. Not production tested.
Symbol Parameter Test Conditions Minimum Typical Maximum Units
fMAX Output Frequency 700 MHz
tPD Propagation Delay; NOTE 1 PLL_SEL = 0V, f 700MHz 2.9 3.4 4.0 ns
tsk(Ø) Static Phase Offset; NOTE 2, 5 PLL_SEL = 3.3V -100 25 150 ps
tsk(o) Output Skew; NOTE 3, 5 40 ps
tjit(cc) Cycle-to-Cycle Jitter; NOTE 5, 6 30 ps
tjit(θ) Phase Jitter; NOTE 4, 5, 6 ±52 ps
tLPLL Lock Time 1ms
tR / tFOutput Rise/Fall Time; NOTE 7 20% to 80% 200 700 ps
odc Output Duty Cycle 45 50 55 %
ICS8745BYI REVISION D JUNE 11, 2009 8 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information
3.3V LVDS Output Load AC Test Circuit
Phase Jitter and Static Phase Offset
Cycle-to-Cycle Jitter
Differential Input Level
Output Skew
Output Rise/Fall Time
SCOPE
Qx
nQx
3.3V±5%
POWER SUPPLY
+–
Float GND LVDS
VDDA,
VDDO
VDD,
nCLK[0:1]
CLK[0:1]
nFB_IN
FB_IN
t(Ø)
VOH
VOL
VOH
VOL
tcycle n tcycle n+1
tjit(cc) = |tcycle n – tcycle n+1|
1000 Cycles
Q[0:4]
nQ[0:4]
VDD
nCLK[0:1]
CLK[0:1]
GND
VCMR
Cross Points
VPP
tsk(o)
Qx
nQx
Qy
nQy
20%
80% 80%
20%
tRtF
VOD
Q[0:4]
nQ[0:4]
ICS8745BYI REVISION D JUNE 11, 2009 9 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information, continued
Output Duty Cycle
Offset Voltage Setup
Propagation Delay
Differential Output Voltage Setup
tPW
tPERIOD
tPW
tPERIOD
odc = x 100%
Q[0:4]
nQ[0:4]
out
out
LVDS
DC Input
VOS/ VOS
VDD
nQ[0:4]
Q[0:4]
nCLK[0:1]
CLK[0:1]
tPD
100
out
out
LVDS
DC Input VOD/ VOD
VDD
ICS8745BYI REVISION D JUNE 11, 2009 10 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Application Information
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance,
power supply isolation is required. The ICS8745BI provides separate
power supplies to isolate any high switching noise from the outputs
to the internal PLL. VDD, VDDA and VDDO should be individually
connected to the power supply plane through vias, and 0.01µF
bypass capacitors should be used for each pin. Figure 1 illustrates
this for a generic VDD pin and also shows that VDDA requires that an
additional 10 resistor along with a 10µF bypass capacitor be
connected to the VDDA pin.
Figure 1. Power Supply Filtering
Wiring the Differential Input to Accept Single Ended Levels
Figure 2 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio of
R1 and R2 might need to be adjusted to position the V_REF in the
center of the input voltage swing. For example, if the input clock swing
is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/R1 =
0.609.
Figure 2. Single-Ended Signal Driving Differential Input
VDD
VDDA
3.3V
10
10µF.01µF
.01µF
V_REF
Single Ended Clock Input
VDD
CLKx
nCLKx
R1
1K
C1
0.1u R2
1K
ICS8745BYI REVISION D JUNE 11, 2009 11 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and
other differential signals. Both signals must meet the VPP and VCMR
input requirements. Figures 3A to 3F show interface examples for the
HiPerClockS CLK/nCLK input driven by the most common driver
types. The input interfaces suggested here are examples only.
Please consult with the vendor of the driver component to confirm the
driver termination requirements. For example, in Figure 3A, the input
termination applies for IDT HiPerClockS open emitter LVHSTL
drivers. If you are using an LVHSTL driver from another vendor, use
their termination recommendation.
3A. HiPerClockS CLK/nCLK Input Driven by an IDT
Open Emitter HiPerClockS LVHSTL Driver
Figure 3C. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVPECL Driver
Figure 3E. HiPerClockS CLK/nCLK Input
Driven by a 3.3V HCSL Driver
Figure 3B. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVPECL Driver
Figure 3D. HiPerClockS CLK/nCLK Input
Driven by a 3.3V LVDS Driver
Figure 3F. HiPerClockS CLK/nCLK Input
Driven by a 2.5V SSTL Driver
R1
50
R2
50
1.8V
Zo = 50
Zo = 50
CLK
nCLK
3.3V
LVHSTL
IDT
HiPerClockS
LVHSTL Driver
HiPerClockS
Input
R3
125
R4
125
R1
84
R2
84
3.3V
Zo = 50
Zo = 50
CLK
nCLK
3.3V
3.3V
LVPECL HiPerClockS
Input
HCSL
*R3 33
*R4 33
CLK
nCLK
2.5V 3.3V
Zo = 50
Zo = 50
HiPerClockS
Input
R1
50
R2
50
*Optional – R3 and R4 can be 0
CLK
nCLK
HiPerClockS
Input
LVPECL
3.3V
Zo = 50
Zo = 50
3.3V
R1
50
R2
50
R2
50
3.3V
R1
100
LVDS
CLK
nCLK
3.3V
Receiver
Zo = 50
Zo = 50
CLK
nCLK
HiPerClockS
SSTL
2.5V
Zo = 60
Zo = 60
2.5V
3.3V
R1
120
R2
120
R3
120
R4
120
ICS8745BYI REVISION D JUNE 11, 2009 12 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Recommendations for Unused Input and Output Pins
Inputs:
LVCMOS Control Pins:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional protection.
A 1k resistor can be used.
CLK/nCLK Input
For applications not requiring the use of the differential input, both
CLK and nCLK can be left floating. Though not required, but for
additional protection, a 1k resistor can be tied from CLK to ground.
Outputs:
LVDS Outputs
All unused LVDS output pairs can be either left floating or terminated
with 100 across. If they are left floating, we recommend that there
is no trace attached.
3.3V LVDS Driver Termination
A general LVDS interface is shown in Figure 4. In a 100 differential
transmission line environment, LVDS drivers require a matched load
termination of 100 across near the receiver input. For a multiple
LVDS outputs buffer, if only partial outputs are used, it is
recommended to terminate the unused outputs.
Figure 4. Typical LVDS Driver Termination
3.3V
LVDS Driver
R1
100
+
3.3V 50
50
100 Differential Transmission Line
ICS8745BYI REVISION D JUNE 11, 2009 13 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Schematic Example
The schematic of the ICS8745BI layout example is shown in Figure
5A. The ICS8745BI recommended PCB board layout for this example
is shown in Figure 5B. This layout example is used as a general
guideline. The layout in the actual system will depend on the selected
component types, the density of the components, the density of the
traces, and the stack up of the P.C. board.
Figure 5A. ICS8745BI LVDS Zero Delay Buffer Schematic Example
U3
8745
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
32
31
30
29
28
27
26
25
SEL0
SEL1
CLK0
nCLK0
CLK1
nCLK1
CLK_SEL
MR
VDD
nFB_IN
FB_IN
SEL2
GND
nQ0
Q0
VDDO
nQ1
Q1
GND
nQ2
Q2
VDDO
nQ3
Q3
VDD
PLL_SEL
VDDA
SEL3
VDDO
Q4
nQ4
GND
SP = Space (i.e. not intstalled)
C16
10u
CLK_SEL
C2
0.1uF
VDDO=3.3V
C11
0.01u
RD3
SP
VDD
(U1-9)
VDD=3.3V
SEL[3:0] = 0101,
Divide by 2
RU3
1K
Zo = 50 Ohm
(77.76 MHz)
RU4
1K
RU5
SP
SEL0
RD4
SP
(155.5 MHz)
SEL2
RU6
1K
C4
0.1uF
C1
0.1uF
RU7
SP
3.3V PECL Driver
CLK_SEL
RD2
1K
RD5
1K
VDDO
SEL1
VDDO
(U1-28)
SEL3
R8A
50
R7
10
R9
50
Zo = 50 Ohm
R2
100
Decoupling capacitor located near the power pins
R10
50
SEL3
RU2
SP
RD6
SP
R4
100
VDD
SEL0
(U1-32)
SEL2
C6
0.1uF
RD7
1K
Zo = 50 Ohm
SEL1
3.3V
(U1-16)
PLL_SEL
VDD
VDD
VDDA
(U1-22)
C5
0.1uF
PLL_SEL
Zo = 50 Ohm
LVDS_input
+
-
ICS8745BYI REVISION D JUNE 11, 2009 14 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
The following component footprints are used in this layout example.
All the resistors and capacitors are size 0603.
Power and Grounding
Place the decoupling capacitors as close as possible to the power
pins. If space allows, placement of the decoupling capacitor on the
component side is preferred. This can reduce unwanted inductance
between the decoupling capacitor and the power pin caused by the
via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power and
ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed as
close to the VDDA pin as possible.
Clock Traces and Termination
Poor signal integrity can degrade the system performance or cause
system failure. In synchronous high-speed digital systems, the clock
signal is less tolerant to poor signal integrity than other signals. Any
ringing on the rising or falling edge or excessive ring back can cause
system failure. The shape of the trace and the trace delay might be
restricted by the available space on the board and the component
location. While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
The differential 50 output traces should have the same length.
Avoid sharp angles on the clock trace. Sharp angle turns cause
the characteristic impedance to change on the transmission
lines.
Keep the clock traces on the same layer. Whenever
possible, avoid placing vias on the clock traces.
Placement of vias on the traces can affect the trace
characteristic impedance and hence degrade signal
integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between the clock
trace pair.
The matching termination resistors should be located as close
to the receiver input pins as possible.
Figure 5B. PCB Board Layout for ICS8745BI
C16
GND
U1
C5
50 Ohm
Traces
C2
VDDA
VDDO
VIA
Pin 1
C4
R7 C11
VDD
C6
C1
ICS8745BYI REVISION D JUNE 11, 2009 15 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8745BI.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8745BI is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (128mA + 18mA) = 506mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 3.465V * 62mA = 215mW
Total Power_MAX = 506mW + 215mW = 721mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a moderate air
flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.721W * 42.1°C/W = 115.3°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resitance θJA for 32 Lead LQFP, Forced Convection
θJA vs. Air Flow
Linear Feet per Minute 0200500
Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
ICS8745BYI REVISION D JUNE 11, 2009 16 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Reliability Information
Table 8. θJA vs. Air Flow Table for a 32 Lead LQFP
Transistor Count
The transistor count for ICS8745BI is: 2772
θJA vs. Air Flow
Linear Feet per Minute 0200500
Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
ICS8745BYI REVISION D JUNE 11, 2009 17 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Package Outline and Package Dimensions
Package Outline - Y Suffix for 32 Lead LQFP
Table 9. Package Dimensions for 32 Lead LQFP
Reference Document: JEDEC Publication 95, MS-026
JEDEC Variation: BBC - HD
All Dimensions in Millimeters
Symbol Minimum Nominal Maximum
N32
A1.60
A1 0.05 0.10 0.15
A2 1.35 1.40 1.45
b0.30 0.37 0.45
c0.09 0.20
D & E 9.00 Basic
D1 & E1 7.00 Basic
D2 & E2 5.60 Ref.
e0.80 Basic
L0.45 0.60 0.75
θ
ccc 0.10
ICS8745BYI REVISION D JUNE 11, 2009 18 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Ordering Information
Table 10. Ordering Information
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
Part/Order Number Marking Package Shipping Packaging Temperature
8745BYI ICS8745BYI 32 Lead LQFP Tray -40°C to 85°C
8745BYIT ICS8745BYI 32 Lead LQFP 1000 Tape & Reel -40°C to 85°C
8745BYILF ICS8745BYILF “Lead-Free” 32 Lead LQFP Tray -40°C to 85°C
8745BYILFT ICS8745BYILF “Lead-Free” 32 Lead LQFP 1000 Tape & Reel -40°C to 85°C
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial and industrial applications. Any other applications, such as those requiring high reliability or other extraordinary environmental requirements are not recommended without
additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support
devices or critical medical instruments.
ICS8745BYI REVISION D JUNE 11, 2009 19 ©2009 Integrated Device Technology, Inc.
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
Revision History Sheet
Rev Table Page Description of Change Date
BT4D 5 LVDS DC Characteristics Table - modified VOS 0.90V min. to 1.05V min,
1.15V typical to 1.2V typical, and 1.4V max. to 1.35V max. 3/17/04
C
T6 7
15
AC Characteristics Table - changed tPD max limit from 3.9ns to 4.0ns.
Added Power Considerations section.
Updated format throughout the datasheet.
4/16/07
D
T4C
T6
T10
1
6
7
11
18
Pin Assignment - corrected pin 14 from Q0 to nQ0. Missed error when converted to new
format on April 16, 2007 from March 17, 2004.
Differential DC Characteristics Table - replaced NOTE 1 with new note.
AC Characteristics Table - added thermal note.
Updated Differential Clock Input Interface section.
Ordering Information Table - Part/Order Number - deleted “ICS” prefix.
Updated Header/Footer throughout the document and contact page.
6/4/09
ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT
product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third
party owners.
Copyright 2009. All rights reserved.
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