PMBFJ113,215 - NXP - Product.Network

1. Product profile

1.1 General description

Symmetrical N-channel junction FETs in a SOT23 package.

1.2 Features and benefits

High-speed switching

Interchangeability of drain and source connections

Low RDSon at zero gate voltage (< 30 for PMBFJ111).

1.3 Applications

Analog switches

Choppers

Commutators

Multiplexers

Thin and thick film hybrids.

2. Pinning information

[1] Drain and source are interchangeable.

PMBFJ111; PMBFJ112;

PMBFJ113

N-channel junction FETs

Rev. 4 — 20 September 2011 Product data sheet

SOT23

Table 1. Pinning

Pin Description[1] Simplified outline Symbol

1drain

2source

3gate

sym053

Product data sheet Rev. 4 — 20 September 2011 2 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

3. Ordering information

4. Marking

[1] * = p: Made in Hong Kong

* = t: Made in Malaysia

* = W: Made in China

5. Limiting values

[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.

6. Thermal characteristics

[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.

[2] Mounted on printed circuit board.

Table 2. Orderin g information

Type number Package

Name Description Version

PMBFJ111 - plastic surface mounted package; 3 leads SOT23

PMBFJ112

PMBFJ113

Table 3. Marking

Type number Marking code[1]

PMBFJ111 41*

PMBFJ112 42*

PMBFJ113 47*

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage (DC) - 40 V

VGSO gate-source voltage - 40 V

VGDO gate-drain voltage - 40 V

IGforward gate current (DC) - 50 mA

Ptot total power dissipation Tamb = 25 C[1] -300mW

Tstg storage temperature 65 +150 C

Tjjunction temperature - 150 C

Table 5. Thermal characteris tics

Tj= P (Rth(j-t) +R

th(t-s) +R

th(s-a))+T

amb.

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient [1] 430 K/W

thermal resistance from junction to ambient [2] 500 K/W

Product data sheet Rev. 4 — 20 September 2011 3 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

7. Static characteristics

8. Dynamic characteristics

[1] Test conditions for switching times are as follows:

VDD =10V, V

GS =0VtoV

GSoff (all types);

VGSoff =12 V, RL= 750 (PMBFJ111);

VGSoff =7 V, RL= 1550 (PMBFJ112);

VGSoff =5 V, RL= 3150 (PMBFJ113).

Table 6. Static ch aracteristics

Tj=25



Symbol Parameter Conditions Min Typ Max Unit

IGSS gate-source leakage current VGS =15 V; VDS =0V - - 1nA

IDSS drain-source leakage current

PMBFJ111 VGS =0V; V

DS =15 V 20--mA

PMBFJ112 VGS =0V; V

DS =15 V 5--mA

PMBFJ113 VGS =0V; V

DS =15 V 2--mA

V(BR)GSS gate-source breakdown voltage IG=1A; VDS =0V 40--V

VGSoff gate-source cut-off voltage

PMBFJ111 ID=1 A; VDS =5 V 10 - 3V

PMBFJ112 ID=1 A; VDS =5 V 5- 1V

PMBFJ113 ID=1 A; VDS =5 V 3- 0.5 V

RDSon drain-sourc e on-state resistance

PMBFJ111 VGS =0 V; V

DS = 0.1 V - - 30 

PMBFJ112 VGS =0 V; V

DS = 0.1 V - - 50 

PMBFJ113 VGS =0 V; V

DS = 0.1 V - - 100 

Table 7. Dynamic character istics

Symbol Parameter Conditions Min Typ Max Unit

Ciss input capacit ance VDS =0V; V

GS =10V; f=1MHz -6-pF

VDS =0V; V

GS =0V; f=1MHz; T

amb =25C - 22 28 pF

Crss feedback capacitance - 3 - pF

Switching times; see Figure 2

trrise time [1] -6-ns

ton turn-on time [1] -13-ns

tffall time [1] -15-ns

toff turn-off time [1] -35-ns

Product data sheet Rev. 4 — 20 September 2011 4 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

Fig 1. Switching circuit.

Fig 2. Input and output waveforms.

mbk289

50 Ω

DUT

10 μF

1 μF

10 nF

50 Ω

SAMPLING

SCOPE

50 Ω

mbk294

−V

GS off

off

= 0 V

10%

90%

10%

Product data sheet Rev. 4 — 20 September 2011 5 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

9. Package outline

Fig 3. Package outline.

UNIT A1

max. bpcDE e1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

04-11-04

06-03-16

IEC JEDEC JEITA

mm 0.1 0.48

0.38 0.15

0.09 3.0

2.8 1.4

1.2 0.95

1.9 2.5

2.1 0.55

0.45 0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

vMA

0 1 2 mm

scale

1.1

0.9

Plastic surface-mounted package; 3 leads SOT23

Product data sheet Rev. 4 — 20 September 2011 6 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

10. Revision history

Table 8. Revision history

Document ID Release date Data sheet statu s Change notice Supersedes

PMBFJ111_112_113 v.4 20110920 Product data sheet - PMBFJ111_112_113 v.3

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Package outline drawings have been updated to the latest version.

PMBFJ111_112_113 v.3

(9397 750 13402) 20040804 Product data sheet - PMBFJ111_112_113_CNV v.2

PMBFJ111_112_113_CNV v.2 19971201 Product specification - -

Product data sheet Rev. 4 — 20 September 2011 7 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) d escribed in th is docume nt may have changed since this docume nt was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative li ability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or envi ronmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expr essly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 4 — 20 September 2011 8 of 9

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product cl aims resulting fr om customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

11.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PMBFJ111; PMBFJ112; PMBFJ113

N-channel junction FETs

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 September 2011

Document identifier: PMBFJ111_112_113

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 3

8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 3

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9