TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Applications * Phased Array Antenna Systems * Satellite Communication Systems * Electronic Warfare Product Features * * * * * * * * * * * Functional Block Diagram Frequency Range: 6 to 18 GHz 6-Bit Digital Phase Shifter 360 Coverage, LSB = 5.625 RMS Phase Error: 5 RMS Amplitude Error: 0.55 dB Insertion Loss: <10 dB Return Loss: >12 dB Input P1dB: >25 dBm Input IP3: >41 dBm Control Voltage: -5/0 V Chip Dimensions: 3.15 x 3.15 x 0.10 mm General Description Pad Configuration TriQuint's TGP2107 is a 6-bit, digital phase shifter fabricated on TriQuint's high performance 0.15m GaAs pHEMT process. It operates over 6 to 18 GHz and provides 360 of phase coverage with a LSB of 5.625. It also achieves a low RMS phase error of 5 with 8 dB of insertion loss over all states. The TGP2107 uses negative switch logic, eliminating the need for a reference voltage. That, along with low insertion and a high degree of resolution makes the TGP2107 ideally suited for a variety of wideband phased array applications, including commercial and military radars, satellite-based communication systems and electronic warfare. The device is lead-free and RoHS compliant. Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint Pad No. Symbol 1 2 3, 15 4, 14 5, 13 6, 12 7 8 9 10 11 RF In 90Bit 5N Bit 5P Bit 11N Bit 11P Bit 180P Bit 180N Bit 45 Bit 22 Bit RF Out Ordering Information Part ECCN Description TGP2107 EAR99 6-Bit Digital Phase Shifter (-Vc) - 1 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Value Control Votage (5N, 5P, 11N, 11P, 22, 45, 90, 180N, 180P) -5/0 V Value Control Voltage Control Current Power Dissipation Input Power, CW, 50 , 85C Channel tremperature 6V -15 to +5 mA 0.9 W 30 dBm 200C Mounting Temperature (30 Seconds) Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. 320C Storage Temperature -55 to 150C Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Electrical Specifications Test conditions unless otherwise noted: 25C. Control Voltage (5N, 5P, 11N, 11P, 22, 45, 90, 180N, 180P) = -5/0 V; See Bias Truth Table. Parameter Conditions Min Operational Frequency Range Insertion Loss Input Return Loss Output Return Loss RMS Phase Error RFM Amplitude Error Input P1dB Typical Max Units 18 6 - 10 >12 >12 5 0.55 >25 GHz dB dB dB deg dB dBm >41 dBm 0.008 dB/C 6 Tone spacing = 10 MHz Pin/Tone = 15 dBm Input IP3 Insertion Loss Temperature Coefficient Bias Truth Table Logic "0" = -5 V, Logic "1" = 0 V Phase Shifter 0 (Reference) 5 11 22 45 90 180 355 5P 5N 11P 11N 22 45 90 180P 180N 0 1 0 0 0 0 0 1 1 0 1 1 1 1 1 0 0 1 0 0 0 0 1 1 1 0 1 1 1 1 0 0 0 0 1 0 0 0 1 0 0 0 0 1 0 0 1 0 0 0 0 0 1 0 1 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint 0 - 2 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Thermal and Reliability Information Parameter Test Conditions Value Units PDISS = 0.09 W, TBASEPLATE = 85C 22 87 3.8E+9 C/W C Hrs (1) Thermal Resistance (JC) Channel Temperature (TCH) Median Lifetime (TM) Notes: 1. Thermal resistance measured to back of carrier plate. MMIC mounted on 40 mils thick CuMo carrier using 1.5 mil 80/20 AuSn. Median Lifetime Median Lifetime vs. Channel Temperature Median Lifetime, TM (Hours) 1E+15 1E+14 1E+13 1E+12 1E+11 1E+10 1E+09 1E+08 1E+07 1E+06 1E+05 1E+04 1E+03 FET5 25 50 75 100 125 150 175 200 Channel Temperature, TCH (C) Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint - 3 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Typical Performance Average Insertion Loss vs. Temperature Insertion Loss vs. Frequency All phase states -4 -4 -6 -6 -8 -8 S21 (dB) S21 (dB) All phase states -10 -10 -40C -12 -12 +25C +85C -14 -14 4 6 8 10 12 14 Frequency (GHz) 16 18 20 4 Average IRL vs. Temperature 8 10 12 14 Frequency (GHz) 16 18 20 Input Return Loss vs. Frequency All phase states All phase states, 25C 0 0 -6 -6 -12 -12 S11 (dB) S11 (dB) 6 -18 -18 -40C -24 -24 +25C +85C -30 -30 4 6 8 10 12 14 Frequency (GHz) 16 18 20 4 Average ORL vs. Temperature 8 10 12 14 16 Frequency (GHz) 18 20 Output Return Loss vs. Frequency All phase states All phase states, 25C 0 0 -6 -6 S22 (dB) S22 (dB) 6 -12 -18 -12 -18 -40C -24 -24 +25C +85C -30 -30 4 6 8 10 12 14 Frequency (GHz) Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint 16 18 20 4 - 4 of 10 - 6 8 10 12 14 16 Frequency (GHz) 18 20 Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Typical Performance Phase Error vs. State Amplitude Error (relative to mean) 25C 25C 30 3.0 20 2.5 Amplitude Error (dB) Phase Error (degrees) 6 GHz 10 0 -10 -20 6 GHz -30 0 45 9 GHz 90 135 12 GHz 180 15 GHz 225 270 18 GHz 315 9 GHz 18 GHz 1.5 1.0 0.5 0.0 360 0 45 90 135 180 225 270 315 360 State (degrees) RMS Phase Error vs. Frequency RMS Amplitude Error vs. Frequency All phase states, 25C All phase states, 25C 2.0 RMS Amplitude Error (dB) 10 RMS Phase Error (degrees) 15 GHz 2.0 State (degrees) 8 6 4 2 0 1.5 1.0 0.5 0.0 4 6 8 10 12 14 16 18 20 4 6 8 10 12 14 16 Frequency (GHz) Frequency (GHz) Relative Phase Shift vs. Frequency Phase Error vs. Frequency Major States, 25C 18 20 18 20 Major States, 25C 405 30 360 Phase Error (degrees) Relative Phase (degrees) 12 GHz 315 270 225 180 135 90 20 10 0 -10 -20 45 0 -30 4 6 8 10 12 14 16 18 20 4 Frequency (GHz) Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint 6 8 10 12 14 16 Frequency (GHz) - 5 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Typical Performance Input P1dB vs. Frequency Input IP3 vs. Frequency Major phase states, 25C 40 Major phase states, 25C 60 Pin = 30 dBm was max power level tested Pin/Tone = 15dBm, Tone Spacing = 10 MHz 55 Input IP3 (dBm) Input P1dB (dBm) 35 30 25 20 15 50 45 40 35 10 30 6 8 10 12 14 Frequency (GHz) 16 18 6 8 10 12 14 Frequency (GHz) 16 18 Input IP3 vs. Frequency vs. Temperature REF States 54 Pin/Tone = 15 dBm, Tone Spacing = 10 MHz Input IP3 (dBm) 52 50 48 46 -40C 44 +25C 42 +85C 40 6 Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint 8 10 12 14 Frequency (GHz) - 6 of 10 - 16 18 Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Mechanican Information and Bond Pad Description 2 3 4 5 6 7 8 9 10 11 1 15 14 13 12 Unit: millimeters Thickness: 0.10 Die x, y size tolerance: 0.050 Chip edge to bond pad dimensions are shown to center of pad Ground is backside of die Bond Pad Symbol Description 1 2 3, 12 4, 13 5, 14 6, 15 7 8 9 10 11 RF In 90 5N 5P 11N 11P 180P 180N 45 22 RF Out Input; matched to 50 ; DC de-coupled 90 Bit 5N Bit; use either pad 3 or 12 5P Bit; use either pad 4 or 13 11N Bit; use either pad 5 or 14 11P Bit; use either pad 6 or 15 180P Bit 180N Bit 45 Bit 22 Bit Output; matched to 50 ; DC de-coupled Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint - 7 of 10 - Pad Size 0.200 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.100 x 0.100 0.200 x 0.100 Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Assembly Drawing 90 180N 5P 5N 180P 45 RF In RF Out 11N - 22 11P The spacing between MMIC and TFN (at RF In or RF Out) is <5 mils typical. RF connections: Bond two 1 mil diameter, <20 mils length gold bond wires at RF In and RF Out for optimum RF performance. Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint - 8 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Assembly Notes Component placement and adhesive attachment assembly notes: * Vacuum pencils and/or vacuum collets are the preferred method of pick up. * Air bridges must be avoided during placement. * The force impact is critical during auto placement. * Solder or Organic Adhesive attachment can be used for TGL2205. * Curing should be done in a convection oven; proper exhaust is a safety concern. Solder attachment reflow process assembly notes: * Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3 to 4 minutes, maximum. * An alloy station or conveyor furnace with reducing atmosphere should be used. * Do not use any kind of flux. * Coefficient of thermal expansion matching is critical for long-term reliability. * Devices must be stored in a dry nitrogen atmosphere. Organic adhesive attachment assembly notes: * The organics such as epoxy or polyimide can be used. * Epoxies cure at temperatures of 100 to 200C. Interconnect process assembly notes: * Thermosonic ball bonding is the preferred interconnect technique. * Force, time, and ultrasonics are critical parameters. * Aluminum wire should not be used. * Devices with small pad sizes should be bonded with 0.0007-inch wire. Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint - 9 of 10 - Disclaimer: Subject to change without notice www.triquint.com TGP2107 6 to 18 GHz 6-Bit Digital Phase Shifter (-Vc) Product Compliance Information ESD Sensitivity Ratings Solderability Caution! ESD-Sensitive Device This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: * Lead Free * Halogen Free (Chlorine, Bromine) * Antimony Free * TBBP-A (C15H12Br402) Free * PFOS Free * SVHC Free ESD Rating: TBD Value: TBD Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ECCN US Department of Commerce: EAR99 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@triquint.com Tel: Fax: For technical questions and application information: +1.972.994.8465 +1.972.994.8504 Email: info-products@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Preliminary Datasheet: Rev - 09-23-13 (c) 2013 TriQuint - 10 of 10 - Disclaimer: Subject to change without notice www.triquint.com Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: TriQuint: TGP2107