Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
Features
Low-voltage and Standard-voltage Operation
2.7V (VCC = 2.7V to 5.5V)
1.8V (VCC = 1.8V to 5.5V)
Low-power Devices (ISB = 6μA at 5.5V) Available
Internally Organized 8192 x 8
2-Wire Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bi-directional Data Transfer Protocol
400kHz Clock Rate
Write Protect Pin for Hardware Data Protection
32-byte Page Write Mode (Partial Page Writes Allowed)
Self-Timed Write Cycle (5ms max)
High Reliability
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Lead-free/Halogen-free Devices Available
8-lead JEDEC SOIC and TSSOP Packages
Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers
Description
The Atmel® AT24C64B provides 65,536 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 8,192 words of 8 bits
each. The device’s cascadable feature allows up to eight devices to share a
common 2-Wire bus. The device is optimized for use in many industrial and
commercial applications where low-power and low-voltage operation are
essential. The AT24C64B is available in space saving 8-lead JEDEC SOIC and
8-lead TSSOP packages and is accessed via a 2-Wire serial interface. In addition,
the entire family is available in 2.7V (2.7 to 5.5V) and 1.8V (1.8 to 5.5V) versions.
AT24C64B
I2C-Compatible (2-Wire) Serial EEPROM
64K (8192 x 8)
DATASHEET
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
2
1. Pin Configurations
Table 1-1. Pin Configurations
2. Absolute Maximum Ratings*
Pin Name Function
A0 – A2Address Inputs
GND Ground
SCL Serial Clock Input
SDA Serial Data
WP Write Protect
VCC Power Supply
Operating Temperature . . . . . . . . . . . . .-55 to +125C
Storage Temperature . . . . . . . . . . . . . . .-65 to +150°C
Voltage on Any Pin
with Respect to Ground . . . . . . . . . . . . . . . -1V to +7V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . 5mA
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
1
2
3
4
A0
A1
A2
GND
8
7
6
5
VCC
WP
SCL
SDA
8-lead SOIC
(Top View)
8-lead TSSOP
(Top View)
1
2
3
4
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SDA
3
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
3. Block Diagram
4. Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open collector devices.
Device Addresses (A2, A1, A0): The A2, A1, and A0 pins are Device Address inputs which are hardwired or left
not connected for hardware compatibility with other AT24Cxxxx devices. When the pins are hardwired, as many
as eight 64Kb devices may be addressed on a single bus system (see Section 7., “Device Addressing”). If the
pins are left floating, the A2, A1, and A0 pins will be internally pulled down to GND if the capacitive coupling to the
circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the address pins to GND.
Write Protect (WP): The Write Protect input, when connected to GND, allows normal Write operations. When
WP is connected high to VCC, all Write operations to the upper quandrant (16Kb) of memory are inhibited. If the
pin is left floating, the WP pin will be internally pulled down to GND if the capacitive coupling to the circuit board
VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the pin to GND.
Start
Stop
Logic
VCC
GND
WP
SCL
SDA
A2
A1
A0
Serial
Control
Logic
EN H.V. Pump/Timing
EEPROM
Data Recovery
Serial MUX
X DEC
DOUT/ACK
Logic
COMP
LOAD INC
Data Word
ADDR/Counter
Y DEC
R/W
DOUT
DIN
LOAD
Device
Address
Comparator
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
4
5. Memory Organization
AT24C64B, 64K Serial EEPROM: The 64K is internally organized as 256 pages of 32 bytes each. Random
word addressing requires a 13 bit data word address.
5.1 Pin Capacitance (1)
Note: 1. This parameter is characterized and is not 100% tested.
5.2 DC Characteristics
Note: 1. VIL min and VIH max are reference only and are not tested.
Applicable over recommended operating range from TA = 25°C, f = 1MHz, VCC = +5.0V.
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8pF VI/O =0V
CIN Input Capacitance (A0, A1, A2, SCL) 6pF VIN =0V
Applicable over recommended operating range from: TAI = -40 to +85°C, VCC = +1.8V to +5.5V (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Units
VCC1 Supply Voltage 1.8 5.5 V
VCC2 Supply Voltage 2.7 5.5 V
VCC3 Supply Voltage 4.5 5.5 V
ICC1 Supply Current VCC = 5.0V Read at 400kHz 0.4 1.0 mA
ICC2 Supply Current VCC = 5.0V Write at 400kHz 2.0 3.0 mA
ISB1
Standby Current
(1.8V Option) VCC = 1.8V VIN =V
CC or VSS 1.0 A
ISB2
Standby Current
(2.7V Option) VCC = 2.7V VIN =V
CC or VSS 2.0 A
ISB3
Standby Current
(5.0V Option) VCC = 4.5 - 5.5V VIN =V
CC or VSS 6.0 A
ILI Input Leakage Current VIN =V
CC or VSS 0.10 3.0 A
ILO Output Leakage Current VOUT =V
CC or VSS 0.05 3.0 A
VIL Input Low Level(1) -0.6 VCC x0.3 V
VIH Input High Level(1) VCC x0.7 VCC +0.5 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.10mA 0.4 V
VOL1 Output Low Level VCC = 1.8V IOL = 0.15mA 0.2 V
5
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
5.3 AC Characteristics
Notes: 1. This parameter is characterized and is not 100% tested (TA = 25C).
2. AC measurement conditions:
RL (connects to VCC): 1.3k (2.5V, 5.5V), 10k (1.7V)
Input pulse voltages: 0.3VCC to 0.7VCC
Input rise and fall times: 50ns
Input and output timing reference voltages: 0.5 x VCC
Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = +1.8V to +5.5V, CL = 1 TTL
Gate and 100pF (unless otherwise noted). Test conditions are listed in Note 2.
Symbol Parameter
1.8V to 3.6V 5V
UnitsMin Max Min Max
fSCL Clock Frequency, SCL 400 400 kHz
tLOW Clock Pulse Width Low 1.3 1.2 μs
tHIGH Clock Pulse Width High 0.6 0.6 μs
tINoise Suppression Time(1) 100 50 ns
tAA Clock Low to Data Out Valid 0.2 0.9 0.1 0.9 μs
tBUF Time the bus must be free before a new transmission can start(1) 1.3 1.2 μs
tHD.STA Start Hold Time 0.6 0.6 μs
tSU.STA Start Set-up Time 0.6 0.6 μs
tHD.DAT Data In Hold Time 0 0 μs
tSU.DAT Data In Set-up Time 100 100 ns
tRInputs Rise Time(1) 0.3 0.3 μs
tFInputs Fall Time(1) 300 300 ns
tSU.STO Stop Set-up Time 0.6 0.6 μs
tDH Data Out Hold Time 200 50 ns
tWR Write Cycle Time 5 5 ms
Endurance(1) 25C, Page Mode, 5.0V 1,000,000 Write
Cycles
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
6
6. Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop condition as defined below.
Figure 6-1. Data Validity
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the
Stop command will place the EEPROM in a standby power mode.
Figure 6-2. Start and Stop Definition
SDA
SCL
Data
Change
Data Stable Data Stable
SDA
SCL
Start Stop
7
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word.
Figure 6-3. Output Acknowledge
Standby Mode: The AT24C64B features a low-power standby mode which is enabled:
Upon power-up,
After the receipt of the Stop bit, and
Completion of any internal operations.
Memory Reset: After an interruption in protocol, power loss or system reset, any 2-Wire part can be reset by
following these steps:
1. Clock up to nine cycles,
2. Look for SDA high in each cycle while SCL is high,
3. Create a Start condition as SDA is high.
The device is ready for the next communication after the above steps have been completed.
Figure 6-4. Software Reset
SCL
Data In
Data Out
Start Acknowledge
9
8
1
SCL
SDA
9
8321
Start
Bit
Start
Bit
Stop
Bit
Dummy Clock Cycles
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
8
Figure 6-5. Bus Timing — SCL: Serial Clock, SDA: Serial Data I/O
Figure 6-6. Write Cycle Timing — SCL: Serial Clock, SDA: Serial Data I/O
Note: 1. The write cycle time tWR is the time from a valid Stop condition of a Write Sequence to the end of the internal
clear/write cycle.
SCL
SDA In
SDA Out
tF
tHIGH
tLOW tLOW
tR
tAA tDH tBUF
tSU.STO
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
SCL
SDA
tWR
(1)
Stop
Condition
Start
Condition
WORDn
ACK
8th bit
9
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
7. Device Addressing
The 64Kb EEPROM requires an 8-bit device address word following a Start condition to enable the device for a
Read or Write operation. The device address word consists of a mandatory one, zero sequence for the first four
most significant bits as shown below. This is common to all 2-Wire EEPROM devices.
Figure 7-1. Device Address
The 64Kb uses the three Device Address bits A2, A1, and A0 to allow as many as eight devices on the same
bus. These bits must compare to their corresponding hardwired input pins. The A2, A1, and A0 pins use an
internal proprietary circuit that biases them to a Logic Low condition if the pins are allowed to float.
The eighth bit of the Device Address is the Read/Write operation select bit. A Read operation is initiated if this
bit is high, and a Write operation is initiated if this bit is low.
Upon a compare of the Device Address, the EEPROM will output a zero. If a compare is not made, the device
will return to standby state.
Noise Protection: Special internal circuitry placed on the SDA and SCL pins prevent small noise spikes from
activating the device. A low-VCC detector resets the device to prevent data corruption in a noisy environment.
Data Security: The AT24C64B has a hardware data protection scheme which allows the user to write protect
the upper quadrant (16Kb) of memory when the WP pin is at VCC.
1 0 1 0 A2 A1 A0 R/W
MSB LSB
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
10
8. Write Operations
Byte Write: A Write operation requires two 8-bit data word addresses following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, i.e. microcontroller, must terminate the write sequence with a Stop condition. At this time, the
EEPROM enters an internally-timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during
this write cycle and the EEPROM will not respond until the write is complete.
Figure 8-1. Byte Write
Note: * = Don’t Care bits
Page Write: The 64K EEPROM is capable of 32-byte Page Writes.
A Page Write is initiated the same way as a Byte Write, but the microcontroller does not send a Stop condition
after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word,
the microcontroller can transmit up to 31 more data words. The EEPROM will respond with a zero after each
data word received. The microcontroller must terminate the Page Write sequence with a Stop condition.
Figure 8-2. Page Write
Note: * = Don’t Care bits
The data word address’ lower five bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the
same page. If more than 32 data words are transmitted to the EEPROM, the data word address will roll-over
and the previous data will be overwritten.
Acknowledge Polling: Once the internally-timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a Start condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero, allowing the Read or Write Sequence to continue.
S
T
A
R
T
W
R
I
T
E
S
T
O
P
Device
Address
First
Word Address
Second
Word Address Data
SDA Line
M
S
B
M
S
B
A
C
K
L
S
B
L
S
B
R
/
W
A
C
K
A
C
K
A
C
K
SDA Line
S
T
A
R
T
W
R
I
T
E
Device
Address
First
Word Address (n)
Second
Word Address (n) Data (n) Data (n + x)
M
S
B
A
C
K
L
S
B
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
11
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
9. Read Operations
Read operations are initiated the same way as Write operations with the exception the Read/Write Select bit in
the device address word is set to one. There are three read operations:
Current Address Read
Random Address Read
Sequential Read
Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the device power is maintained. The address roll-over during Read is from the last byte of the last memory page
to the first byte of the first page. The address roll-over during Write is from the last byte of the current page to
the first byte of the same page.
Once the Device Address with the Read/Write Select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
input zero but does generate a following Stop condition.
Figure 9-1. Current Address Read
Random Read: A Random Read requires a dummy Byte Write sequence to load in the data word address.
Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start condition. The microcontroller now initiates a Current Address
Read by sending a Device Address with the Read/Write Select bit high. The EEPROM acknowledges the
Device Address and serially clocks out the data word. The microcontroller does not respond with a zero but
does generate a following Stop condition.
Figure 9-2. Random Read
Note: 1. * = Don’t Care bits
SDA Line
S
T
A
R
T
Device
Address
R
E
A
D
S
T
O
P
M
S
B
A
C
K
L
S
B
R
/
W
N
O
A
C
K
Data
SDA Line
S
T
A
R
T
S
T
A
R
T
W
R
I
T
E
Device
Address
Device
Address
1st, 2nd Word
Address (n)
R
E
A
D
S
T
O
P
M
S
B
L
S
B
A
C
K
R
/
W
N
O
A
C
K
Data (n)
Dummy Write
A
C
K
A
C
K
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
12
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address
Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM
receives an acknowledge, it will continue to increment the data word address and serially clock out sequential
data words. When the memory address limit is reached, the data word address will roll-over and the Sequential
Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond
with a zero but does generate a following Stop condition.
Figure 9-3. Sequential Read
SDA Line
Device
Address
R
E
A
D
A
C
K
A
C
K
A
C
K
S
T
O
P
A
C
K
R
/
W
N
O
A
C
K
Data (n) Data (n + 1) Data (n + 2) Data (n + x)
13
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
10. Ordering Code Detail
AT24C64BN-10SU-2.7
Atmel Designator
Product Family
Device Density
Device Revision
Package Variation
Operating Voltage
Package Option
Speed Type
64 = 64 kilobit
(Package Type Dependant)
N = 0.150” with SOIC
24C = Standard I2C Serial
EEPROM
1.8 = 1.8V to 5.5V
2.7 = 2.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
U = Green, Lead-free/Halogen-free
Industrial Temperature Range
(-40°C to +85°C)
11 = 11mil Wafer Thickness
S = JEDEC SOIC
T = TSSOP
W = Wafer Unsawn
10 = Default Value
Note: This field is not used for
Serial EEPROM products.
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
14
11. Part Markings
DRAWING NO. REV. TITLE
24C64BSM A
1/31/14
24C64BSM, AT24C64B Package Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
SU%% D
24C64BN
ATMELYWW
8-lead SOIC 8-lead TSSOP
AT64B
U% D
Note 2: Package drawings are not to scale
Note 1: designates pin 1
AT24C64B: Package Marking Information
Date Codes Voltages
Y = Year M = Month WW = Work Week of Assembly %% = Minimum Voltage
9: 2009 3: 2013 A: January 02: Week 2 18 or 1: 1.8V min
0: 2010 4: 2014 B: February 04: Week 4 27 or 3: 2.7V min
1: 2011 5: 2015 ... ...
2: 2012 6: 2016 L: December 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number U: Industrial/Matte Tin/SnAguCu
Trace Code Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel
Example: AA, AB.... YZ, ZZ ATM: Atmel
ATML: Atmel
Note 3: Back side marking will include Assembly Location and lot Number
Note 4: Back side marking will include Date Code, Assembly Location and Lot Number
(3) (4)
15
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
12. Ordering Information
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, see Section 5.2, “DC Characteristics” and Section 5.3, “AC
Characteristics”.
2. U = Green Package and RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon
request. Please contact Serial Marketing.
Ordering Code Lead Finish Package Voltage Operation Range
AT24C64BN-10SU-2.7(2)
Lead-free/Halogen-free
8S1
1.8V to 5.5V Industrial Temperature
(-40C to 85C)
AT24C64BN-10SU-1.8(2)
AT24C64B-10TU-2.7(2)
8X
AT24C64B-10TU-1.8(2)
AT24C64B-W1.8-11(3) — Die Sale
Package Type
8S1 8-lead 0.150” wide body, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X 8-lead 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
16
13. Packaging Information
13.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC) SWB
17
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
13.2 8X — 8-lead TSSOP
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 0.25 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
packagedrawings@atmel.com
8X E
2/27/14
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1
AT24C64B [DATASHEET]
Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014
18
14. Revision History
Doc. Rev. Date Comments
3350F 05/2014 Add ordering code detail and part markings. Update the 8X package drawing, template,
logos, and disclaimer page. (No change in functional specification.)
3350E 09/2007 Update template; implemented revision history.
X
XXX
XX
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© 2014 Atmel Corporation. / Rev.: Atmel-3350F-SEEPROM-AT24C64B-Datasheet_052014.
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Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are
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