SCHOTTKY BARRIER DIODE 3.3A/40V NSQO3A04 FLAT PAK FEATURES Surface Mounting Device 83(327) 2 31 091) Low Foward Voltage Drop a 13 075) ax rea Low Power Loss, High Effciency ho bares +f 001 High Surge Capability l | a = 20 Volts thru 100 Volts Types Available | bh Packaged in 16mm Tape and Reel | ~ naa a Not Rolling During Assembly | ih 35t 138) Th 5.059) 058), Tr 088) 053) 051 035) oo 035; 6 Bf a Dimensions in mm(Inches) Approx. Net Weight : 0.16 Grams MAXIMUM RATINGS : TYPE . Voltage Rating Symbo NSQ03A04 Unit Repetitive Peak Reverse Voltage VRRM 40 Non- Repetitive Peak Reverse Voltage VRSM 40 Vv DC Reverse Voltage VR 40 Electrical Rating Symbol Condition Rating Unit Average Rectified Output Current Io 180 rectangular wave conduction Tg *=87C 3.3 A (resisitive load) 180 sinusoidal wave conduction Tg *=100C 3.0 Peak One cycle Foward . we h Surge Current IpsM | SOHz half sine wave, non repetitive 80 A Operating Junction ; _ Temperature Range Tiw 40 to 125 Storage Temperature _ Range Tstg 40 to 125 ELECTRICAL & THERMAL CHARACTERISTICS Characteristics Symbol Test Condition Max. Unit Peak Foward Voltage ** Vem | l pwe3a, Tj=25C 0.525 Vv DC Reverse Current IR |VrR=VRRM = Tj=25C 2.0 mA Peak Reverse Current ** IRM | VRM=VRRM: Tj=100C 20 mA Thermal Resistance Rth(j- g ) | Junction to Lead 130 | "C/A *T g = Lead Temperature **Pulse Test :10ms Sine Wave Single Pulse (FUP Nhon inter Electronics Corporation 1394NSQ03A04 AVERAGE REVERSE POWER DISSIPATION (W) INSTANTANEUUS FORWARD CURRENT (A) SURGE FORWARD CURRENT (A) FIG 1-FORWARD VOLTAGE VS FORWARD CURRENT SINE 02 4 06 08 T INSTANTANEQUS FORWARD VOLTAGE I'v) FIG 4-AVERAGE REVERSE POWER DISSIPATION vt | Or L360 60 Lf L_[fs 02 NY L~ LL REVERSE VOLTAGE \V} i ir | 180 ry) NS oo G 0 26 30 a FIG.7- SURGE CURRENT RATINGS NONREPETITIVE NO LOAD CONDITION Ts =40 bod O15 2 002 | G2 PULSE DURATION 15) AVERAGE FORWARD POWER DISSIPATION (Wy AVERAGE FORWARD CURRENT (A) JUNCTION CAPACITANCE (pF) FIG 2- AVERAGE FORWARD POWER OSSIPSATION he 4 AVERAGE FORWARD CURRENT 1A: FIG 5- AVERAGE FORWARD CURRENT VS AMBIENT TEMPERATURE 35 I J ] MOUNTED ON CERAMIC SUBSTRATE SOLDERING LAND 2X3 | 5mm) oc | Ng