MAL203035159E3 - VISHAY - Product.Network

1. General description

NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support

industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and

advanced privacy-protection modes.

Very high chip sensitivity (18 dBm) enables longer read ranges with simple, single-port

antenna designs. When connected to a power supply, the READ as well as the WRITE

range can be boosted to a sensitivity of 27 dBm. In fashion and retail the UCODE G2iL

series improve read rates and provide for theft deterrence. For consumer electronics the

UCODE G2iL series is suited for device configuration, activation, production control, and

PCB tagging. In authentication applications the transponders can be used to protect

brands and guard against counterfeiting. They can also be used to tag containers,

electronic vehicles, airline baggage, and more.

In addition to the EPC specifications the G2iL offers an integrated Pro du ct Status Flag

(PSF) feature and read protection of the memory content.

On top of the G2iL features the G2iL+ offers an integrated tag tamper alar m, RF field

detection, digital switch, external supply mode, read range reduction and data transfer

mode.

2. Features and benefits

2.1 Key features

UHF RFID Gen2 tag chip according EPCglobal v1.2.0 with 128 bit EPC memory

Memory read protection

Integrated Product Status Flag (PSF)

Tag tamper alar m

RF field detection

Digital switch

Data transfer mode

Real Read Range Reduction (Privacy Mode)

External supply mode where both the READ & WRITE range are boosted to -27dBm

2.1.1 Memory

128-bit of EPC memory

64-bit Tag IDent ifie r (T ID) inclu din g 32 -bit factory locked unique serial number

32-bit kill password to permanently disable the tag

32-bit access password to allow a transition into the secured state

SL3S1203_1213

UCODE G2iL and G2iL+

Rev. 4.4 — 17 March 2014

178844 Product data sheet

COMPANY PUBLIC

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 2 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

Data retention: 20 years

Broad international operating frequency: from 840 MHz to 960 MHz

Long read/write ranges due to extremely low power design

Reliable operation of multiple tags due to advanced anti-collision

READ protection

WRITE Lock

Wide specified temp er at ur e ra ng e : 40 C up to +85 C

2.2 Key benefits

2.2.1 End user benefit

Prevention of unauthorized memory acce ss thr o ug h re ad pro te ction

Indication of tag tampering attempt by use of the tag tamper alarm feature

Electronic device configuration and / or activa tion by the u se of the digita l switch / dat a

transfer mode

Theft deterrence supported by the PSF feature (PSF alarm or EPC code )

Small label sizes, long read ranges due to high chip sensitivity

Product identification thro ugh unalterable ex tended TID range, including a 32-bit serial

number

Reliable operation in dense reader and noisy environments through high interference

suppression

2.2.2 Antenna design benefits

High sensitivity enables small and cost efficient antenna designs

Low Q-Value eases broad band antenna design for global usage

2.2.3 Label manufacturer benefit

Consistent performance on different materials due to low Q-factor

Ease of assembly and high assembly yields through large chip input capacitance

Fast first WRITE of the EPC memory for fast label initialization

2.3 Custom commands

PSF Alarm

Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag

(Electronic Article Surveillance) tag without the need for a back-end data base.

Read Protect

Protects all memory content including CRC16 from unauthorized reading.

ChangeConfig

Configures the addition al features of the chip li ke external supp ly mode, t amper alarm,

digital switch, read range reduction or data transfer.

The UCODE G2iL is equipped with a number of additional features and custom

commands. Nevertheless, the chip is designed in a way standard EPCglobal

READ/WRITE/ACCESS commands can be used to operate the features. No custom

commands are needed to take advantage of all the features in case of unlocked EPC

memory.

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

3. Applications

3.1 Markets

Fashion (Apparel and footwear)

Retail

Electronics

Fast Moving Consumer Goods

Asset management

Electronic Vehicle Identification

3.2 Applications

Supply chain management

Item level tagging

Pallet and case tracking

Container identification

Product authentication

PCB tagging

Cost efficient, low level seals

Wireless firmware download

Wireless product act iva tion

Outside above mentioned applications, please contact NXP Semiconductors for support.

4. Ordering information

5. Marking

Table 1. Ordering information

Type number Package

Name IC type Description Version

SL3S1203FUF Wafer G2iL bumped die on sawn 8” 75 m wafer not applicable

SL3S1213FUF Wafer G2iL+ bumped die on sawn 8” 75 m wafer not applicable

SL3S1203FUD/BG Wafer G2iL bumped die on sawn 8” 120 m wafer,

7 m Polyimide spacer not applicable

SL3S1213FUD/BG Wafer G2iL+ bumped die on sawn 8” 120 m wafer,

7 m Polyimide spacer not applicable

SL3S1203FTB0 XSON6 G2iL plastic extremely thin small outline package;

no leads; 6 terminals; body 1  1.45  0.5 mm SOT886F1

Table 2. Marking codes

Type number Marking code Comment Version

SL3S1203FTB0 UN UCODE G2iL SOT886

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

6. Block diagram

The SL3S12x3 IC consists of three major blocks:

- Analog Interface

- Digital Control

- EEPROM

The analog part provides stab le supply voltage and demodulates data received from the

reader for being processed by the digital part. Further, the modulation transistor of the

analog part transmits data back to the reader.

The digital section includes the state machines, processes the protocol and handles

communication with the EEPROM, which contains the EPC and the user data.

Fig 1. Block diagram of G2iL IC

001aam226

MOD

DEMOD

VREG

VDD

data

out

R/W

ANALOG

RF INTERFACE

PAD

RECT

DIGITAL CONTROL

ANTENNA

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

I/O CONTROL

I/O

CONTROL

EEPROM

MEMORY

SEQUENCER

CHARGE PUMP

PAD

OUT

PAD

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

7. Pinning information

7.1 Pin description

Fig 2. Pinning bare die Fig 3. Pin configuration for SOT886

001aam529

VDD

OUT RFN

RFPNXP trademark

SL3S12x3FTB0

n.c.

001aan103

RFP

RFN

n.c.

VDD

OUT

Transparent top view

Table 3. Pin description bare die

Symbol Description

OUT output pin

RFN grounded antenna connector

VDD external supply

RFP ungrounded antenna connector

Table 4. Pin description SOT886

Pin Symbol Description

1 RFP ungrounded antenna connector

2 n.c. not connected

3 RFN grounded antenna connector

4 OUT output pin

5 n.c. not connected

6 VDD ex ternal supply

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

8. Wafer layout

8.1 Wafer layout

(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)

(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)

(3) Chip step, x-length: 485 m

(4) Chip step, y-length: 435 m

(5) Bump to bump distance X (OUT - RFN): 383 m

(6) Bump to bump distance Y (RFN - RFP): 333 m

(7) Distance bump to metal sealring X: 40,3 m (outer edge - top metal)

(8) Distance bump to metal sealring Y: 40,3 m

Bump size X x Y: 60 m x 60 m

Remark: OUT and VDD are used with G2iL+ only

Fig 4. G2iL wafer layout

001aak871

not to scale!

(1)

(7)

(2)

(8)

(5)

(6) (4)

(3)

VDD

OUT RFN

RFP

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

9. Mechanical specification

The UCODE G2iL/G2iL+ wafers ar e available in 75 m and 120 m thickn ess. The 75m

thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser

during production. Because of the more robust structure of the 120m wafer , the wafer is

ideal for harsh applications. The 1 20 m thick wa fer is a lso enha nced with 7 m Polyimide

spacer allowing additional protection of the active circuit.

9.1 Wafer specification

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”.

9.1.1 Wafer

Table 5. Specifications

Wafer

Designation each wafer is scribed with batch number

and wafer number

Diameter 200 mm (8”)

Thickness

SL3S12x3FUF 75 m  15 m

SL3S12x3FUD 120 m  15 m

Number of pads 4

Pad location non diagonal/ placed in chip corners

Distance pad to pad RFN-RFP 333.0 m

Distance pad to pad OUT-RFN 383.0 m

Process CMOS 0.14 m

Batch size 25 wafers

Potential good dies per wafer 1 39.351

Wafer backside

Material Si

Treatment ground and stress release

Roughness Ra max. 0.5 m, Rt max. 5 m

Chip dimensions

Die size including scribe 0.485 mm  0.435 mm = 0.211 mm2

Scribe line width: x-dimension = 15 m

y-dimension = 15 m

Passivation on front

Type Sandwich structure

Material PE-Nitride (on top)

Thickness 1.75 m total thickness of passivation

Polyimide spacer 7 m  1 m (SL3S12x3FUD only)

Au bump

Bump material > 99.9 % pure Au

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

[1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.

9.1.2 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

9.1.3 Map file distribution

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

10. Functional description

10.1 Air interface standards

The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface

EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID,

Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".

10.2 Power transfer

The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL.

The antenna tra nsforms the impe dance of free space to the chip input imped ance in orde r

to get the maximum possible power for the G2iL on the tag. The G2iL+ can also be

supplied externally.

The RF field, which is oscillating on the operating frequency provided by the interrogator,

is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.

Bump hardness 35 – 80 HV 0.005

Bump shear strength > 70 MPa

Bump height

SL3S12x3FUF 18 m

SL3S12x3FUD 25 m[1]

Bump height unifo rm ity

within a die  2 m

– within a wafer  3 m

– wafer to wafer  4 m

Bump flatness  1.5 m

Bump size

– RFP, RFN 60  60 m

– OUT, VDD 60  60 m

Bump size variation  5 m

Table 5. Specifications

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

The antenna that is attached to the chip may use a DC connection between the two

antenna pads. Therefore the G2iL also enables loop antenna design. Possible examples

of supported antenna structures can be found in the reference antenna design guide.

10.3 Data transfer

10.3.1 Reader to tag Link

An interrogator transmits information to the UCODE G2iL by modulating an UHF RF

signal. The G2iL receives bo th information and operating ener gy from this RF signal. Tags

are pa ssive, meaning that they receive all of the ir operatin g energy from th e interrog ator's

RF waveform. In order to furth er impro v e th e read ran g e the UCO DE G2iL + ca n be

externally supplied as well so the energy to operate the chip does not need to be

transmitted by the reader.

An interrogator is using a fixed modulation and data rate for the duration of at least one

inventory round. It communicates to the G2iL by modulating an RF carrier using DSB-ASK

with PIE encoding.

For further details refer to Section 16, Ref. 1. Interrogator-to-tag (R=>T) communications.

10.3.2 Tag to reader Link

An interrogator receives information from a G2iL by transmitting an unmodulated RF

carrier and listening for a backscattered reply. The G2iL backscatters by switching the

reflection coefficient of its antenna between two states in accordance with the data being

sent. For further details refer to Section 16, Ref. 1, chapter 6.3.1.3.

The UCODE G2iL communicates information by backscatter-modulating the amplitude

and/or phase of the RF carrier. Interrogators shall be capable of demodulating either

demodulation type.

The encoding format, selected in response to interrogator commands, is either FM0

baseband or Miller-modulated subcarrier.

10.4 G2iL and G2iL+ differences

The UCODE G2iL is tailored for application where mainly EPC or TID number sp ace is

needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external

supply operation to further boost re ad/write range (external supply mode) , a Privacy mode

reducing the read rang e or I/O functionality (dat a transfer to externally conne cted devices)

required.

The following table provides an overview of G2iL, G2iL+ special features.

Table 6. Ov erview of G2iL and G2iL+ features

Features G2iL G2iL+

Read protection (bankwise) yes yes

PSF (Built-in Product Status Flag) yes yes

Backscatter strength reduction yes yes

Real read range reduction yes yes

Digital switch / Digital input - yes

External supply mode - yes

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

10.5 Supported commands

The G2iL supports all mandatory EPCglobal V1.2.0 commands.

In addition the G2iL supports the following optional commands:

•ACCESS

•Block Write (32 bit)

The G2iL features the following custom commands described more in detail later:

•ResetReadProtect (backward compatible to G2X)

•ReadProtect (backward compatible to G2X)

•ChangeEAS (backward compatible to G2X)

•EAS_Alarm (backward compatible to G2X)

•ChangeConfig (new with G2iL)

10.6 G2iL, G2iL+ memory

The G2iL, G2iL+ memory is implemented according EPCglobal Class1Gen2 and

organized in thr e e sec tio ns :

The logical address of all memory banks begin at zero (00h).

In addition to the three memory banks one co nfiguration word to handle the G2iL specific

features is available at EPC bank 01 address 200h. The configuration word is described in

detail in Section 10.7.1 “ChangeConfig”.

Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle

before writing data to it. This approach accelerates initialization of the chip and enables

faster programming of the memory.

RF field detection - yes

Data transfer - yes

Tag tamper alarm - yes

Table 6. Ov erview of G2iL and G2iL+ features …continued

Features G2iL G2iL+

Table 7. G2 iL memory sections

Name Size Bank

Reserved memory (32 bit ACCESS and 32 bit KILL password) 64 bit 00b

EPC (excluding 16 bit CRC-16 and 16 bit PC) 128 bit 01b

G2iL Configuration Word 16 bit 01b

TID (including permalocked unique 32 bit serial number) 64 bit 10b

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

10.6.1 G2iL, G2iL+ overall memory map

[1] See Figure 5

[2] Indicates the existence of a Configuration Word at the end of the EPC number

[3] See also Table 12 for further details.

Table 8. G2iL, G2iL+ overall memory map

Bank

address Memory

address Type Content Initial Remark

Bank 00 00h to 1Fh reserved kill password all 00h unlocked memory

20h to 3Fh reserved access password all 00h unlocked memory

Bank 01

EPC 00h to 0Fh EPC CRC-16: refer to Ref. 16 memory mapped

calculated CRC

10h to 14h EPC backscatter length 00110b unlocked memory

15h EPC UMI 0b unlocked memory

16h EPC XPC indicator 0b hardwired to 0

17h to 1Fh EPC numbering system indicator 00h unlocked memory

20h to 9Fh EPC EPC [1] unlocked memory

Bank 01

Config Word 200h EPC tamper alarm flag 0b[3] indicator bit

201h EPC external supply flag or input

signal 0b[3] indicator bi t

202h EPC RFU 0b[3] locked memory

203h EPC RFU 0b[3] locked memory

204h EPC invert digital output: 0b[3] temporary bit

205h EPC transparent mode on/off 0b[3] temporary bit

206h EPC transparent mode data/raw 0b[3] temporary bit

207h EPC RFU 0b[3] locked memory

208h EPC RFU 0b[3] locked memory

209h EPC max. backscatter strength 1b[3] unlocked memory

20Ah EPC digital output 0b[3] unlocked memor y

20Bh EPC read range reduction on/off 0b[3] unlocked memory

20Ch EPC RFU 0b[3] locked memory

20Dh EPC read protect EPC Bank 0b[3] unlocked me mory

20Eh EPC read protect TID 0b[3] unlocked memory

20Fh EPC PSF alarm flag 0b[3] unlocked memor y

Bank 10

TID 00h to 07h TID allocation class identifier 1110 0010b locked memory

08h to 13h TID tag mask designer ide ntifier 0000 0000 0110b locked memory

14h TID config word indicator 1b[2] locked memory

14h to 1Fh TID tag model number TMNR[1] locked memory

20h to 3Fh TID se rial number SNR locked memory

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

10.6.2 G2iL TID memory details

Fig 5. G2iL TID memory structure

aaa-010217

E2006906 E2h 006h 1 0010b 0000110b

Ucode G2iL+ E2006807 E2h 006h 1 0000b 0000111b

E2006907 E2h 006h 1 0010b 0000111b

Ucode G2iL E2006806 E2h 006h 1 0000b 0000110b

First 32 bit of TID

memory Class ID Mask

Designer

ID Config Word

Indicator Sub

Version Nr .

Model Number

Version

(Silicon) Nr.

Class Identifier

MS Byte

MS Bit LS Bit

LS Byte

TID

MS Bit LS Bit

Mask-Designer Identifier Model Number Serial Number

000 07Bits 11 11 31

07h 13h 1Fh 3Fh00hAddresses

3Fh00hAddresses

08h 14h 20h

E2h

(EAN.UCC) 006h

(NXP) 806h or 906h or B06h

(UCODE G2iL) 00000001h to FFFFFFFFh

Sub Version Number Version Number

000b or 001b or 0110b 0000110b

(UCODE G2iL)

6003Bits 0

1Fh14h 18hAddresses 19h

E2006B06 E2h 006h 1 0110b 0000110b

E2006B07 E2h 006h 1 0110b 0000111b

Product data sheet

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NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

10.7 Custom commands

The UCODE G2iL, G2iL+ is equipped with a number of additional features and custom

commands.

Nevertheless, the chip is designed in a way standard EPCglobal READ/WRITE/ACCESS

commands can be used to operate the features.

The memory map st ated in the pre vious section describes the Configuration W ord used to

control the additional features located at address 200h of the EPC memory. For this

reason the standard READ/WRITE commands of an UHF EPCglobal compliant reader

can be used to select the flags or activate/deactivate features.

The features can only be activated/deactivated (written) using standard EPC WRITE

command as long the EPC is not locked. In case the EPC is locked either the bank needs

to be unlocked to apply changes or the ChangeConfig custom command is used to

change the settings.

The UCODE G2iL is also equipped with the complete UCODE G2X command set for

backward compatibility reasons. Nevertheless, the one ChangeConfig command of the

G2iL can be used instead of the entire G2X command set.

Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable

selecting Config-Word enhanced transponders in mixed tag populations.

10.7.1 ChangeConfig

Although G2iL is tailored for supply chain management, item level tagging and product

authentication the G2iL+ version enables active interaction with products. Among the

password protected features are the capability of download firmware to electronics,

activate/deactivate electronics which can also be used as theft deterrence, a dedicated

privacy mode by reducing the read range, integrated PSF (Product Status Flag) or Tag

Tamper Alarm.

The G2iL ChangeConfig custom command allows handling the special NXP

Semiconductors features described in the following paragraph. Please also see the

memory map in Sectio n 10.6 “G2iL, G2iL+ memory” and “Section 10.7.2 “G2iL, G2iL+

special features control mechanism”. If the EPC memory is not write locked the standard

EPC READ/WRITE command can be used to change the settings.

G2iL, G2iL+ special features1

UCODE G2iL and G2iL+ common special features are:

•Bank wise read protection (separate for EPC and TID)

EPC bank and the serial number pa rt of the TID can be read p rotected independently.

When protected reading of the particular memory will return '0'. The flags of the

configuration word can be selected using the standard SELECT2 command. Only

read protected parts will then participate an inventory round. The G2X ReadProtect

command will set both EPC and TID read protect flags.

1. The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be

used.

2. SELECT has to be applied onto the Configuration Word with pointer address 200h. Selecting bits within the Configuration Word

using a pointer address not equal to 200h is not possible.

Product data sheet

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UCODE G2iL and G2iL+

•Integrated PSF (Product Status Flag)

The PSF is a general purpose flag that can be used as an EAS (Electronic Article

Surveillance) flag, quality checked flag or similar.

The G2iL offers two ways of detecting an activated PSF. In cases extremely fast

detection is needed the EAS_Alarm command can be used. The UCODE G2iL will

reply a 64-bit alarm code like described in section EAS_Alarm upon sending the

command. As a second option the EPC SELECT2 command selecting th e PSF flag of

the configuration word can be used. In the following inventory round only PSF

enabled chips will reply their EPC number.

•Backscatter strength reduction

The UCODE G2iL features two levels of backscatter strengths. Per default maximum

backscatter is enabled in order to enab le maximum read rates. Whe n clearing the flag

the strength can be reduced if needed.

•Real Read Range Reduction 4R

Some applications require the reduction of the read range to close proximity for

privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to

+12 dBm. The +12 dBm have to be available at chip start up (slow increase of field

strength is not applicable ). For additional pr ivacy, the read protection can be activated

in the same configur ation step. The rela te d flag of th e con fig u ra tio n wor d ca n be

selected using the standard SELECT2 comma nd s o only c hips with reduce d re a d

range will be part of an inventory.

Remark: The attenuation will result in only a few centimeter of read range at 36 dBm

EIRP!

UCODE G2iL+ specific special features are:1

•Tag Tamper Alarm (G2iL+ only)

The UCODE G2iL+ Tamper Alarm will flag the status of the VDD to OUT pad

connection which can be designed as an predetermined breaking point (see

Figure 6).

The status of the pad connection (open/closed) can be read in the configuration register

and/or selected using the EPC SELECT2. This feature will enable designing a wireless

RFID safety seal. When breaking the connection by peeling off the label or mani pulating a

lock an alarm can be triggered.

Fig 6. Schematic of connecting V DD and OUT pad with a predetermined break in g po int

to turn a standard RFID label into a wireless safety seal

001aam228

OUT VDD

GND RFP

Product data sheet

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UCODE G2iL and G2iL+

•RF field detection (G2iL+ only)

The UCODE G2iL+ VDD pin can be also used as a RF field detector. Upon bringing

the tag within an RF field, a pulse signal will be immediately sent from the VDD test

pad. (for details see Ref. 21).

•Digital Switch (G2iL+ only)

The UCODE G2iL+ OUT pin can be used as digit al switch. The st ate of the output pad

can be switched to VDD or GND depending on the Dig ital OUT bit of the Configuration

Word register. The state of the output is persistent in the memory even after KILL or

switching off the supply. This feature will allow activating/deactivating externally

connected peripherals or can be used as theft deterrence of electronics.

The sta te of the OUT pin can also be changed tempor ary by toggling the 'Invert Digital

Output' bit.

•Data transfer Mode (G2iL+ only)

In applications where not switching the output like described in "Digital Switch" but

external device communica tion is needed the G2iL+ Data T ran sfer Mode can be used

by setting the according bit of the Configuration Word register. When activated the air

interface communication will be directly transferred to the OUT pad of the chip.

Two modes of data transfer are available and can be switched using the Transparent

Mode DATA/RAW bit.

The default Transparent Mode DATA will remove the Frame Sync of the

communication and toggle the output with every raising edge in the RF field. This will

allow implementing a Manchester type of data transmission.

The T ransp arent Mo de RA W will switch the demodulated air interface communication

to the OUT pad.

•External Supply Indicator - Digital Input (G2iL+ only)

The VDD pad of the UCODE G2iL+ can be used as a single bit digital input pin. The

state of the pad is directly associated with the External Supply Indicator bit of the

configuration register. Simple one bit return signaling (chip to read er) can be

implemented by polling this Configuration Word register flag. RF reset is necessary

for proper polling.

•External Supply Mode (G2iL+ only)

The UCODE G2iL+ can be supplied externally by connecting 1.85 V (Iout = 0µA)

supply. When externally supplied less energy from th e RF fiel d is needed to operate

the chip. This will not just enable further improved sensitivity and read ranges (up to

27 dBm) but also enable a write range that is equal to the read range.

The figure schematically shows the supply connected to the UCODE G2iL+.

Remark: When permanently externally supplied there will not be a power-on-reset. This

will result in the following limitations:

•When externally supplied session flag S0 will keep it’s state during RF-OFF phase.

•When externally supplied session flag S2, S3, SL will have infinite persistence time

and will behave similar to S0.

•Session flag S1 will behave regular like in pure passive operation.

Product data sheet

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UCODE G2iL and G2iL+

The bits to be toggled in the configuration register need to be set to '1'.

E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the

very same command a second time will disable the features again.

The reply of the ChangeConfig will return the current register setting.

Fig 7. Schematic of external power supply

Table 9. Ch angeConfig custom command

Command RFU Data RN CRC-16

No. of bits 16 8 16 16 16

Description 11100000

00000111 00000000 Toggle bits

XOR RN 16 handle -

Table 10. ChangeConfig custom command reply

Header Status bits RN CRC-16

No. of bits 1 16 16 16

Description 0 Config-Word Handle -

Table 11. ChangeConfig command-response table

Starting state Condition Response Next state

ready all - ready

arbitrate, reply,

acknowledged all - arbitrate

open valid handle Status word

needs to change Backscatter unchanged

Config-WordConfig-Word

immediately

open

valid handle S tatus word does

not need to change Backscatter Config-Word

immediately open

secured valid handle Status word

needs to change Backscatter modified

Config-Word, when done secured

valid handle S tatus word does

not need to change Backscatter Config-Word

immediately secured

killed all - killed

001aam229

OUT VDD

Vsupply

GND RFP

Product data sheet

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UCODE G2iL and G2iL+

The features can only be activated/deactivated using st andard EPC WRITE if the EPC

bank is unlocked. The permanent and temporary bits of the Configuration Word can be

toggled without the need for an ACCESS password in case the ACCESS password is set

to zero. In case the EPC bank is locked the lock needs to be removed before applying

changes or the ChangeConfig command has to be used.

10.7.2 G2iL, G2iL+ special features control mechanism

Special features of the G2iL are managed using a configuration word (Config-Word)

located at address 200h in the EPC memory bank.

The entire Config-Word is selectable (using the standard EPC SELECT2 co mmand) and

can be read using standard EPC READ command and modified using the standard EPC

WRITE or ChangeConfig cu stom co mma nd in case the EPC memory is locked for writing.

ChangeConfig can be executed from the OPEN and SECURED state.

The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS

password is zero; therefore it will not alter any status bits, but report the current status

only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip

will then remain in the current state. The CRC-16 is calculated from the first

command-code bit to the last handle bit.

A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored.

The command will also be ignored if any of the RFU bits are toggled.

In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written

to the correspon ding r eg ister flag to to gg le the st atus. E.g. sending 0x0002 to the register

will activate the read protection of the TID. Sending the same command a second time will

again clear the read protection of the TID. Invalid toggling on indicato r or RFU bits are

ignored.

Executing the command with zero as payload or in the OPEN state will return the current

preamble rega rd les s of th e TRext value of the Quer y com m and .

After sending a ChangeConfig an interrogator shall transmit CW for less than T Reply or

20 ms, where TReply is the time between the interrogator's ChangeConfig command and

the chip’s backscattered reply. An interrogator may observe three possible responses

after sending a ChangeConfig, depending on the success or failure of the operation

•ChangeConfigChangeConfig succeeded: The chip will backscatter the reply shown

above comprising a header (a 0-bit), the current Status Word setting, the handle, and

a CRC-16 calculated over the 0-bit, the status word and the handle. If the interrogator

observes this reply within 20 ms then the ChangeConfig completed successfully.

•The chip encounters an error: The chip will backscatter an error code during the CW

period rather than the reply shown below (see EPCglobal Spec for error-code

definitions and for the reply format).

•ChangeConfig does not succeed: If the interrogato r does not observe a reply within

20 ms then the ChangeStatus did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the chip is still in the

interrogator's field, and may reissue the ChangeConfig command.

The G2iL configuration word is located at address 200h of the EPC memory and is

structured as following:

Product data sheet

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UCODE G2iL and G2iL+

The configuration word contains three different type of bits:

•Indicator bits cannot be changed by command:

Tag Tamper Alarm Indicator

External Supply Indicator (digital input)

•Temporary bits are reset at power up:

Invert Output

Tra nsparent Mo d e on /off

Data Mode data/raw

•Permanent bits: permanently stored bits in the memory

Max. Backscatter Strength

Digital Output

Read Range Reduction

Read Protect EPC

Read Protect TID

PSF Alarm

10.7.3 ReadProtect3

The G2iL ReadProtect custom command enables reliable read protection of the entire

G2iL memory. Executing ReadProtect from the Secu red st ate will set the ProtectEPC and

ProtectTID bits of the Configuration Wo rd to '1'. With the ReadProtect-Bit set the G2iL will

continue to work unaffected but veil its protected content.

The read protection can be removed by executing Reset ReadProtect. The

ReadProtect-Bits will than be cleared.

Devices whose access password is zero will ignore the command. A frame-sync must be

pre-pended the command.

After sending the ReadProtect command an interrogator shall transmit CW for the lesser

of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect

command and the backscattered reply. An interrogator may observe three possible

responses after sendin g a Rea d Pro te ct, dep ending on the success or failure of the

operation:

Table 12. Address 200h to 207h

Indicator bi ts Temporary bits

Tamper

indicator External supply

indicator RFU RFU Invert Output Transparent

mode on/off Data mode

data/raw RFU

01 234567

Table 13. Address 208h to 20Fh

Permanent bits

RFU max. backscatter

strength Digital

output Privacy

mode RFU Protect EPC Protect TID PSF Alarm

bit

8 9 10 11 12 13 14 15

3. Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”.

Product data sheet

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UCODE G2iL and G2iL+

•ReadProtect succeeds: After completing the ReadProtect the G2iL shall backscatter

the reply shown in Table 15 comprising a header (a 0-bit), the tag's handle, and a

CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2iL will

render itself to this ReadProtect mode. If the interrogator obse rves this reply within

20 ms then the ReadProtect completed successfully.

•The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in the EPCgloba l Spec (see Annex I for erro r-code

definitions and for the reply format).

•ReadProtect does not succeed: If the interrogator does not observe a reply within

20 ms then the ReadProtect did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the G2iL is still in the

interrogation zone, and may re-initiate the ReadProtect command.

The G2iL reply to the ReadProtect command will use the extended preamble shown in

EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if

TRext=1) regardless of the TRext value in the Query that initiated the round.

10.7.4 Reset ReadProtect3

Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of

the Configuratio n Word. This w ill re -e n ab le re ad in g of the re lat ed G2iL me m or y con te nt .

For details on the command response please refer to Table 17 “Reset ReadProtect

command”.

Table 14. ReadProtect command

Command RN CRC-16

# of bits 16 16 16

description 11100000 00000001 handle -

Table 15. G2iL reply to a successful ReadProtect procedure

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

Table 16. ReadProtect command-response table

Starting Stat e Condition Response Next State

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open all - open

secured valid handle & invalid

access password – arbitrate

valid handle & valid

non zero access

password

Backscatter handle,

when done secured

invalid handle – secured

killed all – killed

Product data sheet

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UCODE G2iL and G2iL+

After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of

TReply or 20 ms, wher e TReply is the time between the interrogator's Reset ReadProtect

command and the G2iL backscattered reply. A Req_RN command prior to the Reset

ReadProtect is necessary to successfully execute the command. A frame-sync must be

pre-pended the command.

An interrogator may observe three possible responses after sending a Reset

ReadProtect, depending on the success or failure of the operation:

•Reset ReadProtect succeeds: After completing the Reset ReadProtect a G2iL will

backscatter the reply shown in Table 18 comprising a hea der (a 0-bit), the handle, and

a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply

within 20 ms then the Reset ReadProtect completed successfully.

•The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in Table 18 (see EPCglobal Spec for error-code

definitions and for the reply format).

•Reset ReadProtect does not succeed: If the interrogator does not observe a reply

within 20 ms then the Reset ReadProtect did not complete successfully. The

interrogator may issue a Req_RN command (containing the handle) to verify that the

G2iL is still in the interrogation zone, and may reissue the Reset ReadProtect

command.

The G2iL reply to the Reset ReadProtect command will use the extended preamble

shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2iL will

reply as if TRext=1 regardless of the TRext value in the Query that initiated the round.

The Reset ReadProtect command is structured as following:

•16 bit command

•Password: 32 bit Access-Password XOR with 2 times current RN16

Remark: To gene rate the 32 bit p assword the 1 6 bit RN1 6 is duplicated and u sed two

times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234).

•16 bit handle

•CRC-16 calculate over the first command-code bit to the last handle bit

Table 17. Reset ReadProtect command

Command Password RN CRC-16

# of bits 16 32 16 16

description 11100000

00000010 (access

password) 

2*RN16

handle -

Table 18. G2iL reply to a successful Reset ReadProtect command

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

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UCODE G2iL and G2iL+

10.7.5 ChangeEAS3

UCODE G2iL equipped RFID tags will also feature a stand-alone operating EAS alarm

mechanism for fast and offline electronic article surveillance. The PSF bit of the

Configuration Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the

tag will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without

the need of a Select or Query. The EAS is a built-in solution so no connection to a

backend database is required. In case the EAS_Alarm command is not implemented in

the reader a standard EPC SELCET to the Configuration Wor d and Query can be used.

When using standard SELECT/QUERY the EPC will be returned during inventory.

ChangeEAS can be executed from the Secured state only. The command will be ignored

if the Access Password is zero, the command will also be ignored with an invalid CRC-16

or an invalid handle, the G2iL will than remain in the current state. The CRC-16 is

calculated from the first command-code bit to the last handle bit. A frame-sync must be

pre-pended the command.

The G2iL reply to a successful ChangeEAS will use the extended preamble, as

appropriat e (i.e . a Ta g sha ll rep ly as if TRext=1) regardless of the TRext value in the

Query that initiated the round.

After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or

20 ms, where TReply is the time between the interrogator's ChangeEAS command and the

G2iL backscattered reply. An interrogator may observe three possible responses after

sending a ChangeEAS, depending on the success or failure of the operation

•ChangeEAS succeeds: After completing the ChangeEAS a G2iL will backscatter the

reply shown in Table 21 comprising a header (a 0-bit), the handle, and a CRC-16

calculated over the 0-bit and handle. If the interrogator observes this reply within

20 ms then the ChangeEAS completed successfully.

•The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in Table 21 (see EPCglobal Spec for error-code

definitions and for the reply format).

Table 19. Reset ReadProtect command-response table

Starting Stat e Condition Response Next State

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open valid handle & valid access password Backscatter handle,

when done open

valid handle & invalid access password – arbitrate

invalid handle – open

secured valid handle & valid access password Backscatter handle,

when done secured

valid handle & invalid access password – arbitrate

invalid handle – secured

killed all – killed

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UCODE G2iL and G2iL+

•ChangeEAS does not succeed: If the interrogator does not observe a reply within

20 ms then the ChangeEAS did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the G2iL is still in the

interrogator's field, and may reissue the ChangeEAS command.

Upon receiving a valid ChangeEAS command a G2iL will perform the commanded

set/reset operation of the PSF bit of the Configuration Word.

If PSF bit is set, the EAS_Alarm command will be available after the next power up and

reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be

ignored.

10.7.6 EAS_Alarm

Upon receiving an EAS_Alarm custom command the UCODE G2iL will immediately

backscatter an EAS-Alarmcode in case the PSF bit of the Configuration Word is set. The

alarm code is returned without any delay caused by Select, Query and without the need

for a backend database.

The EAS feature of the G2iL is available after enabling it by sending a ChangeEAS

command described in Section 10.7.5 “ChangeEAS3” or after setting the PSF bit of the

Configuration Word to ’1’. With the EAS-Alarm enabled the G2iL will reply to an

EAS_Alarm command by backscattering a fixed 64 bit alarm code. A G2iL will reply to an

EAS_Alarm command from the ready state only. As an alternative to the fast EAS_Alarm

command a standard SELECT2 (upon the Configuration Word) and QUERY can be used.

If the PSF bit is reset to '0' by sending a ChangeEAS command in the pa ssword protected

Secure state or clearing the PSF bit the G2iL will not reply to an EAS_Alarm command.

Table 20. ChangeEAS command

Command ChangeEAS RN CRC-16

# of bits 16 1 16 16

description 11100000

00000011 1 ... set PSF bit

0 ... reset PSF bit handle

Table 21. G2iL reply to a successful Ch angeEAS command

Header RN CRC-16

# of bits 1 16 16

description 0 handle -

Table 22. ChangeEAS command-response table

Starting Stat e Condition Response Next state

ready all – ready

arbitrate, reply,

acknowledged all – arbitrate

open all – open

secured valid handle backscatter handle,

when done secured

invalid handle – secured

killed all – killed

Product data sheet

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UCODE G2iL and G2iL+

The EAS_Alarm command is structured as following:

•16 bit command

•16 bit inverted command

•DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal S pec.

6.3.1.2. 8 an d Table 6.9.

•M (cycles per symbol) sets the T=>R data rate and modulation format as shown in

EPCglobal Spec. Table 6.10.

•TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as

described in EPCglobal Spec. 6.3.1.3.

A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec,

6.3.1.2.8.

Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b

and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate

the CRC5 over the backscattered 64 bits received to verify the received code.

Table 23. EAS_Alarm command

Command Inv_Command DR MTRext CRC-16

# of bits 16 16 1 2 1 16

description 11100000

00000100 00011111

11111011 0: DR = 8

1: DR = 64/3 00: M = 1

01: M = 2

10: M = 4

11: M = 8

0: no pilot

tone

1: use pilot

tone

Table 24. G2iL reply to a successful EAS_Alarm command

Header EAS Code

# of bits 1 64

description 0 CRC5 (MSB)

Table 25. EAS_Alarm command-response table

Starting Stat e Condition Response Next state

ready PSF bit is set

PSF bit is cleard backscatter alarm code

ready

arbitrate, reply,

acknowledged all – arbitrate

open all – open

secured all – secured

killed all – killed

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UCODE G2iL and G2iL+

11. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.

Table 26. Limiting values[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages are referenced to RFN

Symbol Parameter Conditions Min Max Unit

Bare die and SOT886 limitations

Tstg storage temperature 55 +125 C

Tamb ambient temperature 40 +85 C

VESD electrostatic discharge

voltage Human body

model [3] -2kV

Pad limitations

Viinput voltage absolute limits,

VDD-OUT pad 0.5 +2.5 V

Iooutput current absolute limi ts

input/output

current, VDD-OUT

pad

0.5 +0.5 mA

Piinput power maximum power

dissipation, RFP

pad

-100mW

Product data sheet

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UCODE G2iL and G2iL+

12. Characteristics

12.1 UCODE G2iL, G2iL+ bare die characteristics

[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

[4] It has to be assured the reader (system) is capable of providing enough field strength to give +12 dBm at the chip otherwise

communication with the chip will not be possible.

[5] Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4.

[6] Will result in up to 10 dB higher tag backscatter power at high field strength.

[7] Results in approx. 18.5 dBm tag sensitivity on a 2 dBi gain antenna.

Table 27. G2iL, G2iL+ RF interface characteristics (RFN, RFP)

Symbol Parameter Conditions Min Typ Max Unit

fiinput frequency 840 - 960 MHz

Normal mode - no external supply, read range reduction OFF

Pi(min) minimum input power READ sensitivity [1][2][7] -18 - dBm

Pi(min) minimum input power WRITE sensitivity,

(write range/read

range - ratio)

-30-%

Ciinput capacitance parallel [3] -0.77-pF

Q quality factor 915 MHz [3] -9.7--

Z impedance 866 MHz [3] - 25 -j237 - 

915 MHz [3] - 23 -j224 - 

953 MHz [3] - 21 -j216 - 

External supply mode - VDD pad supplied, read range reduction OFF

Pi(min) minimum input power Ext. supplied READ [1][2] -27 - dBm

Ext. supplied WRITE [2] -27 - dBm

Z impedance externally supplied,

915 MHz [3] -7 -j230-

Read range reduct ion ON - no external supply

Pi(min) minimum input power 4R on READ [1][2][4] -+12-dBm

4R on WRITE [2][4] -+12-dBm

Z impedance 4R on, 915 MHz [3] -18 -j2-

Modulation resistance

R resistance modulation

resistance, max.

backscatter = off

[5] -170-

modulation

resistance, max.

backscatter = on

[6] -55-

Product data sheet

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UCODE G2iL and G2iL+

[1] Activates Digital Output (OUT pin), increases read range (external supplied).

[2] Activates Digital Output (OUT pin), increases read and write range (external supplied).

[3] Operating the chip outside the specified voltage range may lead to undefined behaviour.

[4] Either the voltage or the current needs to be above given values to g uarantee specified functionality.

[5] No proper operation is guaranteed if both, voltage and current, limits are exceeded.

[1] Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN.

[2] Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality.

[3] Resistance between VDD and OUT pin in checked during power up only.

[4] Resistance range to achieve tamper alarm flag = 1.

[5] Resistance range to achieve tamper alarm flag = 0:

Table 28. VDD pin char acteristics

Symbol Parameter Conditions Min Typ Max Unit

Minimum supply voltage/current - without assisted EEPROM WRITE [1][3][4]

VDD supply voltage minimum voltage - - 1.8 V

IDD supply current minimum curre nt,

Iout-^- = 0 A-- 7A

Iout = 100 A--110A

Minimum supply voltage/current - assisted EEPROM READ and WRITE [2][3][4]

VDD supply voltage minimum voltage,

Iout = 0 A- 1.8 1.85 V

Iout = 100 A--1.95V

IDD supply current minimum curre nt,

Iout = 0 A-- 125

A

Iout = 100 A--265A

Maximum supply voltage/current [3][5]

VDD supply voltage absolute maximum

voltage 2.2 - - V

Ii(max) maximum input current absolute maximum

current 280 - - A

Table 29 . G2iL, G2iL+ VDD and OUT pin characteristics

Symbol Parameter Conditions Min Typ Max Unit

OUT pin characteristi cs

VOL Low-level output voltage Isink = 1 mA - - 100 mV

VOH HIGH-level output voltage VDD = 1.8 V; Isource

= 100 µA 1.5 - - V

VDD/OUT pin characteris ti cs

CLload capacitance VDD - OUT pin max. [1] -- 5pF

Vooutput voltage maximum RF peak

voltage on VDD-OUT

pins

[2] -- 500mV

VDD/OUT pin tamper alarm characteristics [3]

RL(max) maximum load resistance resistance range high [4] -- <2 M

RL(min) minimum lo ad resistance resistance range low [5] >20 - - M

Product data sheet

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UCODE G2iL and G2iL+

For further read in g we reco m me n d application note “FAQ UCODE G2iL+“ (Ref. 21)

describing the output characteristics more in detail. An example schematic is available in

application note “UCODE G2iL+ Demo board Manual“ (Ref. 22). The documents are

available at NXP Docum e nt Cont ro l or at th e we bsit e www. nx p.c om .

[1] Tamb 25 C

12.2 UCODE G2iL SOT886 characteristics

[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

Remark: For DC and memory characteristics refer to Table 28, Table 29 and Table 30.

Table 30. G2iL, G2iL+ memory characteristics

Symbol Parameter Conditions Min Typ Max Unit

EEPROM characteristics

tret retention time Tamb 55 C20--year

Nendu(W) write endurance 1000 10000[1] - cycle

Table 31. G2iL RF interface characteristics (RFN, RFP)

Symbol Parameter Conditions Min Typ Max Unit

Normal mode - no external supply, read range reduction OFF

Pi(min) minimum input power READ

sensitivity [1][2] -17.6 - dB

Z impedance 915 MHz [3] -21 j199 - 

Normal mode - externally supplied, read range reduction OFF

Pi(min) minimum input power READ

sensitivity [1][2] -27 - dB

Z impedance 915 MHz [3] -5.6 j204 - 

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UCODE G2iL and G2iL+

13. Package outline

Fig 8. Package outline SOT886

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT886 MO-252

sot886_po

04-07-22

12-01-05

Unit

mm max

nom

min

0.5 0.04 1.50

1.45

1.40

1.05

1.00

0.95

0.35

0.30

0.27

0.40

0.35

0.32

0.6

A(1)

Dimensions (mm are the original dimensions)

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886

A1b

0.25

0.20

0.17

DEee

0.5

terminal 1

index area

0 1 2 mm

scale

(2)

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 29 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

14. Packing information

14.1 Wafer

See Ref. 20 “Dat a sheet - Delivery type descript ion – Gener al specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

14.2 SOT886

Part orientation T1. For details please refer to

http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf

15. Abbreviations

Table 32. Abbreviations

Acronym Description

CRC Cyclic Redundancy Check

CW Continuous Wave

DSB-ASK Double Side Band-Amplitude Shift Keying

DC Direct Current

EAS Electronic Article Surveillance

EEPROM Electrically Erasable Programmable Read Only Memory

EPC Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

FM0 Bi phase space modulation

G2 Generation 2

IC Integrated Circuit

PIE Pulse Interval Encoding

RRRR Real Read Range Reduction

PSF Product Status Flag

RF Radio Frequency

UHF Ultra High Frequency

SECS Semi Equipment Communication Standard

TID Tag IDentifier

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 30 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

16. References

[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF

RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0

(December 17, 2005)

[2] EPCglobal: EPC Tag Data Standards

[3] EPCgl obal (2 00 4 ): FMCG RF ID P hys ical Requirements Document (draft)

[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference

(draft)

[5] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 1 – Technical characteristics and test methods

[6] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive

[7] [CEPT1]: CEPT REC 70-03 Annex 1

[8] [ETSI1]: ETSI EN 330 220-1, 2

[9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility

And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment

operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:

Technical characteristics and test methods.

[10] [FCC1]: FCC 47 Part 15 Section 247

[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International

Standards

[12] ISO/IEC 3309: Information technology – Telecommunications and information

exchange between systems – High-level data link control (HDLC) procedures –

Frame structure

[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –

Radio frequency identification (RFID) for item management – Data protocol :

application interface

[14] ISO/IEC 15962: Information technology, Automatic identification and data capture

techniques – Radio frequency identification (RFID) for item management – Data

protocol: data encoding rules and logical memory functions

[15] ISO/IEC 15963: Information technology — Radio frequency identification for item

management — Unique identification for RF tags

[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item

management — Part 1: Reference architecture and definition of parameters to be

standardized

[17] ISO/IEC 18000-6: Information technology automatic identification and data capture

techniques — Radio frequency identification for item management air interface —

Part 6: Parameters for air interface communications at 860–960 MHz

[18] ISO/IEC 19762: Information technology AIDC tech niques – Ha rmo nized vocabulary

– Part 3: radio-frequency identification (RFID)

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 31 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:

Radio-frequency devices, U.S. Federal Communications Commission.

[20] Data sheet - Delivery type description – General specification for 8” wafer on

UV-tap e with electronic fail die marking, BU-ID document number: 1093**4

[21] Application note - FAQ UCODE G2i, BU-ID document number: AN10940

[22] Application note - UCODE G2iM+ demo board documentation, BU-ID document

number: AN11237

4. ** ... document version number

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 32 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

17. Revision history

Table 33. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SL3S1203_1213 v.4.4 20140317 Product data sheet - SL3S1203_1213 v.4.3

Modifications: •Table 8 “G2iL, G2iL+ overall memory map”: Table notes updated

•Figure 5 “G2iL TID memory structure”: TIDs updated

SL3S1203_1213 v.4.3 20131127 Product data sheet - SL3S1203_1213 v.4.2

Modifications: •Figure 5 “G2iL TID memory structure”: updated

SL3S1203_1213 v.4.2 20130701 Product data sheet - SL3S1203_1213 v.4.1

Modifications: •Update of delivery form

•Update RF field detectio n

SL3S1203_1213 v.4.1 20120917 Product data sheet - SL3S1203_1213 v.4.0

Modifications: •Update of delivery form

SL3S1203_1213 v.4.0 20120227 Product data sheet - SL3S1203_1213 v.3.9

Modifications: •Figure 4 “G2iL wafer layout”: Figure notes (1) and (2) updated

SL3S1203_1213 v.3.9 20120130 Product data sheet - SL3S1203_1213 v.3.8

Modifications: •Table 6 “Specifications”: “Passivation on front” updated

•Section 15.2.1 “General assembly recommendations”: updated

SL3S1203_1213 v.3.8 20120111 Product data sheet - SL3S1203_1213 v.3.7

Modifications: •Section 8.1 “Wafer layout”: Figure notes (1) and (2) updated

SL3S1203_1213 v.3.7 20111124 Product data sheet - SL3S1203_1213 v.3.6

Modifications: •Table 11 “G2iL, G2iL+ overall memory map”: upda ted

•Table 34 “G2iL, G2iL+ RF interface characteristics (RFN, RFP)”: updated

SL3S1203_1213 v.3.6 20110803 Product data sheet - SL3S1203_1213 v.3.5

Modifications: •Real Read Range Reduction feature added to G2iL

SL3S1203_1213 v.3.5 20110531 Product data sheet - SL3S1203_1213 v.3.4

Modifications: •Superfluous text removed from Ta ble 6

SL3S1203_1213 v.3.4 20110511 Product data sheet - SL3S1203_1213 v.3.3

Modifications: •Security status changed into COMPANY PUBLIC

•Delivery form of FCS2 strap added

•Section 13 “Package information”, Section 15 “Handling information” and Section 16

“Packing information” added

SL3S1203_1213 v.3.3 20110131 Product data sheet - SL3S1203_1213 v.3.2

Modifications: •Section 4 “Ordering information”: new types SL3S1203FUD and SL3S1213FUD added

•Section 9 “Mechanical specification”: updated according to the new types

•Replaced wording of “ChangeStatus” with “ChangeConfig”

SL3S1203_1213 v.3.2 20101109 Product data sheet - SL3S1203_1213 v.3.1

Modifications: •Version SOT886F1 added

•Section 5 “Marking”, Section 13 “Package outline” and Section 14 “Packing information”

added

SL3S1203_1213 v.3.1 20100922 Product data sheet - SL3S1203_1213 v.3.0

Modifications: •General Modifications

SL3S1203_1213 v.3.0 20100621 Product data sheet - 178810

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 33 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

Modifications: •General update

178810 20100304 Objective data sheet - -

Table 33. Revision history …continued

Document ID Release date Data sheet status Change notice Supersedes

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 34 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

18. Legal information

18.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

18.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full da ta sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short dat a sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

18.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incident al,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with app lications or customer product

design. It is customer’s sole re sponsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associa ted with their

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 35 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neither qua lified nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) versio n of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

18.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

UCODE — is a trademark of NXP Semiconductors N.V.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet

COMPANY PUBLIC Rev. 4.4 — 17 March 2014

178844 36 of 37

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

20. Tables

Table 1. Ordering information. . . . . . . . . . . . . . . . . . . . . .3

Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3

Table 3. Pin description bare die . . . . . . . . . . . . . . . . . . .5

Table 4. Pin description SOT886 . . . . . . . . . . . . . . . . . . .5

Table 5. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Table 6. Overview of G2iL and G2iL+ features . . . . . . . .9

Table 7. G2iL memory sections . . . . . . . . . . . . . . . . . . .10

Table 8. G2iL, G2iL+ overall memory map. . . . . . . . . . .11

Table 9. ChangeConfig custom command . . . . . . . . . . .16

Table 10. Change Config custom command reply. . . . . . .16

Table 11. ChangeConfig command-response table. . . . .16

Table 12. Address 200h to 207 h . . . . . . . . . . . . . . . . . . .18

Table 13. Address 208h to 20Fh . . . . . . . . . . . . . . . . . . .18

Table 14. ReadProtect command. . . . . . . . . . . . . . . . . . .19

Table 15. G2iL reply to a successful ReadProtect

procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Table 16. ReadProtect command-response table . . . . . .1 9

Table 17. Reset ReadProtect command . . . . . . . . . . . . .20

Table 18. G2iL reply to a successful Reset

ReadProtect command. . . . . . . . . . . . . . . . . . .20

Table 19. Reset ReadProtect command-response

table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . 22

Table 21 . G2iL reply to a successful ChangeEAS

command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 22. ChangeEAS command-response table . . . . . . 22

Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 23

Table 24. G2iL reply to a successful EAS_Alarm c

ommand. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 25. EAS_Alarm command-resp onse table . . . . . . 23

Table 26 . Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . 24

Table 27. G2iL, G2iL+ RF interface characteristics

(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 28. VDD pin characteristics . . . . . . . . . . . . . . . . . . 26

Table 29. G2iL, G2iL+ VDD and OUT

pin characteristics . . . . . . . . . . . . . . . . . . . . . . 26

Table 30. G2iL, G2iL+ memory characteristics . . . . . . . . 27

Table 31. G2iL RF interface characteristics

(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 32. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 33. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32

21. Figures

Fig 1. Block diagram of G2iL IC . . . . . . . . . . . . . . . . . . .4

Fig 2. Pinning bare die. . . . . . . . . . . . . . . . . . . . . . . . . . .5

Fig 3. Pin configuration for SOT886 . . . . . . . . . . . . . . . .5

Fig 4. G2iL wafer layout. . . . . . . . . . . . . . . . . . . . . . . . . .6

Fig 5. G2iL TID memory structure . . . . . . . . . . . . . . . . .1 2

Fig 6. Schematic of connecting VDD and OUT pad

with a predetermined breaking point to turn a

standard RFID label into a wireless safety seal. .14

Fig 7. Schematic of external power supply . . . . . . . . . .16

Fig 8. Package outline SOT8 86. . . . . . . . . . . . . . . . . . .28

NXP Semiconductors SL3S1203_1213

UCODE G2iL and G2iL+

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 March 2014

178844

Please be aware that important notices concerning this document and the product(s)

described herei n, have been included in section ‘Legal information’.

22. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Fe atures and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1.1 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2.1 End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2

2.2.2 Antenna design benefits. . . . . . . . . . . . . . . . . . 2

2.2.3 Label manufacturer benefit. . . . . . . . . . . . . . . . 2

2.3 Custom commands. . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.1 Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4 Or dering information. . . . . . . . . . . . . . . . . . . . . 3

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

7.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.1 Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Mechanical specification . . . . . . . . . . . . . . . . . 7

9.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7

9.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

9.1.2 Fail die identification . . . . . . . . . . . . . . . . . . . . 8

9.1.3 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8

10 Functional description . . . . . . . . . . . . . . . . . . . 8

10.1 Air interface standards . . . . . . . . . . . . . . . . . . . 8

10.2 Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8

10.3 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

10.3.1 Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 9

10.3.2 Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 9

10.4 G2iL and G2iL+ di fferences . . . . . . . . . . . . . . . 9

10.5 Supported commands . . . . . . . . . . . . . . . . . . 10

10.6 G2iL, G2iL+ memory . . . . . . . . . . . . . . . . . . . 10

10.6.1 G2iL, G2iL+ overall memory map. . . . . . . . . . 11

10.6.2 G2iL TID memory details . . . . . . . . . . . . . . . . 12

10.7 Custom commands. . . . . . . . . . . . . . . . . . . . . 13

10.7.1 Ch angeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 13

G2iL, G2iL+ special features . . . . . . . . . . . . . .13

10.7.2 G2iL, G2iL+ special features

control mechanism . . . . . . . . . . . . . . . . . . . . . 17

10.7.3 ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 18

10.7.4 Reset ReadProtect3 . . . . . . . . . . . . . . . . . . . . 19

10.7.5 ChangeEAS3 . . . . . . . . . . . . . . . . . . . . . . . . . 21

10.7.6 EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 22

11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 24

12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25

12.1 UCODE G2iL, G2iL+ bare die characteristics 25

12.2 UCODE G2iL SOT886 characteristics. . . . . . 27

13 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 28

14 Packing information . . . . . . . . . . . . . . . . . . . . 29

14.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

14.2 SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29

16 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 32

18 Legal information . . . . . . . . . . . . . . . . . . . . . . 34

18.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 34

18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35

19 Contact information . . . . . . . . . . . . . . . . . . . . 35

20 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

21 Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37