TYPE DFN S11-MEL/MED REVISION 00 CHECKED NE DATE 30.05.2006 PAGE XX
S U R F A C E M O U N T C L O C K O S C I L L A T O R
D F N S 1 1 - M E L P I ( 3 . 3 V ) & D F N S 1 1 - M E D P I ( 2 . 5 V )
FEATURES
27 TO 800 MHz
Low noise PLL multiplication circuit
Low jitter
APPLICATIONS
Datacomms
Function DFN S11
E / D 1
NC 2
GND 3
Output 1 4
Output 2 5
Vcc 6
TYPE DFN S11-MELPI DFN S11-MEDPI
Frequency Range 27 to 800 MHz
ELECTRICAL SPECIFICATIONS
supply voltage 3.3 V ± 5 % 2.5 V ± 5 %
supply current (no load) ≤ 80 mA ≤ 80 mA
output load LVPECL ( 50 Ω to 1.3 V ) LVPECL ( 50 Ω to 0.5 V )
duty cycle @ 50% level 45/55…55/45 % 45/55…55/45 %
rise/fall times ( 20 to 80% ) ≤ 0.6 ns ≤ 0.6 ns
high/low levels ≥ 2.27 V/ ≤ 1.68 V ≥ 1.47 V/ ≤ 1.09 V
jitter RMS (12 kHz to 20 MHz) ≤ 3 ps ≤ 3 ps
enable / disable on pin 1 high or open = enable, low = disable high or open = enable, low = disable
complementary output on pin 5 180° phase shifted 180° phase shifted
start up ≤ 10 ms @ 3.15 V ≤ 10 ms @ 2.37 V
FREQUENCY STABILITY stability [ ppm ] and temperature code
types temperature range stability code stability code stability code
0 to 70°C
≤ ± 25 XB25 ≤ ± 50 XB50 ≤ ± 100 XB100
all types -40 to 85°C
≤ ± 50 XE50 ≤ ± 75 XE75 ≤ ± 100 XE100
remarks stability includes calibration at 25°C, temperature, ageing, Vcc and load changes 1
st
yr.
OPTIONS
stability over long life time A = 5 years B = 10 years C = 15 years
ORDERING CODE type + option code + frequency + stability/temperature code
Example DFN S11-MELPI 622.08 MHz XB25
REMARK Please consult factory for life time/stabilities possible combinations
PC board footprint
6 4
31
5.08
H±0.22.4
1.4
2.0
5.0±0.2
2.4
L±0.2
5.08
1.4
2
5
L 7.0 mm
H 1.7 mm
FREQUENCY CONTROL PRODUCTS
TYPE ORDERING CODE REVISION 03 CHECKED NE DATE 23.07.2007 PAGE
GENERIC ORDERING CODES
SOME EXAMPLES
TYPE 1 2 3 4 5 6 FREQUENCY 7 89 10 11
PXO DFN 1 14 - K H Z 68.736 MHz X H 100
VCXO DFV 14 - K H 32.768 MHz 100 A B 25
TCXO DFA S7 - K O A 16.384 MHz C 1
VC-TCXO DFAV 36 - M H 10.000 MHz 40 C 2 /12
1.
TYPE CODE 2.
VERSION 3.
PACKAGE CODE 4.
INTERNAL 5.
OUTPUT CODE
Through hole Surface mount CODE
DFN = CXO/PXO model no. 14 = DIL 14 S1 = epoxy 14 x 9 mm not for T = TTL
DFV = VCXO not for 4 = DIL 8 S2 = epoxy 7 x 5 mm customer use H = HCMOS
DFA = TCXO customer use 20 = 20 x 20 mm S3 = epoxy 9 x 7 mm B = TTL & HCMOS
DFO = OCXO 36 = 36 x 27 mm S4 = epoxy 24 x 22 mm E = Negative ECL 10KH
DFAV = VC-TCXO S5 = plastic 14 x 9 mm EC = Pos. ECL 10KH/100K
DFT = FCXO S7 = epoxy 20 x 12 mm LEC = LVPECL 100K
S8 = epoxy 20 x 12 mm L = LVDS
S10 = ceramic 14 x 9 mm O = Clipped square wave
S11 = ceramic 7 x 5 mm S = Sine wave
S13 = epoxy 11 x 9 mm
S15 = ceramic 5 x 3.2 mm
S16 = ceramic 3.2 x 2.5 mm
S17 = ceramic 2.5 x 2 mm
6.
OPTION CODE 7.
PULLING RANGE 8.
INDICATION CODE 9.
TEMPERATURE
(IF NEEDED) CODE General VCXO RA NGE
Z = tri-state X = overall frequency A= 0.5 to 4.5 V range A = 0 to 50°C K = -30 to 60°C
L = low power model stability 1 year or center @ 2.5 V L = 0 to 60°C R = -30 to 70°C
R = tight symmetry value in ppm long term ageing (only DIL-14) B = 0 to 70°C N = -30 to 75°C
P = complimentary outputs code M = -10 to 50°C T = -30 to 85°C
G = inverted pin-out C= 0.5 to 10 V range D = -10 to 60°C F = -40 to 70°C
T = external trimmer center @ 4.25 V I = -10 to 70°C E = -40 to 85°C
A = internal trimmer void = temperature Q = -20 to 60°C G = -55 to 105°C
V = external control voltage stability only D= 0.3 to 3.0 V range C = -20 to 70°C H = -55 to 125°C
Y = external potentiometer center @ 1.65 V P = -25 to 75°C
I = enable/disable
void = standard spec
10.
FREQUENCY STABILITY 11.
SUPPLY VOLTAGE / LONG TERM AGEING CODE
frequency stability expressed in ppm, either as indicates the supply voltage value in Volts for models offering different
an overall tolerance or as temperature options of supply voltage for (VC)-TCXO
stability only. indicates long term ageing for surface mount PXO
NON-STANDARD SPECIFICATIONS
Specifications that cannot be covered by the above codes will be issued a unique specification number
FREQUENCY CONTROL PRODUCTS
TYPE HAND. GUIDELINES REVISION 04 CHECKED NE DATE 21.09.2007 PAGE 1
FORDAHL SMD PRODUCTS : TAPE & REEL DIMENSIONS
DIRECTION OF UNREELING
P1
P2 P0
K
AD0
D1 B
F
E
SW
FORDAHL TYPE
FREQUENCY
SPEC DATE
ORIENTATION M AR K E R
INDICATES PIN 1
> 165°
DIRECTION OF PULLING
T
LABEL
A
B
1.0
13.0
10.6
C D
Materials: Carrier tape : conductive polycarbonate
Cover tape : polyester, antistatic coated
Reel : conductive or antistatic treated polystyrene
Product Oscil. Tape [mm] MOQ Reel [mm]
type A B E F K S T W D0 D1 P0 P1 P2 [pcs] A B C D
S1 PXO
VCXO
TCXO 9.4 15
1.75
11.5 6.25 - 21.3 24
1.55
2.0
4.0
12
2.0
250 27.8 24.7 60 180
1000 30.5 26.1 100 330
S2 PXO
VCXO
TCXO 5.5 8.7 7.5 3.6 - 13.3 16 1.5 8 500 19.8 16.7 60 180
2000 21.4 17.0 100 330
S4 TCXO 26.5 26.5 20.2 7.5 40.4 37.5 44 1.0 32 250 49.6 45.2 100 330
S7 VCXO 13.2 20.2 14.2 9.5 28.4 25.3 32 2.0 24 250 39.6 35.2 100 330
TCXO 8.0 20
450
S8 PXO 13.2 20.2 14.2 5.3 28.4 25.3 32 2.0 20 600 39.6 35.2 100 330
250
Please consult factory for details on S5, S11, S15, S16 and S17
NOTICE
1. Storage
Please store the products in room where temperature /
humidity is stable. Conditions should be:
Temperature : 5 to 35°C
Humidity : 30 to 60% RH
If products are stored for more than a year, solderability
may be degraded. Please confirm it regularly.
2. Tra
educate and guide a carrier
to prevent rough handling.
nsportation
If you transport the products, please pack them so that
the package will not be damaged by mechanical
vibration / shock and please
FREQUENCY CONTROL PRODUCTS
TYPE HAND. GUIDELINES REVISION 05 CHECKED NE DATE 29.10.2007 PAGE
RoHS SMD PRODUCTS SOLDERING GUIDELINES
1. WASHING CONDITIONS
Our non hermetic SMD products are strictly non-washable as liquid cleaning solutions could penetrate the base to cap seal.
No-washing type flux with no washing is highly recommended. Please consult factory for any other process.
2. REFLOW SOLDERING CONDITIONS
Reflow profile:
25
Ts min
Ts max
Tp
TL
ts
t
L
tpt 25 °C to P e a k
Temperature
Time
PROFILE DATA
Minimum preheat temperature Ts min 150°C
Maximum preheat temperature Ts max 200°C
Preheat time Ts min to TS max 90 - 180 seconds
Average ramp-up rate Ts max to Tp 3°C/second max.
Reflow temperature TL 217°C
Reflow time tL 60 - 150 seconds
Peak temperature TP According to Jedec J-STD-020C
Peak time tp 20 - 40 seconds
Average down ramp rate 6°C/seconds max.
Time 25°C to peak temperature 8 min max.
This profile is applicable for the following packages: S1, S2, S3, S4, S5, S7, S8, S11, S13, and S15
Additional recommendations:
• do not vibrate during reflow soldering
• do not reflow solder on back side
• Only one reflow is allowed
• solder adhesion may vary depending on the motherboard’s thermal capacity and other factors
Hand soldering (not recommended):
Maximum temperature: 300°C/5 sec, fine tipped soldering iron
