TD62001~004AP/AF
2006-06-13
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TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62001AP,TD62001AF,TD62002AP,TD62002AF,
TD62003AP,TD62003AF,TD62004AP,TD62004AF
7-channel Darlington Sink Driver
The TD62001AP/AF Series are high-voltage, high-current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
Features
z Output current (single output): 500 mA (max)
z High sustaining voltage output: 50 V (min)
z Output clamp diodes
z Inputs compatible with various types of logic
z Package type
AP: DIP-16 pin
AF: SOP-16 pin
Type Input base resistor Designation
TD62001AP/AF External General purpose
TD62002AP/AF 10.5-k + 7-V
Zenner diode 14-V to 25-V PMOS
TD62003AP/AF 2.7 k TTL, 5-V CMOS
TD62004AP/AF 10.5 k 6-V to 15-V PMOS,
CMOS
Pin Connection (top view)
TD62001AP, TD62002AP
TD62003AP, TD62004AP
TD62001AF, TD62002AF
TD62003AF, TD62004AF
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
SOP16-P-225-1.27: 0.16 g (typ.)
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Schematics (each driver)
TD62001AP/AF TD62002AP/AF TD62003AP/AF
TD62004AP/AF
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Output sustaining voltage VCE (SUS) −0.5 to 50 V
Output current IOUT 500 mA/ch
Input voltage VIN
(Note 1) −0.5 to 30 V
Input current IIN
(Note 2) 25 mA
Clamp diode reverse voltage VR 50 V
Clamp diode forward current IF 500 mA
AP 1.47
Power dissipation
AF
PD 0.625
(Note 3)
W
Operating temperature Topr −40 to 85 °C
Storage temperature Tstg −55 to 150 °C
Note 1: Except TD62001AP/AF
Note 2: Only TD62001AP/AF
Note 3: When mounted on a glass-epoxy PCB (30 mm × 30 mm × 1.6 mm, Cu area: 50%)
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Recommended Operating Conditions (Ta = −40°C to 85°C)
Characteristics Symbol Condition Min Typ. Max Unit
Output sustaining voltage VCE (SUS) 0 50 V
Duty = 10% 0 370
AP
Duty = 50% 0 130
Duty = 10% 0 233
Output current
AF
IOUT
Tpw = 25 ms
7 circuits
Ta = 85°C
Tj = 120°C
Duty = 50% 0 70
mA/ch
Input voltage
Except
TD62001AP/A
F
VIN 0 24 V
TD62002 14.5 24
TD62003 2.8 24
Input voltage (output on)
TD62004
VIN (ON) IOUT = 400 mA
hFE = 800
6.2 24
V
TD62001 0 0.6
TD62002 0 7.4
TD62003 0 0.7
Input voltage (output off)
TD62004
VIN (OFF)
0 1.0
V
Input current Only TD62001 IIN 0 10 mA
Clamp diode reverse voltage VR 50 V
Clamp diode forward current IF 350 mA
AP Ta = 85°C 0.76
Power dissipation
AF
PD Ta = 85°C (Note) 0.325
W
Note: When mounted on a glass-epoxy PCB (30 mm × 30 mm × 1.6 mm, Cu area: 50%)
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Electrical Characteristics (Ta = 25°C unless otherwise noted)
Characteristics Symbol
Test
Circuit Test Condition Min Typ. Max Unit
VCE = 50 V, Ta = 25°C 50
Ooutput leakage current ICEX 1
VCE = 50 V, Ta = 85°C 100
µA
IOUT = 350 mA, IIN = 500 µA 1.3 1.6
IOUT = 200 mA, IIN = 350 µA 1.1 1.3
Collectoremitter saturation voltage VCE (sat) 2
IOUT = 100 mA, IIN = 250 µA 0.9 1.1
V
DC current transfer ratio hFE 2 VCE = 2 V, IOUT = 350 mA 1000
TD62002 VIN = 20 V, IOUT = 350 mA 1.1 1.7
TD62003 VIN = 2.4 V, IOUT = 350 mA 0.4 0.7
Input current (output on)
TD62004
IIN (ON) 3
VIN = 9.5 V, IOUT = 350 mA 0.8 1.2
mA
Input current (output off) IIN (OFF) 4 IOUT = 500 µA, Ta = 85°C 50 65 µA
IOUT = 350 mA 13.7
TD62002
IOUT = 200 mA 11.4
IOUT = 350 mA 2.6
TD62003
IOUT = 200 mA 2.0
IOUT = 350 mA 4.7
Input voltage (output on)
TD62004
VIN (ON) 5 VCE = 2 V
hFE = 800
IOUT = 200 mA 4.4
V
VR = 50 V, Ta = 25°C 50
Clamp diode reverse current IR 6
VR = 50 V, Ta = 85°C 100
µA
Clamp diode forward voltage VF 7 IF = 350 mA 2.0 V
Input capacitance CIN 15 pF
Turnon delay tON 8 VOUT = 50 V, RL = 125 Ω
CL = 15 pF 0.1
Turnoff delay tOFF 8 VOUT = 50 V, RL = 125 Ω
CL = 15 pF 0.2
µs
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Test Circuit
1. ICEX 2. VCE (sat), hFE 3. IIN (ON)
4. IIN (OFF) 5. VIN (ON) 6. IR
7. VF
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8. tON, tOFF
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 , tr 5 ns, tf 10 ns
Note 2: Input conditions are shown as following:
Input Condition
Type Number R1 VIH
TD62001AP/AF 2.7 kΩ 3 V
TD62002AP/AF 0 13 V
TD62003AP/AF 0 3 V
TD62004AP/AF 0 8 V
Note 3: CL includes probe and jig capacitance.
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD6200XAF
TD6200XAF
TD6200XAP TD6200XAP
TD62001~004AP/AF
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TD62001~004AP/AF
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TD62001~004AP/AF
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TD62001AP/AF
TD62002AP/AF
TD62003AP/AF
TD62004AP/AF
① Type-AP Free-Air
② Type-AF Glass Epoxy PCB
30×30×1.6mm Cu 50%
③ Type-AF Free Air
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Package Dimensions
Weight: 1.11 g (Typ.)
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Package Dimensions
Weight: 0.16 g (Typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
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RESTRICTIONS ON PRODUCT USE 060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
