INTEGRATED CIRCUITS DATA SHEET TEA6810V; TEA6811V Front-end and PLL synthesizers for car radios Product specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1996 Jun 18 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V FEATURES * Synthesizer function which includes a Voltage Controlled Oscillator (VCO), dividers, phase detector, charge-pump and in-lock detector * FM mixer with AGC * AM RF amplifier with AGC * AM mixer. Minimum alignments are required due to wideband RF inputs and the common AM/FM VCO. APPLICATIONS High dynamic behaviour and minimum distortion is obtained by a special RF input design combined with AGC. High sensitivity is possible in combination with RF input FETs. * Car radios. GENERAL DESCRIPTION Minimum interference is experienced due a to special synthesizer loop design and ensuring that the I2C-bus is inoperative in the locked-tuned condition. The TEA6810V and TEA6811V, together with TEA6821V forms an AM/FM receiving concept for electronically tuned car radios. The reference frequency for the synthesizer and the I2C-bus information is delivered by the TEA6821V. The TEA681xV is an FM/AM front-end with one local synthesized oscillator for both AM and FM which is used together with the TEA6821T in a double-conversion concept. It delivers a first FM-IF of 72.2 MHz and, for MW/LW, a first AM-IF of 10.7 MHz. The programmable local/dx switch enables switching the gain of the FM mixer from normal AGC control (FM dx) to the forced 4th level of AGC (FM local). QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCCA1 analog supply voltage (pin 2) VCCA2 analog supply voltage (pin 13) 8.1 8.5 8.9 V VAMant AM AGC range see Fig.4 0.3 - 6.0 V VFMant FM AGC range see Fig.5 10 - 600 mV fAMant AM input frequency 0.144 - 22 MHz fFMant FM input frequency 60 - 108 MHz Tamb operating ambient temperature -40 - +85 C 4.75 5.0 5.25 V ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TEA6810V VSO40 plastic very small outline package; 40 leads SOT158-1 TEA6811V VSO40 plastic very small outline package; 40 leads; face down SOT158-2 1996 Jun 18 2 37 38 AM/FM OSCILLATOR VTUNE CHPOUT 32 30 34 31 3 LCKDET VCCA2 AGND2 12 33 AMSB2 AMPREC 27 28 FM AM/FM BUFFER AM/FM PROGRAMME DIVIDER N1 PHASE DETECTOR 14 frefN 26 22 RF AMPREO AM/FM TEA6810V TEA6811V 18 AMMIN 7 2 17 frefP VCCA1 n.c. 23 n.c. 10 n.c. BAND GAP I2C-BUS CONTROL 20 n.c. 5 4 SCL SDA DGND 9 VCCD 15 16 AMMON AMMOP 21 Vref 29 AMMGND RFGND MGE727 Product specification Fig.1 Block diagram. 8 19 TEA6810V; TEA6811V AGND1 24 AM/FM 13 6 25 AM N2 LOCK DETECTOR 1 AMPREI AMSB1 AM CHARGE PUMP BUFFER 3 AMAGCC FMAGCC 11 PIN DIODE DRIVER 39 40 FMIFOP FMIFON Philips Semiconductors 35 FMRFIP Front-end and PLL synthesizers for car radios 36 FMRFIN IPIDIO BLOCK DIAGRAM ndbook, full pagewidth 1996 Jun 18 VCCOSC OSCFDB OSCGND FMAGCref OSCTNK Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V PINNING PIN(1) DESCRIPTION SYMBOL TEA6810 TEA6811 AGND1 1 1 analog ground 1 VCCA1 2 2 analog supply voltage 1 (+5 V) LCKDET 3 3 lock detector flag SDA 4 4 serial data input/output; I2C-bus SCL 5 5 serial clock input; I2C-bus frefN 6 6 reference frequency input from TEA6821 N-terminal frefP 7 7 reference frequency input from TEA6821 P-terminal DGND 8 8 digital ground VCCD 9 9 digital supply voltage (+5 V) n.c. 10 10 not connected FMIFON 11 11 FM mixer negative output (72.2 MHz) FMIFOP 12 12 FM mixer positive output (72.2 MHz) VCCA2 13 13 analog supply voltage 2 (+8.5 V) AGND2 14 14 analog ground 2 AMMOP 15 15 AM mixer positive output (10.7 MHz) AMMON 16 16 AM mixer negative output (10.7 MHz) n.c. 17 17 not connected AMMIN 18 18 AM mixer RF input Vref 19 19 reference voltage output from AM band gap n.c. 20 20 not connected AMMGND 21 21 AM mixer ground AMPREO 22 22 AM preamplifier output n.c. 23 23 not connected AMSB1 24 24 AM feedback switch SB1 AMSB2 25 25 AM feedback switch SB2 AMPREI 26 26 AM preamplifier input AMAGCC 27 27 AM AGC capacitor AMPREC 28 28 AM preamplifier decoupling capacitor RFGND 29 29 RF ground FMRFIP 30 30 RF positive input for FM mixer FMRFIN 31 31 RF negative input for FM mixer IPIDIO 32 32 pin diode drive FMAGCC 33 33 FM AGC integrating capacitor FMAGCref 34 34 FM AGC reference voltage OSCFDB 35 35 oscillator feedback input OSCGND 36 36 oscillator ground OSCTNK 37 37 oscillator tank output 1996 Jun 18 4 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V PIN(1) SYMBOL DESCRIPTION TEA6810 TEA6811 VCCOSC 38 38 oscillator supply voltage (+8.5 V) VTUNE 39 39 tuning voltage CHPOUT 40 40 charge pump output Note 1. Pins 10, 17, 20 and 23 should be connected to a common ground. 1996 Jun 18 5 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V handbook, halfpage handbook, halfpage CHPOUT 40 1 AGND1 VTUNE 39 2 VCCA1 38 VCCOSC VCCOSC 38 3 LCKDET 4 37 OSCTNK OSCTNK 37 4 SDA SCL 5 36 OSCGND OSCGND 36 5 SCL frefN 6 35 OSCFDB OSCFDB 35 6 frefN frefP 7 34 FMAGCref FMAGCref 34 7 frefP DGND 8 33 FMAGCC FMAGCC 33 8 DGND VCCD 9 32 IPIDIO IPIDIO 32 9 VCCD AGND1 1 40 CHPOUT VCCA1 2 39 VTUNE LCKDET 3 SDA FMRFIN 31 31 FMRFIN n.c. 10 FMIFON 11 30 FMRFIP FMRFIP 30 11 FMIFON FMIFOP 12 29 RFGND RFGND 29 12 FMIFOP VCCA2 13 28 AMPREC AMPREC 28 13 VCCA2 AGND2 14 27 AMAGCC AMAGCC 27 14 AGND2 AMMOP 15 26 AMPREI AMPREI 26 15 AMMOP AMMON 16 25 AMSB2 AMSB2 25 16 AMMON n.c. 17 24 AMSB1 AMSB1 24 17 n.c. n.c. 23 n.c. AMMIN 18 23 18 AMMIN Vref 19 22 AMPREO AMPREO 22 19 Vref n.c. 20 21 AMMGND AMMGND 21 20 n.c. MGE726 MGE725 Fig.2 Pin configuration (TEA6810). 1996 Jun 18 10 n.c. TEA6811V TEA6810V Fig.3 Pin configuration (TEA6811). 6 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V I2C-BUS ORGANIZATION The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes a module address and four data bytes are required. When used partially, the transmission must be ended by a stop condition. Table 1 Bit organization START MODULE ADDRESS S byte 0 Table 2 PROGRAMMABLE DIVIDER DATA A byte 1 A SWITCH CONTROL byte 2 A TEST byte 3 A STOP byte 4 A P I2C-bus address and received bytes BUS ADDRESS BYTES TO BE RECEIVED (4 BYTES) MSB LSB 1 1 0 0 0 1 0 0 Byte 1(1) program divider N1 (Low byte) S7 S6 S5 S4 S3 S2 S1 S0 Byte 2(1) program divider N1 (High byte) S15 S14 S13 S12 S11 S10 S9 S8 Byte 3 switching MSB in-lock counter LSB in-lock counter 1 = HIGH 0 = LOW current tuning oscillator 1 = HIGH 0 = LOW current charge pump 1 = FM local 0 = FM dx MSB divider N2 LSB divider N2 1 = FM 0 = AM Byte 4 testing 1 = 3-state 0 = normal charge pump 1 = fdiv 0 = LCKDET 1 = test 0 = normal in-lock counter X(2) X X X X Notes 1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum ratio; if N < 2048 then N1 divider ratio is {2048 + (N - 2)}. 2. X = don't care. Table 3 N2 divider Table 4 In-lock N2 DIVIDER MSB LSB IN-LOCK MSB LSB AM/FM 3 0 0 8 0 0 FM 5 0 1 16 1 0 AM or FM 10 1 0 32 1 1 AM or FM 15 1 1 48 0 0 AM 64 0 1 AM 1996 Jun 18 7 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCCA1 analog supply voltage (pin 2) -0.3 12 V VCCA2 analog supply voltage (pin 13) -0.3 12 V VCCD digital supply voltage (pin 9) -0.3 12 V VCCOSC oscillator supply voltage (pin 38) -0.3 12 V Ptot maximum power dissipation - 0.55 W Tstg storage temperature -65 +150 C Ves electrostatic handling -300 +300 V note 1 Note 1. Machine model: equivalent to discharging a 200 pF capacitor through 0 . HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE UNIT 90 K/W DC CHARACTERISTICS V13 = V38 = 8.5 V; V9 = V2 = 5.0 V; Tamb = 25 C; unless otherwise specified. SYMBOL PARAMETER ICCA1 analog input current (pin 2) ICCA2 analog input current (pin 13) ICCOSC CONDITIONS oscillator input current (pin 38) ICCD digital input current (pin 9) IAMMO AM mixer output current (pins 15 and 16) IFMIFO 1996 Jun 18 FM mixer output current (pins 11 and 12) 8 TYP. MAX. UNIT AM mode 7 9 mA FM mode 6 8 mA AM mode 17 22 mA FM mode 15 18 mA AM mode 4 6 mA FM mode 6 8 mA AM mode 32 35 mA FM mode 27 30 mA AM mode 8.5 - mA FM mode 0 - mA AM mode 0 - mA FM mode 10 - mA Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V AC CHARACTERISTICS All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT AM signal channel; (note 1; see Fig.4) RF PREAMPLIFIER STAGE Z21 40 65 - k AGC start level 1 - 750 - mV AGC start level 2 - 850 - mV AGC stop level 1 - 145 - mV AGC stop level 2 - 170 - mV transimpedance AGC STAGE; FI2 = 1 MHZ Vi2 HF input voltage IAGCsink AGC sink current V18 = V19 + 0.5 V; V27 = V19 - 1 - A IAGCsource AGC source current V18 = V19 - 0.5 V; V27 = V19 - 2 - mA MIXER (fO = 10.7 MHZ) Ri input resistance between pins 18 and 21 15(2) 20 - k Ci input capacitance between pins 18 and 21 - 5 - pF Co output capacitance between pins 15 and 16 - - 5(2) pF GmC conversion transconductance (I15 to I16/V18 to V19 2.4 2.75 3.1 mS GmC variation in conversion transconductance - -0.005 - mS/K IP3 third-order intermodulation 130(2) 137 - dBmV CP -1 dB compression point 114(2) 120 - dBmV Vn(eq) equivalent input noise voltage - 9 - nV/Hz - 15 - - 10 - - 5 - - 3 - OSCILLATOR/N2 DIVIDER RN2 internal divider ratio (N2) set by I2C-bus; see Table 3 REFERENCE VOLTAGE (PIN 19) Vo output reference voltage - 2.75 - V Zo output impedance - 40 - Io(max) maximum output current - - 0.1 mA 1996 Jun 18 9 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios SYMBOL PARAMETER TEA6810V; TEA6811V CONDITIONS MIN. TYP. MAX. UNIT FM signal channel (note 3; see Fig.5) MIXER Ri input resistance between pins 30 and 31 1.65(2) 2 - k Ci input capacitance between pins 30 and 31 3.4(2) 4 4.5(2) pF Ro output resistance between pins 11 and 12 10 - - k Co output capacitance between pins 11 and 12 6.5(2) 8 9(2) pF Gm transconductance I11 to I12/V30 to V31 < VAGC1 5.5 6.3 6.9 mS I11 to I12/V30 to V31 < VAGC2 - 4.7 - mS I11 to I12/V30 to V31 < VAGC3 - 2.3 - mS I11 to I12/V30 to V31 > VAGC3 - 1.0 - mS GmT variation in transconductance with temperature <VAGC1 - -0.015 - mS/K F noise figure (both sidebands) fi = 72.2 MHz; PLL tuned - 7(2) - dB IP3 third-order intermodulation 135(2) 139 - dBmV CP -1 dB compression point 120(2) 127 - dBmV IF1 1st IF rejection 25(2) 30 - dB VAGC(S) AGC start voltage between pins 30 and 31 VAGC(H) AGC hysteresis voltage start level 1 4.8 6.2 7.8 mV start level 2 - 15 - mV start level 3 - 39 - mV hysteresis level 1 - 1 - mV hysteresis level 2 - 2 - mV hysteresis level 3 - 3 - mV - 5 - k R33 FM AGC output resistance Ipin pin diode current V32 = 1.4 V 4 - - mA Vpin start level pin diode voltage between pins 30 and 31 Io = 1 mA - 57 - mV OSCILLATOR fosc oscillator frequency 116.8 - 207 MHz fosc/T oscillator temperature dependence - -90 - 10-6/K 1996 Jun 18 10 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios SYMBOL PARAMETER TEA6810V; TEA6811V CONDITIONS MIN. TYP. MAX. UNIT SYNTHESIZER (see Fig.6) Reference frequency input (pins 6 and 7) Vref(p-p) reference frequency input voltage (V6 to V7) (peak-to-peak value) - 0.4 - V ttrans reference frequency transition time - - 50 ns fref input reference frequency for: tuning step (kHz) N2 50 - - 50 - kHz AM standard SW1 5 10 - 50 - kHz AM full-band MW (USA) 10 5 - 50 - kHz FM 25 - - 25 - kHz AM full-band SW1 5 5 - 25 - kHz AM standard MW/LW 1 15 - 15 - kHz AM full-band MW/LW 3 5 - 15 - kHz AM full-band SW2 5 3 - 15 - kHz FM 10 - - 10 - kHz AM standard SW1 1 10 - 10 - kHz AM full-band MW/LW 1 5 - 5 - kHz AM full-band SW1 1 5 - 5 - kHz AM full-band SW2 1 3 - 5 - kHz FM Phase detector/charge pump IOL LOW level output charge pump current V40 = 4 V 120 175 215 A IOH HIGH level output charge pump current V40 = 4 V 0.85 1 1.2 mA VOL LOW level tuning voltage at charge pump LOW IO = 0.5Icharge; V13 = 8.5 V 0.2 - 8.25 V VOH HIGH level tuning voltage at charge pump HIGH IO = 0.5Icharge; V13 = 8.5 V 0.4 - 8.0 V Ioz 3-state output current V40 = 4 V -5 - +5 nA Hz fr(p-p) residual FM frequency (peak-to-peak value) B = 300 Hz to 20 kHz; Icharge = IOL; fi = 100 MHz - 9 16(2) tlock lock time FM = 88 to 108 MHz - 2 - ms FM = 108 to 88 MHz - 2 - ms AM = 510 to 1710 kHz - 2 - ms AM = 1710 to 510 kHz - 2 - ms 1996 Jun 18 11 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios SYMBOL PARAMETER TEA6810V; TEA6811V CONDITIONS MIN. TYP. MAX. UNIT Programmable divider Nmin minimum programmable ratio - 2 050 - Nmax maximum programmable ratio - 65537 - DR divider ratio for: tuning step (kHz) N2 FM 50 - 2050 - 3 604 FM 25 - 6388 - 7208 FM 10 - 15970 - 18020 FM 5 - 31940 - 36040 AM standard MW/LW 1 15 10844 - 12420 AM standard SW1 5 10 3320 - 4140 AM standard SW1 1 10 16600 - 20700 AM full-band MW/LW 3 5 10448 - 10973 AM full-band MW/LW 1 5 31344 - 32920 AM full-band SW1 5 5 6700 - 8240 AM full-band SW1 1 5 33500 - 41200 AM full-band SW2 5 3 8240 - 10640 AM full-band SW2 1 3 41200 - 53200 10 5 3172 - 3292 AM full-band MW (USA) In-lock detector (reset by any start condition on I2C-bus) VOH in-lock HIGH level output voltage (pin 3) 4.0 - 5.0 V VOL in-lock LOW level output voltage (pin 3) 0 - 0.4 V td in-lock delay - N x 1fref - ms counter length = N Notes 1. fi1 = 1053 kHz; fmod = 400 Hz; m = 0.3; Vi1 = Vi2 = 1 mV; N2 divider switched to divide-by-15. 2. Not measured 100% in production. 3. Vi1 = 1 mV; fi1 = 98 MHz; fmod = 1 kHz; f = 22.5 kHz. 1996 Jun 18 12 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V 50 10 nF 1 mH handbook, full pagewidth 20 k 50 Vo1 33 F V i2 Vref 18 19 22 AM/FM 50 20 k 4.7 nF 10 k 50 Vi1 10 k 33 F 1.5 F 24 25 AM RF 1 nF BB515 10 k 50 nH 2.7 pF 22 nF TEA6810V TEA6811V AGC N2 37 35 36 AM/FM OSCILLATOR I 2 C BUS CONTROL AM/ FM 9 V TUNE 8 4 5 VCCD 10 k 100 nF 10 k 5V SDA SCL Fig.4 AM test circuit. 1996 Jun 18 100 nF 12 AM/ FM 13 MLB828 Vo2 33 H 13 VCCA2 V CCOSC 38 1.8 pF 200 15 28 27 1:1 16 AM 29 8.5 V 21 BAND GAP 26 33 F 8.5 V Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios handbook, full pagewidth 100 nF 75 Vo3 TEA6810V; TEA6811V 33 TEA6810V TEA6811V 29 AGC 50 FM 50 f i1 11 31 30 12 Vo1 34 PIN DIODE DRIVE 32 8.5 V 10 k Vo2 50 nH 2.7 pF 13 VCCA2 100 nF 14 BUFFER VCCOSC 38 1.6 pF BB515 37 35 AM/FM OSCILLATOR 1 36 AM/FM V TUNE I 2 C BUS CONTROL 9 8 4 5 VCCD 10 k 100 nF 10 k 5V SDA SCL Fig.5 FM test circuit. 1996 Jun 18 1 k Vi1 50 1 nF 56 pF 14 MLB829 1 mH 33 F 8.5 V Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios handbook, full pagewidth 8.5 V VCCOSC 38 1.8 pF 1 nF 2.2 k BB515 Vo1 50 nH 2.7 pF TEA6810V; TEA6811V TEA6810V TEA6811V BUFFER 37 35 AM/FM OSCILLATOR PROGRAM DIVIDER N1 1 2 VCCA1 36 39 120 nF 12 nF 3.6 k 10 k 13 CHARGE PUMP 40 PHASE DETECTOR I 2 C BUS CONTROL 14 9 8 4 5 10 k 100 nF 10 k 5V SDA SCL Fig.6 Synthesizer test circuit. 15 1.2 k LOCK DETECTOR VCCD 1996 Jun 18 8 pF 1 3.3 nF 3 5V 1.2 k MLB830 Viref 0.4 V (p p) Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V INTERNAL PIN CONFIGURATION handbook, full pagewidth AGND1 1 40 VCCA1 LCKDET SDA 2 39 VTUNE 38 VCCOSC 3 4 TEA6810V TEA6811V 37 36 35 SCL frefN DGND VCCD n.c. FMIFON FMIFOP VCCA2 AGND2 AMMON n.c. 8 33 10 32 11 12 31 IPIDIO FMRFIN 14 15 29 FMRFIP RFGND 16 28 AMPREC 17 18 25 23 22 19 21 20 MGE728 Fig.7 Internal pin configuration. 1996 Jun 18 FMAGCC 13 24 n.c. FMAGCref 9 26 Vref OSCFDB 7 27 AMMIN OSCGND 6 30 AMMOP OSCTNK 5 34 frefP CHPOUT 16 AMAGCC AMPREI AMSB2 AMSB1 n.c. AMPREO AMMGND 6.4 MHz RTC 9 8 10 7 VSS 100 k MR 5 12 HEF4060B 47 pF 12 pF O8 O7 O9 150 nF VDD 13 4 14 3 15 2 16 1 47 F 47 F O3 6 O6 11 1 mH SCL 470 k RS 1 mH VCCA2 47 F 47 F 12 nF 1 k 50 kHz 3.3 nF 1 1 k 1 k O4 O5 10 k 220 nF 2 39 120 nF VTUNE 100 nF 1 pF 22 k TR4 10 k O13 1 k 10 k 3 38 1 k O11 TR2 TR3 17 4 37 5 36 6 35 7 34 8 33 9 32 47 k O12 3.6 k 40 1 k TR1 12.5 kHz FMOUT 4.7 nF 10 100 100 nF ANZAC TP103 1 nF FMAGCref 120 nF FMAGCC 120 nF IPIDIO 100 100 4.7 nF AMOUT 11 TEA6810V TEA6811V 31 FMIN ANZAC TP101 50 30 1 nF 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21 47 F 1 k 2.2 F 1 k AMAGCC 20 k 10 F AMPREI 50 k AMSB2 10 k AMSB1 10 k 10 nF AMPREO 1 mH 5 k AMMIN 50 47 F MGE729 Fig.8 Test board diagram. Product specification 12 TEA6810V; TEA6811V 4.7 nF 50 nH 1 nF 100 ANZAC TP103 2.2 k 2.7 pF 100 nF 4.7 nF OSCTNK 1.8 pF Philips Semiconductors CTC 1 k DGND Front-end and PLL synthesizers for car radios SDA 100 VCCD APPLICATION INFORMATION dbook, full pagewidth 1996 Jun 18 LCKDET VCCA1 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1996 Jun 18 EUROPEAN PROJECTION 18 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V VSO40: plastic very small outline package; 40 leads; face down SOT158-2 D E A y X c HE v M A Z 40 21 L Lp A1 Q (A 3) A2 A pin 1 index detail X 1 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Note 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-2 1996 Jun 18 EUROPEAN PROJECTION 19 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all VSO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all VSO packages. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 1996 Jun 18 20 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1996 Jun 18 21 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V NOTES 1996 Jun 18 22 Philips Semiconductors Product specification Front-end and PLL synthesizers for car radios TEA6810V; TEA6811V NOTES 1996 Jun 18 23 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 805 4455, Fax. +61 2 805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 708 296 8556 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 52 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 83749, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com/ps/ (1) ADDRESS CONTENT SOURCE April 6, 1998 (c) Philips Electronics N.V. 1996 SCA49 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 517021/02/pp24 Date of release: 1996 Jun 18 Document order number: 9397 750 00916