DATA SH EET
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC01
1996 Jun 18
INTEGRATED CIRCUITS
TEA6810V; TEA6811V
Front-end and PLL synthesizers for
car radios
1996 Jun 18 2
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
FEATURES
•Synthesizer function which includes a Voltage
Controlled Oscillator (VCO), dividers, phase detector,
charge-pump and in-lock detector
•FM mixer with AGC
•AM RF amplifier with AGC
•AM mixer.
APPLICATIONS
•Car radios.
GENERAL DESCRIPTION
The TEA6810V and TEA6811V, together with TEA6821V
forms an AM/FM receiving concept for electronically tuned
car radios.
The TEA681xV is an FM/AM front-end with one local
synthesized oscillator for both AM and FM which is used
together with the TEA6821T in a double-conversion
concept. It delivers a first FM-IF of 72.2 MHz and, for
MW/LW, a first AM-IF of 10.7 MHz.
Minimum alignments are required due to wideband RF
inputs and the common AM/FM VCO.
High dynamic behaviour and minimum distortion is
obtained by a special RF input design combined with AGC.
High sensitivity is possible in combination with RF input
FETs.
Minimum interference is experienced due a to special
synthesizer loop design and ensuring that the I2C-bus is
inoperative in the locked-tuned condition.
The reference frequency for the synthesizer and the
I2C-bus information is delivered by the TEA6821V.
The programmable local/dx switch enables switching the
gain of the FM mixer from normal AGC control (FM dx) to
the forced 4th level of AGC (FM local).
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VCCA1 analog supply voltage (pin 2) 4.75 5.0 5.25 V
VCCA2 analog supply voltage (pin 13) 8.1 8.5 8.9 V
VAMant AM AGC range see Fig.4 0.3 −6.0 V
VFMant FM AGC range see Fig.5 10 −600 mV
fAMant AM input frequency 0.144 −22 MHz
fFMant FM input frequency 60 −108 MHz
Tamb operating ambient temperature −40 −+85 °C
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TEA6810V VSO40 plastic very small outline package; 40 leads SOT158-1
TEA6811V VSO40 plastic very small outline package; 40 leads; face down SOT158-2
1996 Jun 18 3
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
BLOCK DIAGRAM
n
dbook, full pagewidth
MGE727
AM/FM
OSCILLATOR PIN DIODE
DRIVER
LOCK
DETECTOR
CHARGE
PUMP
PROGRAMME
DIVIDER N1 BAND
GAP
FM AM RF
AM/FM AM/FM
AM/FM TEA6810V
TEA6811V
AM/FM
BUFFER
OSCGND
OSCFDB
OSCTNK IPIDIO FMRFIP
FMRFIN
FMIFON
FMIFOP
AMPREC
AMSB2
AMSB1
AMPREI
FMAGCC
AMAGCC
VCCOSCFMAGCref
BUFFER
I2C-BUS CONTROLPHASE DETECTOR
N2 AM
36 35 37 38 34 32 30 31 11 12 33 27 28 25 24 26
AMPREO
AMMIN
Vref
22
18
19
159845201023172761
AGND1 n.c. n.c. n.c. n.c. SCL SDA DGND AMMOP
AMMON AMMGND RFGND
VCCD
frefN frefP VCCA1
VTUNE
VCCA2
CHPOUT
LCKDET
AGND2 14
13
3
40
39
16 21 29
Fig.1 Block diagram.
1996 Jun 18 4
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
PINNING
SYMBOL PIN(1) DESCRIPTION
TEA6810 TEA6811
AGND1 1 1 analog ground 1
VCCA1 2 2 analog supply voltage 1 (+5 V)
LCKDET 3 3 lock detector flag
SDA 4 4 serial data input/output; I2C-bus
SCL 5 5 serial clock input; I2C-bus
frefN 6 6 reference frequency input from TEA6821 N-terminal
frefP 7 7 reference frequency input from TEA6821 P-terminal
DGND 8 8 digital ground
VCCD 9 9 digital supply voltage (+5 V)
n.c. 10 10 not connected
FMIFON 11 11 FM mixer negative output (72.2 MHz)
FMIFOP 12 12 FM mixer positive output (72.2 MHz)
VCCA2 13 13 analog supply voltage 2 (+8.5 V)
AGND2 14 14 analog ground 2
AMMOP 15 15 AM mixer positive output (10.7 MHz)
AMMON 16 16 AM mixer negative output (10.7 MHz)
n.c. 17 17 not connected
AMMIN 18 18 AM mixer RF input
Vref 19 19 reference voltage output from AM band gap
n.c. 20 20 not connected
AMMGND 21 21 AM mixer ground
AMPREO 22 22 AM preamplifier output
n.c. 23 23 not connected
AMSB1 24 24 AM feedback switch SB1
AMSB2 25 25 AM feedback switch SB2
AMPREI 26 26 AM preamplifier input
AMAGCC 27 27 AM AGC capacitor
AMPREC 28 28 AM preamplifier decoupling capacitor
RFGND 29 29 RF ground
FMRFIP 30 30 RF positive input for FM mixer
FMRFIN 31 31 RF negative input for FM mixer
IPIDIO 32 32 pin diode drive
FMAGCC 33 33 FM AGC integrating capacitor
FMAGCref 34 34 FM AGC reference voltage
OSCFDB 35 35 oscillator feedback input
OSCGND 36 36 oscillator ground
OSCTNK 37 37 oscillator tank output
1996 Jun 18 5
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Note
1. Pins 10, 17, 20 and 23 should be connected to a common ground.
VCCOSC 38 38 oscillator supply voltage (+8.5 V)
VTUNE 39 39 tuning voltage
CHPOUT 40 40 charge pump output
SYMBOL PIN(1) DESCRIPTION
TEA6810 TEA6811
1996 Jun 18 6
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Fig.2 Pin configuration (TEA6810).
handbook, halfpage
TEA6810V
MGE725
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
CHPOUT
VTUNE
VCCOSC
OSCTNK
OSCGND
OSCFDB
FMAGCref
FMAGCC
IPIDIO
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
AMPREO
AMMGND
AGND1
VCCA1
LCKDET
SDA
SCL
frefN
frefP
DGND
VCCD
n.c.
FMIFON
FMIFOP
VCCA2
AGND2
AMMOP
AMMON
n.c.
AMMIN
Vref
n.c.
Fig.3 Pin configuration (TEA6811).
handbook, halfpage
TEA6811V
MGE726
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
CHPOUT
VTUNE
VCCOSC
OSCTNK
OSCGND
OSCFDB
FMAGCref
FMAGCC
IPIDIO
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
AMPREO
AMMGND
AGND1
VCCA1
LCKDET
SDA
SCL
frefN
frefP
DGND
VCCD
n.c.
FMIFON
FMIFOP
VCCA2
AGND2
AMMOP
AMMON
n.c.
AMMIN
Vref
n.c.
1996 Jun 18 7
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
I2C-BUS ORGANIZATION
The TEA6810V; TEA6811V is controlled via the I2C-bus which is driven from the TEA6821V. For programming purposes
a module address and four data bytes are required. When used partially, the transmission must be ended by a stop
condition.
Table 1 Bit organization
Table 2 I2C-bus address and received bytes
Notes
1. N1 divider ratio is (N + 2); where N is the programmed binary number composed of bytes 1 and 2. For the minimum
ratio; if N < 2048 then N1 divider ratio is {2048 + (N −2)}.
2. X = don’t care.
START MODULE
ADDRESS PROGRAMMABLE
DIVIDER DATA SWITCH
CONTROL TEST STOP
S byte 0 A byte 1 A byte 2 A byte 3 A byte 4 A P
BYTES TO
BE
RECEIVED
(4 BYTES)
BUS ADDRESS
MSB LSB
11000100
Byte 1(1)
program
divider N1
(Low byte)
S7 S6 S5 S4 S3 S2 S1 S0
Byte 2(1)
program
divider N1
(High byte)
S15 S14 S13 S12 S11 S10 S9 S8
Byte 3
switching MSB in-lock
counter LSB in-lock
counter 1 = HIGH
0 = LOW
current
tuning
oscillator
1 = HIGH
0 = LOW
current
charge
pump
1=FM
local
0 = FM dx
MSB
divider
N2
LSB divider
N2 1=FM
0=AM
Byte 4
testing 1 = 3-state
0 = normal
charge pump
1=f
div
0 = LCKDET 1 = test
0 = normal
in-lock
counter
X(2) XX X X
Table 3 N2 divider
N2 DIVIDER MSB LSB
300
501
10 1 0
15 1 1
Table 4 In-lock
IN-LOCK MSB LSB AM/FM
800FM
16 1 0 AM or FM
32 1 1 AM or FM
48 0 0 AM
64 0 1 AM
1996 Jun 18 8
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Machine model: equivalent to discharging a 200 pF capacitor through 0 Ω.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
V13 =V
38 = 8.5 V; V9=V
2= 5.0 V; Tamb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCCA1 analog supply voltage (pin 2) −0.3 12 V
VCCA2 analog supply voltage (pin 13) −0.3 12 V
VCCD digital supply voltage (pin 9) −0.3 12 V
VCCOSC oscillator supply voltage (pin 38) −0.3 12 V
Ptot maximum power dissipation −0.55 W
Tstg storage temperature −65 +150 °C
Ves electrostatic handling note 1 −300 +300 V
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 90 K/W
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
ICCA1 analog input current (pin 2) AM mode 7 9 mA
FM mode 6 8 mA
ICCA2 analog input current (pin 13) AM mode 17 22 mA
FM mode 15 18 mA
ICCOSC oscillator input current (pin 38) AM mode 4 6 mA
FM mode 6 8 mA
ICCD digital input current (pin 9) AM mode 32 35 mA
FM mode 27 30 mA
IAMMO AM mixer output current (pins 15 and 16) AM mode 8.5 −mA
FM mode 0 −mA
IFMIFO FM mixer output current (pins 11 and 12) AM mode 0 −mA
FM mode 10 −mA
1996 Jun 18 9
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
AC CHARACTERISTICS
All voltage and current values are RMS values; noise values are unweighted within the bandwidth 0.03 to 20 kHz;
unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
AM signal channel; (note 1; see Fig.4)
RF PREAMPLIFIER STAGE
Z21 transimpedance 40 65 −kΩ
AGC STAGE;FI2=1MHZ
V
i2 HF input voltage AGC start level 1 −750 −mV
AGC start level 2 −850 −mV
AGC stop level 1 −145 −mV
AGC stop level 2 −170 −mV
IAGCsink AGC sink current V18 =V
19 + 0.5 V; V27 =V
19 −1−µA
I
AGCsource AGC source current V18 =V
19 - 0.5 V; V27 =V
19 −2−mA
MIXER (fO= 10.7 MHZ)
Riinput resistance between pins
18 and 21 15(2) 20 −kΩ
Ciinput capacitance between
pins 18 and 21 −5−pF
Cooutput capacitance between
pins 15 and 16 −− 5
(2) pF
GmC conversion transconductance
(I15 to I16/V18 to V19
2.4 2.75 3.1 mS
∆GmC variation in conversion
transconductance −−0.005 −mS/K
IP3third-order intermodulation 130(2) 137 −dBmV
CP −1 dB compression point 114(2) 120 −dBmV
Vn(eq) equivalent input noise voltage −9−nV/√Hz
OSCILLATOR/N2 DIVIDER
RN2 internal divider ratio (N2) set by I2C-bus; see Table 3 −15 −
−10 −
−5−
−3−
REFERENCE VOLTAGE (PIN 19)
Vooutput reference voltage −2.75 −V
Zooutput impedance −40 −Ω
I
o(max) maximum output current −− 0.1 mA
1996 Jun 18 10
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
FM signal channel (note 3; see Fig.5)
MIXER
Riinput resistance between
pins 30 and 31 1.65(2) 2−kΩ
Ciinput capacitance between
pins 30 and 31 3.4(2) 4 4.5(2) pF
Rooutput resistance between
pins 11 and 12 10 −−kΩ
C
ooutput capacitance between
pins 11 and 12 6.5(2) 89
(2) pF
Gmtransconductance I11 to I12/V30 to V31 <V
AGC1 5.5 6.3 6.9 mS
I11 to I12/V30 to V31 <V
AGC2 −4.7 −mS
I11 to I12/V30 to V31 <V
AGC3 −2.3 −mS
I11 to I12/V30 to V31 >V
AGC3 −1.0 −mS
∆GmT variation in transconductance
with temperature <VAGC1 −−0.015 −mS/K
F noise figure
(both sidebands) fi= 72.2 MHz; PLL tuned −7(2) −dB
IP3third-order intermodulation 135(2) 139 −dBmV
CP −1 dB compression point 120(2) 127 −dBmV
αIF1 1st IF rejection 25(2) 30 −dB
VAGC(S) AGC start voltage between
pins 30 and 31 start level 1 4.8 6.2 7.8 mV
start level 2 −15 −mV
start level 3 −39 −mV
VAGC(H) AGC hysteresis voltage hysteresis level 1 −1−mV
hysteresis level 2 −2−mV
hysteresis level 3 −3−mV
R33 FM AGC output resistance −5−kΩ
Ipin pin diode current V32 = 1.4 V 4 −−mA
Vpin start level pin diode voltage
between pins 30 and 31 Io=1mA −57 −mV
OSCILLATOR
fosc oscillator frequency 116.8 −207 MHz
∆fosc/∆T oscillator temperature
dependence −−90 −10−6/K
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Jun 18 11
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
SYNTHESIZER (see Fig.6)
Reference frequency input (pins 6 and 7)
Vref(p-p) reference frequency input
voltage (V6to V7)
(peak-to-peak value)
−0.4 −V
ttrans reference frequency transition
time −− 50 ns
fref input reference frequency for: tuning step (kHz) N2
FM 50 −−50 −kHz
AM standard SW1 5 10 −50 −kHz
AM full-band MW (USA) 10 5 −50 −kHz
FM 25 −−25 −kHz
AM full-band SW1 5 5 −25 −kHz
AM standard MW/LW 1 15 −15 −kHz
AM full-band MW/LW 3 5 −15 −kHz
AM full-band SW2 5 3 −15 −kHz
FM 10 −−10 −kHz
AM standard SW1 1 10 −10 −kHz
AM full-band MW/LW 1 5 −5−kHz
AM full-band SW1 1 5 −5−kHz
AM full-band SW2 1 3 −5−kHz
Phase detector/charge pump
IOL LOW level output charge
pump current V40 = 4 V 120 175 215 µA
IOH HIGH level output charge
pump current V40 = 4 V 0.85 1 1.2 mA
VOL LOW level tuning voltage at
charge pump LOW IO= 0.5Icharge; V13 = 8.5 V 0.2 −8.25 V
VOH HIGH level tuning voltage at
charge pump HIGH IO= 0.5Icharge; V13 = 8.5 V 0.4 −8.0 V
Ioz 3-state output current V40 =4V −5−+5 nA
∆fr(p-p) residual FM frequency
(peak-to-peak value) B = 300 Hz to 20 kHz;
Icharge =I
OL; fi= 100 MHz −916
(2) Hz
tlock lock time FM = 88 to 108 MHz −2−ms
FM = 108 to 88 MHz −2−ms
AM = 510 to 1710 kHz −2−ms
AM = 1710 to 510 kHz −2−ms
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Jun 18 12
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Notes
1. fi1 = 1053 kHz; fmod = 400 Hz; m = 0.3; Vi1 =V
i2 = 1 mV; N2 divider switched to divide-by-15.
2. Not measured 100% in production.
3. Vi1 = 1 mV; fi1 = 98 MHz; fmod = 1 kHz; ∆f=±22.5 kHz.
Programmable divider
Nmin minimum programmable ratio −2050 −
Nmax maximum programmable ratio −65537 −
DR divider ratio for: tuning step (kHz) N2
FM 50 −2050 −3604
FM 25 −6388 −7208
FM 10 −15970 −18020
FM 5 −31940 −36040
AM standard MW/LW 1 15 10844 −12420
AM standard SW1 5 10 3320 −4140
AM standard SW1 1 10 16600 −20700
AM full-band MW/LW 3 5 10448 −10973
AM full-band MW/LW 1 5 31344 −32920
AM full-band SW1 5 5 6700 −8240
AM full-band SW1 1 5 33500 −41200
AM full-band SW2 5 3 8240 −10640
AM full-band SW2 1 3 41200 −53200
AM full-band MW (USA) 10 5 3172 −3292
In-lock detector (reset by any start condition on I
2
C-bus)
VOH in-lock HIGH level output
voltage (pin 3) 4.0 −5.0 V
VOL in-lock LOW level output
voltage (pin 3) 0−0.4 V
tdin-lock delay counter length = N −N×1⁄fref −ms
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1996 Jun 18 13
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Fig.4 AM test circuit.
handbook, full pagewidth
MLB828
AM
RF
AGC
AM
10 kΩ
20 kΩ50 Ω
50
Ω
20
kΩ
10 kΩ
26
24
22 18 19
25
28
27
35
37
36
38
29
4.7 nF
1.8 pF
2.7 pF
33 µF
1.5 µF
21
16
15
13
12
9845
V
i1
50 Ω
50
ΩVi2
Vref
Vo1
Vo2
VTUNE
8.5 V VCCOSC
8.5 V
VCCA2
5 V
VCCD
AM/FM
OSCILLATOR
50
nH
BB515
1 nF
10
kΩ
N2
BAND
GAP
AM/FM
AM/
FM
AM/
FM
10 nF 1 mH
33 µH
200
Ω
100
nF 33
µF
I C BUS
CONTROL
2
10 kΩ
10 kΩ
100 nF
SDA SCL
TEA6810V
TEA6811V
22
nF
1:1
33 µF
1996 Jun 18 14
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Fig.5 FM test circuit.
handbook, full pagewidth
MLB829
FM
AGC
PIN
DIODE
DRIVE
BUFFER
31
33
30
34
32
35
37
36
38
29
1.6 pF
2.7 pF
11
12
13
14
50 Ω
50
ΩVi1
75
ΩVo3
Vo2
Vo1
VTUNE
8.5 V VCCOSC
8.5 V
VCCA2
AM/FM
OSCILLATOR
50
nH
BB515
1 nF
10
kΩ1 Ω
1 mH
1 kΩ
100
nF 33
µF
9845
5 V
VCCD
AM/FM
I C BUS
CONTROL
2
10 kΩ
10 kΩ
100 nF
100 nF
SDA SCL
TEA6810V
TEA6811V
56
pF
50 Ω
fi1
1996 Jun 18 15
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
Fig.6 Synthesizer test circuit.
handbook, full pagewidth
MLB830
CHARGE
PUMP
40
39 13
2
1
14
5 V
VCCA1
0.4 V (p p)
35
37
36
38
1.8 pF
2.7 pF
Vo1
Viref
V
8.5 V CCOSC
AM/FM
OSCILLATOR
50
nH
BB515
1 nF
12
nF
120 nF
3.3
nF
2.2
kΩ
3.6
kΩ
10
kΩ
1 Ω
8 pF
9845 3
5 V
VCCD
I C BUS
CONTROL
2
PHASE
DETECTOR
PROGRAM
DIVIDER
N1
BUFFER
LOCK
DETECTOR
10 kΩ
10 kΩ
1.2 kΩ
1.2 kΩ
100 nF
SDA SCL
TEA6810V
TEA6811V
1996 Jun 18 16
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
INTERNAL PIN CONFIGURATION
Fig.7 Internal pin configuration.
handbook, full pagewidth
MGE728
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
CHPOUT
VTUNE
VCCOSC
OSCTNK
OSCGND
OSCFDB
FMAGCref
FMAGCC
IPIDIO
FMRFIN
FMRFIP
RFGND
AMPREC
AMAGCC
AMPREI
AMSB2
AMSB1
n.c.
AMPREO
AMMGND
AGND1
VCCA1
LCKDET
SDA
SCL
frefN
frefP
DGND
VCCD
n.c.
FMIFON
FMIFOP
VCCA2
AGND2
AMMOP
AMMON
n.c.
AMMIN
Vref
n.c.
TEA6810V
TEA6811V
1996 Jun 18 17
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
APPLICATION INFORMATION
d
book, full pagewidth
MGE729
10 kΩ
1 kΩ
1 kΩ
10 kΩ
50 kΩ
50 Ω
5 kΩ
20 kΩ
2.2 µF
10 µF
47 µF
TEA6810V
TEA6811V
HEF4060B
1
2
3
4
5
6
7
8
9
100 nF
100 nF
10 nF 1 mH
10
11
12
13
14
15
16
9
10
6.4
MHz 50
kHz
11
12
13
14
15
16
VSS
VCCA1 VCCD
VTUNE
FMAGCref
FMAGCC
IPIDIO
FMIN
AMAGCC
AMPREI
AMSB2
AMSB1
AMPREO
OSCTNK
DGND
1 mH
3.3 nF
120 nF
1 mH
VCCA2
O3
O6
O4
O5 TR4
TR3 TR2
TR1
FMOUT
AMOUT
AMMIN
ANZAC
TP103
ANZAC
TP103
ANZAC
TP101
4.7
nF
4.7
nF
4.7
nF
4.7
nF
220 nF
O13
O12
O11
8
7
6
5
4
3
2
1
CTC
LCKDET
SDA
SCL
RTC
RS
MR
O8
O7
O9
VDD
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1 kΩ1 kΩ
1 kΩ1 kΩ
22 kΩ
1 kΩ
1 kΩ
1 kΩ
10 kΩ
100 Ω
100 Ω
100 Ω
50 Ω
100 Ω
10 kΩ
10 kΩ
3.6 kΩ
2.2 kΩ
12 nF
100 nF
1 nF
1.8 pF
1 pF
2.7 pF
120 nF
120 nF
1 nF
1 nF
50 nH
47 kΩ
470 kΩ
100 kΩ
100 Ω
47 µF
47 µF
47
µF
47
µF
47
µF
47 pF
12 pF
12.5 kHz
150 nF
Fig.8 Test board diagram.
1996 Jun 18 18
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
PACKAGE OUTLINES
UNIT A1A2A3bpcD
(1) E(2) Z(1)
eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 2.25
12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-1 92-11-17
95-01-24
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40
20
21
1
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03 0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
0 5 10 mm
scale
VSO40: plastic very small outline package; 40 leads SOT158-1
A
max.
2.70
0.11
1996 Jun 18 19
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
UNIT A1A2A3bpcD
(1) E(2) eH
ELL
pQywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1 2.45
2.25 0.25 0.42
0.30 0.22
0.14 15.6
15.2 7.6
7.5 0.762 12.3
11.8 1.15
1.05 0.6
0.3 7
0
o
o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.4 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1.7
1.5
SOT158-2
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
y
40 21
201
pin 1 index
0.012
0.004 0.096
0.089 0.017
0.012 0.0087
0.0055 0.61
0.60 0.30
0.29 0.03
2.25
0.089
0.48
0.46 0.045
0.041 0.024
0.012
0.004
0.2
0.008 0.004
0.067
0.059
0.010
Z(1)
0 5 10 mm
scale
92-11-17
95-01-24
VSO40: plastic very small outline package; 40 leads; face down SOT158-2
A
max.
2.70
0.11
1996 Jun 18 20
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all VSO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1996 Jun 18 21
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Jun 18 22
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
NOTES
1996 Jun 18 23
Philips Semiconductors Product specification
Front-end and PLL synthesizers for
car radios TEA6810V; TEA6811V
NOTES
Internet: http://www.semiconductors.philips.com/ps/
(1) ADDRESS CONTENT SOURCE April 6, 1998
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1996 SCA49
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
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Printed in The Netherlands 517021/02/pp24 Date of release: 1996 Jun 18 Document order number: 9397 750 00916
