GP2S24J0000F Series
1
Sheet No.: D3-A01801EN
Date Oct. 3. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
GP2S24J0000F
Series
Detecting Distance : 0.7mm
Phototransistor Output,
Compact Refl ective
Photointerrupter
■Description
GP2S24J0000F Series is a compact-package, photo-
transistor output, refl ective photointerrupter, with emitter
and detector facing the same direction in a molding that
provides non-contact sensing. The compact package
series is a result of unique technology, combing transfer
and injection molding, that also blocks visible light to
minimize false detection.
■Features
1. Refl ective with Phototransistor Output
2. Highlights :
• Compact Size
3. Key Parameters :
• Optimal Sensing Distance : 0.7mm
• Package : 4×3×1.7mm
• Visible light cut resin package
4. Lead free and RoHS directive compliant
■Agency approvals/Compliance
1. Compliant with RoHS directive
■Applications
1. Detection of object presence or motion.
2. Example : printer, optical storage
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Internal Connection Diagram
Anode
Emitter
Collector
Cathode
3
2
4
1
1
2
3
4
θ
0.75
±15°
1.7
C0.7
1.75
Top view
(0.2) Emitter center
(4)
Date
code
mark
(0.4) Detector center
θ : 0 to 20°
∗4±0.2
4+0.2
−0.1
3.5+1
−0
3+0.2
−0.1
34
21
4−0.4+0.2
−0.1
4−(0.5)
4−0.15+0.2
−0.1
■Outline Dimensions (Unit : mm)
Product mass : approx. 0.04g
Plating material : SnCu (Cu : TYP. 2%)
• Tolerance : ±1.5mm
• ( ) : Reference dimensions
• The dimensions indicated by ∗ refer
to those measured from the lead
bending part.
•
The dimensions shown do not include
burr.
Burr's dimension : 0.15mm MAX.
3
Sheet No.: D3-A01801EN
GP2S24J0000F Series
Date code (Symbol)
January July
February August
March September
April October
May November
June December
Rank mark
There is no rank indicator.
Country of origin
Japan
4
Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Absolute Maximum Ratings
■Electro-optical Characteristics
(Ta=25˚C)
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
Reverse voltage VR6V
Power dissipation P 75 mW
Output
Collector-emitter voltage
VCEO 35 V
Emitter-collector voltage
VECO 6V
Collector current IC20 mA
Collector power dissipation PC75 mW
Total power dissipation Ptot 100 mW
Operating temperature Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
∗1Soldering temperature Tsol 260 ˚C
∗1 For 5s or less
(Ta=25˚C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=20mA −1.2 1.4 V
Reverse current IRVR=6V −−
10 μA
Output Collector dark current ICEO VCE=20V −1 100 nA
Transfer
charac-
teristics
∗2 Collector Current ICIF=4mA, VCE=2V 20 45 120 μA
Response time Rise time trVCE=2V, IC=100μA,
RL=1kΩ, d=1mm
−20 100 μs
Fall time tf−20 100
∗3 Leak current ILEAK IF=4mA, VCE=2V −−
100 nA
∗2 The condition and arrangement of the refl ective object are shown below.
The rank splitting of collector current (IC) shall be executed according to the table below.
Rank Collector current, IC [μA]
(IF=4mA, VCE=2V) Package sleeve color
A 20 to 42 Yellow
B 34 to 71 Transparent
C 58 to 120 Green
∗3 Without refl ective object.
Soldering area
1mm or more
●Test Conditon and Arrangement for Collector Current
d=1mm glass plate
Al evaporation
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Model Line-up
Model No. Rank Collector current IC[μA]
(IF=4mA, VCE=2V, Ta=25˚C)
GP2S24J0000F A, B or C 20 to 120
GP2S24BJ000F B 34 to 71
GP2S24CJ000F C 58 to 120
GP2S24ABJ00F A or B 20 to 71
GP2S24BCJ00F B or C 34 to 120
∗ The ratio of each rank can not be guaranteed.
Please contact a local SHARP sales representative to inquire about production status.
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
Fig.5 Collector Current vs.
Collector-Emitter Voltage
Fig.6 Relative Collector Current vs.
Ambient Temperature
Fig.3 Forward Current vs. Forward
Voltage
Fig.4 Collector Current vs.
Forward Current
00.5 1 1.5 2 2.5 3
1
10
100 25˚C
0˚C
50˚C
−25˚C
Ta=75˚C
Forward current IF (mA)
Forward voltage VF (V)
51015 25300
0
100
200
300
400
500
600
700
20
VCE=2V
Ta=25˚C
Collector current IC (μA)
Forward current IF (mA)
2468100
0
50
100
150
200
250
300
350
12
4mA
2mA
7mA
10mA
Ta=
25˚CIF=15mA
Collector current IC (μA)
Collector-emitter voltage VCE (V)
Relative collector current IC (%)
Ambient temperature Ta (˚C)
025−25
0
20
40
60
80
100
120
50 10075
IF=4mA
VCE=2V
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Power Dissipation vs.
Ambient Temperature
−25 0 25 50 75 85 100
0
10
20
30
40
50
60
Forward current IF (mA)
Ambient temperature Ta (˚C)
025−25
0
20
15
40
60
120
50 10075
80
75
100
85
Ptot
P, P C
Power dissipation P (mW)
Ambient temperature Ta (˚C)
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
Fig.7 Collector Dark Current vs.
Ambient Temperature
Fig.8 Response Time vs. Load
Resistance
Fig.9
Test Circuit for Response Time
Fig.10
Relative Collector Current vs.
Distance (Reference value)
Fig.11
Detecting Position Characteristics (1)
Fig.12
Detecting Position Characteristics (2)
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
75 100
5025
0
10−10
10−9
10−8
10−7
10−6
VCE=20V
Input Output
Output
Input
RD
R
Reflector
Plate
L
VCC
td
tr
tstf
90%
10%
Response time (μs)
Load resistance RL (kΩ)
0.1 1 10 100 1 000
0.1
1
10
100
1 000
VCE=2V
IC=100μA
Ta=25˚Ctr
tf
td
ts
Relative collector current (%)
Card moving distance L (mm)
0−1−224
80
100
40
60
20
0
61357
d=1mm
VCE=2V
IF=4mA
Ta=25˚C
Relative collector current (%)
Card moving distance L (mm)
−2−3024
80
100
40
60
20
0
6−11 3 5
d=1mm
IF=4mA
VCE=2V
Ta=25˚C
Relative collector current (%)
Distance between sensor and Al evaporation glass d (mm)
012 45
80
100
40
60
20
0
3
IF=4mA
VCE=2V
Ta=25˚C
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
Fig.13
Test Condition for Distance &
Detecting Position Characteristics
Fig.14
Freauency Response
Fig.15 Spectral Sensitivity (Detecting Side)
Al evaporated glass
d
Correspond to Fig.11
OMS card
L=0
d
−
White
1mm
Test condition
d=1mm
++
d=1mm
Test condition
1mm
White
−
d
L=0
OMS card
Correspond to Fig.12
Black Black
VCE =2V
IF=4mA
VCE =2V
IF=4mA
Correspond to Fig.10
Relative sensitivity (%)
Wavelength λ (nm)
600 700 800 900 1 000 1 200
80
100
40
60
20
0
1 100
Ta=25˚C
Voltage gain AV (dB)
Frequency f (Hz)
-20
−15
−10
−5
0
5
1kΩ
RL=10kΩ
VCE=2V
IC=100μA
Ta=25˚C
102103104105106
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Design Considerations
●Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Distance characteristic
Please refer to Fig.10 (Relative collector current vs. Distance) to set the distance of the photointerrupter
and the object.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In general, the emission of the IRED used in photointerrupter will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
●Parts
This product is assembled using the below parts.
• Photodetector (qty. : 1)
Category Material Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm) Response time (μs)
Phototransister Silicon (Si) 930 700 to 1 200 20
• Photo emitter (qty. : 1)
Category Material Maximum light emitting
wavelength (nm) I/O Frequency (MHz)
Infrared emitting diode
(non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material
Case Lead frame Lead frame plating
Black polyphernylene 42Alloy SnCu plating
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Manufacturing Guidelines
●Soldering Method
Flow Soldering:
Soldering should be completed below 260˚C and within 5 s.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any external force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by refl ow.
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Package specifi cation
●Sleeve package
Package materials
Sleeve : Polystyrene
Stopper : Styrene-Butadiene
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
MAX. 40 sleeves in one case.
Color of sleeve
Rank classifi cation is distinguished by the color of the sleeve as shown in the table below.
But the ratio of each rank can not be guaranteed.
Rank Color of sleeve
A Yellow
B Transparent
C Green
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Sheet No.: D3-A01801EN
GP2S24J0000F Series
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifi cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[H143]
