ZS300B - Formosa Microsemi co., LTD

Page 1

Formosa MS

Chip Zener Diode

ZS100B THRU ZS330B

1

2

3

4

5

6

7

8

List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Maximum ratings .............................................................................

Electrical characteristics...................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

Mechanical data...............................................................................

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

Features

Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

Glass passivated chip junction.

Standard zener voltage tolerance ±5%.

Low inductance.

Low profile package.

Built-in strain relief.

Lead-free parts meet environmental standards of

MIL-STD-19500 /228

Suffix "-H" indicates Halogen-free part, ex.ZS100B-H.

•

Mechanical data

•

• Case :

• Terminals :Plated terminals, solderable per MIL-STD-750,

Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.05 gram

Epoxy : UL94-V0 rated flame retardant

Molded plastic,JEDEC DO-214AC / SMA

Package outline

Page 2

1000mW Surface Mount Zener

Diodes - 100V-330V

PARAMETER CONDITIONS Symbol

VF

PD

MIN. TYP. MAX.

1.20

1000

UNIT

V

mW

Storage temperature

Operating temperature

TSTG

TJ-55

-65

+150

+175 oC

oC

o

Maximum ratings (at T =25 C unless otherwise noted)

A

Forward voltage

Power Dissipation

I = 200 mA

F

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

0.196(4.9)

0.180(4.5) 0.012(0.3) Typ.

0.106(2.7)

0.091(2.3)

0.068(1.7)

0.060(1.5)

0.032 (0.8) Typ.0.032(0.8) Typ.

Dimensions in inches and (millimeters)

SMA

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

Page 3

Note : 5% tolerance of Zener voltage for suffix "B" ex: ZS110B

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

o

Electrical characteristics (at T =25 C unless otherwise noted)

A

Marking

code

Zener

voltage

Test

current

Zener

impedance

Leakage

current

mA

IZT Z @ I

ZT ZT

Volts

Min. V @ I

Z ZT IZK IR

Volts

VR

Z @ I

ZK ZK

150

110

160

115

170

180

120

130

190

140

200

210

220

230

240

262.5

260

270

280

290

300

310

320

330

5.0

1500

750

2200

750

2200

850

1000

2500

1200

2500

1300

5000

0.25

0.5

120

80

130

85

140

90

95

105

110

150

165

170

175

180

190

195

200

210

215

220

225

233

240

5000

8000

9000

Part No.

ZS160B

ZS110B

ZS170B

ZS115B

ZS180B

ZS120B

ZS130B

ZS190B

ZS140B

ZS200B

ZS150B

ZS210B

ZS220B

ZS230B

ZS240B

ZS250B

ZS260B

ZS270B

ZS280B

ZS290B

ZS300B

ZS310B

ZS320B

ZS330B

Z160

Z110

Z170

Z115

Z180

Z120

Z130

Z190

Z140

Z200

Z150

Z210

Z220

Z230

Z240

Z250

Z260

Z270

Z280

Z290

Z300

Z310

Z320

Z330

Nom. V @ I

Z ZT Max. V @ I

Z ZT

Volts Volts

142.5

104.5

152

109.25

161.5

171

114

123.5

180.5

133

190

199.5

209

218.5

228

237.5

247

256.5

266

275.5

285

294.5

304

313.5

157.5

115.5

168

120.75

178.5

189

126

136.5

199.5

147

210

220.5

231

241.5

252

250

273

283.5

294

304.5

315

325.5

336

346.5

105 5.0 750 0.25 0.5 775000

ZS105B Z105 99.75 110.25

100 5.0 750 0.25 0.5 755000

ZS100B Z100 95 105

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

mA (uA)Max

(Ω)Max

Page 4

Rating and characteristic curves (ZS100B THRU ZS330B)

0.1

1.0

.01

10

FIG.2-TYPICAL FORWARD

CHARACTERISTICS

INSTANTANEOUS FORWARD CURRENT,(A)

FORWARD VOLTAGE,(V)

Pulse Width 300us

1% Duty Cycle

.6 .7 .8 .9 1.0 1.1 1.2 1.3

T =25 C

J

REVERSE POWER DISSIPATION (mW)

o

LEAD TEMPERATURE ( C)

FIG.1-TOTAL POWER DISSIPATION VS.

AMBIENT TEMPERATURE

0

200

400

600

800

1000

1200

40 80 120 160 200

.1

1.0

10

100

FIG.3 - TYPICAL REVERSE

CHARACTERISTICS

REVERSE LEAKAGE CURRENT, (mA)

PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%)

0 20 40 60 80 100 120 140

.01

T =25 C

J

FIG.4 - TYPICAL TEMPERATURE COEFFICIENTS

VZ TEMPERATURE COEFFICIENT @ IZT, mV/K

10 20 50 100 200 500 1000

VZ, ZENER VOLTAGE @ IZT, VOLTS

10

20

50

100

200

500

1000

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

Pinning information

12

Pin1 cathode

Pin2 anode

Pin Simplified outline Symbol

Page 5

2

1

Suggested solder pad layout

Dimensions in inches and (millimeters)

A

C

B

0.063 (1.60)

A

0.110 (2.80)

C

0.087 (2.20)

PACKAGE

SMA

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

Page 6

Packing information

Item Tolerance SMA

Carrier width

Carrier length

Carrier depth

Sprocket hole

13" Reel outside diameter

7" Reel outside diameter

13" Reel inner diameter

7" Reel inner diameter

Feed hole diameter

Sprocket hole position

Punch hole position

Punch hole pitch

Sprocket hole pitch

Embossment center

Reel width

Overall tape thickness

Tape width

P0

P1

E

B

C

d

F

T

W

P

A

D

D1

D2

W1

Symbol

0.1

min

0.5

0.1

0.3

1.0

0.1

2.0

unit:mm

1.50

330.00

178.00

50.00

62.00

13.00

1.75

5.50

4.00

2.00

0.23

12.00

18.00

P0

P1

E

B

d

F

W

P

A

D

D1

D2

W1

C

T

Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.

2.80

5.00

1.90

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

Page 7

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Reel packing

SMA 7" 2,000 4.0 20,000 183*170*183 178 382*356*387 160,000 16.0

PACKAGE REEL SIZE REEL

COMPONENT

SPACING BOX

INNER

BOX

REEL

DIA,

CARTON

SIZE CARTON

APPROX.

GROSS WEIGHT

(kg)(pcs)(m/m)(m/m)

(m/m)

(pcs)(m/m)

(pcs)

SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2

Document ID Issued Date Revised Date Revision Page.

Profile Feature Soldering Condition

Average ramp-up rate(TL to TP) <3 /sec

Preheat

o

-Temperature Min(Tsmin) 150 C

o

-Temperature Max(Tsmax) 200 C

-Time(min to max)(ts) 60~120sec

Tsmax to TL

o

-Ramp-upRate <3 C/sec

Time maintained above:

o

-Temperature(TL) 217 C

-Time(tL) 60~260sec

o o

Peak Temperature(TP) 255 C-0/+5 C

o

Time within 5 C of actual Peak

Temperature(tP)

o

Ramp-down Rate <6 C/sec

o

Time 25 C to Peak Temperature <6minutes

oC

3.Reflow soldering

10~30sec

1.Storage environment: Temperature=5 ~40 Humidity=55%±25%

2.Reflow soldering of surface-mount devices

o o

C C

Suggested thermal profiles for soldering processes

Critical Zone

TL to TP

TL

Tsmax

Tsmin

Ramp-up

Tp

tS

Preheat

o

t25 C to Peak

Time

25

TL

TP

Ramp-down

Temperature

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

Page 8

Formosa MS

Chip Zener Diode

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID Issued Date Revised Date Revision Page.

DS-121711 2008/02/10 2010/10/05 D 8

ZS100B THRU ZS330B

High reliability test capabilities

1. Solder Resistance

2. Solderability

3. High Temperature Reverse Bias

4. Pressure Cooker

5. Temperature Cycling

6. Thermal Shock

7. Humidity

8. High Temperature Storage Life

at 260 5 for 10 2sec.

immerse body into solder 1/16"±1/32"

O

at 245±5 C for 5 sec.

O

V =80% rate at T =150 C for 168 hrs.

R J

O

15P at T =121 C for 4 hrs.

SIG A

O O

-55 C to +125 C dwelled for 30 min.

and transferred for 5min. total 10 cycles.

O O

0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.

O

at T =85 C, RH=85% for 1000hrs.

A

O

at 175 C for 1000 hrs.

O

± C ± MIL-STD-750D

METHOD-2031

MIL-STD-202F

METHOD-208

MIL-STD-750D

METHOD-1038

JESD22-A102

MIL-STD-750D

METHOD-1051

MIL-STD-750D

METHOD-1056

MIL-STD-750D

METHOD-1021

MIL-STD-750D

METHOD-1031

Item Test Conditions Reference