TDA8714T/4/C1/S1 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1996 Jan 31

File under Integrated Circuits, IC02

1997 Oct 29

INTEGRATED CIRCUITS

TDA8714

8-bit high-speed analog-to-digital

converter

1997 Oct 29 2

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

FEATURES

•8-bit resolution

•Sampling rate up to 80 MHz

•No missing codes guaranteed

•High signal-to-noise ratio over a large analog input

frequency range (7.7 effective bits at 4.43 MHz

full-scale input at fclk = 80 MHz)

•Overflow/underflow 3-state TTL output

•TTL compatible digital inputs

•Low-level AC clock input signal allowed

•External reference voltage regulator

•Power dissipation only 340 mW (typical)

•Low analog input capacitance, no buffer amplifier

required

•No sample-and-hold circuit required.

APPLICATIONS

High-speed analog-to-digital conversion for:

•video data digitizing

•radar pulse analysis

•transient signal analysis

•high energy physics research

•Σ∆ modulators

•medical imaging.

GENERAL DESCRIPTION

The TDA8714 is an 8-bit high-speed Analog-to-Digital

Converter (ADC) for professional video and other

applications. It converts the analog input signal into 8-bit

binary-coded digital words at a maximum sampling rate of

80 MHz. All digital inputs and outputs are TTL compatible,

although a low-level sine wave clock input signal is

allowed.

QUICK REFERENCE DATA

Note

1. Full-scale sine wave (fi= 4.43 MHz; fclk = 80 MHz).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCCA analog supply voltage 4.75 5.0 5.25 V

VCCD digital supply voltage 4.75 5.0 5.25 V

VCCO output stages supply voltage 4.75 5.0 5.25 V

ICCA analog supply current −25 30 mA

ICCD digital supply current −27 33 mA

ICCO output stages supply current −16 20 mA

INL DC integral non-linearity −±0.4 ±0.5 LSB

DNL DC differential non-linearity −±0.2 ±0.35 LSB

AINL AC integral non-linearity note 1 −±0.5 ±1.0 LSB

fclk(max) maximum clock frequency

TDA8714/7 80 −−MHz

TDA8714/6 60 −−MHz

TDA8714/4 40 −−MHz

Ptot total power dissipation −340 435 mW

1997 Oct 29 3

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE

NUMBER PACKAGE SAMPLING

FREQUENCY (MHz)

NAME DESCRIPTION VERSION

TDA8714T/4 SO24 plastic small outline package; 24 leads;

body width 7.5 mm SOT137-1 40

TDA8714T/6 SO24 SOT137-1 60

TDA8714T/7 SO24 SOT137-1 80

TDA8714M/4 SSOP24 plastic shrink small outline package; 24 leads;

body width 5.3 mm SOT340-1 40

TDA8714M/6 SSOP24 SOT340-1 60

TDA8714M/7 SSOP24 SOT340-1 80

Fig.1 Block diagram.

handbook, full pagewidth

DGND

AGND

VRB

VRT

VCCD

VCCA

24 D2

OVERFLOW / UNDERFLOW

LATCH

TTL OUTPUTSLATCHES

ANALOG -TO-DIGITAL

CONVERTER

CLOCK DRIVER

MSA669

TTL OUTPUT

CLK

TDA8714

19 VCCO1

analog ground digital ground

analog

voltage input

overflow / underflow

output

data outputs

LSB

MSB

21 VCCO2

output ground

OGND

1997 Oct 29 4

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

PINNING

SYMBOL PIN DESCRIPTION

D1 1 data output; bit 1

D0 2 data output; bit 0 (LSB)

n.c. 3 not connected

VRB 4 reference voltage BOTTOM input

n.c. 5 not connected

AGND 6 analog ground

VCCA 7 analog supply voltage (+5 V)

VI8 analog input voltage

VRT 9 reference voltage TOP input

n.c. 10 not connected

O/UF 11 overﬂow/underﬂow data output

D7 12 data output; bit 7 (MSB)

D6 13 data output; bit 6

D5 14 data output; bit 5

D4 15 data output; bit 4

CLK 16 clock input

DGND 17 digital ground

VCCD 18 digital supply voltage (+5 V)

VCCO1 19 supply voltage for output stages 1

(+5 V)

OGND 20 output ground

VCCO2 21 supply voltage for output stages 2

(+5 V)

CE 22 chip enable input (TTL level input,

active LOW)

D3 23 data output; bit 3

D2 24 data output; bit 2 Fig.2 Pin configuration.

handbook, halfpage

TDA8714

n.c.

O/UF

VCCO1

OGND

AGND

n.c.

VRB

CLK

DGND

VCCD

VCCA

VRT

n.c.

MSA667

CCO2

1997 Oct 29 5

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. The supply voltages VCCA and VCCD may have any value between −0.3 V and +7.0 V provided the difference

between VCCA and VCCD is between −1 V and +1 V.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCCA analog supply voltage note 1 −0.3 +7.0 V

VCCD digital supply voltage note 1 −0.3 +7.0 V

VCCO output stages supply voltage note 1 −0.3 +7.0 V

∆VCC supply voltage differences between

VCCA and VCCD

−1.0 +1.0 V

∆VCC supply voltage differences between

VCCO and VCCD

−1.0 +1.0 V

∆VCC supply voltage differences between

VCCA and VCCO

−1.0 +1.0 V

VIinput voltage referenced to AGND −0.3 +7.0 V

Vclk(p-p) AC input voltage for switching

(peak-to-peak value) referenced to DGND −VCCD V

IOoutput current −10 mA

Tstg storage temperature −55 +150 °C

Tamb operating ambient temperature 0 +70 °C

Tjjunction temperature −+150 °C

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

SOT137-1 75 K/W

SOT340-1 119 K/W

1997 Oct 29 6

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

CHARACTERISTICS

VCCA =V

7to V6= 4.75 to 5.25 V; VCCD =V

18 to V17 = 4.75 to 5.25 V; VCCO =V

19 and V21 to V20 = 4.75 to 5.25 V;

AGND and DGND shorted together; VCCA to VCCD =−0.25 to +0.25 V; VCCO to VCCD =−0.25 to +0.25 V;

VCCA to VCCO =−0.25 to +0.25 V; Vi(p-p) = 1.75 V; Tamb = 0 to +70 °C; typical values measured at

VCCA =V

CCD =V

CCO = 5 V and Tamb =25°C; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VCCA analog supply voltage 4.75 5.0 5.25 V

VCCD digital supply voltage 4.75 5.0 5.25 V

VCCO output stages supply voltage 4.75 5.0 5.25 V

ICCA analog supply current −25 30 mA

ICCD digital supply current −27 33 mA

ICCO output stages supply current −16 20 mA

Inputs

CLOCK INPUT CLK (REFERENCED TO DGND); note 1

VIL LOW level input voltage 0 −0.8 V

VIH HIGH level input voltage 2.0 −VCCD V

IIL LOW level input current Vclk = 0.4 V −400 −−µA

IH HIGH level input current Vclk = 2.7 V −−300 µA

ZIinput impedance fclk = 80 MHz −18 −kΩ

CIinput capacitance fclk = 80 MHz −1−pF

INPUT CE (REFERENCED TO DGND); see Table 2

VIL LOW level input voltage 0 −0.8 V

VIH HIGH level input voltage 2.0 −VCCD V

IIL LOW level input current VIL = 0.4 V −400 −−µA

IH HIGH level input current VIH = 2.7 V −−20 µA

VI(ANALOG INPUT VOLTAGE REFERENCED TO AGND)

IIL LOW level input current VI= 1.2 V −0−µA

IH HIGH level input current VI= 3.5 V 60 130 280 µA

ZIinput impedance fi= 4.43 MHz −10 −kΩ

CIinput capacitance fi= 4.43 MHz −14 −pF

Reference voltages for the resistor ladder; see Table 1

VRB reference voltage BOTTOM 1.2 1.3 1.6 V

VRT reference voltage TOP 3.5 3.6 3.9 V

Vdiff differential reference voltage VRT − VRB 1.9 2.3 2.7 V

Iref reference current −11.5 −mA

RLAD resistor ladder −200 −Ω

TCRLAD temperature coefﬁcient of the resistor ladder −0.24 −ppm

VosB offset voltage BOTTOM note 2 275 285 295 mV

VosT offset voltage TOP note 2 305 315 325 mV

Vi(p-p) analog input voltage (peak-to-peak value) 1.45 1.75 2.15 V

1997 Oct 29 7

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Outputs

DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND)

VOL LOW level output voltage IO= 1 mA 0 −0.4 V

VOH HIGH level output voltage IO=−0.4 mA 2.7 −VCCD V

IO=−1 mA 2.4 −VCCD V

IOZ output current in 3-state mode 0.4V<V

O<V

CCD −20 −+20 µA

Switching characteristics

CLOCK INPUT CLK (note 1; see Fig.3)

fclk(max) maximum clock frequency

TDA8714/4 40 −−MHz

TDA8714/6 60 −−MHz

TDA8714/7 80 −−MHz

tCPH clock pulse width HIGH 6 −−ns

tCPL clock pulse width LOW 6 −−ns

Analog signal processing

LINEARITY

INL DC integral non-linearity −±0.4 ±0.5 LSB

DNL DC differential non-linearity −±0.2 ±0.35 LSB

AINL AC integral non-linearity note 3 −±0.5 ±1.0 LSB

BANDWIDTH (fclk = 40 MHz); note 4

B analog bandwidth full-scale sine wave −13 −MHz

75% full-scale sine

wave; small signal at

Vi=±5 LSB, code 128

−20 −MHz

tSTLH analog input settling time LOW-to-HIGH full-scale square

wave; Fig.6; note 5 −2.5 3.5 ns

tSTHL analog input settling time HIGH-to-LOW full-scale square

wave; Fig.6; note 5 −3.0 4.0 ns

HARMONICS (fclk = 40 MHz)

h1fundamental harmonics (full scale) fi= 4.43 MHz −−0dB

all harmonics (full scale);

all components fi= 4.43 MHz

second harmonics −−64 −60 dB

third harmonics −−58 −55 dB

THD total harmonic distortion fi= 4.43 MHz −−56 −dB

SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13)

S/N signal-to-noise ratio (full scale) without harmonics;

fclk = 40 MHz;

fi= 4.43 MHz

46 48 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Oct 29 8

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

EFFECTIVE BITS (note 6; see Figs 7 and 13)

EB effective bits

TDA8714/4 fclk = 40 MHz

fi= 4.43 MHz −7.75 −bits

fi= 7.5 MHz −7.6 −bits

effective bits

TDA8714/6 fclk = 60 MHz

fi= 4.43 MHz −7.7 −bits

fi= 7.5 MHz −7.55 −bits

fi= 10 MHz −7.4 −bits

effective bits

TDA8714/7 fclk = 80 MHz

fi= 4.43 MHz −7.7 −bits

fi= 7.5 MHz −7.5 −bits

fi= 10 MHz −7.2 −bits

fi= 15 MHz −6.3 −bits

TWO-TONE (note 7)

TTIR two-tone intermodulation rejection fclk = 40 MHz −−56 −dB

BIT ERROR RATE

BER bit error rate fclk = 40 MHz;

fi= 4.43 MHz;

VI=±16 LSB at

code 128

−10−11 −times/

samples

DIFFERENTIAL GAIN (note 8)

Gdiff differential gain fclk = 40 MHz;

fi= 4.43 MHz −0.6 −%

DIFFERENTIAL PHASE (note 8)

ϕdiff differential phase fclk = 40 MHz;

fi= 4.43 MHz −0.8 −deg

Timing (note 9; see Figs 3 and 5; fclk = 80 MHz)

tds sampling delay time −−2ns

houtput hold time 5 −−ns

tdoutput delay time −10 11 ns

3-state output delay times (see Fig.4)

tdZH enable HIGH −40 44 ns

tdZL enable LOW −12 16 ns

tdHZ disable HIGH −50 54 ns

tdLZ disable LOW −10 14 ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1997 Oct 29 9

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Notes to the characteristics

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock

must not be less than 1 ns.

2. Analog input voltages producing code 00 up to and including FF:

a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and

the reference voltage BOTTOM (VRB) at Tamb =25°C.

b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which

produces data outputs equal to FF at Tamb =25°C.

3. Full-scale sine wave (fi= 4.43 MHz; fclk = 80 MHz).

4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.

No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale

input (square-wave signal) in order to sample the signal and obtain correct output data.

6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent

fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency

(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB ×6.02 + 1.76 dB.

7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two

input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.

8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a

digital-to-analog converter.

9. Output data acquisition: the output data is available after the maximum delay time of td; in the event of 80 MHz clock

operation, the hardware design must take into account the tdand th limits with respect to the input characteristics of

the acquisition circuit.

1997 Oct 29 10

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Table 1 Output coding and input voltage (typical values; referenced to AGND)

Table 2 Mode selection

STEP VI(p-p) O/UF BINARY OUTPUT BITS

D7 D6 D5 D4 D3 D2 D1 D0

Underﬂow <1.585 1 0 0000000

0 1.585 0 0 0000000

1 . 000000001

. . .. ......

. . .........

254 . 011111110

255 3.28 0 1 1111111

Overﬂow >3.28 1 1 1111111

CE D7 to D0 O/UF

1 high impedance high impedance

0 active; binary active

Fig.3 Timing diagram.

handbook, full pagewidth

sample N + 1

sample N

CLK

MSA670

sample N + 2

50 %

DATA

D0 to D7

CPH

tCPL

VDDO

0 V

50 %

DATA

N + 1

DATA

N - 1

DATA

N - 2

1997 Oct 29 11

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

book, full pagewidth

MBD876

50 %

HIGH

LOW

dZH

dHZ

50 %

HIGH

LOW

dZL

dLZ

10 %

90 %

output

data

VCCD

output

data

3.3 kΩ

15 pF

VCCD

TDA8714

Fig.4 Timing diagram and test conditions of 3-state output delay time.

TEST S1

tdLZ VCCD

tdZL VCCD

tdHZ DGND

tdZH DGND

fCE = 100 kHz.

Fig.5 Load circuit for timing measurement.

handbook, halfpage

MBB956 - 1

D0 to D7

15 pF

1997 Oct 29 12

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Fig.6 Analog input settling-time diagram.

handbook, full pagewidth

MGD184

50 %

STLH

2 ns

code 0

code 255

50 %

0.5 ns

50 %

2 ns

STHL

50 %

0.5 ns

CLK

1997 Oct 29 13

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Fig.7 Fast Fourier Transform (fclk = 40 MHz; fi= 4.43 MHz).

Effective bits: 7.80; THD = −57.82 dB.

Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th = −68.88.

handbook, full pagewidth

7.50

120 0 2.50 5.00

MBD877

17.510.0 12.5 15.0 20.0

f (MHz)

100

amplitude

(dB)

Fig.8 Fast Fourier Transform (fclk = 80 MHz; fi= 10 MHz).

Effective bits: 7.27; THD = −49.23 dB.

Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th = −65.34.

handbook, full pagewidth

14.1

120 0 4.69 9.39

MBD878

32.918.8 23.5 28.2 37.5

f (MHz)

100

amplitude

(dB)

1997 Oct 29 14

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

INTERNAL PIN CONFIGURATIONS

Fig.9 TTL data and overflow/underflow outputs.

handbook, halfpage

MLB036

DGND

D7 to D0

O/UF

VCCO2

VCCO1

Fig.10 Analog inputs.

handbook, halfpage

MLB037

AGND

VCCA

(x 90)

Fig.11 CE (3-state) input.

ook, halfpage

MLB038

DGND

VCCO1

Fig.12 VRB and VRT.

handbook, halfpage

MEA050 - 1

AGND

VRB

VRM

VCCA

VRT

LAD

1997 Oct 29 15

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

Fig.13 CLK input.

handbook, full pagewidth

30 kΩ30 kΩ

VCCD

CLK

DGND

MCD189 - 1

ref

1997 Oct 29 16

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

APPLICATION INFORMATION

Fig.14 Application diagram.

The analog and digital supplies should be separated and decoupled.

The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value.

(1) VRB and VRT are decoupled to AGND.

(2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.

handbook, halfpage

TDA8714

VCCO1

OGND

CLK

VCCD

n.c.

O/UF

AGND

n.c.

VRB

VCCA

VRT

n.c.

MSA668

100 nF

DGND

VCCO2

AGND

(2)

(1)

(2)

(1)

(2)

1997 Oct 29 17

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 15.6

15.2 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT137-1

detail X

vMA

(A )

0.25

075E05 MS-013AD

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.61

0.60 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

95-01-24

97-05-22

1997 Oct 29 18

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

UNIT A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.21

0.05 1.80

1.65 0.38

0.25 0.20

0.09 8.4

8.0 5.4

5.2 0.65 1.25

7.9

7.6 0.9

0.7 0.8

0.4 8

0.13 0.10.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03

0.63

SOT340-1 MO-150AG 93-09-08

95-02-04

detail X

vMA

(A )

112

24 13

0.25

pin 1 index

0 2.5 5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

max.

2.0

1997 Oct 29 19

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Reﬂow soldering

Reflow soldering techniques are suitable for all SO and

SSOP packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

SSOP

Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following

conditions must be observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

•The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate

solder thieves at the downstream end.

Even with these conditions, only consider wave

soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or

SSOP20 (SOT266-1).

METHOD (SO AND SSOP)

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1997 Oct 29 20

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1997 Oct 29 21

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

NOTES

1997 Oct 29 22

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

NOTES

1997 Oct 29 23

Philips Semiconductors Product speciﬁcation

8-bit high-speed analog-to-digital converter TDA8714

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

South America: Rua do Rocio 220, 5th floor, Suite 51,

04552-903 São Paulo, SÃO PAULO - SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 829 1849

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 3 301 6312, Fax. +34 3 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 632 2000, Fax. +46 8 632 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2686, Fax. +41 1 481 7730

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,

Fax. +43 160 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 0044

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580920

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Middle East: see Italy

Printed in The Netherlands 547047/1200/06/pp24 Date of release: 1997 Oct 29 Document order number: 9397 750 02956