4 3 b 2 1 Tre euprose condition {ref Hr'is not fo be disckieed, reproduced or used, tn REVISIONS Corpora m witout a prior conor, & tcl no Hah i prone 10" dnclowe SYM ECN DESCRIPTION DATE APPROVED r uss any ini ion in io CTVOriT. CUSTOMER DRAWING 1 CDXXXX NEW RELEASE SEP.25,2013 YH 2 | CDXXXX UPDATE DRAWING SEP.26,2013 YH 22.00MAX 3 | CDXXXX UPDATE DRAWING NOV.22,2013 YH IMA P50 DMB 4 | CDXXXX ADD A DIMENSION AND UPDATE DRAWING APR.30,2014 YH 34x0.20 / "SER cy 2 Ope SECT oy, NOTE: o Amphenol | | PIN 75 20 1. MATERIAL: = Mi oF 110 PLASTIC: LCP, UL 94V-0, BLACK NSJxey io | CONTACT: COPPER ALLOY BOARD LOCK: ALLOY LI Uf 3 Uy ~- < 2. FINISHED: WORKING POSITION CONTACT AREA: SEE P/N SYSTEM MK SOLDER AREA: GOLD FLASH PIN 74 PIN 2 0.59 110 | BOARD LOCK: TIN PLATING LIM D 33x0.20 UNDERPLATED: NI PLATING | 3. ELECTRICAL PERFORMANCE: 3.1 CURRENT RATING: 0.5A PER PIN, VOLTAGE RATING: 50 VAC PER PIN LL 9.00MAX 3.2 DIELECTRIC STRENGTH: 300V AC FOR 1 MINUTE ws 20.15+0.05 6.75 3.3 INSULATION RESISTANCE: 500MQ MIN z 3.4 CONTACT RESISTANCE: 55m MAX CT 3.5 OPERATION TEMPERATURE: -40C TO +80C ] Ms 4. DIMENSIONING SHALL BE INTERPRETED PER ASME Y14.5M 1994 ll l 4 = 5. MATERIAL SHOULD BE FULFILLED AMPHENOL SPEC# S-SN-002 a FOR HALOGEN FREE PRODUCTS, ALSO NEED TO MEET # S-SN-004 00.90+0.08 mi $1.4.0+0.08 CA|0.10 ORDER P/N SYSTEM: PV AVEV VG S 475 510 FOR ALL SOLDER TAILS MDT XXX X XX 001 CONNECTOR HEIGHT PLATING XXX | DIME DIME 01 0.76 MICRONS GOLD PLATING 580 | 5.80MAX | &.14MAX 02 0.38 MICRONS GOLD PLATING 420 | &4.20MAX | 2.54MAX 03 GOLD FLASH 320 | 3.20MAX | 154MAX 38x0.30+0.03 275 | 2.75MAX | 0.89MAX CONNECTOR KEY ID JOIN TS 0.10[Z|X-Y 245 | 2.45MAX | 0.61MAX A-KEY A et B-KEYB * ETAL A Lo aw A Key a t : I | SS - = / _#1.60+0.05 | | \ wl Dy fe f i | \ S gu & | I] i] V3 PROPOSAL DRAWING a 38x1.55+0.03} | | om TA = \OSOTYP. | SS re 0.10 \50 L | 1s M 14.0 2.0 1.375 6.125 s \. ! / E 55 10.5 ~2.625 01102005 \ (|Z B 25 B35 1.125 -5 625 10+0. 37x0.30+0.03 3 X\,, 4 A 15 14.5 -6.625 PIN2/| | Te 2 ape ~ KEY ID DIMA DIMB DIM.C DIM.D REMARK n UNLESS OTHERWISE SPECIFIED APPROVAL DATE B = 2x1.20+0.03 TOLERANG ES METRIC | DRAWN | Yunx.ltu |APR.30,201 4 A mM p h eno | 0.10|Z|X-Y xX 4/- 0.50 |CHECKED|LY.vi _[APR.30,2014 eK 4 0.25 APPROVED . +/- RECOMMENDED M.2 MINI CARD MOUNTING TYPE SMT_ PCB OUTLINE DETAIL A FRACTIONS +/ > bomen TITLE DATUM Z: PCB SOLDER SURFACE SCALE 2.5:1 | FOR WATERIALS AND FINISHES | DRAWING MOT cMoTIODOOKXDO1 M.2 MINI PCle CONECTOR REMOVE SHARP EDGES ANGLE OF PROJECTION DIMENSIONS SIZE | DRAWING NO. REV. ve | wens C4 A3| c MDT-xxx-x-xx-001 | 4 (METRIC) (MM) SCALE | NONE | SHEET 1 OF 1 2 1