Ver 20150324
Type
Dimension [mm]
L
W
t
d
05
1.0±0.05
0.5±0.05
0.5±0.05
0.25±0.1
FEATURES
APPLICATION
CHARACTERISTIC DATA
DIMENSION
DESCRIPTION
Chip Bead For High Current
RECOMMENDED LAND PATTERN
CIC05Y Series (1005/ EIA 0402)
Part no.
Thickness
(mm)
Impedance
(Ω)±25%@100MHz
DC Resistance
(Ω) Max.
Rated Current
(mA) Max.
CIC05Y100
0.5±0.05
10
0.035
2200
CIC05Y300
0.5±0.05
30
0.035
2200
CIC05Y600
0.5±0.05
60
0.06
1700
CIC05Y800
0.5±0.05
80
0.07
1500
CIC05Y101
0.5±0.05
100
0.07
1500
CIC05Y121
0.5±0.05
120
0.09
1500
CIC series is used for high current. (~ 3A)
this type is the best for energy-saving
in the low DC resistance
0.40~0.50m
m
0.40~0.50mm
0.45~0.55mm
0.45~0.55m
m
Ver 20150324
CI C 05 Y 300 N C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) For High current(C:~3A)
(3) Dimension (4) Material Code
(5) Nominal impedance (300:30Ω, 121:120Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape(7"), D:Paper tape(13"), E:embossed tape)
PACKAGING
Packaging Style
Quantity(pcs/reel)
Card Board Taping (7'')
10,000
Card Board Taping (13'')
40,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW
SOLDERING
FLOW
SOLDERING
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question regarding the
data sheets, please contact our sales personnel or application engineers.