IS43TR81280A-15HBLI - Integrated Silicon Solution, Inc.

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 1

Rev. 00A

12/12/2011

128Mx8, 64Mx16 1Gb DDR3 SDRAM

ADVANCED INFORMATION

DECEMBER 2011

FEATURES

 Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V

Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V

 High speed data transfer rates with system

frequency up to 933 MHz

 8 internal banks for concurrent operation

 8Bits pre-fetch architecture

 Programmable CAS Latency: 5, 6, 7, 8, 9, 10 and

 Programmable Additive Latency: 0, CL-1,CL-2

 Programmable CAS WRITE latency (CWL) based

on tCK

 Programmable Burst Length: 4 and 8

 Programmable Burst Sequence: Sequential or

Interleave

 BL switch on the fly

 Auto Self Refresh(ASR)

 Self Refresh Temperature(SRT)

 Refresh Interval:

7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C

3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C

 Partial Array Self Refresh

 Asynchronous RESET pin

 TDQS (Termination Data Strobe) supported (x8

only)

 OCD (Off-Chip Driver Impedance Adjustment)

 Dynamic ODT (On-Die Termination)

 Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)

 Write Leveling

 Operating temperature:

Commercial (TC = 0°C to +95°C)

Industrial (TC = -40°C to +95°C)

Automotive, A1 (TC = -40°C to +95°C)

Automotive, A2 (TC = -40°C to +105°C)

OPTIONS

 Configuration:

128Mx8

64Mx16

 Package:

96-ball FBGA (9mm x 13mm) for x16

78-ball FBGA (8mm x 10.5mm) for x8

ADDRESS TABLE

Parameter 128Mx8 64Mx16

Row Addressing A0-A13 A0-A12

Column Addressing A0-A9 A0-A9

Bank Addressing BA0-2 BA0-2

Page size 1KB 2KB

Auto Precharge Addressing A10/AP A10/AP

BL switch on the fly A12/BC# A12/BC#

SPEED BIN

Speed Option 187F 15G 15H 125J 125K 107K 107L

Units

JEDEC Speed Grade DDR3-

1066F

DDR3-

1333G

DDR3-

1333H

DDR3-

1600J

DDR3-

1600K

DDR3-

1866K

DDR3-

1866L

CL-nRCD-nRP 7-7-7 8-8-8 9-9-9 10-10-10 11-11-11 11-11-11 12-12-12 tCK

tRCD,tRP(min) 13.125 12.0 13.5 12.5 13.75 11.77 12.84 ns

Note: Faster speed options are backward compatible to slower speed options.

Copyright©2011IntegratedSiliconSolution,Inc.Allrightsreserved.ISSIreservestherighttomakechangestothisspecificationanditsproductsatanytime

withoutnotice.ISSIassumesnoliabilityarisingoutoftheapplicationoruseofanyinformation,productsorservicesdescribedherein.Customersareadvised

toobtainthelatestversionofthisdevicespecificationbeforerelyingonanypublishedinformationandbeforeplacingordersforproducts.



IntegratedSiliconSolution,Inc.doesnotrecommendtheuseofanyofitsproductsinlifesupportapplicationswherethefailureormalfunctionoftheproduct

canreasonablybeexpectedtocausefailureofthelifesupportsystemortosignificantlyaffectitssafetyoreffectiveness.Productsarenotauthorizedforuse

insuchapplicationsunlessIntegratedSiliconSolution,Inc.receiveswrittenassurancetoitssatisfaction,that:

a.)theriskofinjuryordamagehasbeenminimized;

b.)theuserassumeallsuchrisks;and

c.)potentialliabilityofIntegratedSiliconSolution,Incisadequatelyprotectedunderthecircumstances

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 2

Rev. 00A

12/12/2011

1. DDR3 PACKAGE BALLOUT

1.1 DDR3 SDRAM package ballout 78-ball FBGA – x8

1 2 3 4 5 6 7 8 9

A VSS VDD NC NU/TDQS# VSS VDD

B VSS VSSQ DQ0 DM/TDQS VSSQ VDDQ

C VDDQ DQ2 DQS DQ1 DQ3 VSSQ

D VSSQ DQ6 DQS# VDD VSS VSSQ

E VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ

F NC1 VSS RAS# CK VSS NC

G ODT VDD CAS# CK# VDD CKE

H NC CS# WE# A10/AP ZQ NC

J VSS BA0 BA2 A15 VREFCA VSS

K VDD A3 A0 A12/BC# BA1 VDD

L VSS A5 A2 A1 A4 VSS

M VDD A7 A9 A11 A6 VDD

N VSS RESET# A13 NC/A14 A8 VSS

Note:

NC balls have no internal connection. NC/14 and NC/15 are one of NC pins and reserved for higher densities.

1.2 DDR3 SDRAM package ballout 96-ball FBGA – x16

1 2 3 4 5 6 7 8 9

A VDDQ DQU5 DQU7 DQU4 VDDQ VSS

B VSSQ VDD VSS DQSU# DQU6 VSSQ

C VDDQ DQU3 DQU1 DQSU DQU2 VDDQ

D VSSQ VDDQ DMU DQU0 VSSQ VDD

E VSS VSSQ DQL0 DML VSSQ VDDQ

F VDDQ DQL2 DQSL DQL1 DQL3 VSSQ

G VSSQ DQL6 DQSL# VDD VSS VSSQ

H VREFDQ VDDQ DQL4 DQL7 DQL5 VDDQ

J NC VSS RAS# CK VSS NC

K ODT VDD CAS# CK# VDD CKE

L NC CS# WE# A10/AP ZQ NC

M VSS BA0 BA2 NC/A15 VREFCA VSS

N VDD A3 A0 A12/BC# BA1 VDD

P VSS A5 A2 A1 A4 VSS

R VDD A7 A9 A11 A6 VDD

T VSS RESET# NC/A13 NC/A14 A8 VSS

Note:

NC balls have no internal connection. NC/13, NC/14 and NC/15 are one of NC pins and reserved for higher densities.

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 3

Rev. 00A

12/12/2011

1.3 Pinout Description - JEDEC Standard

Symbol Type Function

CK, CK# Input Clock: CK and CK# are differential clock inputs. All address and control input signals are sampled

on the crossing of the positive edge of CK and negative edge of CK#.

CKE, (CKE0),

(CKE1)

Input Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device

input buffers and output drivers. Taking CKE Low provides Precharge Power-Down and Self-

Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is

asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable during the

power on and initialization sequence, they must be maintained during all operations (including

Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers,

excluding CK, CK#, ODT and CKE, are disabled during power-down. Input buffers, excluding

CKE, are disabled during Self-Refresh.

CS#, (CS0#),

(CS1#), (CS2#),

(CS3#)

Input Chip Select: All commands are masked when CS# is registered HIGH. CS# provides for external

Rank selection on systems with multiple Ranks. CS# is considered part of the command code.

ODT, (ODT0),

(ODT1)

Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3

SDRAM. When enabled, ODT is only applied to each DQ, DQSU, DQSU#, DQSL, DQSL#, DMU,

and DML signal. The ODT pin will be ignored if MR1 and MR2 are programmed to disable RTT.

RAS#. CAS#.

WE#

Input Command Inputs: RAS#, CAS# and WE# (along with CS#) define the command being entered.

DM, (DMU),

(DML)

Input Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is

sampled HIGH coincident with that input data during a Write access. DM is sampled on both

edges of DQS. For x8 device, the function of DM or TDQS/TDQS# is enabled by Mode Register

A11 setting in MR1.

BA0 - BA2 Input Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write, or Precharge

command is being applied. Bank address also determines which mode register is to be accessed

during a MRS cycle.

A0 - A13 Input Address Inputs: Provide the row address for Active commands and the column address for Read/

Write commands to select one location out of the memory array in the respective bank. (A10/AP

and A12/BC# have additional functions; see below). The address inputs also provide the op-code

during Mode Register Set commands.

A10 / AP Input Auto-precharge: A10 is sampled during Read/Write commands to determine whether

Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH:

Autoprecharge; LOW: no Autoprecharge). A10 is sampled during a Precharge command to

determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If

only one bank is to be precharged, the bank is selected by bank addresses.

A12 / BC# Input Burst Chop: A12 / BC# is sampled during Read and Write commands to determine if burst chop

(on-the-fly) will be performed. (HIGH, no burst chop; LOW: burst chopped). See command truth

table for details.

RESET# Input Active Low Asynchronous Reset: Reset is active when RESET# is LOW, and inactive when

RESET# is HIGH. RESET# must be HIGH during normal operation. RESET# is a CMOS rail- to-

rail signal with DC high and low at 80% and 20% of VDD, i.e., 1.20V for DC high and 0.30V for

DC low.

DQ Input / Output Data Input/ Output: Bi-directional data bus.

DQU, DQL, DQS,

DQS#, DQSU,

DQSU#, DQSL,

DQSL#

Input / Output Data Strobe: output with read data, input with write data. Edge-aligned with read data, centered

in write data. For the x16, DQSL corresponds to the data on DQL0-DQL7; DQSU corresponds to

the data on DQU0-DQU7. The data strobes DQS, DQSL, and DQSU are paired with differential

signals DQS#, DQSL#, and DQSU#, respectively, to provide differential pair signaling to the

system during reads and writes. DDR3 SDRAM supports differential data strobe only and does

not support single-ended.

TDQS, TDQS# Output Termination Data Strobe: TDQS/TDQS# is applicable for x8 DRAMs only. When enabled via

Mode Register A11 = 1 in MR1, the DRAM will enable the same termination resistance function

on TDQS/TDQS# that is applied to DQS/DQS#. When disabled via mode register A11 = 0 in

MR1, DM/TDQS will provide the data mask function and TDQS# is not used. x16 DRAMs must

disable the TDQS function via mode register A11 = 0 in MR1.

NC No Connect: No internal electrical connection is present.

VDDQ Supply DQ Power Supply: 1.5 V +/- 0.075 V for standard voltage or 1.35V +0.1V, -0.067V for low voltage

VSSQ Supply DQ Ground

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 4

Rev. 00A

12/12/2011

VDD Supply Power Supply: 1.5 V +/- 0.075 V for standard voltage or 1.35V +0.1V, -0.067V for low voltage

VSS Supply Ground

VREFDQ Supply Reference voltage for DQ

VREFCA Supply Reference voltage for CA

ZQ, (ZQ0), (ZQ1),

(ZQ2), (ZQ3)

Supply Reference Pin for ZQ calibration Input only pins (BA0-BA2, A0-A13, RAS#, CAS#, WE#, CS#,

CKE, ODT, and RESET#) do not supply termination.

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 5

Rev. 00A

12/12/2011

ORDERING INFORMATION

64Mx16 - Commercial Range: (0°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS43TR16640A -187FBL 96-ball FBGA,Lead-free

1333MT/s 8-8-8 IS43TR16640A -15GBL 96-ball FBGA,Lead-free

1333MT/s 9-9-9 IS43TR16640A -15HBL 96-ball FBGA,Lead-free

1600MT/s 10-10-10 IS43TR16640A -125JBL 96-ball FBGA,Lead-free

1600MT/s 11-11-11 IS43TR16640A -125KBL 96-ball FBGA,Lead-free

64Mx16 - Industrial Range: (–40°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS43TR16640A -187FBLI 96-ball FBGA,Lead-free

1333MT/s 8-8-8 IS43TR16640A -15GBLI 96-ball FBGA,Lead-free

1333MT/s 9-9-9 IS43TR16640A -15HBLI 96-ball FBGA,Lead-free

1600MT/s 10-10-10 IS43TR16640A -125JBLI 96-ball FBGA,Lead-free

1600MT/s 11-11-11 IS43TR16640A -125KBLI 96-ball FBGA,Lead-free

64Mx16 – Automotive, A1 Range: (–40°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS46TR16640A -187FBLA1 96-ball FBGA,Lead-free

1333MT/s 8-8-8 IS46TR16640A -15GBLA1 96-ball FBGA,Lead-free

1333MT/s 9-9-9 IS46TR16640A -15HBLA1 96-ball FBGA,Lead-free

1600MT/s 10-10-10 IS46TR16640A -125JBLA1 96-ball FBGA,Lead-free

1600MT/s 11-11-11 IS46TR16640A -125KBLA1 96-ball FBGA,Lead-free

64Mx16 – Automotive, A2 Range: (–40°C ≤ TC ≤ 105°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS46TR16640A -187FBLA2 96-ball FBGA,Lead-free

1333MT/s 8-8-8 IS46TR16640A -15GBLA2 96-ball FBGA,Lead-free

1333MT/s 9-9-9 IS46TR16640A -15HBLA2 96-ball FBGA,Lead-free

1600MT/s 10-10-10 IS46TR16640A -125JBLA2 96-ball FBGA,Lead-free

1600MT/s 11-11-11 IS46TR16640A -125KBLA2 96-ball FBGA,Lead-free

Note: Contact ISSI for availability of options.

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 6

Rev. 00A

12/12/2011

ORDERING INFORMATION

128Mx8 - Commercial Range: (0°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS43TR81280A -187FBL 78-ball FBGA,Lead-free

1333MT/s 8-8-8 IS43TR81280A -15GBL 78-ball FBGA,Lead-free

1333MT/s 9-9-9 IS43TR81280A -15HBL 78-ball FBGA,Lead-free

1600MT/s 10-10-10 IS43TR81280A -125JBL 78-ball FBGA,Lead-free

1600MT/s 11-11-11 IS43TR81280A -125KBL 78-ball FBGA,Lead-free

128Mx8 - Industrial Range: (–40°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS43TR81280A -187FBLI 78-ball FBGA,Lead-free

1333MT/s 8-8-8 IS43TR81280A -15GBLI 78-ball FBGA,Lead-free

1333MT/s 9-9-9 IS43TR81280A -15HBLI 78-ball FBGA,Lead-free

1600MT/s 10-10-10 IS43TR81280A -125JBLI 78-ball FBGA,Lead-free

1600MT/s 11-11-11 IS43TR81280A -125KBLI 78-ball FBGA,Lead-free

128Mx8 – Automotive, A1 Range: (–40°C ≤ TC ≤ 95°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS46TR81280A -187FBLA1 78-ball FBGA,Lead-free

1333MT/s 8-8-8 IS46TR81280A -15GBLA1 78-ball FBGA,Lead-free

1333MT/s 9-9-9 IS46TR81280A -15HBLA1 78-ball FBGA,Lead-free

1600MT/s 10-10-10 IS46TR81280A -125JBLA1 78-ball FBGA,Lead-free

1600MT/s 11-11-11 IS46TR81280A -125KBLA1 78-ball FBGA,Lead-free

128Mx8 – Automotive, A2 Range: (–40°C ≤ TC ≤ 105°C)

Data Rate CL-tRCD-tRP Order Part No. Package

1066MT/s 7-7-7 IS46TR81280A -187FBLA2 78-ball FBGA,Lead-free

1333MT/s 8-8-8 IS46TR81280A -15GBLA2 78-ball FBGA,Lead-free

1333MT/s 9-9-9 IS46TR81280A -15HBLA2 78-ball FBGA,Lead-free

1600MT/s 10-10-10 IS46TR81280A -125JBLA2 78-ball FBGA,Lead-free

1600MT/s 11-11-11 IS46TR81280A -125KBLA2 78-ball FBGA,Lead-free

Note: Contact ISSI for availability of options.

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 7

Rev. 00A

12/12/2011

PACKAGE OUTLINE DRAWING

78-ball BGA (8mm x 10.5mm): 0.8mm x 0.8mm Pitch (x8)

Bottom View

6.40

Min 0.1 Min 0.1

Min. 0.40

Max. 0.50

Min. 0.25

Max. 0.40

Max. 1.20

78 x ø

8.00 +/- 0.10

10.50 +/- 0.10

9.60

0.8

IS43/46TR16640A/AL, IS43/46TR81280A/AL

Integrated Silicon Solution, Inc. – www.issi.com – 8

Rev. 00A

12/12/2011

PACKAGE OUTLINE DRAWING

96-ball BGA (9mm x 13mm): 0.8mm x 0.8mm Pitch (x16)

Bottom View

6.40

12.00

0.8

Min 0.1 Min 0.1

9.00 +/- 0.10

Min. 0.40

Max. 0.50

96 x ø

Min. 0.25

Max. 0.40

Max. 1.20

13.00 +/- 0.10