ASMT-QWBE-Nxxxx
Super 0.5W Cool White Power PLCC-4
Surface Mount LED Indicator
Data Sheet
CAUTION: ASMT-QWBE-Nxxxx LEDs are ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Description
The Super 0.5W Cool White Power PLCC-4 SMT LED is rst
Cool white mid-Power PLCC-4 SMT LEDs using InGaN
chip technology. The package can be driven at high
current due to its superior package design. The product
is able to dissipate the heat more e ciently compared to
the Power PLCC-4 SMT LEDs. These LEDs produce higher
light output with better ux performance compared to
the Power PLCC-4 SMT LED.
The Super 0.5W Cool White Power PLCC-4 SMT LEDs are
designed for higher reliability, better performance, and
operate under a wide range of environmental conditions.
The performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh condi-
tions such as in automotive applications, and in electron-
ics signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and sub color bin, to provide
close uniformity.
Features
• Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
• High reliability package with enhanced silicone resin
encapsulation
• High brightness with optimum ux performance
using InGaN chip technologies
• Available in Cool White
• Available in 8mm carrier tape & 7 inch reel
• Low Thermal Resistance 40°C/W
• Super wide viewing angle at 120 degree
• JEDEC MSL 2a
Applications
1. Interior automotive
a. Instrument panel backlighting
b. Central console backlighting
c. Navigation and audio system backlighting
d. Dome/Map lighting
e. Push button backlighting
f. Puddle lamp.
g. Glove compartment illumination
2. Exterior automotive
a. Number plate illumination
3. Electronic signs and signals
a. Decorative lighting
4. Office automation, home appliances, industrial
equipment
a. Panel/button backlighting
b. Display backlighting
2
3.6 ± 0.2
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3
CC
AA
0.79 ± 0.3
CATHODE
MARKING
Ø 2.4
1.15 ± 0.2
0.41 (TYP .)
0.56 (TYP .)
0.97
Package Drawing
Figure 1. Package Drawing
Table 1. Device Selection Guide (TJ = 25 °C)
Color Part Number
Luminous Flux, ΦV[1] (lm)
Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)
Cool White ASMT-QWBE-NFH0E 15.0 19.5 33.0 150 InGaN
Notes:
1. ΦV is the total luminous ux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
Notes:
1. All dimensions in millimeters
2. Lead polarity as shown in gure 13.
3. Terminal nish: Ag plating.
4. Encapsulation material: silicone resin.
A S M T - Q X1B E – N X 2X3X4X5
Packaging Option
Colour Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
W - Cool White
3
Table 2. Absolute Maximum Ratings (TA = 25 °C)
Parameters ASMT-QWBE-Nxxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 513 mW
Reverse Voltage -4V
Junction Temperature 125 °C
Operating Temperature -40 °C to +110 °C
Storage Temperature -40 °C to +110 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25 °C)
Color Part Number
Dice
Technology
Typical
Chromaticity
Coordinates
Viewing
Angle 2θ½[1]
(Degrees)
Luminous
E ciency
ηe (lm/W)
Total Flux /
Luminous Intensity
ΦV (lm) / IV (cd)
x y Typ. Typ. Typ.
Cool White ASMT-QWBE-Nxxxx InGaN 0.33 0.33 120 40 2.75
Notes:
1. θ½ is the o -axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25 °C)
Part Number
Forward Voltage VF (Volts) @ IF = 150 mA
Thermal Resistance RθJ-P (°C/W)Typ. Max.
ASMT-QWBE-NFH0E 3.6 4.1 40
4
Figure 4. Relative Flux Vs. Forward Current Figure 5. Relative Flux Vs. Temperature
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
DeratedBased on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.
0
0.2
0.4
0.6
0.8
1.0
1.2
0 30 60 90 120 150
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 150 mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 25°C)
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120
TEMPERATURE (°C)
CURRENT - mA
RJA = 90°C/W
RJA = 110°C/W
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120
TEMPERATURE (°C)
CURRENT - mA
RJP = 40°C/W
Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
0
50
100
150
200
250
300
350
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
5
Figure 10. Radiation Pattern
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
Figure 9. Forward Voltage Shift Vs. Temperature.
Figure 8. Chromaticity shift Vs. forward current
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
-0.015
-0.010
-0.005
0.000
0.005
0.010
0 50 100 150 200 250 300
FORWARD CURRENT - mA
COORDINATE SHIFT
Cy
Cx
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 25°C, RθJ-A=110°C/W.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA= 85°C, RθJ-P=110°C/W.
0.00
0.10
0.20
0.30
0.40
0.00001 0.0001 0.001 0.01 0.1 0 10 100
tp - Time - (s)
CURRENT - A
CURRENT - A
0.00001 0.0001 0.001 0.01 0.1 0 10 100
tp - Time - (s)
0.00
0.10
0.20
0.30
0.40
D = tp
T
tp
IF
T
D =
0.05
0.10
0.25
0.50
1
D =
0.05
0.10
0.25
0.50
1
D = tp
T
tp
IF
T
6
Figure 13. Recommended Soldering Pad Pattern
Figure 11. Recommended Pick and Place Nozzle Size
Note: For detail information on re ow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
217ºC
200ºC
150ºC
60 - 120 SEC.
-6ºC/SEC. MAX.
3ºC/SEC. MAX.
3 C/SEC. MAX.
255 - 260ºC
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
Figure 12. Recommended Pb-free Re ow Soldering Pro le
CATHODE
MARKING
CATHODE
MARKING
A
C
A A
C C
C C
SOLDER MASK
ANODE
CATHODE
0.4
0.3
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
AA
CC
ID
Note: Diameter "ID" should
be bigger than 2.3mm
7
Figure 15. Tape Dimensions
Figure 16. Reeling Orientation
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.1 4 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5 +0.1
–0
8°
Ø1+0.1
–0
AA
CC
Figure 14. Tape Leader and Trailer Dimensions
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
8
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone
is a soft material, please do not press on the silicone
or poke a sharp object onto the silicone. These might
damage the product and cause premature failure. During
assembly or handling, the unit should be held on the
body only. Please refer to Avago Application Note AN
5288 for detail information.
Moisture Sensitivity
This product is quali ed as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the
reliability of the product. Do refer to Avago Application
Note AN5305 Handling of Moisture Sensitive Surface
Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to re ow
the LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for un nished reel
- For any unuse LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their oor life of 672 hours.
E. Baking is required if:
- “10%” is Not Green and “5%” HIC indicator is Azure.
- The LEDs are exposed to condition of >30°C / 60%
RH at any time.
- The LEDs oor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
Device Color (X1)
W Cool White
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
0 3.40 4.30
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X4)
Individual reel will contain parts from one sub bin only.
X4
0 Full Distribution
A 5K and 5L only
B 6K and 6L only
C 7K and 7L only
D 8K and 8L only
E 5K and 6K only
F 5L and 6L only
G 6K and 7K only
H 6L and 7L only
J 7K and 8K only
K 7L and 8L only
L 5K, 5L, 6K and 6L only
M 6K, 6L, 7K and 7L only
N 7K, 7L, 8K and 8L only
Z Special binning
9
Color Bin Limits
Bin ID Sub Bin ID Limits (Chromaticity Coordinates)
5K 5Ka x 0.296 0.304 0.302 0.294
y 0.259 0.270 0.276 0.264
5Kb x 0.294 0.302 0.300 0.291
y 0.264 0.276 0.281 0.268
5Kc x 0.304 0.313 0.312 0.302
y 0.270 0.284 0.291 0.276
5Kd x 0.302 0.312 0.310 0.300
y 0.276 0.291 0.297 0.281
5L 5La x 0.291 0.300 0.298 0.288
y 0.268 0.281 0.288 0.274
5Lb x 0.288 0.298 0.295 0.285
y 0.274 0.288 0.294 0.279
5Lc x 0.300 0.310 0.309 0.298
y 0.281 0.297 0.305 0.288
5Ld x 0.298 0.309 0.307 0.295
y 0.288 0.305 0.312 0.294
6K 6Ka x 0.313 0.322 0.321 0.312
y 0.284 0.297 0.305 0.291
6Kb x 0.312 0.321 0.320 0.310
y 0.291 0.305 0.314 0.297
6Kc x 0.322 0.330 0.330 0.321
y 0.297 0.310 0.320 0.305
6Kd x 0.321 0.330 0.330 0.320
y 0.305 0.320 0.330 0.314
6L 6La x 0.310 0.320 0.319 0.309
y 0.297 0.314 0.322 0.305
6Lb x 0.309 0.319 0.318 0.307
y 0.305 0.322 0.329 0.312
6Lc x 0.320 0.330 0.330 0.319
y 0.314 0.330 0.339 0.322
6Ld x 0.319 0.330 0.330 0.318
y 0.322 0.339 0.347 0.329
Bin ID Sub Bin ID Limits (Chromaticity Coordinates)
7K 7Ka x 0.330 0.336 0.337 0.330
y 0.310 0.320 0.330 0.320
7Kb x 0.330 0.337 0.337 0.330
y 0.320 0.330 0.341 0.330
7Kc x 0.336 0.343 0.344 0.337
y 0.320 0.331 0.341 0.330
7Kd x 0.337 0.344 0.345 0.337
y 0.330 0.341 0.352 0.341
7L 7La x 0.330 0.337 0.337 0.330
y 0.330 0.341 0.349 0.339
7Lb x 0.330 0.337 0.338 0.330
y 0.339 0.349 0.358 0.347
7Lc x 0.337 0.345 0.346 0.337
y 0.341 0.352 0.362 0.349
7Ld x 0.337 0.346 0.347 0.338
y 0.349 0.362 0.371 0.358
8K 8Ka x 0.343 0.351 0.352 0.344
y 0.331 0.343 0.354 0.341
8Kb x 0.344 0.352 0.354 0.345
y 0.341 0.354 0.364 0.352
8Kc x 0.351 0.360 0.362 0.352
y 0.343 0.357 0.369 0.354
8Kd x 0.352 0.362 0.364 0.354
y 0.354 0.369 0.380 0.364
8L 8La x 0.345 0.354 0.355 0.346
y 0.352 0.364 0.375 0.362
8Lb x 0.346 0.355 0.356 0.347
y 0.362 0.375 0.385 0.371
8Lc x 0.354 0.364 0.366 0.355
y 0.364 0.380 0.391 0.375
8Ld x 0.355 0.366 0.367 0.356
y 0.375 0.391 0.401 0.385
Tolerance of each bin limit = ±0.02
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch
0.25
0.27
0.29
0.31
0.33
0.35
0.37
0.39
0.41
0.28 0.30 0.32 0.34 0.36 0.38
X-COORDINATE
Y-COORDINATE
6Lb
6La
6Lc
6Ld 7Kb
7Ka
7Kc
7Kd
7Lb
7La
7Lc
7Ld
8Kb
8Ka
8Kc
8Kd
8Lb
8La
8Lc
8Ld
6Kb
6Ka
6Kc
6Kd
5Ld
7000K - 5600K
5600K - 5000K
5000K - 4500K
5Lc
5Kd
5Kc
5La
5Kb
5Ka
5Lb
10000K - 7000K
VF Bin Limits
Bin ID Min. Max.
S5 3.20 3.50
S6 3.50 3.80
S7 3.80 4.10
Tolerance of each bin limit = ±0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0741EN - September 30, 2011
