173
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP6002 Series
SP6002
ESD and EMI Filter Devices - SP6002 Series
Description
Applications
The Littelfuse SP6002 SPA series integrates 4 and 6 EMI
filters (C-R-C) into a small, low-profile DFN package with
each filter providing greater than -30dB attenuation at
1GHz. Additionally, each I/O is capable of shunting ±30kV
ESD strikes (IEC61000-4-2, contact discharge) away from
sensitive electronic components. The performance of this
small, slim design makes it extremely suitable for mobile
handsets, PDAs and notebook computers.
Features
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frequencies from
800MHz to 3GHz
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attenuation (TYP) at 1GHz
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±30kV contact, ±30kV air
t4NBMMMPXQSPmMFç%'/
(JEDEC MO-229) package
(TYP 0.5mm height)
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portable electronics
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interfaces for handsets
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portable electronics
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t4NBSUQIPOF
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device
Pinout
5
8
14
1
6
7
12
GND
GND
SP6002-04UTG-1
SP6002-06UTG-1
μDFN-08
μDFN-12
Functional Block Diagram
Cd Cd
18
Cd Cd
27
Cd Cd
36
Cd Cd
45
Cd Cd
112
Cd Cd
211
Cd Cd
310
Cd Cd
49
Cd Cd
58
Cd Cd
67
SP6002-04UTG-1 SP6002-06UTG-1
RoHS Pb GREEN
Application Example
Signal
Ground
Outside World
SP6002-04UTG (µDFN)
LCD Module
Controller
D1
D2
D3
D4
Input
5
8
1
4
GND
SP6002 Series 15pF 30kV EMI Filter Array
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
174
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP6002 Series
ESD and EMI Filter Devices - SP6002 Series
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
TOP Operating Temperature -40 to 85 °C
TSTOR Storage Temperature -60 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range -65 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 6.0 V
Breakdown Voltage VBR IR=1mA 7.0 7.8 8.5 V
Reverse Leakage Current ILEAK VRWM=5V 0.1 1.0 µA
Resistance RAIR=10mA 85 100 115
Diode Capacitance1,2 CDVR=2.5V,f=1MHz 15 pF
Line Capacitance1,2 CLVR=2.5V,f=1MHz 24 30 36 pF
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact Discharge) ±30 kV
IEC61000-4-2 (Air Discharge) ±30 kV
Cutoff Frequency3F-3dB
Above this frequency, appreciable
attenutation occurs 100 MHz
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2 Total line capacitance is two times the diode capacitance (CD).
3 50 source and 50 load termination
Analog Crosstalk (S41)Insertion Loss (S21)
3.000 000MHz Stop 6 000.000.000MHz
x2
Start
21 log MAG 5 dB/ REF 0 dB 1 _:-613 dB
CH1 S
Cor
Smo
1
START 3.000 000 MHz STOP 6 000.000 000 MHz
x2
Smo
Cor
Del
CH1 S log MAG 10 dB/ REF 0 dB
175
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP6002 Series
SP6002
ESD and EMI Filter Devices - SP6002 Series
Line Capacitance vs. DC Bias
0
10
20
30
40
50
60
DC Bias (V)
Capacitance (pF)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
PreheatPrehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Ordering Information
Part Number Package Size Marking Min. Order Qty.
SP6002-04UTG-1 DFN-08 1.7x1.35mm K*4 3000
SP6002-06UTG-1 DFN-12 2.5x1.35mm K*6 3000
Part Numbering System Part Marking System
SP 6002 ** U T G -1
Series
Package
μDFN-08 (1.7x1.35mm)
μDFN-12 (2.5x1.35mm)
T= Tape & Reel
G= Green
Number of Channels
04 = 4 Channel μDFN-08
06 = 6 Channel μDFN-12
–
Silicon Protection Array (SPATM)
Family of TVS Diode Arrays
J* *
Product Series
K = SP6002
Assembly Site
4 = μDFN-08
6 = μDFN-12
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
176
TVS Diode Arrays (SPA
™ Family of Products)
Revision: March 20, 2012
SP6002 Series
ESD and EMI Filter Devices - SP6002 Series
Package Dimensions — DFN-08
μDFN-08
JEDEC MO-229
Millimeters Inches
Min Max Min Max
A0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.127 REF 0.005 REF
b0.15 0.25 0.006 0.010
D1.60 1.80 0.063 0.071
D2 1.10 1.30 0.043 0.051
E1.25 1.45 0.049 0.057
E2 0.30 0.50 0.012 0.020
e0.400 BSC 0.016 BSC
K0.20 0.008 0.000
L0.15 0.35 0.006 0.014
D
EA
A1
A3
D2
E2
L
K
b
e
Package Dimensions — DFN-12
μDFN-12
JEDEC MO-229
Millimeters Inches
Min Max Min Max
A0.45 0.55 0.018 0.022
A1 0.00 0.05 0.000 0.002
A3 0.127 REF 0.005 REF
b0.15 0.25 0.006 0.010
D2.40 2.60 0.094 0.102
D2 1.90 2.10 0.075 0.083
E1.25 1.45 0.049 0.057
E2 0.30 0.50 0.012 0.020
e0.400 BSC 0.016 BSC
K0.20 0.008 0.000
L0.15 0.35 0.006 0.014
D
EA
A1
A3
D2
E2
L
K
b
e
Embossed Carrier Tape & Reel Specification – DFN-08
P2
D
EF
t
W
BO
KO
AO
P
D1
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.136 0.140
D1 1.00 - 0.040 -
D1.50 min 0.059 min
P 3.90 4.10 0.154 0.161
10P 40.0 +/- 0.20 1.575 +/- 0.008
W7.70 8.30 0.303 0.327
P2 1.95 2.05 0.077 0.081
A0 1.55 1.75 0.061 0.069
B0 1.90 2.1 0.075 0.083
K0 0.95 1.15 0.037 0.045
t0.30 max 0.012 max
Embossed Carrier Tape & Reel Specification – DFN-12
Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F3.45 3.55 0.136 0.140
D1 0.55 0.65 0.021 0.025
D 1.50 min 0.059 min
P3.90 4.10 0.154 0.161
10P 40.0 +/- 0.20 1.575 +/- 0.008
W7.90 8.30 0.311 0.327
P2 1.95 2.05 0.077 0.081
A0 1.33 1.53 0.052 0.060
B0 2.63 2.83 0.103 0.111
K0 0.58 0.78 0.023 0.031
t0.22 max 0.009 max
P2 t
BO
E
F
W
oD
/
oD
/P
K0
A0