AP15T15GM-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET Lower Gate Charge D D Simple Drive Requirement D D Surface Mount Package G RoHS Compliant & Halogen-Free SO-8 S BVDSS 150V RDS(ON) 150m ID 2.6A S S D Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G S The SO-8 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25 ID@TA=70 Rating Units 150 V +20 V 3 2.6 A 3 2.1 A Continuous Drain Current , VGS @ 10V Continuous Drain Current , VGS @ 10V 1 IDM Pulsed Drain Current 10 A PD@TA=25 Total Power Dissipation 2.5 W TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 50 /W 1 201105031 AP15T15GM-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Min. Typ. 150 - - V VGS=10V, ID=2A - - 150 m VGS=4.5V, ID=1A - - 250 m VGS=0V, ID=250uA 2 Max. Units VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance VDS=10V, ID=2A - 4 - S IDSS Drain-Source Leakage Current VDS=120V, VGS=0V - - 1 uA IGSS Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA Qg Total Gate Charge ID=2A - 22.5 36 nC Qgs Gate-Source Charge VDS=75V - 3.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 7.5 - nC td(on) Turn-on Delay Time VDS=75V - 8 - ns tr Rise Time ID=1A - 5.5 - ns td(off) Turn-off Delay Time RG=3.3 - 25 - ns tf Fall Time VGS=10V - 10 - ns Ciss Input Capacitance VGS=0V - 1050 1680 pF Coss Output Capacitance VDS=15V - 115 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 75 - pF Rg Gate Resistance f=1.0MHz - 1.2 2.4 Min. Typ. Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage IS=1.9A, VGS=0V - - 1.3 V trr Reverse Recovery Time IS=8A, VGS=0V, - 55 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 140 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board ; 125/W when mounted on min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP15T15GM-HF 30 20 10V 8.0V 7.0V 6.0V V G =5.0V ID , Drain Current (A) 20 10V 8.0V 7.0V 6.0V V G =5.0V o T A =150 C 16 ID , Drain Current (A) o T A =25 C 10 12 8 4 0 0 0 4 8 12 16 20 0 4 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 12 16 20 Fig 2. Typical Output Characteristics 1.4 2.8 I D =2A V G =10V I D =1mA 2.4 1.2 Normalized RDS(ON) Normalized BVDSS (V) 8 V DS , Drain-to-Source Voltage (V) 1 2.0 1.6 1.2 0.8 0.8 0.4 0.6 0.0 -50 0 50 100 150 -50 0 T j , Junction Temperature ( o C) 50 100 150 T j , Junction Temperature ( o C) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 8 1.6 I D =1mA 6 T j =150 o C Normalized VGS(th) (V) IS (A) 1.2 T j =25 o C 4 0.8 0.4 2 0 0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j ,Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP15T15GM-HF f=1.0MHz 1600 12 V DS =75V V DS =90V V DS =120V 8 1200 C (pF) VGS , Gate to Source Voltage (V) I D =2A 10 6 C iss 800 4 400 2 C oss C rss 0 0 0 5 10 15 20 25 1 30 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 100 Normalized Thermal Response (Rthja) DUTY=0.5 10 ID (A) Operation in this area limited by RDS(ON) 100us 1ms 1 10ms 100ms 1s 0.1 0.01 DC T A =25 o C Single Pulse 0.2 0.1 0.1 0.05 PDM 0.02 t T 0.01 Duty factor = t/T Peak Tj = P DM x Rthja + Ta 0.01 Rthja = 125/W Single Pulse 0.001 0.001 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.1 1 10 100 1000 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4