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¤EPCOS AG 2017. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS’ prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Data and signal line chokes
Common-mode chokes, ring core
0.005 … 4.7 mH, 200 … 1000 mA, +60 °C
Series/Type: B82790C0/S0
Date: January 2017
201/17
Please read Cautions and warnings and
Important notes at the end of this document.
Rated voltage 42 V AC/80 V DC
Rated inductance 0.005 ... 4.7 mH
Rated current 200 ... 1000 mA
Construction
■Current-compensated ring core double choke
■Ferrite core
■PPS case (UL 94 V-0)
■Bifilar winding (B82790C0)
■Sector winding (B82790S0)
Features
■Suitable for reflow soldering
■Qualified to AEC-Q200
■RoHS-compatible
Function
■B82790C0:
Suppression of asymmetrical interference coupled in on lines,
whereas data signals up to some MHz can pass unaffectedly.
■B82790S0:
Suppression of asymmetrical and symmetrical interference (by Lstray)
coupled in on lines. The high-frequency portions of the symmetrical
data signal are decreased so far that EMC problems can be significantly reduced.
Applications
■Automotive applications, e.g. CAN bus
■Industrial applications
Terminals
■Base material CuSn6
■Layer composition Ni, Sn
■Electro-plated
Marking
■Marking on component: Manufacturer, process location (coded),
winding method (coded), ordering code (short form),
date of manufacture (YMMD)
■Minimum data on reel: Manufacturer, ordering code,
L value and tolerance, quantity, date of packing
Delivery mode and packing unit
■16-mm blister tape, wound on 330-mmreel
■Packing unit: 1500 pcs./reel
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
301/17
Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawing and pin configuration Layout recommendation
Taping and packing
Blister tape Reel
Dimensions in mm
No polarity
Dimensions in mm
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
401/17
Please read Cautions and warnings and
Important notes at the end of this document.
Technical data and measuring conditions
Rated voltage VR42 V AC (50/60 Hz) / 80 V DC
Rated temperature TR+60 °C
Rated current IRReferred to 50 Hz and rated temperature
Rated inductance LRMeasured with Agilent 4284A at 0.1 mA, +20 °C
Measuring frequency: LRd1 mH = 100 kHz
LR!1mH= 10kHz
Inductance is specified per winding.
Inductance tolerance r30% (LRd0.47 mH), –30/+50% (LRt1 mH) at +20 °C
Inductance decrease 'L/L0< 10% at DC magnetic bias with IR, +20 qC
Stray inductance Lstray,typ Measured with Agilent 4284A at 5 mA, +20 °C, typ. values
Measuring frequency: LRd11 PH= 1MHz
LR>11PH = 100 kHz
DC resistance Rtyp Measured at +20 qC, typical values, specified per winding
Solderability SnPb: +(215 r3) °C, (3 r0.3) s
Sn96.5Ag3.0Cu0.5: +(245 r5) °C, (3 r0.3) s
Wetting of soldering area t95%
(to IEC 60068-2-58)
Resistance to soldering heat +(260 r5) °C, (10 r1) s (to IEC 60068-2-58)
Climatic category 40/125/56 (to IEC 60068-1)
Storage conditions (packaged) –25 °C … +40 °C, d75% RH
Weight Approx. 0.3 g
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
501/17
Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics and ordering codes
Types with LRt0.47 mH:
750 V DC possible for soldering process with Pb containing solder material.
For lead-free soldering please use series B82793.
LR
mH
Lstray,typ
nH
IR
mA
Rtyp
m:
Vtest
V DC, 2 s
Ordering code
0.005 40 1000 60 250 B82790C0502N201
0.011 50 500 80 250 B82790C0113N201
0.025 60 500 110 250 B82790C0253N201
0.025 1400 500 110 250 B82790S0253N201
0.051 70 500 140 250 B82790C0513N201
0.051 2100 500 140 250 B82790S0513N201
0.470 100 500 170 250 B82790C0474N215
1.0 100 500 170 250 B82790C0105N240
2.2 200 400 400 250 B82790C0225N265
4.7 300 200 510 250 B82790C0475N265
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
601/17
Please read Cautions and warnings and
Important notes at the end of this document.
Insertion loss D (typical values at |Z| = 50 :, +20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 0.005 mH
LR = 0.025 mH (low Lstray)
LR = 0.011 mH
LR = 0.025 mH (high Lstray)
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
701/17
Please read Cautions and warnings and
Important notes at the end of this document.
Insertion loss D (typical values at |Z| = 50 :, +20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 0.051 mH (low Lstray)
LR = 0.47 mH
LR = 0.051 mH (high Lstray)
LR = 1.0 mH
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
801/17
Please read Cautions and warnings and
Important notes at the end of this document.
Insertion loss D (typical values at |Z| = 50 :, +20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 2.2 mH
Current derating Iop/IR
versus ambient temperature
LR = 4.7 mH
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
901/17
Please read Cautions and warnings and
Important notes at the end of this document.
Recommended reflow soldering curve
Pb containing solder material (based on CECC 00802 edition 2)
Pb-free solder material (based on JEDEC J-STD 020D)
Time from +25 °C to T4: max 300 s
Maximal numbers of reflow cycles: 3
T1
°C
T2
°C
T3
°C
T4
°C
t1
s
t2
s
t3
s
150 200 217 250 < 110 < 90 < 30 @ T4 –5 °C
B82790C0/S0Data and signal line chokes
Common-mode chokes, ring core
10 01/17
Cautions and warnings
■Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for EPCOS products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications and the website of EPCOS, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the
ordering codes are due to different processes employed and do not affect the
specifications of the respective products. Detailed information can be found on the Internet
under www.epcos.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
11 01/17
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain areas
of application. These statements are based on our knowledge of typical requirements that are often placed
on our products in the areas of application concerned. We nevertheless expressly point out that such
statements cannot be regarded as binding statements about the suitability of our products for a
particular customer application. As a rule we are either unfamiliar with individual customer applications or
less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent
on the customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before
the end of their usual service life cannot be completely ruled out in the current state of the art, even
if they are operated as specified. In customer applications requiring a very high level of operational safety
and especially in customer applications in which the malfunction or failure of an electronic component could
endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be
ensured by means of suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet
(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our
sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this publication
may change from time to time. The same is true of the corresponding product specifications. Please
check therefore to what extent product descriptions and specifications contained in this publication are still
applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The aforementioned
does not apply in the case of individual agreements deviating from the foregoing for customer-specific
products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF
certifications confirm our compliance with requirements regarding the quality management system in the
automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK
always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949
may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only
requirements mutually agreed upon can and will be implemented in our Quality Management
System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered
or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-
electronics.tdk.com/trademarks.
Release 2018-10
