Datasheet
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
. 1/13 TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
TSZ22111・14・001
www.rohm.com
Voltage Detector IC Series
Low Voltage Free Delay Time Setting
CMOS Voltage Detector IC Series
BU42xx series BU43xx series
●General Description
ROHM’s BU42xx and BU43xx series are CMOS Voltage
Detector ICs with adjustable output delay. It is a
high-accuracy, low current consumption Voltage Detector
IC series with a built-in delay circuit. The lineup was
established with two output types (Nch open drain and
CMOS output) and detection voltages range from 0.9V to
4.8V in increments of 0.1V, so that the series may be
selected according to application.
●Features
Delay Time Controlled by external Capacitor
Two output types (Nch open drain and CMOS output)
Ultra-low current consumption
Wide operating temperature range
Very small and low height package
Package SSOP5 and SOP4 is similar to SOT-23-5
and SC-82 respectively (JEDEC)
●Key Specifications
Detection voltage: 0.9V to 4.8V (Typ.)
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.55µA (Typ.)
Operating temperature range: -40°C to +125°C
●Package
SSOP5: 2.90mm x 2.80mm x 1.25mm
SOP4: 2.00mm x 2.10mm x 0.95mm
VSOF5: 1.60mm x 1.60mm x 0.60mm
●Applications
Circuits using microcontrollers or logic circuits that require
a reset.
●Typical Application Circuit
●Connection Diagram & Pin Descriptions
SSOP5 SOP4 VSOF5
PIN
No. Symbol
Function PIN
No. Symbol
Function PIN
No. Symbol
Function
1 VOUT Reset output 1 GND GND 1 VOUT Reset output
2 VDD Power supply voltage 2 VDD Power supply voltage 2 SUB Substrate*
3 GND GND 3 CT Capacitor connection
terminal for output
delay time
3 CT Capacitor connection
terminal for output
delay time
4 N.C. Unconnected terminal 4 VOUT Reset output 4 VDD Power supply voltage
5 CT Capacitor connection
terminal for output
delay time
5 GND GND
VDD1
BU42xx
VDD2
GND
C
L
(Capacitor for
noise filtering)
CT
R
L
CIN
R
ST
Micro
controller
Open Drain Output type
BU42xx series
VDD1
BU43xx
CIN
GND
CT
C
L
(Capacitor for
noise filtering)
R
ST
Micro
controller
CMOS Output type
BU43xx series
TOP VIEW
TOP VIEW
TOP VIEW
*Connect the substrate to VDD
GND
VDD
CT
VOUT
1
2
3
4
Marking Lot. No
V
OUT
V
DD
GND
N.C.
CT
Lot. No
Marking
V
DD
V
OUT
SUB
C
T
GND
4
3
2
1
5
Marking Lot. No
Datasheet
2/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Ordering Information
(Unit : mm)
SOP4
2.1±0.2
0.05
1.3
2.0±0.2
1 2
4 3
1.25 +0.2
–0.1
4°+6°
0.27±0.15
–4°
0.13 +0.05
–0.03
0.9±0.050.05±0.05
1.05Max.
0.32 +0.05
–0.04
0.42 +0.05
–0.04
S
0.1 S
(Unit : mm)
VSOF5
1.2±0.05
4
3
1.0±0.05
1
0.6MAX
0.22±0.05
0.5
5
1.6±0.05
0.13±0.05
0.2MAX
2
1.6±0.05
(MAX 1.28 include BURR)
(Unit : mm)
SSOP5
2.9±0.2
0.13
4°+6°
−4°
1.6
2.8±0.2
1.1±0.05
0.05±0.05 +0.2
−0.1
+0.05
−0.03
0.42+0.05
−0.04
0.95
54
123
1.25Max.
0.2Min.
0.1
Direction of feed
Reel ∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
( )
1pin
B U x x x x x - T R
Part Output Type Reset Voltage Value Package Packaging and
Number 42 : Open Drain 09 : 0.9V G : SSOP5 forming specification
43 : CMOS 0.1V step F : SOP4 TR : Embossed tape
48 : 4.8V FVE : VSOF5 and reel
Datasheet
3/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Lineup Output Type Open Drain CMOS
Detection Voltage
Marking
Part Number Marking
Part Number
4.8V ZR BU4248 1H BU4348
4.7V ZQ BU4247 1G BU4347
4.6V ZP BU4246 1F BU4346
4.5V ZN BU4245 1E BU4345
4.4V ZM BU4244 1D BU4344
4.3V ZL BU4243 1C BU4343
4.2V ZK BU4242 1B BU4342
4.1V ZJ BU4241 1A BU4341
4.0V ZH BU4240 0Z BU4340
3.9V ZG BU4239 0Y BU4339
3.8V ZF BU4238 0X BU4338
3.7V ZE BU4237 0W BU4337
3.6V ZD BU4236 0V BU4336
3.5V ZC BU4235 0U BU4335
3.4V ZB BU4234 0T BU4334
3.3V ZA BU4233 0S BU4333
3.2V YZ BU4232 0R BU4332
3.1V YY BU4231 0Q BU4331
3.0V YX BU4230 0P BU4330
2.9V YW BU4229 0N BU4329
2.8V YV BU4228 0M BU4328
2.7V YU BU4227 0L BU4327
2.6V YT BU4226 0K BU4326
2.5V YS BU4225 0J BU4325
2.4V YR BU4224 0H BU4324
2.3V YQ BU4223 0G BU4323
2.2V YP BU4222 0F BU4322
2.1V YN BU4221 0E BU4321
2.0V YM BU4220 0D BU4320
1.9V YL BU4219 0C BU4319
1.8V YK BU4218 0B BU4318
1.7V YJ BU4217 0A BU4317
1.6V YH BU4216 ZZ BU4316
1.5V YG BU4215 ZY BU4315
1.4V YF BU4214 ZX BU4314
1.3V YE BU4213 ZW BU4313
1.2V YD BU4212 ZV BU4312
1.1V YC BU4211 ZU BU4311
1.0V YB BU4210 ZT BU4310
0.9V YA BU4209 ZS BU4309
Datasheet
4/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Absolute Maximum Ratings
Parameter Symbol Limit Unit
Power Supply Voltage VDD -0.3 to +7 V
Output Voltage Nch Open Drain Output VOUT GND-0.3 to +7 V
CMOS Output GND-0.3 to VDD+0.3
Output Current Io 70 mA
Power
Dissipation
SSOP5(SOT-23-5)
*1*4
Pd 540 mW
SOP4(SC-82)
*2*4
400
VSOF5
*3*4
210
Operation Temperature Range Topt -40 to +125 °C
Ambient Storage Temperature Tstg -55 to +125 °C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 Reduced by 4.0mW/°C when used over 25°C.
*3 Reduced by 2.1mW/°C when used over 25°C.
*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C)
Parameter Symbol
Condition Limit Unit
Min. Typ. Max.
Detection Voltage VDET
VDD=HL, Ta=25°C, RL=470kΩ VDET(T)
×0.99 VDET(T) VDET(T)
×1.01
V
VDET=1.8V Ta=+25°C 1.782 1.8 1.818
Ta=-40°C to 85°C 1.741 - 1.860
Ta=85°C to 125°C 1.718 - 1.883
VDET=2.5V Ta=+25°C 2.475 2.5 2.525
Ta=-40°C to 85°C 2.418 - 2.584
Ta=85°C to 125°C 2.386 - 2.615
VDET=3.0V Ta=+25°C 2.970 3.0 3.030
Ta=-40°C to 85°C 2.901 - 3.100
Ta=85°C to 125°C 2.864 - 3.139
VDET=3.3V Ta=+25°C 3.267 3.3 3.333
Ta=-40°C to 85°C 3.191 - 3.410
Ta=85°C to 125°C 3.150 - 3.452
VDET=4.2V Ta=+25°C 4.158 4.2 4.242
Ta=-40°C to 85°C 4.061 - 4.341
Ta=85°C to 125°C 4.009 - 4.394
Circuit Current when ON IDD1 VDD=VDET-0.2V
VDET =0.9 to 1.3V - 0.15 0.88
µA
VDET =1.4 TO 2.1V - 0.20 1.05
VDET =2.2 TO 2.7V - 0.25 1.23
VDET =2.8 to 3.3V - 0.30 1.40
VDET =3.4 to 4.2V - 0.35 1.58
VDET =4.3 to 4.8V - 0.40 1.75
Circuit Current when OFF IDD2 VDD=VDET+2.0V
VDET =0.9 TO 1.3V - 0.30 1.40
µA
VDET =1.4 TO 2.1V - 0.35 1.58
VDET =2.2 to 2.7V - 0.40 1.75
VDET =2.8 to 3.3V - 0.45 1.93
VDET =3.4 to 4.2V - 0.50 2.10
VDET =4.3 to 4.8V - 0.55 2.28
Operating Voltage Range VOPL VOL≤0.4V, Ta=25 to 125°C, RL=470kΩ 0.70 - - V
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ 0.90 - -
‘High’ Output Voltage (Pch) VOH VDD=4.8V, ISOURCE=1.7 mA,VDET=0.9V to 3.9V VDD-0.5
- - V
VDD=6.0V, ISOURCE=2.0 mA,VDET=4.0V to 4.8V VDD-0.5
- - V
‘Low’ Output Voltage (Nch) VOL VDD=0.85V, ISINK = 20 µA - - 0.05 V
VDD=1.5V, ISINK = 1 mA, VDET=1.7 to 4.8V - - 0.5 V
VDD=2.4V, ISINK = 3.6 mA, VDET=2.7 to 4.8V - - 0.5
*1: Design Guarantee. (Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Datasheet
5/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C) - continued
Parameter Symbol
Condition Limit Unit
Min. Typ. Max.
Leak Current when OFF Ileak VDD=VDS=7V Ta=-40 to 85°C - 0 0.1 µA
VDD=VDS=7V Ta=85 to 125°C - 0 1
CT pin Threshold Voltage VCTH
VDD=VDET×1.1, VDET=0.9 to 2.5V Ta=25°C
RL=470kΩ VDD
×0.35 VDD
×0.45 VDD
×0.55 V
VDD=VDET×1.1, VDET=2.6 to 4.8V Ta=25°C
RL=470kΩ VDD
×0.40 VDD
×0.50 VDD
×0.60
Output Delay Resistance RCT VDD=VDET×1.1 VCT=0.5V Ta=25°C
*1
9 10 11 MΩ
CT pin Output Current ICT VCT=0.1V VDD=0.85V 5 40 - µA
VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V 200 400 -
Detection Voltage
Temperature coefficient VDET/T
Ta=-40°C to 125°C - ±30 - ppm/°C
Hysteresis Voltage VDET VDD=LHL
Ta=-40 to 125°C
RL=470kΩ
VDET≤1.0V VDET
×0.03 VDET
×0.05 VDET
×0.08 V
VDET≥1.1V VDET
×0.03 VDET
×0.05 VDET
×0.07
*1: Design Guarantee. (Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Datasheet
6/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Block Diagrams
Vref
V
OUT
V
DD
GND CT
Fig.1 BU42xx Series
Vref
V
OUT
V
DD
GND CT
Fig.2 BU43xx Series
Datasheet
7/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves
Fig.3 Circuit Current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0 1 2 3 4 5 6 7
VDD SUPPLY VOLTAGE ：VDD[V]
CIRCUIT CURRENT ： IDD[µA]
0
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]
"LOW" OUTPUT CURRENT ： IOL[mA]
VDD
=1.2V
【BU4216F】
Fig.4 “LOW” Output Current
0
5
10
15
20
25
0 1 2 3 4 5 6
DRAIN-SOURCE VOLTAGE ： V
DS
[V]
"HIGH" OUTPUT CURRENT ： I
OH
[mA]
【BU4318G
】
V
DD
=6.0V
V
DD
=4.8V
Fig.5 “High” Output Current Fig.6 I/O Characteristics
0
1
2
3
4
5
6
7
01234567
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE
： VOUT[V]
【BU4216F】
【BU4216】
【BU4316】
【BU4318】 【BU4216】
【BU4316】
【BU4216】
【BU4316】
Datasheet
8/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.1
0.2
0.3
0.4
0.5
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN ON ： IDD1[µA]
【BU4216F】
Fig.10 Circuit Current when ON
Fig.9 Detecting Voltage
Release Voltage
1.0
1.5
2.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
DETECTION VOLTAGE
： VDET[V]
Low to high(VDET+∆VDET)
High to low(VDET)
【BU4216F】
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5 2.0 2.5
VDD SUPPLY VOLTAGE ： VDD[V]
OUTPUT VOLTAGE
： VOUT[V]
【BU4216F】
Fig.7 Operating Limit Voltage
0
100
200
300
400
500
600
700
0 0.5 1 1.5 2 2.5
VDD SUPPLY VOLTAGE ： VDD[V]
CT OUTPUT CURRENT ： ICT[µA]
【BU4216F
】
Fig.8 CT Terminal Current
【BU4216】
【BU4316】
【BU4216】
【BU4316】
【BU4216】
【BU4316】
【BU4216】
【BU4316】
Datasheet
9/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.5
1.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
MINIMUM OPERATING VOLTAGE ： V
OPL
[V]
【BU4216F】
Fig.12 Operating Limit Voltage
0
2
4
6
8
10
12
14
16
18
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
RESISTANCE OF CT ： R
CT
[MΩ]
【BU4216F】
Fig.13 CT Terminal Circuit Resistance
0.001
0.01
0.1
1
10
100
1000
10000
0.0001 0.001 0.01 0.1
CAPACITANCE OF CT ： CCT[µF]
DELAY TIME ： TPLH[ms]
【BU4216F】
Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance
0.0
0.2
0.4
0.6
0.8
1.0
-40 0 40 80 120
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN OFF ： IDD2 [µA]
【BU4216F
】
Fig.11 Circuit Current when OFF
【BU4216】
【BU4316】
【BU4216】
【BU4316】
【BU4216】
【BU4316】
【BU4216】
【BU4316】
Datasheet
10/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VouT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. BU42xx and BU43xx series have delay time function
which set tPLH (Output “Low””High”) using an external capacitor (CCT). Because the BU42xx series uses an open drain
output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High”
voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].
Fig.15 (BU42xx series Internal Block Diagram) Fig.16 (BU43xx type Internal Block Diagram)
Setting of Detector Delay Time
The delay time of this detector IC can be set at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD tPLH:Time until when VouT rises to 1/2 of VDD after VDD rises up and beyond the release
voltage(VDET+VDET)
TPLH=-1×CCT×RCT×ln
CCT: CT pin Externally Attached Capacitance VCTH: CT pin Threshold Voltage(P.3 VCTH refer.)
RCT: CT pin Internal Impedance(P.3 RCT refer.) ln: Natural Logarithm
Reference Data of Falling Time (tPHL) Output
Examples of Falling Time (tPHL) Output
Part Number t
PHL
[µs]
BU4245 275.7
BU4345 359.3
* This data is for reference only.
The figures will vary with the application, so please confirm the actual operating conditions before use.
Timing Waveforms
Example: The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are shown in
Fig.15 and 16). ① When the power supply is turned on, the output is unstable from
after over the operating limit voltage (VOPL) until tPHL. Therefore, it is
possible that the reset signal is not outputted when the rise time of
VDD is faster than tPHL.
② When VDD is greater than VOPL but less than the reset release
voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT
switches from L to H (with a delay to the CT terminal).
④ If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of tPHL).
⑤ The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The system
is designed such that the output does not toggle with power supply
fluctuations within this hysteresis width, preventing malfunctions due
to noise.
Vref
V
DD
GND
CT
R1
R2
R3 Q3
Q1
V
OUT
RESET
V
DD
Vref
V
DD
GND
CT
R1
R2
R3
Q3
Q2
V
OUT
RESET
Q1
V
DD
VDD-VCTH
VDD
V
DD
VDET+ΔVDET
VDET
VOPL
0V
1/2 VDD
tPHL
①
tPLH
tPHL
tPLH
②
③
④
⑤
VCT
VOUT
Fig.17 Timing Waveforms
Datasheet
11/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●Circuit Applications
1) Examples of common power supply detection reset circuits
Application examples of BU42xx series
(Open Drain output type) and BU43xx series
(CMOS output type) are shown below.
CASE1: Power supply of microcontroller (VDD2) differs
from the power supply of the reset detection (VDD1).
Use an open drain output Type (BU42xx series) device
with a load resistance RL as shown Fig.18.
CASE2: Power supply of microcontroller (VDD1) is the
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BU43xx series) device or an
open drain output type (BU42xx series) device with a pull
up resistor between the output and VDD1.
When a capacitance CL for noise filtering is connected to
VouT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall time of the output voltage (VouT).
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU42xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
V
DD1
BU43xx
C
IN
GND
C
T
R
ST
C
L
(Capacitor for
noise filtering)
Micro
controller
Fig.19 CMOS Output type
VDD1
BU42xx
VDD2
GND
RST
CL
(Capacitor for
noise filtering)
CT
R
L
CIN
Micro
controller
Fig.18 Open Drain Output type
VDD1 VDD3
GND
RST
microcontroller
CT
RL
VDD2
CT
BU42xx
NO.1 BU42xx
NO.2
Fig.20
Datasheet
12/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
3) Examples of the power supply with resistor dividers
In applications wherein the power supply input terminal (VDD) of an IC has resistor dividers, it is possible that an in-rush
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillations).
(In-rush current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
Fig.21
A voltage drop [in-rush current (I1)] × [input resistor (R2)] is caused by the in-rush current, and causes the input voltage
to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection
voltage, the output voltage switches from “High” to “Low”. At this time, the in-rush current stops flowing through output
“Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which again causes the
in-rush current to flow and the voltage to drop. This operation repeats and will result to oscillation.
Consider the use of BD52xx when the power supply input has resistor dividers.
Fig.22 Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm the actual operating conditions before use.
VOUT
R2
V
DD
BU42xx
BU43xx
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
Through
Current
V D D - ID D P eak C urrent Ta=25°C
0.001
0.01
0.1
1
10
3 4 5 6 7 8 9 10
V D D [V ]
ID D -peak[m A ]
B U 49xx,B U 43xx
B U 48xx,B U 42xx
B D 52xx
B D 53xx
Tem p - ID D (B U 42xx)
0.0
0.5
1.0
1.5
2.0
2.5
-50 -30 -10 10 30 50 70 90 110 130
Tem p
IDD peak Current[mA]
V D D 3V
V D D 6V
V D D 7V
V D D 4V
Datasheet
13/13
BU42xx series BU43xx series
TSZ02201-0R7R0G300050-1-
2
© 2014 ROHM Co., Ltd. All rights reserved.
03.Feb.2014 Rev.008
www.rohm.com
TSZ22111・15・001
●
●●
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The
recommended value of RL Resistor is over 50kΩ to 1MΩ for VDET=1.5V to 4.8V, and over 100kΩ to 1MΩ for VDET=0.9V
to 1.4V. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc)
that can affect characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) CT pin discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external
resistor that is connected to CT terminal, so please consider the delay time that is decided by t × RCT × CCT changes.
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
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H2S, NH3, SO2, and NO2
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[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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QR code printed on ROHM Products label is for ROHM’s internal use only.
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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
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1. All information and data including but not limited to application example contained in this document is for reference
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Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
