2014 Microchip Technology Inc. Advance Information DS70005173A-page 1
MRF24J40MD/ME
Features:
IEEE Std. 802.15.4™ Compliant RF Transceiver
Supports ZigBee®, MiWi™ Development
Environment Proprietary Wireless Networking
Protocols
4-Wire Serial Peripheral Interface (SPI) with
Interrupt
Small size: 0.9" x 1.3" (22.9 mm x 33.0 mm),
Surface Mountable: Pin Compatible with
MRF24J40MB and MRF24J40MC
Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry, Power Amplifier, Low Noise
Amplifier
PCB Antenna (MRF24J40MD), External Antenna
Connector (MRF24J40ME): Ultra Miniature
Coaxial (U.FL), 50
Easy Integration into Final Product: Minimize
Product Development, Quicker Time to Market
Compliance:
- Modular Certified for the United States (FCC)
and Canada (IC)
- European R&TTE Directive Assessed Radio
Module
- Australia/New Zealand
Compatible with Microchip microcontroller
families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)
Range up to 4000 ft
Operational:
Operating Voltage: 3.0V-3.6V (3.3V typical)
Temperature Range: -40°C to +85°C Industrial
Low-Current Consumption:
- Rx Mode: 32 mA (typical)
- Tx Mode: 140 mA (typical)
- Sleep: 10 A (typical)
RF/Analog Features:
ISM Band 2.405 GHz-2.475 GHz Operation
Data Rate: 250 kbps
-104 dBm Typical Sensitivity with -23 dBm
Maximum Input Level
+19 dBm Typical Output Power with 45 dB Tx
Power Control Range
Integrated Low Phase Noise VCO, Frequency
Synthesizer and PLL Loop Filter
Digital VCO and Filter Calibration
Integrated RSSI ADC and I/Q DACs
Integrated LDO
High Receiver RSSI Dynamic Range
MAC/Baseband Features:
Hardware CSMA-CA Mechanism, Automatic ACK
Response and FCS Check
Independent Beacon, Transmit and GTS FIFO
Supports all CCA modes and RSS/LQI
Automatic Packet Retransmit Capable
Hardware Security Engine (AES-128) with CTR,
CCM and CBC-MAC modes
Supports Encryption and Decryption for MAC Sub
layer and Upper Layer
Pin Diagram:
2
3
4
5
6
1
7
VIN
GND
8
9
10
RESET
WAKE
SDO
SDI
SCK
CS
NC
GND
INT
12
11 GND
2.4 GHz IEEE Std. 802.15.4™
RF Transceiver Module with PA/LNA
MRF24J40MD/ME
DS70005173A-page 2 Advance Information 2014 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Circuit Description ...................................................................................................................................................................... 11
3.0 Regulatory Approval................................................................................................................................................................... 19
4.0 Electrical Characteristics ........................................................................................................................................................... 25
Appendix A: Revision History............................................................................................................................................................... 27
The Microchip Web Site ....................................................................................................................................................................... 29
Customer Change Notification Service ................................................................................................................................................ 29
Product Identification System............................................................................................................................................................... 30
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2014 Microchip Technology Inc. Advance Information DS70005173A-page 3
MRF24J40MD/ME
1.0 DEVICE OVERVIEW
The MRF24J40MD/ME is a 2.4 GHz IEEE Std.
802.15.4™ compliant, surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry, Power Amplifier (PA), Low Noise Amplifier
(LNA) with PCB Trace Antenna (MRF24J40MD) or 50
external antenna connector (MRF24J40ME). The
MRF24J40MD/ME module operates in the non-
licensed 2.4 GHz frequency band. The integrated
module design frees the integrator from extensive RF
and antenna design, and regulatory compliance testing
allowing quicker time to market.
The MRF24J40MD/ME module is compatible with
Microchip’s MiWi™ Development Environment
software stacks. The MiWi Development Environment
software stack including the source code is available as
a free download, from the Microchip web site: http://
www.microchip.com/wireless.
The MRF24J40MD/ME module has received
regulatory approvals for modular devices in the United
States (FCC) and Canada (IC). Modular approval
removes the need for expensive RF and antenna
design, and allows the end user to place the
MRF24J40MD/ME module inside a finished product
and does not require regulatory testing for an
intentional radiator (RF transmitter). To maintain
conformance, refer to module settings in Section 3.1.2
“RF Exposure for the United States and Section
“Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010): User manuals for
transmitters shall display the following notice in a
conspicuous location:” for Canada.
The MRF24J40MD/ME module is an R&TTE Directive
assessed radio module for operation in Europe. The
module tests can be applied toward final product
certification and Declaration of Conformity (DoC). To
maintain conformance for Europe, refer to module
settings in Section 3.4 Australia”. Additional testing
may be required depending on the end application.
1.1 Interface Description
Figure 1-1 shows a simplified block diagram of the
MRF24J40MD/ME module. The module is based on
the Microchip Technology MRF24J40 IEEE
802.15.4™ 2.4 GHz RF Transceiver IC. The module
interfaces to many popular Microchip PIC® microcon-
trollers through a 4-wire SPI interface, interrupt, wake,
reset, power and ground, as shown in Figure 1-2.
Table 1-1 provides the pin descriptions.
Serial communication and module configuration for the
MRF24J40MD/ME module are documented in the
“MRF24J40 Data Sheet” (DS39776). Refer to the data
sheet for specific serial interface protocol and register
definitions.
Also, see Section 1.4 “Operation” for specific register
settings that are unique to the MRF24J40MD/ME
module.
FIGURE 1-1: MRF24J40MD/ME BLOCK DIAGRAM
Antenna
U.FL
PA
Physical MAC
Interface
Power
Management
SPI
20 MHz
Crystal
Digital
I/O
Power
MRF24J40MD/ME IEEE Std. 802.15.4™ Module
MRF24J40
LNA
Connector
MRF24J40MD/ME
DS70005173A-page 4 Advance Information 2014 Microchip Technology Inc.
FIGURE 1-2: MICROCONTROLLER TO MRF24J40MD/ME INTERFACE
TABLE 1-1: PIN DESCRIPTION
Pin Symbol Type Description
1 GND Ground Ground
2 RESET DI Global hardware Reset pin
3 WAKE DI External wake-up trigger
4 INT DO Interrupt pin to microcontroller
5 SDI DI Serial interface data input
6 SCK DI Serial interface clock
7 SDO DO Serial interface data output from MRF24J40
8CS DI Serial interface enable
9 NC No connection
10 VIN Power Power supply
11 GND Ground Ground
12 GND Ground Ground
Legend: Pin type abbreviation: D = Digital, I = Input, O = Output
SDO
I/O
SDI
SCK
INTX
MRF24J40MD/ME
CS
SDI
SDO
SCK
INT
I/O WAKE
VIN
GND
PIC® MCU
I/O RESET
2014 Microchip Technology Inc. Advance Information DS70005173A-page 5
MRF24J40MD/ME
1.2 Mounting Details
The MRF24J40MD/ME is a surface mountable mod-
ule. Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick
with castellated mounting points on the edge.
Figure 1-4 is a recommended host PCB footprint for
the MRF24J40MD/ME.
The MRF24J40MD has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the mod-
ule be mounted on the edge of the host PCB, and an
area around the antenna, approximately 1.2", be kept
clear of metal objects. A host PCB ground plane
around the MRF24J40MD acts as a counterpoise to
the PCB antenna. It is recommended to extend the
ground plane at least 0.4" around the module.
The MRF24J40ME has 50 ultra miniature coaxial
(U.FL) connector.
1.3 Soldering Recommendations
The MRF24J40MD/ME module was assembled using
a standard lead-free reflow profile. The module is com-
patible with standard lead-free solder reflow profiles. To
avoid damaging the module, the following recommen-
dations are given:
Refer to the solder paste data sheet for specific
reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under
the shield
Use only one flow. If the PCB requires multiple
flows, apply the module on the last flow
FIGURE 1-3: MODULE DETAILS
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.
MRF24J40MD/ME
DS70005173A-page 6 Advance Information 2014 Microchip Technology Inc.
FIGURE 1-4: RECOMMENDED PCB FOOTPRINT
FIGURE 1-5: MOUNTING DETAILS
0.315”
Edge of PCB
Keep area around antenna
(approximately 1.2 inches)
clear of metallic structures
for best performance
PCB Ground Plane (Counterpoise)
Underneath and extend as far as possible
to the sides and below the module
(at least 0.4 inches on each side)
for best performance
0.4”
0.4” 0.4”
1.2”
1.2”
2014 Microchip Technology Inc. Advance Information DS70005173A-page 7
MRF24J40MD/ME
1.4 Operation
The MRF24J40MD/ME module is based on the
Microchip Technology MRF24J40 2.4 GHz IEEE
802.15.4 RF Transceiver IC. Serial communication and
configuration are documented in the “MRF24J40 Data
Sheet” (DS39776).
This section emphasizes operational settings that are
unique to the MRF24J40MD/ME module design that
must be followed for proper operation.
1.4.1 PA/LNA CONTROL
Operation of the PA U6 and LNA U1 is controlled by the
MRF24J40 internal RF state machine through RF
switches, U3 and U4, and the GPIO0, GPIO1 and GPIO2
pins on the MRF24J40. Figure 1-6 shows the PA/LNA
block diagram. Figure 2-5 is the schematic diagram for
the module.
The internal RF state machine is configured for the PA/
LNA Mode by setting TESTMODE (0x22<2:0>) = 111.
Pins GPIO0, GPIO1 and GPIO2 control the RF
switches, PA and LNA automatically when the
MRF24J40 receives and transmits data.
FIGURE 1-6: PA/LNA BLOCK DIAGRAM
Note: A complete explanation of the operation of
the PA/LNA control is documented in the
“MRF24J40 Data Sheet” (DS39776),
Section 4.2 “External PA/LNA Control”.
MRF24J40
GPIO1
GPIO2
U.FL
Connector
(ME)
Balun RFP
RFN
PA
SST12LP17E
LNA
PA
RF Switch
RF3023TR7
RF Switch
RF3023TR7
LNA
SST12LN01
V2 V1 V2 V1
GPIO0
PA_ON
TX
RX
BPF
PCB
Antenna
(MD)
MRF24J40MD/ME
DS70005173A-page 8 Advance Information 2014 Microchip Technology Inc.
1.4.2 ENERGY DETECTION (ED)
Before performing an energy detection (see Section
3.6.1 “RSSI Firmware Request (RSSI Mode 1)” in the
“MRF24J40 Data Sheet” (DS39776), perform the
following steps:
1. Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
2. Configure GPIO2 and GPIO1 direction for
output (TRISGP2 (0x34<2>) = 1 and TRISGP1
(0x34<1>) = 1).
3. Set GPIO2 (0x33<2>) = 1 and GPIO1
(0x32<1>) = 0. This enables the LNA and
disables the PA.
4. Perform the energy detection following the steps
in Section 3.6.1 “RSSI Firmware Request (RSSI
Mode 1)” in the “MRF24J40 Data Sheet”
(DS39776).
1.4.3 SLEEP
To get the lowest power consumption from the
MRF24J40MD/ME module during Sleep, it is neces-
sary to disable the PA, PA voltage regulator and LNA.
To do this, perform the following steps:
1. Configure the internal RF state machine to normal
operation (TESTMODE (0x22F<2:0>) = 000).
2. Configure the GPIO2, GPIO1 and GPIO0
direction for output (TRISGP2 (0x34<2>) = 1,
TRISGP1 (0x34<1>) = 1) = 1 and TRISGP0
(0x34<0>) = 1).
3. Set GPIO2 (0x33<2>) = 0 and GPIO1
(0x32<1>) = 0. This disables the LNA and the PA.
4. Put the MRF24J40 to Sleep following the steps
in the “MRF24J40 Data Sheet” (DS39776).
When waking the module, re-enable the PA/LNA Mode.
Note: The LNA will amplify the received signal.
The RSSI value will include the receive
signal strength plus the LNA amplification.
2014 Microchip Technology Inc. Advance Information DS70005173A-page 9
MRF24J40MD/ME
1.4.4 TRANSMIT POWER SETTINGS
Table 1-2 lists the power settings in register RFCON3
(0x203<7:3>) and the output power at antenna
connector J1.
Note 1: Typical output power at antenna connector J1, Channel 11, 50 impedance.
TABLE 1-2: MRF24J40ME TRANSMIT POWER SETTINGS
RFCON3 (0x203<7:3>) MRF24J40 Power Setting Conducted Output Power(1) (dBm)
11111 –36.3 -13.6
11110 –34.9 -12.4
11101 –33.7 -11.5
11100 –32.8 -10.7
11011 –31.9 -10.0
11010 –31.2 -9.6
11001 –30.5 -9.2
11000 –30.0 -3.4
10111 –26.3 -1.3
10110 –24.9 -0.7
10101 –23.7 0.1
10100 –22.8 0.5
10011 –21.9 1.0
10010 –21.2 1.3
10001 –20.5 5.8
10000 –20.0 7.0
01111 –16.3 8.1
01110 –14.9 9.0
01101 –13.7 9.7
01100 –12.8 10.4
01011 –11.9 10.9
01010 –11.2 11.3
01001 –10.5 16.0
01000 –10.0 17.2
00111 –6.3 17.9
00110 –4.9 18.5
00101 –3.7 19.0
Note: Refer to Section 3.0 “Regulatory
Approval” for the required maximum
power setting necessary to maintain
certification requirements for each country
the module will be used.
MRF24J40MD/ME
DS70005173A-page 10 Advance Information 2014 Microchip Technology Inc.
NOTES:
2014 Microchip Technology Inc. Advance Information DS70005173A-page 11
MRF24J40MD/ME
2.0 CIRCUIT DESCRIPTION
The MRF24J40MD/ME is a 2.4 GHz IEEE
Std. 802.15.4™ compliant surface mount module with
integrated crystal, internal voltage regulator, matching
circuitry, power amplifier, low noise amplifier with PCB
trace antenna (MRF24J40MD) and 50 external
antenna connector (MRF24J40ME).
The MRF24J40MD/ME module interfaces to many
popular Microchip PIC microcontrollers through a 4-wire
SPI Interface, interrupt, wake, reset, power and ground.
An example application schematic is illustrated in
Figure 2-4.
Serial communications and register definitions for the
MRF24J40MD/ME module are documented in the
MRF24J40 Data Sheet” (DS39776). Refer to this data
sheet for specific serial interface protocol and register
definitions. Also, see Section 1.4 “Operation” for
specific register settings that are unique to the
MRF24J40MD/ME module.
2.1 PCB Antenna (MRF24J40MD)
The Printed Circuit Board (PCB) antenna is fabricated
on the top copper trace of the module PCB. The layers
below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB following the recom-
mendations in Section 1.2 “Mounting Details”.
The PCB antenna was designed and simulated using
Ansoft Designer® and HFSS™ 3D full-wave solver soft-
ware by Ansoft Corporation (www.ansoft.com) and
tested in an anechoic room. The design goal was to
create a compact, low-cost antenna with the best radi-
ation pattern. Figure 2-1 shows the simulation drawing
and Figure 2-2 and Figure 2-3 show the 2D and 3D
radiation patterns, respectively. As shown by the radia-
tion patterns, the performance of the antenna is depen-
dent upon the orientation of the module. The discrete
matching circuitry matches the impedance of the
antenna with the MRF24J40 transceiver IC.
FIGURE 2-1: PCB ANTENNA SIMULATION DRAWING
MRF24J40MD/ME
DS70005173A-page 12 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-2: SIMULATED 2D RADIATION PATTERN
FIGURE 2-3: SIMULATED 3D RADIATION PATTERN
2.2 External Antenna (MRF24J40ME)
The MRF24J40ME module has a 50 ultra miniature
coaxial (U.FL) connector to connect to an external 2.4
GHz antenna.
Modular certification of the MRF24J40ME module was
performed with the external antenna types listed in
Table 2-1. An antenna type comprises antennas having
similar in-band and out-of-band radiation patterns.
Refer to Section 3.0 “Regulatory Approval” for
specific regulatory requirements by country.
TABLE 2-1: TESTED EXTERNAL
ANTENNA TYPES
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.
Type Gain
Whip Dipole 5 dBi
Note 1: An antenna type comprises antennas
having similar in-band and out-of-band
radiation patterns.
2014 Microchip Technology Inc. Advance Information DS70005173A-page 13
MRF24J40MD/ME
2.3 Module Schematic
A schematic diagram of the module is illustrated in
Figure 2-5 and the Bill of Materials (BOM) is shown in
Table 2-2.
The MRF24J40MD/ME module is based on the
Microchip Technology MRF24J40 IEEE 802.15.4™ 2.4
GHz RF Transceiver IC (U2). The Serial I/O (SCK, SDI,
SDO and CS), RESET, WAKE and INT pins are
brought out to the module pins. The SDO signal is
tri-state buffered by U7 to solve a silicon errata, where
the SDO signal does not release to a high-impedance
state, after the CS pin returns to its inactive state.
Crystal, X1, is a 20 MHz crystal with a frequency
tolerance of ±10 ppm @ 25°C to meet the IEEE Std.
802.15.4 symbol rate tolerance of ±40 ppm.
A balun is formed by components: L2, L4, L5, C19,
C20, C22 and C43. L2 is also a pull-up for the RFP and
RFN pins on the MRF24J40. C19 also act as a DC
block capacitor. RF switches, U3 and U4, switch
between the power amplifier, U6, when transmitting
and low noise amplifier, U1, when receiving. A
band-pass filter U5 is placed after the PA U6 to reduce
harmonics. The remaining passive components
provide bias and decoupling.
FIGURE 2-4: MRF24J40MD/ME APPLICATION SCHEMATIC
MRF24J40MD/ME
DS70005173A-page 14 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-5: MRF24J40MD/ME SCHEMATIC
VDD
NC7SZ125P5X
24
Vcc 5
GND
3
OE 1
U7
VDD
CS
CS
SC K
SD I
IN T
WA K E
SCK
SDI
INT
WAKE
SDO
SD O
33pF
C6
1uF
C5
0.01uF
C10
0.1uF
C4
0.01uF
C2
1uF
C9
33pF
C3
0.01uF
C7
33pF
C1
GND
100pF
C31
18pF
C32
20MH z
X1
18pF
C33
0.1uF
C35
0.1uF
C34
B1
1
GND
2
B2
3
Vc1 6
Vc2 4
A5
U3RF3023TR 7
4.7nH
L2
4.7nH
L5
0.5pF
C22
1.8pF
C19
VDD
0.5pF
C20
3.0nH
L4
B1 1
GND
2
B2 3
Vc1 6
Vc2 4
A
5
U4RF3023TR 7
TX
RX
RX
TX
SST12LN 01
RFIN
2
GND
0
VDD 6
RFOUT 5
U1
NP
C14
33pF
C29
NP
C30
2450B P15B 100E
GND
1
OUT
2
GND
3
IN 4
U5
SST12LP17E
VCC2 1
VCC1 2
RFIN 3
VREF 4
DET
5
RFOUT
6
GND
0
U6
33pF
C23
0.2pF
C27
6.8nH
L10
8.2nH
L8
1nF
C17
1nF
C18 1nF
C15
1nF
C16
0.1uF
C11
2N7002P,215
Q2
BSS84
Q1
VDD
470k
R1
RX
TX
J1-ME
UFL C onnector
RX
PA _ON
PA _ON _R
VDD
0.0R
R2
0.0R
R3-ME
A1A
i
Power Net
i
50 Ohm
iPower Net
i
Power Net
iPower Net
i
50 Ohm
i
50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i50 Ohm
i
50 Ohm
i50 Ohm
i
50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i
50 Ohm
i
50 Ohm
i50 Ohm
i
50 Ohm
i
50 Ohm
GND
1
RESET
2
WA K E
3
IN T
4
SD I
5
SC K
6SD O 7
CS 8
VIN 10
GND 11
GND 12
NC 9
M1
MR F24J40 Module Footprint
RF Testpoint
NC
1nF
C37
1nF
C38
2.2uF
C26
5.6R
R8
33pF
C28
1.5pF
C44
33pF
C36
GND
NP
R9
NC
GPIO 4
10
GPIO 5
9
GPIO 1
8
GPIO 0
7
GND
6
VDD
5
VDD
4
RFN
3
RFP
2
VDD
1
CS
20
SCK
19
SDI
18
SDO
17
INT
16
WAKE
15
GND
14
RESET
13
GPIO3
12
GPIO2
11
NC 30
NC 29
NC 28
NC 27
NC 26
GND 25
GND 24
NC 23
GND 22
VDD 21
LCAP 40
VDD 39
NC 38
VDD 37
GND 36
VDD 35
OSC1 34
OSC2 33
VDD 32
VDD 31
GND 41
U2
GND
VDD
GND
GND
GND
VDD
VDD
VDD
GND
VDD
VDD
VDDVDD GND
100pF
C42
GND
NP
R7
GND GND
GND
GND
GND
GND
GND
GND
33pF
C8
GND
1.5pF
C21
1pF
C24
2.7nH
L6
GND
GND
GND
RESET
RESET
33pF
C43
VDD
51R
R6
2014 Microchip Technology Inc. Advance Information DS70005173A-page 15
MRF24J40MD/ME
TABLE 2-2: MRF24J40MD/ME BILL OF MATERIALS
Designator Quantity Value Manufacturer Manufacturer PN
C1 133 pF Murata Electronics GRM1535C1H330JDD5D
C2, C10 20.01 uF Murata Electronics GRM155R71E103KA01D
C3, C6, C8, C9, C23, C25, C28, C29, C36, C43 10 33 pF Murata Electronics GRM1535C1H330JDD5D
C4 11 100 nF Murata Electronics GRM155R61A104KA01D
C5 11 uF Murata Electronics GRM155R60J105KE19D
C7, C15, C16, C17, C18 51000 pF Murata Electronics GRM155R71H102KA01D
C11, C34, C35 30.1 uF Murata Electronics GRM155R61A104KA01D
C14, C30 0Not Populated
C19, C21 21.8 pF Murata Electronics GRM1555C1H1R8CA01D
C20, C22 20.5 pF Murata Electronics GRM1555C1HR50CA01D
C24 11 pF Murata Electronics GRM1555C1H1R0CA01D
C26 12.2 uF Murata Electronics GRM188R60J225KE19D
C27 10.2 pF Murata Electronics GRM1555C1HR20WA01D
C20, C22 20.5 pF Murata Electronics GRM1555C1HR50BA01D
C19 11.8 pF Murata Electronics GRM1555C1H1R8BA01D
C21 11.5 pF Murata Electronics GRM1555C1H1R5BA01D
C31, C42 2100 pF Murata Electronics GRM1555C1H101GA01D
C32, C33 218 pF Murata Electronics GRM1555C1H180JA01D
C11, C4, C34, C35 4100 nF Murata Electronics GRM155R61A104KA01D
C2, C10 210 nF Murata Electronics GRM155R71E103KA01D
C1, C3, C6, C8, C9, C23, C28, C29, C36, C37, C38, C43 12 33 pF Murata Electronics GRM1535C1H330JDD5D
C7,C15, C16, C17, C18 51 nF Murata Electronics GRM155R71H102KA01D
C5 11 uF Murata Electronics GRM155C80G105KE19D
C24 11 pF Murata Electronics GJM1555C1HR75BB01D
C44 11.5 pF Murata Electronics GRM1555C1H1R5BA01D
L2, L5 24.7 nH Murata Electronics LQG15HS4N7S02D
L4 13.0 nH Murata Electronics LQG15HN3N0S02D
L6 12.7 nH Murata Electronics LQG15HS2N7S02D
L7 10R Yageo RC0603JR-0710KL
L8 18.2 nH Murata Electronics LQW15AN8N2J00D
L10 16.8 nH Murata Electronics LQG15HS6N8J02D
MRF24J40MD/ME
DS70005173A-page 16 Advance Information 2014 Microchip Technology Inc.
Q1 1BSS84 Fairchild Semiconductor BSS84
Q2 12N7002P,215 NXP Semiconductor 2N7002P,215
R1 1470k Yageo RC0402FR-07470KL
R5 150R Yageo RC0402JR-0751RL
R2, R3, R4, R6, R10 50 ohm Yageo RC0402JR-070RL
R7, R9 0Not Populated
R8 15.6 R Yageo RC0402JR-075R6L
U1 1SST12LN01 Microchip SST12LN01-QU6F
U2 1MRF24J40 Microchip MRF24J40-I/ML
U3, U4 2RF3023 RFMD RF3023
U5 12450BP15B100E Johanson Technology Inc 2450BP15B100E
U6 1SST12PL17E Microchip SST12PL17E-XX8E
U7 1NC7SZ125P5X Fairchild Semiconductor NC7SZ125P5X
X1 120 MHz Abracon ABM8-156-20.000MHz
TABLE 2-2: MRF24J40MD/ME BILL OF MATERIALS (CONTINUED)
Designator Quantity Value Manufacturer Manufacturer PN
2014 Microchip Technology Inc. Advance Information DS70005173A-page 17
MRF24J40MD/ME
2.4 Printed Circuit Board
The MRF24J40MD/ME module PCB is constructed
with high temperature FR4 material, four layers and
0.032 " thick. The layers are illustrated in Figure 2-6
through Figure 2-10. The stack up of the PCB is
illustrated in Figure 2-11.
FIGURE 2-6: TOP SILK SCREEN
FIGURE 2-7: TOP COPPER
FIGURE 2-8: LAYER 2 – GROUND
PLANE
FIGURE 2-9: LAYER 3 – POWER
PLANE
MRF24J40MD/ME
DS70005173A-page 18 Advance Information 2014 Microchip Technology Inc.
FIGURE 2-10: BOTTOM COPPER
FIGURE 2-11: PCB LAYER STACK UP
Top Copper
Ground Plane
Power Plane
Bottom Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
1/2 oz. Copper
8 mil FR4
12 mil FR4
8 mil FR4
0.032"
±0.005"
2014 Microchip Technology Inc. Advance Information DS70005173A-page 19
MRF24J40MD/ME
3.0 REGULATORY APPROVAL
This section outlines the regulatory information for the
MRF24J40MD/ME module for the following countries:
United States
Canada
Europe
Australia
New Zealand
Other Regulatory Jurisdictions
3.1 United States
The MRF24J40MD/ME module has received Federal
Communications Commission (FCC) CFR47 Telecom-
munications, Part 15 Subpart C “Intentional Radiators”
modular approval in accordance with Part 15.212 Mod-
ular Transmitter approval. Modular approval allows the
end user to integrate the MRF24J40MD/ME module
into a finished product without obtaining subsequent
and separate FCC approvals for intentional radiation,
provided no changes or modifications are made to the
module circuitry. Changes or modifications could void
the user's authority to operate the equipment. The end
user must comply with all of the instructions provided
by the Grantee, which indicate installation and/or oper-
ating conditions necessary for compliance.
The finished product is required to comply with all appli-
cable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with the transmitter module portion. For example, com-
pliance must be demonstrated to regulations for other
transmitter components within the host product; to
requirements for unintentional radiators (Part 15 Sub-
part B “Unintentional Radiators”), such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or Declaration of Conformity) (e.g.,
transmitter modules may also contain digital logic func-
tions) as appropriate.
3.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
The MRF24J40MD/ME module has been labeled with
its own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use word-
ing as follows:
A user’s manual for the product should include the
following statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
Contains Transmitter Module FCC ID:
W7OMRF24J40MDME
or
Contains FCC ID: W7OMRF24J40MDME
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the
following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment
and receiver.
Connect the equipment into an outlet on a cir-
cuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV
technician for help.
MRF24J40MD/ME
DS70005173A-page 20 Advance Information 2014 Microchip Technology Inc.
3.1.2 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. OET Bulletin 65, Evaluating
Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields, provides
assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to Radio Frequency
(RF) fields adopted by the Federal Communications
Commission (FCC). The bulletin offers guidelines and
suggestions for evaluating compliance.
If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation dis-
tances from transmitting structures and proper installa-
tion of antennas.
The following statement must be included as a CAU-
TION statement in manuals and OEM products to alert
users of FCC RF exposure compliance:
If the MRF24J40MD/ME module is used in a portable
application (i.e., the antenna is less than 20 cm from
persons during operation), the integrator is responsible
for performing Specific Absorption Rate (SAR) testing
in accordance with FCC rules 2.1091.
3.1.3 APPROVED EXTERNAL ANTENNA
TYPES
To maintain modular approval in the United States, only
the antenna types that have been tested shall be used.
It is permissible to use different antenna manufacturer
provided the same antenna type and antenna gain
(equal to or less than) is used.
Testing of the MRF24J40MD/ME module was per-
formed with the antenna types listed in Table 2-1
Tested External Antenna Types.
3.1.4 HELPFUL WEB SITES
Federal Communications Commission (FCC)
http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
3.2 Canada
The MRF24J40MD/ME module has been certified for
use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and RSSGen.
Modular approval permits the installation of a module in
a host device without the need to recertify the device.
3.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Sec-
tion 3.2.1, RSS-Gen, Issue 3, December 2010): The
host device shall be properly labeled to identify the
module within the host device.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains transmit-
ter module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 7.1.3 RSS-Gen, Issue 3, December
2010): User manuals for license-exempt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
To satisfy FCC RF Exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.
The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.
Contains transmitter module IC: 7693A-24J40MDME
This device complies with Industry Canada
license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this
device may not cause interference, and (2) this
device must accept any interference, including
interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR
d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes: (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil
doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en
compromettre le fonctionnement.
2014 Microchip Technology Inc. Advance Information DS70005173A-page 21
MRF24J40MD/ME
Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010): User manuals for transmit-
ters shall display the following notice in a conspicuous
location:
The above notice may be affixed to the device instead
of displayed in the user manual.
User manuals for transmitters equipped with detach-
able antennas shall also contain the following notice in
a conspicuous location.
Immediately following the above notice, the
manufacturer shall provide a list of all antenna types
approved for use with the transmitter, indicating the
maximum permissible antenna gain (in dBi) and
required impedance for each.
3.2.2 APPROVED EXTERNAL ANTENNA
TYPES
Transmitter Antenna (from Section 7.1.2 RSS-Gen,
Issue 3, December 2010):
The MRF24J40MD/ME module can only be sold or
operated with antennas with which it was approved.
Transmitter may be approved with multiple antenna
types. An antenna type comprises antennas having
similar in-band and out-of-band radiation patterns.
Testing shall be performed using the highest gain
antenna of each combination of transmitter and
antenna type for which approval is being sought, with
the transmitter output power set at the maximum level.
Any antenna of the same type having equal or lesser
gain as an antenna that had been successfully tested
with the transmitter, will also be considered approved
with the transmitter, and may be used and marketed
with the transmitter.
When a measurement at the antenna connector is
used to determine RF output power, the effective gain
of the device's antenna shall be stated, based on mea-
surement or on data from the antenna manufacturer.
For transmitters of output power greater than 10 milli-
watts, the total antenna gain shall be added to the mea-
sured RF output power to demonstrate compliance to
the specified radiated power limits.
Testing of the MRF24J40MD/ME module was per-
formed with the antenna types listed in Ta b l e 2- 1
Tested External Antenna Types
3.2.3 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Under Industry Canada regulations, this radio
transmitter may only operate using an antenna of a
type and maximum (or lesser) gain approved for the
transmitter by Industry Canada. To reduce potential
radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent
isotropically radiated power (e.i.r.p.) is not more than
that necessary for successful communication.
Conformément à la réglementation d'Industrie
Canada, le présent émetteur radio peut fonctionner
avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie
Canada. Dans le but de réduire les risques de
brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son
gain de sorte que la puissance isotrope rayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication
satisfaisante.
This radio transmitter (identify the device by certifi-
cation number, or model number if Category II) has
been approved by Industry Canada to operate with
the antenna types listed below with the maximum
permissible gain and required antenna impedance
for each antenna type indicated. Antenna types not
included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly
prohibited for use with this device.
Conformément à la réglementation d'Industrie Can-
ada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie
Canada. Dans le but de réduire les risques de brouil-
lage radioélectrique à l'intention des autres utilisa-
teurs, il faut choisir le type d'antenne et son gain de
sorte que la puissance isotrope rayonnée équiva-
lente (p.i.r.e.) ne dépasse pas l'intensité nécessaire
à l'établissement d'une communication satisfais-
ante.
MRF24J40MD/ME
DS70005173A-page 22 Advance Information 2014 Microchip Technology Inc.
3.3 Europe
The MRF24J40MD/ME module is an R&TTE Directive
assessed radio module that is CE marked and has
been manufactured and tested with the intention of
being integrated into a final product.
The MRF24J40MD/ME module has been tested to
R&TTE Directive 1999/5/EC Essential Requirements
for Health and Safety (Article (3.1(a)), Electromagnetic
Compatibility (EMC) (Article 3.1(b)), and Radio (Article
3.2) and are summarized in Table 3-1: European Com-
pliance Testing. A Notified Body Opinion has also been
issued. All test reports are available on the
MRF24J40MD/ME product web page at
http://www.microchip.com.
The R&TTE Compliance Association provides guid-
ance on modular devices in document Technical Guid-
ance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
3.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
MRF24J40MD/ME module must follow CE marking
requirements. The R&TTE Compliance Association
Technical Guidance Note 01 provides guidance on final
product CE marking.
3.3.2 EXTERNAL ANTENNA
REQUIREMENTS
From R&TTE Compliance Association document Tech-
nical Guidance Note 01:
Provided the integrator installing an assessed radio
module with an integral or specific antenna and
installed in conformance with the radio module manu-
facturer's installation instructions requires no further
evaluation under Article 3.2 of the R&TTE Directive and
does not require further involvement of an R&TTE
Directive Notified Body for the final product. [Section
2.2.4]
The European Compliance Testing listed in Table 3-1
was performed using the antenna types listed in
Table 2-1 Tested External Antenna Types.
3.3.3 HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Commu-
nications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
Radio and Telecommunications Terminal
Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
European Conference of Postal and
Telecommunications Administrations (CEPT):
http://www.cept.org
European Telecommunications Standards
Institute (ETSI):
http://www.etsi.org
European Radio Communications Office (ERO):
http://www.ero.dk
The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
Note: To maintain conformance to the testing
listed in Table 3-1: European Compliance
Testing, the module shall be installed in
accordance with the installation
instructions in this data sheet and shall not
be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements of
the R&TTE Directive.
TABLE 3-1: EUROPEAN COMPLIANCE TESTING
Certification Standards Article Laboratory Report Number Date
Safety EN 60950-1:2006+A11:2009+A1:2010 (3.1(a))
Health EN 50371:2002-03
EMC EN 301 489-1 V1.8.1 (2008-04) (3.1(b))
EN 301 489-17 V2.1.1 (2009-05)
Radio EN 300 328 V1.7.1 (2006-10) (3.2)
Notified Body
Opinion
DoC
2014 Microchip Technology Inc. Advance Information DS70005173A-page 23
MRF24J40MD/ME
3.4 Australia
The Australia radio regulations do not provide a modu-
lar approval policy similar to the United States (FCC)
and Canada (IC). However, MRF24J40MD/ME module
RF transmitter test reports can be used in part to
demonstrate compliance in accordance with ACMA
Radio communications “Short Range Devices” Stan-
dard 2004 (The Short Range Devices standard calls up
the AS/NZS 4268:2008 industry standard). The
MRF24J40MD/ME module test reports can be used as
part of the product certification and compliance folder.
For more information on the RF transmitter test reports,
contact Microchip Technology Australia sales office.
To meet overall Australian final product compliance, the
developer must construct a compliance folder contain-
ing all relevant compliance test reports e.g. RF, EMC,
electrical safety and DoC (Declaration of Conformity)
etc. It is the responsibility of the integrator to know what
is required in the compliance folder for ACMA compli-
ance. All test reports are available on the
MRF24J40MD/ME product web page at
http://www.microchip.com. For more information on
Australia compliance, refer to the Australian Communi-
cations and Media Authority web site
http://www.acma.gov.au/.
3.4.1 EXTERNAL ANTENNA
REQUIREMENTS
The compliance testing listed in Table 3-1 was per-
formed using the antenna types listed in Table 2-1
Tested External Antenna Types.
3.4.2 HELPFUL WEB SITES
The Australian Communications and Media Authority:
www.acma.gov.au/.
3.5 New Zealand
The New Zealand radio regulations do not provide a
modular approval policy similar to the United States
(FCC) and Canada (IC). However, MRF24J40MD/ME
module RF transmitter test reports can be used in part
to demonstrate compliance against the New Zealand
"General User Radio License for Short Range
Devices". New Zealand Radio communications (Radio
Standards) Notice 2010 calls up the AS / NZS
4268:2008 industry standard. The MRF24J40MD/ME
module test reports can be used as part of the product
certification and compliance folder. All test reports are
available on the MRF24J40MD/ME product web page
at http://www.microchip.com. For more information on
the RF transmitter test reports, contact Microchip
Technology sales office.
Information on the New Zealand short range devices
license can be found in the following web links:
http://www.rsm.govt.nz/cms/licensees/types-ofli-
cence/general-user-licences/short-range-devices
and
http://www.rsm.govt.nz/cms/policy-and-planning/spec-
trum-policy-overview/legislation/gazette-notices/prod-
uct-compliance/radiocommunications-radiostandards-
notice-2010.
To meet overall New Zealand final product compliance,
the developer must construct a compliance folder con-
taining all relevant compliance test reports e.g. RF,
EMC, electrical safety and DoC (Declaration of Confor-
mity) etc. It is the responsibility of the developer to
know what is required in the compliance folder for New
Zealand Radio communications. For more information
on New Zealand compliance, refer to the web site
http://www.rsm.govt.nz/.
3.5.1 EXTERNAL ANTENNA
REQUIREMENTS
The compliance testing listed in Table 3-1 was per-
formed using the antenna types listed in Ta b l e 2- 1
Tested External Antenna Types.
3.5.2 HELPFUL WEB SITES
Radio Spectrum Ministry of Economic Development:
http://www.rsm.govt.nz/.
3.6 Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, the MRF24J40
Radio Utility Driver Program (AN1192) can be used to
control the module.
MRF24J40MD/ME
DS70005173A-page 24 Advance Information 2014 Microchip Technology Inc.
NOTES:
2014 Microchip Technology Inc. Advance Information DS70005173A-page 25
MRF24J40MD/ME
4.0 ELECTRICAL CHARACTERISTICS
TABLE 4-1: RECOMMENDED OPERATING CONDITIONS
Parameters Min Typ Max Units
Ambient Operating Temperature –40 +85 °C
Supply Voltage for RF, Analog and
Digital Circuits
3.0 3.6 V
Supply Voltage for Digital I/O 3.0 3.3 3.6 V
Input High Voltage (VIH)0.5 x VDD VDD + 0.3 V
Input Low Voltage (VIL)–0.3 0.2 x VDD V
TABLE 4-2: CURRENT CONSUMPTION
(TA = 25°C, VDD = 3.3V)
Chip Mode Condition Min Typ Max Units
Sleep Sleep Clock and PA voltage
regulator Disabled
10 A— A
Tx At Maximum Output Power 140 mA mA
Rx 25 mA mA
TABLE 4-3: RECEIVER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters Condition Min Typ Max Units
RF Input Frequency Compatible to
IEEE Std. 802.15.4™, 2003
2.405 2.480 GHz
RF Sensitivity –104 dBm
Maximum RF Input 50 ——23dBm
LO Leakage Measured at Balun Matching
Network Input at Frequency,
2.405 GHz – 2.48 GHz
–60 dBm
Input Return Loss 50–8 –12 dB
Noise Figure
(including matching)
——1.8dB
Adjacent Channel
Rejection
@ ±5 MHz 30 dB
Alternate Channel
Rejection
@ ±10 MHz 40 dB
RSSI Range 50 dB
RSSI Error –5 5 dB
MRF24J40MD/ME
DS70005173A-page 26 Advance Information 2014 Microchip Technology Inc.
Note 1: Conducted output power at antenna connector J1.
TABLE 4-4: TRANSMITTER AC CHARACTERISTICS
Typical values are at TA = 25°C, VDD = 3.3V, LO Frequency = 2.445 GHz
Parameters Condition Min Typ Max Units
RF Carrier Frequency 2.405 2.475 GHz
Maximum RF Output
Power
50—19
(1) —dBm
RF Output Power
Control Range
——45dB
Tx Gain Control
Resolution
Programmed by Register 1.25 dB
Carrier Suppression –30 dBc
Tx Spectrum Mask for
O-QPSK Signal
Offset Frequency >3.5 MHz,
at 0 dBm Output Power
–33 dBm
Tx EVM 15 %
2014 Microchip Technology Inc. Advance Information DS70005173A-page 27
MRF24J40MD/ME
APPENDIX A: MIGRATING FROM
MRF24J40MB OR
MRF24J40MC TO
MRF24J40MD/ME
MODULE
A.1 Introduction
This appendix assists in migrating designs from the
MRF24J40MB or MRF24J40MC to the MRF24J40MD/
ME module.
A.2 Background
The Power Amplifier (PA) and Low-Noise Amplifier
(LNA) used in the MRF24J40MB and MRF24J40MC
modules were discontinued by the manufacturer. This
required a redesign of the modules with new compo-
nents. The MRF24J40MD/ME module was designed
with the goal of requiring minimal changes when
migrating from the MRF24J40MB or MRF24J40MC
module.
A.3 Circuit Description
The MRF24J40MD/ME module was designed with the
SST12LP17E Power Amplifier (PA) and SST12LN01
Low-Noise Amplifier (LNA). Control of the PA and LNA
by the MRF24J40 is the same for all modules. GPIO0,
GPIO1, and GPIO2 sequence the PA and LNA during
transmit and receive by the MRF24J40. Refer to
Section 1.4.1 PA/LNA Control” for more information.
The MRF24J40MD/ME has the same physical footprint
and pin out.
The PCB trace antenna is the same for both the
MRF24J40MD and MRF24J40MB modules.
The external antenna connector, U.FL, is the same for
both the MRF24J40ME and MRF24J40MC modules.
A.4 Regulatory Approval
Due to the requirement for a redesigned module with
new RF components, new regulatory certifications for
the United States (FCC), Canada (IC) and Europe were
performed.
When migrating from the MRF24J40MB or
MRF24J40MC module to the MRF24J40MD/ME mod-
ule, the new FCC ID and IC numbers will have to be
displayed on the outside of the finished product. Refer
to Section 3.1.1 “Labeling and User Information
Requirements” for the United States and
Section 3.2.1 “Labeling and User Information
Requirements” for Canada.
For Europe, the R&TTE Directive will have to be
assessed using the new reports listed in Table 3-1.
For Australia, product certification and compliance
folder should be re-assessed.
A.5 Electrical Characteristics
Comparison
This section helps compare electrical characterization
values between modules.
TABLE A-1: CURRENT CONSUMPTION COMPARISON
TA = 25°C, VDD = 3.3V
Chip Mode Condition MRF24J40MB
(Typ)
MRF24J40MC
(Typ)
MRF24J40MD/ME
(Typ) Units
Sleep Sleep Clock Disabled 210 12 10 uA
Tx At Maximum Output
Power
130 120 140 mA
Rx 25 25 32 mA
MRF24J40MD/ME
DS70005173A-page 28 Advance Information 2014 Microchip Technology Inc.
TABLE A-2: OUTPUT POWER COMPARISON
TA = 25°C, VDD = 3.3V
RFCON3
(0x203<7:3>)
MRF24J40 Power
Setting
MRF24J40MB
Output Power (dBm)
MRF24J40MC
Output Power (dBm)
MRF24J40MD/ME
Output Power (dBm)
11111 -36.3 -7.0 -26.4 -13.6
11110 -34.9 -6.5 -25.2 -12.4
11101 -33.7 -5.6 -24.1 -11.5
11100 -32.8 -4.8 -23.4 -10.7
11011 -31.9 -4.1 -22.7 -10.0
11010 -31.2 -3.5 -22.4 -9.6
11001 -30.5 -3.2 -21.9 -9.2
11000 -30.0 2.4 -21.6 -3.4
10111 -26.3 4.6 -15.7 -1.3
10110 -24.9 5.3 -14.5 -0.7
10101 -23.7 5.9 -13.7 0.1
10100 -22.8 6.6 -12.9 0.5
10011 -21.9 7.0 -12.3 1.0
10010 -21.2 7.4 -11.8 1.3
10001 -20.5 11.7 -11.5 5.8
10000 -20.0 12.8 -11.1 7.0
01111 -16.3 13.7 -6.6 8.1
01110 -14.9 14.5 -5.5 9.0
01101 -13.7 15.0 -4.7 9.7
01100 -12.8 15.6 -4.0 10.4
01011 -11.9 16.0 -3.4 10.9
01010 -11.2 16.3 -2.9 11.3
01001 -10.5 18.6 -2.5 16.0
01000 -10.0 19.0 -2.0 17.2
00111 -6.3 19.4 10.7 17.9
00110 -4.9 19.6 18.0 18.5
00101 -3.7 19.8 18.5 19.0
Note 1: Conducted output power, channel 11, 50 ohm impedance.
Note: Refer to Section 3.0 “Regulatory
Approval” for the required maximum
power setting necessary to maintain certi-
fication requirements for each country the
module will be used.
2014 Microchip Technology Inc. Advance Information DS70005173A-page 29
MRF24J40MD/ME
APPENDIX B: REVISION HISTORY
Revision A (March 2014)
This is the initial release of the document.
MRF24J40MD/ME
DS70005173A-page 30 Advance Information 2014 Microchip Technology Inc.
NOTES:
2014 Microchip Technology Inc. Advance Information DS70005173A-page 31
MRF24J40MD/ME
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
2014 Microchip Technology Inc. Advance Information DS70005173A-page 32
MRF24J40MD/ME
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
Device MRF24J40MD/ME: 2.4 GHz IEEE Std. 802.15.4 RF Transceiver
Module with PA/LNA and External Antenna Connector
Temperature
Range
I = -40ºC to +85ºC (Industrial)
Example:
a) MRF24J40MD-I/RM: Industrial
temperature, tray.
b) MRF24J40MDT-I/RM: Industrial
temperature, tape and reel.
PART NO
Device
M
Module
X
Module
Type
Tape and
Reel
-X
Temperature
Range
T
2014 Microchip Technology Inc. Advance Information DS70005173A-page 33
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-63276-044-9
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
DS70005173A-page 34 Advance Information 2014 Microchip Technology Inc.
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03/25/14