TSUS4300
www.vishay.com Vishay Semiconductors
Rev. 1.9, 20-Oct-15 1Document Number: 81053
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Infrared Emitting Diode, 950 nm, GaAs
DESCRIPTION
TSUS4300 is an infrared, 950 nm emitting diode in GaAs
technology molded in a blue tinted plastic package.
FEATURES
Package type: leaded
Package form: T-1
Dimensions (in mm): Ø 3
Peak wavelength: λp = 950 nm
High reliability
Angle of half intensity: ϕ = ± 16°
Low forward voltage
Suitable for high pulse current operation
Good spectral matching with Si photodetectors
Package matches with detector TEFT4300
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Infrared remote control and free air transmission systems
with low forward voltage and small package requirements
Emitter in transmissive sensors
Emitter in reflective sensors
Note
Test conditions see table “Basic Characteristics”
Note
MOQ: minimum order quantity
94 8636-1
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns)
TSUS4300 18 ± 16 950 800
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
TSUS4300 Bulk MOQ: 5000 pcs, 5000 pcs/bulk T-1
TSUS4300-ASZ Ammopack MOQ: 10 000 pcs, 2000 pcs/box T-1
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA
Surge forward current tp = 100 μs IFSM 2A
Power dissipation PV170 mW
Junction temperature Tj100 °C
Operating temperature range Tamb -40 to +85 °C
Storage temperature range Tstg -40 to +100 °C
Soldering temperature t 5 s, 2 mm from case Tsd 260 °C
Thermal resistance junction/ambient J-STD-051, leads 7 mm, soldered on PCB RthJA 300 K/W
TSUS4300
www.vishay.com Vishay Semiconductors
Rev. 1.9, 20-Oct-15 2Document Number: 81053
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
0
20
40
60
80
100
120
140
160
180
0 102030405060708090100
21315
T
amb
- Ambient Temperature (°C)
PV - Power Dissipation (mW)
R
thJA
= 300 K/W
0
20
40
60
80
100
120
0 102030405060708090100
T
amb
- Ambient Temperature (°C)
21316
I
F
- Forward Current (mA)
R
thJA
= 300 K/W
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 100 mA, tp = 20 ms VF-1.31.7V
IF = 1.5 A, tp = 100 μs VF-2.2- V
Temperature coefficient of VFIF = 100 mA TKVF --1.3-mV/K
Reverse current VR = 5 V IR- - 100 μA
Breakdown voltage IR = 100 μA V(BR) 540-
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 Cj-30-pF
Radiant intensity IF = 100 mA, tp = 20 ms Ie71835mW/sr
IF = 1.5 A, tp = 100 μs Ie- 160 - mW/sr
Radiant power IF = 100 mA, tp = 20 ms φe-20-mW
Temperature coefficient of φeIF = 20 mA TKφe- -0.8 - %/K
Angle of half intensity ϕ 16- deg
Peak wavelength IF = 100 mA λp- 950 - nm
Spectral bandwidth IF = 100 mA Δλ -50-nm
Temperature coefficient of λpIF = 100 mA TKλp-0.2-nm/K
Rise time IF = 100 mA tr- 800 - ns
IF = 1.5 A tr- 400 - ns
Fall time IF = 100 mA tf- 800 - ns
IF = 1.5 A tf- 400 - ns
Virtual source diameter d - 2.1 - mm
TSUS4300
www.vishay.com Vishay Semiconductors
Rev. 1.9, 20-Oct-15 3Document Number: 81053
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Pulse Forward Current vs. Pulse Duration
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
Fig. 6 - Radiant Intensity vs. Forward Current
Fig. 7 - Radiant Power vs. Forward Current
Fig. 8 - Relative Radiant Intensity/Power vs. Ambient Temperature
tp- Pulse Duration (ms)
94 7947
10 0
10 1
101
10-1
10 -1 10 010 2
10 -2
tp/T = 0.01, I FM =2A
0.05
0.1
0.5
0.02
0.2
I - Forward Current (A)
F
94 7996
10 1
10 0
10 2
10 3
10 4
10-1
I - Forward Current (mA)
F
43210
V
F- Forward Voltage (V)
0.7
0.8
0.9
1.0
1.1
1.2
VF rel - Relative Forward Voltage (V)
94 7990 Tamb - Ambient Temperature (°C)
100806040200
IF = 10 mA
IF- Forward Current (mA)
94 7979
103
101102104
100
0.1
1
10
1000
100
I - Radiant Intensity (mW/sr)
e
- Radiant Power (mW)
e
I
F
- Forward Current (mA)
94 7980
10
3
10
1
10
2
10
4
10
0
0.1
1
10
1000
100
Φ
-10 10 50
0100
0
0.4
0.8
1.2
1.6
I
e rel
;
140
94 7993
I
F
= 20 mA
Φ
e rel
T
amb
- Ambient Temperature (°C)
TSUS4300
www.vishay.com Vishay Semiconductors
Rev. 1.9, 20-Oct-15 4Document Number: 81053
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 9 - Relative Radiant Power vs. Wavelength Fig. 10 - Relative Radiant Intensity vs. Angular Displacement
PACKAGE DIMENSIONS in millimeters
900 950
0
0.25
0.5
0.75
1.0
1.25
λ - Wavelength (nm)
1000
94 7994
Φe rel - Relative Radiant Power
IF = 100 mA
0.4 0.2 0 0.2 0.4
I - Relative Radiant Intensity
e rel
0.6
94 7981
0.6
0.9
0.8
30°
10°20°
40°
50°
60°
70°
80°
0.7
1.0
3.9 ± 0.15
Ø 3 ± 0.1
< 0.6
3.5 ± 0.1
4.5 ± 0.3
6.1 ± 0.3
34.7 ± 0.5
1.5 ± 0.5
0.5
+ 0.2
- 0.1
2.54 nom.
Drawing-No.: 6.544-5269.02-4
Issue: 5; 28.07.14
technical drawings
according to DIN
specications
AC
AREA NOT PLANE
(2.8)
CHIP POSITION
3.2 ± 0.1
0.4
+ 0.15
- 0.05
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 08-Feb-17 1Document Number: 91000
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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