NCP786L
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5
APPLICATION INFORMATION
The typical application circuit for the NCP786L device is shown below.
Figure 7. Typical Application Schematic
NCP786L
Cin Cout
R1
R2
2.2 uF
Vout = 1.27 V – 15 V / 5 mA
IN
GND
OUT
ADJ
Vin = (55 – 450) Vdc
NCP786L
Cin Cout
R1
R2
2.2 uF
Vout = 1.27 V – 15 V / 5 mA
IN
GND
OUT
ADJ
Vin = (40 – 320) Vac
NCP786L
Cin Cout
R1
R2
2.2 uF
Vout = 1.27 V – 15 V / 5 mA
IN
GND
OUT
ADJ
Vin = (40 – 320) Vac
Input Decoupling (C1)
A 1.0 mF capacitor either ceramic or electrolytic is
recommended and should be connected close to the input pin
of NCP786L. Higher value 2.2 mF is necessary to keep the
input voltage above the required minimum input voltage at
full load for AC voltage as low as 85 V with half wave
rectifier. The capacitor 1 mF could be acceptable for DC
input voltage from 55 V up to 450 V or AC input voltage
235 V ±20%. There must be assured minimum Input
Voltage more than 55 V at input pin of NCP786L regulator
in order to keep stable desired output voltage with
guaranteed parameters at AC supply.
Output Decoupling (C2)
The NCP786L Regulator does not require any specific
Equivalent Series Resistance (ESR). Thus capacitors
exhibiting ESRs ranging from a few mW up to 0.5 W can be
used safely. The minimum decoupling value is 2.2 mF. The
regulator accepts ceramic chip capacitors as well as
tantalum devices or low ESR electrolytic capacitors. Larger
values improve noise rejection and especially load transient
response.
Layout Recommendations
Please be sure that the VIN and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up a noise or to cause the malfunction of
regulator by induced parasitic signal.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Thermal
As power across the NCP786L increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design layout and used package. Mounting pad
configuration on the PCB, the board material, and also the
ambient temperature affect the rate of temperature rise for
the part. This is stating that when the NCP786L has good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.