FEATURES
DFIXED AND ADJUSTABLE VERSIONS
D2.85V MODEL FOR SCSI-2 ACTIVE
TERMINATION
DOUTPUT CURRENT:
REG1117: 800mA max
REG1117A: 1A max
DOUTPUT TOLERANCE: +1% max
DDROPOUT VOLTAGE:
REG1117: 1.2V max at IO = 800mA
REG1117A: 1.3V max at IO = 1A
DINTERNAL CURRENT LIMIT
DTHERMAL OVERLOAD PROTECTION
DSOT-223 AND DDPAK SURFACE-MOUNT
PACKAGES
APPLICATIONS
DSCSI-2 ACTIVE TERMINATION
DHAND-HELD DATA COLLECTION DEVICES
DHIGH EFFICIENCY LINEAR REGULATORS
DBATTERY-POWERED INSTRUMENTATION
DBATTERY MANAGEMENT CIRCUITS FOR
NOTEBOOK AND PALMTOP PCs
DCORE VOLTAGE SUPPLY: FPGA, PLD, DSP,
CPU
DESCRIPTION
The REG1117 is a family of easy-to-use three-terminal
voltage regulators. The family includes a variety of fixed-
and adjustable-voltage versions, two currents (800mA and
1A) and two package types (SOT-223 and DDPAK). See
the chart below for available options.
Output voltage of the adjustable versions is set with two
external resistors. The REG1117 low dropout voltage
allows its use with as little as 1V input-output voltage
differential.
Laser trimming assures excellent output voltage accuracy
without adjustment. An NPN output stage allows output
stage drive to contribute to the load current for maximum
efficiency.
800mA 1A
VOLTAGE SOT-223 DDPAK SOT-223 DDPAK
1.8V n n
2.5V n n
2.85V n
3.3V n n
5V n n
Adjustable n n n
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All trademarks are the property of their respective owners.
REG1117
REG1117A
SBVS001D − OCTOBER 1992 − REVISED JULY 2004
800mA and 1A Low Dropout Positive Regulator
1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
www.ti.com
Copyright 1992−2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
ABSOLUTE MAXIMUM RATINGS(1)
Power Dissipation Internally Limited. . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage +15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Junction Temperature Range −40°C to +125°C. . . . . . . .
Storage Temperature Range −65 °C to +150°C. . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s)(2) +300°C. . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
(2) See Soldering Methods section.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
CONNECTION DIAGRAM
Front View
Plastic SOT−223 Plastic DDPAK
Tab is VOUT
VIN
VOUT
Ground
(Adj.)(1)
Tab is
VOUT
VIN
VOUT
Ground
(Adj.)(1)
NOTE: (1) Adjustable−Voltage Model.
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3
PACKAGE/ORDERING INFORMATION (1)
PRODUCT VO/IOPACKAGE-LEAD PACKAGE
DESIGNATOR
OPERATING
TEMPERATURE
RANGE
PACKAGE
MARKING ORDERING
NUMBER
TRANSPORT
MEDIA,
QUANTITY
−40°C t o
REG1117-2.85 Rails, 80
REG1117-2.85 2.85/800mA SOT223-3 DCY −40°C to
+125°CBB11172 REG1117-2.85 Tape and Reel,
2500
−40°C to
REG1117-3.3 Rails, 80
REG1117-3.3 3.3/800mA SOT223-3 DCY −40°C to
+125°CBB11174 REG1117-3.3 Tape and Reel,
2500
REG1117F-3.3
3.3/800mA
DDPAK-3
KTT
−40
°
C to
BB1117F4
REG1117F-3.3KTTT Tape and Reel,
50
REG1117F-3.3 3.3/800mA DDPAK-3 KTT
−40 C to
+125°CBB1117F4 REG1117F-3.3/500 Tape and Reel,
500
−40°C to
REG1117-5 Rails, 80
REG1117-5 5V/800mA SOT223-3 DCY −40°C to
+125°CBB11175 REG1117-5 Tape and Reel,
2500
−40°C to
REG1117 Rails, 80
REG1117 Adj./800mA SOT223-3 DCY −40°C to
+125°CBB1117 REG1117 Tape and Reel,
2500
−40°C to
REG1117A-1.8 Rails, 80
REG1117A-1.8 1.8V/1A SOT223-3 DCY −40°C to
+125°CR111718 REG1117A-1.8 Tape and Reel,
2500
REG1117FA-1.8
1.8/1A
DDPAK-3
KTT
−40
°
C to
REG1117FA1.8
REG1117FA-1.8KTTT Tape and Reel,
50
REG1117FA-1.8 1.8/1A DDPAK-3 KTT
−40 C to
+125°CREG1117FA1.8 REG1117FA-1.8/500 Tape and Reel,
500
−40°C to
REG1117A-2.5 Rails, 80
REG1117A-2.5 2.5/1A SOT223-3 DCY −40°C to
+125°CR111725 REG1117A-2.5 Tape and Reel,
2500
REG1117FA-2.5
2.5/1A
DDPAK-3
KTT
−40
°
C to
REG1117FA2.5
REG1117FA-2.5KTTT Tape and Reel,
50
REG1117FA-2.5 2.5/1A DDPAK-3 KTT
−40 C to
+125°CREG1117FA2.5 REG1117FA-2.5/500 Tape and Reel,
500
REG1117FA-5
5/1A
DDPAK-3
KTT
−40
°
C to
BB1117FA5.0
REG1117FA-5/KTTT Tape and Reel,
50
REG1117FA-5 5/1A DDPAK-3 KTT
−40 C to
+125°CBB1117FA5.0 REG1117FA-5/500 Tape and Reel,
500
−40°C to
REG1117A Rails, 80
REG1117A Adj./1A SOT223-3 DCY −40°C to
+125°CBB1117A REG1117A Tape and Reel,
2500
REG1117FA
Adj./1A
DDPAK-3
KTT
−40
°
C to
REG1117FA
REG1117FA/KTTT Tape and Reel,
50
REG1117FA Adj./1A DDPAK-3 KTT
−40 C to
+125°CREG1117FA REG1117FA/500 Tape and Reel,
500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
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4
ELECTRICAL CHARACTERISTICS
At TJ = +25°C, unless otherwise noted.
REG1117, REG1 117A
PARAMETER CONDITION MIN TYP MAX UNIT
OUTPUT VOLT AGE
REG1117-2.85 IO = 10mA, VIN = 4.85V 2.820 2.85 2.880 V
See Note 1 IO = 0 to 800mA, VIN = 4.05V to 10V 2.790 2.85 2.910 V
REG1117-3.3 IO = 10mA, VIN = 5.3V 3.270 3.30 3.330 V
See Note 1 IO = 0 to 800mA, VIN = 4.8V to 10V 3.240 3.30 3.360 V
REG1117-5 IO = 10mA, VIN = 7V 4.950 5.00 5.050 V
See Note 1 IO = 0 to 800mA, VIN = 6.5V to 10V 4.900 5.00 5.100 V
REG1117A-1.8 IO = 10mA, VIN = 3.8V 1.782 1.8 1.818 V
See Note 1 IO = 0 to 1A, VIN = 3.8V to 10V 1.764 1.8 1.836 V
REG1117A-2.5 IO = 10mA, VIN = 4.5V 2.475 2.5 2.525 V
See Note 1 IO = 0 to 1A, VIN = 4.5V to 10V 2.450 2.5 2.550 V
REG1117A-5 IO = 10mA, VIN = 7V 4.950 5.0 5.050 V
See Note 1 IO = 0 to 1A, VIN = 7V to 10V 4.900 5.0 5.100 V
REFERENCE VOLT AGE
REG1117 (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V
See Note 1 IO = 10 to 800mA, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V
REG1117A (Adjustable) IO = 10mA, VIN − VO = 2V 1.238 1.250 1.262 V
See Note 1 IO = 10mA to 1A, VIN − VO = 1.4 to 10V 1.225 1.250 1.280 V
LINE REGULATION
REG1117-2.85(1) IO = 0, VIN = 4.25 to 10V 1 7 mV
REG1117-3.3(1) IO = 0, VIN = 4.8 to 10V 2 7 mV
REG1117-5(1) IO = 0, VIN = 6.5 to 15V 3 10 mV
REG1117 (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 %
REG1117A (Adjustable)(1) IO = 10mA, VIN − VO = 1.5 to 13.75V 0.1 0.4 %
REG1117A-1.8(1) IO = 0, VIN = 3.8V to 10V 1 7 mV
REG1117A-2.5(1) IO = 0, VIN = 4.5V to 10V 1 7 mV
REG1117A-5.0(1) IO = 0, VIN = 7V to 15V 3 10 mV
LOAD REGULATION
REG1117-2.85(1) IO = 0 to 800mA, VIN = 4.25V 2 10 mV
REG1117-3.3(1) IO = 0 to 800mA, VIN = 4.8V 3 12 mV
REG1117-5(1) IO = 0 to 800mA, VIN = 6.5V 3 15 mV
REG1117 (Adjustable)(1)(2) IO = 10 to 800mA, VIN − VO = 3V 0.1 0.4 %
REG1117A (Adjustable)(1)(2) IO = 10mA to 1A, VIN − VO = 3V 0.1 0.4 %
REG1117A-1.8(1) IO = 0 to 1A, VIN = 3.8V 2 10 mV
REG1117A-2.5 IO = 0 to 1A, VIN = 4.5V 2 10 mV
REG1117A-5 IO = 0 to 1A, VIN = 7.0V 3 15 mV
DROPOUT VOLTAGE(3)
All Models(1) IO = 100mA 1.00 1.10 V
See Note 1 IO = 500mA 1.05 1.15 V
REG1117 Models(1) IO = 800mA 1.10 1.20 V
REG1117A IO = 1A 1.2 1.30 V
See Note 1 IO = 1A 1.2 1.55 V
(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG1117A),
VIN − VO = 1.4V (reading taken 10ms after pulse).
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5
ELECTRICAL CHARACTERISTICS (continued)
At TJ = +25°C, unless otherwise noted.
REG1117, REG1 117A
PARAMETER UNITMAXTYPMINCONDITION
CURRENT LIMIT
REG1117 Models VIN − VO = 5V 800 950 1200 mA
REG1117A VIN − VO = 5V 1000 1250 1600 mA
MINIMUM LOAD CURRENT
Adjustable Models(1)(2) VIN − VO = 13.75V 1.7 5 mA
QUIESCENT CURRENT
Fixed-Voltage Models(1) VIN − VO = 5V 4 10 mA
ADJUSTABLE PIN CURRENT(1)(2) IO = 10mA, VIN − VO = 1.4 to 10V 50 120 µA
vs Load Current, REG11 17(1) IO = 10mA to 800mA, VIN − VO = 1.4 to 10V 0.5 5 µA
vs Load Current, REG11 17A(1) IO = 10mA to 1A, VIN − VO = 1.4 to 10V 0.5 5 µA
THERMAL REGULATION
All Models(4) 30ms Pulse 0.01 0.1 %/W
RIPPLE REJECTION
All Models f = 120Hz, VIN − VOUT = 3V + 1VPP Ripple 62 dB
TEMPERATURE DRIFT
Fixed-Voltage Models TJ = 0°C to +125°C 0.5 %
Adjustable Models TJ = 0°C to +125°C 2 %
LONG-TERM STABILITY
All Models TA = 125°C, 1000Hr 0.3 %
OUTPUT NOISE
rms Noise, All Models f = 10Hz to 10kHz 0.003 %
THERMAL RESISTANCE
Thermal Resistance, qJC (Junction-to-Case at Tab)
3-Lead SOT-223 Surface-Mount 15 °C/W
3-Lead DDPAK Surface-Mount f > 50Hz 2°C/W
dc 3 °C/W
Thermal Resistance, qJA (Junction-to-Case at Tab)
3-Lead DDPAK Surface-Mount No Heatsink 65 °C/W
(1) Specification applies over the full specified junction temperature range, 0°C to +125°C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG11 17 models), IO = 1A (REG1117A),
VIN − VO = 1.4V (reading taken 10ms after pulse).
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6
SIMPLIFIED SCHEMATIC
Thermal
Limit
10X VOUT
VIN
Ground (Fixed−voltage Models)
Adj. (Adjustable−voltage Model)
(Substrate)
+
Current
Limit
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7
TYPICAL CHARACTERISTICS
At TA = +25°C, all models, unless otherwise noted.
SHORT−CIRCUIT CURRENT vs TEMPERATURE
1400
1300
1200
1100
1000
900
800
−50 −25 0 25 50 75 100
Temperature (_C)
Short−Circuit Current (mA)
REG1117A
REG1117 Models
LOAD REGULATION
(∆
ILOAD = 800mA)
1
0
1
−2
−3
−4
−5
−6
−7−50 −25 0 25 50 75 100
Temperature (_C)
Output Voltage Deviation (mV)
REG1117−2.85
REG1117A−1.8
REG1117−5
LINE REGULATION vs TEMPERATURE
6
5
4
3
2
1
0
−1
−2
−50 −25 0 25 50 75 100
Temperature (_C)
Output Voltage Change (mV)
REG1117A−1.8
VIN =3.8Vto10V
VIN =6.5Vto15V
REG1117−5
RIPPLE REJECTION vs FREQUENCY
Frequency (Hz)
Ripple Rejection (dB)
100
90
80
70
60
50
40
30
20
10
010 100 1k 10k 100k
IOUT =100mA
VRIPPLE =1.0V
PP
OUTPUT VOLTAGE vs TEMPERATURE
2.0
1.0
0
−1.0
−2.0
−50 −25 0 25 50 75 100
Temperature (_C)
Output Voltage Change (%)
IO=10mA
QUIESCENT CURRENT vs TEMPERATURE
8
7
6
5
4
3
2
1
0
−50 −25 0 25 50 75 100
Temperature (_C)
Quiescent Current (mA)
Fixed−Voltage Models
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8
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, all models, unless otherwise noted.
LOAD TRANSIENT RESPONSE
0.1
0
−0.1
0.5
0
−0.5
Load Current (A) Output Voltage
Deviations (V)
0 20406080100
Time (µs)
CIN =10
µF
COUT =10
µF
Tantalum
VIN =4.25V
Preload = 0.1A
LINE TRANSIENT RESPONSE
60
40
20
0
−20
−40
5.25
4.25
3.25
Input Voltage (V) Output Voltage
Deviation (mV)
0 20 40 60 80 100 120 140 160 180 200
Time (µs)
CIN =1
µF
COUT =10
µFTantalum
IOUT =0.1A
APPLICATIONS INFORMATION
Figure 1 shows the basic hookup diagram for fixed-voltage
models. All models require an output capacitor for proper
operation, and for improving high-frequency load
regulation; a 10µF tantalum capacitor is recommended.
Aluminum electrolytic types of 50µF or greater can also be
used. A high-quality capacitor should be used to assure
that the ESR (Effective Series Resistance) is less than
0.5Ω.
REG1117 VO
VIN
10µF
Tantalum 10µF
Tantalum
++
Figure 1. Fixed-Voltage Model—Basic
Connections
Figure 2 shows a hookup diagram for the adjustable
voltage model. Resistor values are shown for some
commonly-used output voltages. Values for other voltages
can be calculated from the equation shown in Figure 2. For
best load regulation, connect R1 close to the output pin and
R2 close to the ground side of the load as shown.
THERMAL CONSIDERATIONS
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately TJ = 165°C. For continuous
operation, however, the junction temperature should not
be allowed to exceed 125°C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat s i n k o r e x c essive pow er dissipa t ion. The
power dissipation is equal to:
PD = (VIN – VOUT) IOUT
The junction temperature can be calculated by:
TJ = TA + PD (qJA)
where TA is the ambient temperature, and qJA is the
junction-to-ambient thermal resistance.
REG1117
(Adj)
VIN VO
C2
10µF
C1
10µF
C3(1)
10µF
++
+
R1
R2
Load
32
1
NOTES: (1) C3optional. Improves high−frequency line rejection. (2) Resistors are standard 1% values.
VO= x (1.25V) + (50µA) (R2)
R1
R1+R
2
This term is negligible with
proper choice of values−see
table at right.
VOUT R1R2
(V)(
Ω)(2) (Ω)(2)
1.25 Open Short
1.5 750 147
2.1 158 107
2.85 169 215
3 137 191
3.3 115 187
5 113 340
10 113 787
Figure 2. Adjustable-Voltage Model—Basic Connections
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9
A simple experiment will determine whether the maximum
recommended junction temperature is exceeded in an
actual circuit board and mounting configuration: Increase
the ambient temperature above that expected in normal
operation until the device’s thermal shutdown is activated.
If this occurs at more than 40°C above the maximum
expected ambient temperature, then TJ will be less than
125°C during normal operation.
The internal protection circuitry of the REG1117 was
designed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously
running the REG1117 into thermal shutdown will degrade
reliability.
LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a
surface-mount power package that has excellent thermal
characteristics. For best thermal performance, the
mounting tab should be soldered directly to a circuit board
copper area, as shown in Figure 3. Increasing the copper
area improves heat dissipation. Figure 4 shows typical
thermal resistance from junction-to-ambient as a function
of the copper area.
3−Lead DDPAK(1)
NOTE: (1) For improved thermal performance increase
footprint area. See Figure 4 (Thermal Resistance vs
Circuit Board Copper Area).
All measurements
in inches.
0.45
0.085
0.2
0.51
0.10
0.155 0.05
Figure 3. DDPAK Footprint
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
60
50
40
30
20
10 012345
Copper Area (inches2)
REG1117F
DDPAK Surface Mount Package
1oz copper
Thermal Resistance, qJA (°C/W)
Circuit Board Copper Area
REG1117F
DDPAK Surface−Mount Package
Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area
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10
The SOT-223 package derives heat sinking from
conduction through its copper leads, especially the large
mounting tab. These must be soldered to a circuit board
with a substantial amount of copper remaining, as shown
in Figure 5. Circuit board traces connecting the tab and t h e
leads should be made as large as practical. The mounting
tab of both packages is electrically connected to VOUT.
Total Area: 50 x 50mm
35 x 17 mm
16 x 10 mm 16 x 10 mm
Without backside copper: JA ≈59_C/W
q
With solid backside copper: JA ≈49_C/W
q
Figure 5. SOT-223 Circuit Board Layout Example
Other nearby circuit traces, including those on the back
side of the circuit board, help conduct heat away from the
device, even though they may not be electrically
connected. Make all nearby copper traces as wide as
possible and leave only narrow gaps between traces.
Table 1 shows approximate values of qJA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting
conditions, and ventilation can dramatically affect the
actual qJA. Proper heat sinking significantly increases the
maximum power dissipation at a given ambient
temperature, as shown in Figure 6.
Table 1. SOT-223 qJA for Various Board
Configurations
(1)
SOT-223
THERMAL
T OTAL PC
BOARD
TOPSIDE
(1)
COPPER
BACKSIDE
COPPER
THERMAL
RESISTANCE
JUNCTION-
BOARD
AREA
COPPER
AREA
COPPER
AREA
JUNCTION-
TO-AMBIENT
2500mm22500mm22500mm246°C/W
2500mm21250mm22500mm247°C/W
2500mm2950mm22500mm249°C/W
2500mm22500mm20 51°C/W
2500mm21800mm20 53°C/W
1600mm2600mm21600mm255°C/W
2500mm21250mm20 58°C/W
2500mm2915mm20 59°C/W
1600mm2600mm20 67°C/W
900mm2340mm2900mm272°C/W
900mm2340mm20 85°C/W
(1) Tab is attached to the topside copper.
SOLDERING METHODS
Both REG1117 packages are suitable for infrared reflow
and vapor-phase reflow soldering techniques. The high
rate of temperature change that occurs with wave
soldering or hand soldering can damage the REG1117.
INSPEC Abstract Number: B91007604, C91012627.
Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive
Surface Mount Technology, April 3−6, 1990, Atlantic City,
NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,
IL, USA.
6
5
4
3
2
1
0
Power Dissipation (Watts)
0 255075100125
Ambient Temperature (_C)
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
PD=(T
J(max) −TA)/ JA
TJ(max) = 150_C
q
DDPAK
SOT−223
JA =85
_C/W
(340mm2topside copper,
no backside copper)
q
JA =46
_C/W
(2500mm2topside and
backside copper)
q
JA =27
_C/W
(4in2one oz copper
mounting pad)
q
JA =65
_C/W
(no heat sink)
q
Figure 6. Maximum Power Dissipation versus Ambient Temperature
"#$$$%
"#$$$%
SBVS001D − OCTOBER 1992 − REVISED JULY 2004
www.ti.com
11
10µF10µF
REG1117−2.85
110Ω
110Ω
110Ω
110Ω
10µF10µF
1N5817
5V TERMPWR
2.85V 2.85V
TERMPWR
1N5817
5V
(Upto27Lines)
REG1117−2.85
Figure 7. SCSI Active Termination Configuration
REG1117−5
GND
In Out
10µF100
µF
++
5V to 10V
10µF+
VIN > 12V
1kΩ
Figure 8. Adjusting Output of Fixed Voltage Models
REG1117−5
GND
In Out
10µF100
µF
++
7.5VVIN >9.0V
2.5VOUT
REF1004−2.5
Figure 9. Regulator with Reference
REG1117−5
GND
In Out
REG1117−5
GND
In Out
10µF
10µF
100µF
6.5V
1kΩ
50Ω
5.2V Line
5.0V Battery
VIN
+
++
Figure 10. Battery Backed-Up Regulated Supply
REG1117−5
GND
In Out
10µF 100µF
++
VOUT =−5V
VIN
Floating Input
Figure 11. Low Dropout Negative Supply
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
REG1117 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-2.85 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-2.85/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-2.85/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-2.85G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-3.3 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-3.3/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-3.3/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-3.3G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-5 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117-5G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-1.8 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-1.8/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-1.8/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-1.8G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-2.5 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-2.5/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-2.5/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A-2.5G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117A/2K5 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
REG1117A/2K5G4 ACTIVE SOT-223 DCY 4 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117AG4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
REG1117F-3.3 OBSOLETE DDPAK/
TO-263 KTT 3 TBD Call TI Call TI
REG1117F-3.3/500 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117F-3.3/500G3 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117F-3.3KTTT ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117F33KTTTG3 ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA OBSOLETE DDPAK/
TO-263 KTT 3 TBD Call TI Call TI
REG1117FA-1.8 OBSOLETE DDPAK/
TO-263 KTT 3 TBD Call TI Call TI
REG1117FA-1.8KTTT ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-2.5 OBSOLETE DDPAK/
TO-263 KTT 3 TBD Call TI Call TI
REG1117FA-2.5/500 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-2.5KTTT ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-25/500G3 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-5.0 OBSOLETE DDPAK/
TO-263 KTT 3 TBD Call TI Call TI
REG1117FA-5.0/500 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-5.0KTTT ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA-5.0KTTTG ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA/500 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA/500G3 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA1.8KTTTG3 ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA2.5KTTTG3 ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FA5.0/500G3 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FAKTTT ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117FAKTTTG3 ACTIVE DDPAK/
TO-263 KTT 3 50 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
REG1117G4 ACTIVE SOT-223 DCY 4 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
REG1117-2.85/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117-3.3/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117-5/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117A-1.8/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117A-2.5/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117A/2K5 SOT-223 DCY 4 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
REG1117F-3.3/500 DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117F-3.3KTTT DDPAK/
TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FA-1.8KTTT DDPAK/
TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FA-2.5/500 DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FA-2.5KTTT DDPAK/
TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FA-5.0/500 DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FA-5.0KTTT DDPAK/ KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TO-263
REG1117FA/500 DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
REG1117FAKTTT DDPAK/
TO-263 KTT 3 50 330.0 24.4 10.6 15.6 4.9 16.0 24.0 Q2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
REG1117-2.85/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117-3.3/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117-5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117A-1.8/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117A-2.5/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117A/2K5 SOT-223 DCY 4 2500 358.0 335.0 35.0
REG1117F-3.3/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
REG1117F-3.3KTTT DDPAK/TO-263 KTT 3 50 367.0 367.0 45.0
REG1117FA-1.8KTTT DDPAK/TO-263 KTT 3 50 367.0 367.0 45.0
REG1117FA-2.5/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
REG1117FA-2.5KTTT DDPAK/TO-263 KTT 3 50 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
REG1117FA-5.0/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
REG1117FA-5.0KTTT DDPAK/TO-263 KTT 3 50 367.0 367.0 45.0
REG1117FA/500 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
REG1117FAKTTT DDPAK/TO-263 KTT 3 50 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE
4202506/B 06/2002
6,30 (0.248)
6,70 (0.264)
2,90 (0.114)
3,10 (0.122)
6,70 (0.264)
7,30 (0.287) 3,70 (0.146)
3,30 (0.130)
0,02 (0.0008)
0,10 (0.0040)
1,50 (0.059)
1,70 (0.067)
0,23 (0.009)
0,35 (0.014)
1 2 3
4
0,66 (0.026)
0,84 (0.033)
1,80 (0.071) MAX
Seating Plane
0°–10°
Gauge Plane
0,75 (0.030) MIN
0,25 (0.010)
0,08 (0.003)
0,10 (0.004) M
2,30 (0.091)
4,60 (0.181) M
0,10 (0.004)
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
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