cExpress-BT
COM Express
®
Compact Size Type 6 Module with
Intel
®
Atom™ E3800 series or Celeron
®
Processor SoC
Features
●
Single, dual, quad-core Intel
®
Atom™ or Celeron
®
Processor SoC
●
Up to 8GB Dual Channel DDR3L at 1333MHz
●
VGA and two DDI channels (build option LVDS)
●
Three PCIe x1, GbE
●
Two SATA 3Gb/s, one USB 3.0, seven USB 2.0
●
Supports Smart Embedded Management Agent (SEMA
®
) functions
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
Specications
● Core System
CPU
Single, dual, quad-core Intel
®
Atom™ or Celeron
®
Processor
Atom™ E3845 1.91 GHz 542/792 (Turbo) 10W (4C/1333)
Atom™ E3827 1.75 GHz 542/792 (Turbo) 8W (2C/1333)
Atom™ E3826 1.46 GHz 533/667 (Turbo) 7W (2C/1066)
Atom™ E3825 1.33 GHz 533 (No Turbo) 6W (2C/1066)
Atom™ E3815 1.46 GHz 400 (No Turbo) 5W (1C/1066)
Atom™ E3805 1.33 GHz (No GFX) 3W (2C/1066)
Celeron
®
N2930 1.83/2.16 (Burst) GHz, 313/854 (Turbo) 7.5W (4C/1333)
Celeron
®
J1900 2.0/2.42 (Burst) GHz, 688/854 (Turbo) 10W (4C/1333)
Supports: Single, dual or quad Out-of-Order Execution (OOE) processor
cores, Intel
®
VT-x, Intel
®
SSE4.1 and SSE4.2, Intel
®
64 architecture, IA 32-bit ,
PCLMULQDQ Instruction DRNG, Intel
®
Thermal Monitor (TM1 & TM2)
Note: Availability of features may vary between processor SKUs.
Memory
Dual channel non-ECC 1333/1066 MHz DDR3L memory up to 8GB in dual
stacked SODIMM sockets
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back
data cache
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2; build option PCIe x4 (lose GbE)
LPC bus, SMBus (system), I2C (user)
SEMA Board Controller
Supports: Voltage/Current monitoring, Power sequence debug support, AT/
ATX mode control, Logistics and Forensic information, Flat Panel Control,
General Purpose I
2
C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan
Control
Debug Headers
40-pin multipurpose at cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS ashing, Power test
points, Debug LEDs
26-pin XDP header for ICE debug of CPU/chipset
● Video
GPU Feature Support
7th generation Intel
®
graphics core architecture with four execution units
supporting two independent displays
3D graphics hardware acceleration
Supports DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2,
MVC, VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Digital Display Interface
DDI1 supporting DisplayPort/HDMI/DVI (build option dual channel 18/24-bit
LVDS support)
DDI2 supporting DisplayPort/HDMI/DVI
VGA
Analog VGA supporting resolutions of up to 2560 x 1600 x 24bpp @60
● Audio
Chipset
Intel
®
HD Audio integrated in SoC
Audio Codec
Located on carrier Express-BASE6
● Ethernet
Intel
®
MAC/PHY: Intel
®
i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Note: “Build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Specications
● I/O Interfaces
USB: 1x USB 3.0 (USB 0)
6x USB 1.1/2.0 (USB 1/2/3/4/5/6, ports 3-6 from USB hub)
SATA: Two SATA 3 Gb/s ports
Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)
eMMC: Build option soldered on module bootable eMMC ash storage
8 to 32 GB
SDIO: On module mini SD card socket, eMMC feature may vary between OS
GPIO: 4 GPO and 4 GPI
● Super I/O
On carrier if needed (standard support for W83627DHG-P)
● TPM
Chipset: Atmel AT97SC3204 (build option)
Type: TPM 1.2
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C0, C1, C1E, C4, C6
S0, S3, S4, S5 (Wake on USB S3 for port 0~7/S4 for port 0~3, WOL S3/S4/S5
ECO mode: Wake on USB S3/S4, WOL S3/S4/S5
● Mechanical and Environmental
Specication: PICMG COM.0: Rev 2.1 Type 6
Form Factor: Compact size: 95 mm x 95 mm
Operating Temperature
Standard: 0°C to +60°C
Extreme Rugged™: -40°C to +85°C (build option, Atom™ E38xx series only)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
● Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks 32/64-bit WEC7 32-bit
Functional Diagram
GbE
i210
LVDS
eDP to LVDS
Realtek
Intel® Atom™
E3845
E3827
E3826
E3825
E3815
Intel® Celeron®
N2930
J1900
“Baytrail”
SODIMM
1~4 GB DDR3L
non ECC
DDI1 (4 lanes)
DP/eDP/TMDS
Analog VGA
3x PCIe x1 Gen2 (opt. 4x)
(port 0,1,2)
HD Audio
2x SATA 3Gb/s (port 0/1)
3x USB 2.0/1.0
(ports 0~2)
XDP
26
DDI2 (4 lanes)
DP/eDP/TMDS
Mini SD
Socket
PCIe x1 Gen2
(port 3)
1x USB 3.0 upgrade
(port 0)
Single/dual channel
18/24-bit LVDS (oponal)
UART0, UART1
eDP
2 lanes
eMMC
8~32GB
PCIe x1
altern.
route
LM73
TPM
Atmel
AT97SC3204
GPIO
PCA9535
SEMA
BMC
SMBus
4x GP0
GP I2C
SPI 0
BIOS
LPC bus
SPI
4x GPI
SPI 1
BIOS
DDC I2C
SPI_CS#
SODIMM
1~4 GB DDR3L
non ECC
4x USB 2.0/1.1
(ports 3~6)
USB
Hub
1x USB 2.0/1.1
E3805 (No GFX)
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Oct. 14, 2016. ©2016 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
Ordering Information
●
cExpress-BT-E3845
Compact COM Express
®
Type 6 Module with Intel
®
Atom™
E3845 at 1.91 GHz
●
cExpress-BT-E3827
Compact COM Express
®
Type 6 Module with Intel
®
Atom™
E3827 at 1.75 GHz
●
cExpress-BT-E3826
Compact COM Express
®
Type 6 Module with Intel
®
Atom™
E3826 at 1.46 GHz
●
cExpress-BT-E3825
Compact COM Express
®
Type 6 Module with Intel
®
Atom™
E3825 at 1.33 GHz
●
cExpress-BT-E3815
Compact COM Express
®
Type 6 Module with Intel
®
Atom™
E3815 at 1.46 GHz
●
cExpress-BT-E3805
Compact COM Express Type6 Module with Intel
®
Atom™ E3805
at 1.33 GHz
●
cExpress-BT-J1900
Compact COM Express
®
Type 6 Module with Intel
®
Celeron
®
J1900 at 2.00 GHz
●
cExpress-BT-N2930
Compact COM Express
®
Type 6 Module with Intel
®
Celeron
®
N2930 at 1.83 GHz
Accessories
Heat Spreaders
●
HTS-cBT-B
Heatspreader for cExpress-BT with threaded standoffs for
bottom mounting
●
HTS-cBT-BT
Heatspreader for cExpress-BT with through hole standoffs for
top mounting
Passive Heatsinks
●
THS-cBT-B
Low profile heatsink for cExpress-BT with threaded standoffs
for bottom mounting
●
THSH-cBT-B
High profile heatsink for cExpress-BT with threaded standoffs
for bottom mounting
Active Heatsink
●
THSF-cBT-B
High profile heatsink with Fan for cExpress-BT with threaded
standoffs for bottom mounting (-40°C to + 85°C build option)
Starter Kit
●
COM Express Type 6 Starter Kit Plus
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
ADLINK Technology:
t2cExpress-BT-E3845 cExpress-BT-E3815 HTS-cBT-B cExpress-BT-N2920 t2cExpress-BT-E3815 cExpress-BT-
E3845 cExpress-BT-J1900 t2cExpress-BT-E3826 t2cExpress-BT-E3825 t2cExpress-BT-E3827 cExpress-BT-E3826
cExpress-BT-E3827 cExpress-BT-E3825 THSH-cBT-B THS-cBT-B HTS-cBT-BT cExpress-BT-N2930 THSF-cBT-B
