© Semiconductor Components Industries, LLC, 2014
August, 2018 − Rev. 1 1Publication Order Number:
HBL5006/D
HBL5006 Series
LED Shunt
The HBL5006 Series are electronic shunts which provide a current
bypass in the case of LEDs going into open circuit. LEDs are by nature
quite fragile when subjected to transients and surge conditions. There
are also many cases where high reliability of the LED lighting must be
maintained such as i n headlights, lighthouses, bridges, aircraft, r unways
and so f orth. In t hese c ases t he l ow c ost a ddition o f t he s hunt d evice w ill
provide full assurance that an entire string of LEDs will not extinguish
should one LED fail open. The shunt device is also applicable to other
loads where circuit continuity is required. The devices are designed to
be used with LED string currents from 50 to 350 mA.
Features
•Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
ISO 10605
•Low ESD Clamping Voltage
•Automatically Resets Itself if the LED Heals Itself or is Replaced
•ON−State Voltage Typically 1.1 V
•OFF−State Current less than 1.0 mA
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free and are RoHS Compliant
Typical Applications
•LEDs where Preventive Maintenance is Impractical
•LED Headlights in Automobiles
•Automotive LED Applications
•LEDs with High Reliability Requirements
•Crowbar Protection for Open Circuit Conditions
•Overvoltage Protection for Sensitive Circuits
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Control
Circuit
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
XX = Specific Device Code
M = Date Code
SOD−323
CASE 477
SOD−523
CASE 502
SOD−923
CASE 514AB
HD
M
56
12
M
LD M
+
−
HBL5006
12
12
HBL5006
1
2
Apply heat sinking to pin 2
ESD
HBL5006 Series
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
On−State Current, (TA = 25°C) (Note 2) SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
IT(AVG) 250
200
300
250
350
300
mA
Thermal Resistance, Junction−to−Air (All Packages) SOD−323 (Note 1)
SOD−323 (Note 2)
SOD−523 (Note 1)
SOD−523 (Note 2)
SOD−923 (Note 1)
SOD−923 (Note 2)
qJA 435
550
360
435
285
360
°C/W
Operating Temperature Range (Note 3) TJ−40 to 150 °C
Non−Operating Temperature Range TJ150 °C
Lead Temperature, Soldering (10 Sec) TL260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD) ESD
ESD ±15
±15 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Mounted onto a 2−layer, 1000 mm2 per layer, 3 oz Cu, FR4 PCB with pin 2 connected to the heat sink and pin 1 only connected to a signal
trace. The heat sinking must be connected to pin 2, which is the LED cathode connection.
Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open, then the
HBL shunt would now dissipate the power using the same copper heat sink. Since the shunt has a voltage that is nominally 30% of the LED,
then the power dissipation would be much lower, and easily handled by the same heat sink as the LED.
2. Mounted onto a 2−layer, 50 mm2 per layer, 1 oz Cu, FR4 PCB.
3. Max operating temperature for DC conditions is 150°C, but not to exceed 175°C for pulsed conditions with low duty cycle or non−repetitive.
HBL5006 Series
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3
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: TA = 25°C)
Symbol Characteristics Package Min Typ Max Unit
VBR Breakdown Voltage: The minimum voltage across the device in or
at the breakdown region. Measured at IBR = 1 mA. SOD−323 6.2 7.0 V
SOD−523 6.2 7.0
SOD−923 6.2 7.0
IHHolding Current: The minimum current required to maintain the
device in the on-state. SOD−323 25 40 mA
SOD−523 25 40
SOD−923 25 40
ILLatching Current: The minimum current required to turn from the
off-state to the on-state. SOD−323 9.0 mA
SOD−523 9.0
SOD−923 9.0
VBO Breakover Voltage: The voltage across the device in the breakover
region. SOD−323 6.5 7.2 8.0 V
SOD−523 6.5 7.2 8.0
SOD−923 6.5 7.2 8.0
IROff−State Current: The dc value of current that results from the
application of the off-state voltage. Measured at 3.3 V. SOD−323 1.0 mA
SOD−523 1.0
SOD−923 1.0
VTOn−State Voltage. Measured at 100 mA. SOD−323 0.9 1.1 1.3 V
SOD−523 0.9 1.1 1.3
SOD−923 0.9 1.1 1.3
VCClamping Voltage
TLP (Note 4) IEC 6100−4−2 Level 2 equivalent
(±4 kV Contact, ±4 kV Air)
IEC 6100−4−2 Level 4 equivalent
(±8 kV Contact, ±15 kV Air)
}
}
IPP = 8 A
IPP = 16 A
SOD−323 6.5
11.2 V
SOD−523 6.5
11.2
SOD−923 6.5
11.2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using T ransmission Line Pulse (TLP) Model TLP conditions: Z 0 = 50 W,
tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns.
Figure 1. I−V Characteristics
Breakover
Voltage
Voltage
Current On−state
Current
Holding CurrentLatching Current
Off−state
Current Breakdown
Voltage
HBL5006 Series
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5
DEVICE ORDERING INFORMATION
Device Marking Package Shipping†
HBL5006HT1G HD SOD−323
(Pb−Free) 3000 / Tape & Reel
SZHBL5006HT1G* HD
HBL5006XV2T1G 56
SOD−523
(Pb−Free)
3000 / Tape & Reel
SZHBL5006XV2T1G* 56
HBL5006XV2T5G 56 8000 / Tape & Reel
SZHBL5006XV2T5G* 56
HBL5006P2T5G LD SOD−923
(Pb−Free) 8000 / Tape & Reel
SZHBL5006P2T5G* LD
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
NOTE 3
D
12bE
A3
A1
A
CNOTE 5
L
HE
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF
b0.25 0.32 0.4
C0.089 0.12 0.177
D1.60 1.70 1.80
E1.15 1.25 1.35
0.08
2.30 2.50 2.70
L
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN NOM MAX
INCHES
1.60
0.063
0.63
0.025 0.83
0.033
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HBL5006 Series
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6
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
NOTES:
6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
7. CONTROLLING DIMENSION: MILLIMETERS.
8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D−X−
−Y−
b
2X
M
0.08 X Y
A
H
c
DIM MIN NOM MAX
MILLIMETERS
D1.10 1.20 1.30
E0.70 0.80 0.90
A0.50 0.60 0.70
b0.25 0.30 0.35
c0.07 0.14 0.20
L0.30 REF
H1.50 1.60 1.70
12
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
E
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
2X
0.48 0.40
2X
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2 0.15 0.20 0.25
HBL5006 Series
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7
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM MIN NOM MAX
MILLIMETERS
A0.34 0.37 0.40
b0.15 0.20 0.25
c0.07 0.12 0.17
D0.75 0.80 0.85
E0.55 0.60 0.65
0.95 1.00 1.05
L0.19 REF
HE
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
MIN NOM MAX
INCHES
D
E
c
A
−Y−
−X−
21
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
See Application Note AND8455/D for more mounting details
1.20 2X
0.25
2X
0.36
PACKAGE
OUTLINE
b2X
0.08 XY TOP VIEW
HE
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
L2 0.05 0.10 0.15 0.002 0.004 0.006
HBL5006/D
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