1. General description
The PN5331B3HN is a highly integrated transceiver module for contactless
communication at 13.56 MHz based on the 80C51 microcontroller core.
A dedicated ROM code is implemented to handle different RF protocols.
RF protocols
PN5331B3HN supports four main operating modes:
•ISO/IEC 14443A Reader/Writer (incl. MIFARE product family)
•ISO/IEC 14443B Reader/Writer
•FeliCa Reader/Writer
•ISO/IEC 18092, ECMA 340 Peer-to-Peer
The PN5331B3HN hardware implements a demodulator and decoder for signals from
ISO/IEC 14443A compatible cards and transponders. The PN5331B3HN hardware
handles the complete ISO/IEC 14443A framing and error detection and upper layers of
this protocol (i.e. ISO/IEC 14443-4) are implemented in firmware.
The PN5331B3HN supports all MIFARE products (e.g. MIFARE crypto method). It
supports contactless communication using higher transfer speeds up to 848 kbit/s in both
directions.
The PN5331B3HN hardware supports layers 2 and 3 of the ISO/IEC 14443B
Reader/Writer communication scheme, except anticollision. Anticollision is implemented
in firmware as well as upper layers (i.e. ISO/IEC 14443-4).
The PN5331B3HN can demodulate and decode FeliCa coded signals. The PN5331B3HN
handles the FeliCa framing and error detection. It supports contactless communication
using FeliCa Higher transfer speeds up to 424 kbit/s in both directions.
Compliant to ECMA 340 and ISO/IEC 18092 NFCIP-1 Passive and Active communication
modes, the PN5331B3HN/C270 offers the possibility to communicate to another NFCIP-1
compliant device, at transfer speeds up to 424 kbit/s. The PN5331B3HN handles the
complete NFCIP-1 framing and error detection.
Interfaces
The PN5331B3HN supports USB 2.0 full speed interface (bus powered or host powered
mode).
PN5331B3HN has also a master I2C interface enabling the drive of following peripherals:
•An external EEPROM
•A TDA8029 smart card reader
PN5331B3HN
Near Field Communication (NFC) controller
Rev. 01 - 31 December 2008 Product short data sheet
158231 PUBLIC
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 2 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
Standards compliancy
PN5331B3HN offers commands in order for applications to be compliant with
“Paypass-ISO/IEC 14443 Implementation v1.1” and “EMV Contactless Communication
Protocol Specification v2.0”.
PN5331B3HN supports RF protocols ISO/IEC 14443A and B such as compliancy with
Smart eID standard can be achieved at application level.
A dedicated command is implemented in PN5331B3HN firmware to support NFC secure
applications in accordance with “NFC sec Security layer for NFC” specification in order to
enable USB wireless or BT enabler applications in a host baseband.
2. Features
80C51 microcontroller core with 45056 bytes ROM and 1224 bytes RAM
Highly integrated demodulator and decoder
Buffered output drivers to connect an antenna with minimum number of external
components
Integrated RF level detector
Integrated data mode detector
Supports ISO/IEC 14443A Reader/Writer mode up to 848 kbit/s
Supports ISO/IEC 14443B Reader/Writer mode up to 848 kbit/s
Supports MIFARE encryption in Reader/Writer mode and higher transfer speed
communication at 212 kbit/s, 424 kbit/s and 848kbit/s
Supports contactless communication according to the FeliCa protocol at 212 kbit/s and
424 kbit/s
Typical operating distance in Reader/Writer mode for communication to
ISO/IEC 14443A/MIFARE, ISO/IEC 14443B or FeliCa cards up to 50 mm depending
on antenna size and tuning
Support NFCIP-1 mode up to 424 kbit/s
Typical operating distance in NFCIP-1 mode up to 50 mm depending on antenna size,
tuning and power supply
Supported USB 2.0 full speed interface
Restricted I2C master interface to control an external I2C EEPROM or TDA8029 smart
card reader
Low power modes
Hard-Power-Down mode
Soft-Power-Down mode
27.12 MHz Crystal oscillator
On-Chip PLL to generate internally 96 MHz for the USB interface
Power modes
USB bus power mode
2.5 V to 3.6 V power supply operating range in non USB bus power mode
Dedicated IO ports for external device control
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 3 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
3. Quick reference data
[1] DVDD, AVDD and TVDD must always be at the same supply voltage.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VBUS USB supply voltage (USB
mode)
4.02 55.25 V
supply voltage (non USB
mode)
VBUS = DVDD
DVSS = 0 V
2.5 3.3 3.6 V
TVDD, AVDD,
DVDD
supply voltage TVDD = AVDD = DVDD
VSS = 0 V
[1] 2.5 3.3 3.6 V
PVDD supply voltage
for host interface
VSS = 0 V 1.6 -3.6 V
SVDD supply voltage
reserved for future use
VSS = 0 V DVDD -0.1 -DVDD V
IVBUS maximum load current
(USB mode)
measured on VBUS --150 mA
maximum inrush current
limitation
at power up (curlimoff =0) --100 mA
IHPD hard-power-down current
(not powered from USB)
AVDD = DVDD = TVDD =
PVDD = 3 V, RF level
detector off
--10 μA
ISPD soft-power-down current
(not powered from USB)
AVDD = DVDD = TVDD =
PVDD = 3 V, RF level
detector on
--30 μA
Isuspend USB suspend current AVDD = DVDD = TVDD =
PVDD = 3 V, RF level
detector on, (without
resistor on DP/DM)
--250 μA
IDVDD digital supply current AVDD = DVDD = TVDD =
PVDD = 3 V, RF level
detector on, SVDD switch
off
[1] -15 -mA
ISVDD SVDD load current SVDD = 3 V --30 mA
IAVDD analog supply current AVDD = DVDD = TVDD =
PVDD = 3 V, RF level
detector on
-6-mA
ITVDD transmitter supply current during RF transmission,
TVDD = 3 V
-60 100 mA
Ptot total power dissipation Tamb = -30 to +85 °C --0.55 W
Tamb ambient temperature −30 -+85 °C
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 4 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
4. Ordering information
[1] 70 refers to the ROM code version described in User Manual.
[2] Refer to Section 9.4 “Licenses”
5. Block diagram
The following block diagram describes hardware blocks controlled by PN5331B3HN
firmware or which can be accessible for data transaction by a host baseband.
Table 2. Ordering information
Type number Package
Name Description Version
PN5331B3HN/C270[1][2] HVQFN40 Heatsink Very thin Quad Flat package; 40 pins, plastic,
body 6 x 6 x 0.85 mm; leadless; MSL level 2.
SOT618-1
Fig 1. Block diagram
001aai112
SUPPLY
SUPER
VISOR
27 MHz OSC
AND
FRAC N
PLL
SVDD
SWITCH
NFC
ANALOG
FRONT END
AND
CLUART
80C51 CPU
44 k ROM
1.2 k BYTES RAM
USB
DEVICE
I2C
MASTER
MATX
RSTPD
PVDD
SVDD
VBUS
P30 P31 P32
GPIOs
P33 P35
RSTOUT DVDD IRQ GND
VGND
XTAL1
XTAL2
NSS
MOSI
I0
I1
SDA
SCL
Delatt
48 MHz
SIGIN
SIGOUT
P34
TVDD
AVDD
RX
VMID
TX1
TGND
TX2
REGULATOR
3.3 V
PCR
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 5 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
6. Limiting values
7. Abbreviations
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
PVDD,
SVDD,
TVDD,
AVDD,
DVDD
supply voltage −0.5 4 V
VBUS USB supply voltage −0.5 5.5 V
Ptot total power dissipation -500 mW
ISVDD maximum current in
SVDD switch
-30 mA
VINRX dynamic RX input
voltage range
−0.5 4 V
VINTX1 dynamicTX1 input
voltage range
−0.5 4 V
VINTX2 dynamic TX2 input
voltage range
−0.5 4 V
VESD electrostatic discharge
voltage
VESDH ESD susceptibility
(human body model)
1500 Ω, 100pF;
EIA/JESD22-A114-A
-±2.0 kV
VESDM ESD susceptibility
(machine model)
0.75 mH, 200 pF;
EIA/JESD22-A115-A
-200 V
VESDC ESD susceptibility
(charge device model)
field induced model;
EIA/JESC22-C101-C
-±1 kV
Tstg storage temperature −55 150 °C
Tjjunction temperature −40 125 °C
Table 4. Abbreviations
Acronym Description
CRC Cyclic Redundancy Check
EEPROM Electrically Erasable Programmable Read-Only Memory
HPD Hard Power Down
NFC Near Field Communication
SPD Soft Power Down mode
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 6 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
8. Revision history
Table 5. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PN5331B3HN_SDS_N_1 20081231 Product short data sheet - -
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 7 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
ESD protection devices — These products are only intended for protection
against ElectroStatic Discharge (ESD) pulses and are not intended for any
other usage including, without limitation, voltage regulation applications. NXP
Semiconductors accepts no liability for use in such applications and therefore
such use is at the customer’s own risk.
9.4 Licenses
9.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
I2C-bus — logo is a trademark of NXP B.V.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
This NXP Semiconductors IC is ISO/IEC 14443 Type B
software enabled and is licensed under Innovatron’s
Contactless Card patents license for ISO/IEC 14443 B.
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481
does not convey an implied license under any patent right infringed by
implementation of any of those standards. A license for the patents portfolio
of NXP B.V. for the NFC standards needs to be obtained at Via Licensing,
the pool agent of the NFC Patent Pool, e-mail: info@vialicensing.com.
PN5331B3HN_SDS_N_1 © NXP B.V. 2009. All rights reserved.
Product short data sheet
Rev. 01 - 31 December 2008 — 4 March
2009 8 of 9
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PN5331B3HN
Near Field Communication (NFC) controller
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 March 2009
Document identifier: PN5331B3HN_SDS_N_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Tables
Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .3
Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .4
Table 3. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .5
Table 4. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 5. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6
12. Figures
Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
13. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 4
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
11 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
