TDA2611AN5 - NXP SEMICONDUCTORS

DATA SH EET

Product specification November 1982

INTEGRATED CIRCUITS

TDA2611A

5 W audio power amplifier

November 1982 2

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

The TDA2611A is a monolithic integrated circuit in a 9-lead single in-line (SIL) plastic package with a high supply voltage

audio amplifier. Special features are:

•possibility for increasing the input impedance

•single in-line (SIL) construction for easy mounting

•very suitable fo r application in mains-fed apparatu s

•extremely low number of external components

•thermal protection

•well defined open loop gain circuitry with simple quiescent current setting and fixed integrated closed loop gain.

QUICK REFERENCE DATA

PACKAGE OUTLINE

9-lead SIL; plastic (SOT110B) ; SOT110-1.

Supply voltage range VP6 to 35 V

Repetitive peak output current IORM <1,5 A

Output power at dtot = 10%

P = 18 V; RL = 8 ΩPotyp. 4,5 W

P = 25 V; RL = 15 ΩPotyp. 5 W

Total harmonic distortion at Po < 2 W; RL = 8 Ωdtot typ. 0,3 %

Input impedance |Zi|typ. 45 kΩ

Total quiescent current at VP = 18 V Itot typ. 25 mA

Sensitivity for Po = 2,5 W; RL = 8 ΩVityp. 55 mV

Operating ambien t temperature Tamb −25 to + 150 °C

Storage temperature Tstg −55 to + 150 °C

November 1982 3

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

RATINGS

Limiting values in acco rdance with the Abs olute Maximum System (IEC 134)

Supply voltage VPmax. 35 V

Non-repetitive peak output current IOSM max. 3 A

Repetitive peak output current IORM max. 1,5 A

Total po we r dissipation see derating curve s Fig. 2

Storage temperature Tstg −55 to + 150 °C

Operating a m bient temperature Tamb −25 to + 150 °C

handbook, full pagewidth

TR4

TR5 TR7

TR2

TR9

TR6

TR8

TR10

TR12

TR11

TR14

D5 C1

TR13

TR15

TR17

TR16

TR18

TR19

TR20

TR21

R1 R4

R8 R10 R12 R16

R13

R15

R14

R17 R9

TR3TR1

R2 R5 R6 R11

MGD831

Fig.1 Circuit diagram; pin 3 not connec ted.

November 1982 4

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, full pagewidth

150

−50 0

Ptot

(W)

Tamb (°C)

100

MBL006

infinate

heatsink

without

heatsink

Fig.2 Power deratin g c urves.

HEATSINK EXAMPLE

Assume VP = 18 V; RL = 8 Ω; Tamb = 60 °C maximum; Tj = 15 0 °C (max. for a 4 W application into an 8 Ω load, the

maximum dissipation is about 2,2 W).

The thermal resista nc e from junction to ambient can be ex pressed as:

Since Rth j-tab = 11 K/W and Rth tab-h = 1 K/W, Rth h-a = 41 − (11 + 1) = 29 K/W.

Rth j-a Rth j-tab Rth tab-h Rth h-a 150 60–

22,

---------------------- 41 K/W.==++=

November 1982 5

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

D.C. CHARACTERISTICS

A.C. CHARACTERISTICS

Tamb = 25 °C; VP = 18 V; RL = 8 Ω; f = 1 kHz unless otherwise spec ified; see also Fig. 3

Note

1. Input impedance ca n be increased by ap plying C and R between pins 5 and 9 (see also Figures 6 and 7).

Supply voltage range VP6 to 35 V

Repetitive peak output current IORM <1,5 A

Total quiescent current at VP = 18 V Itot typ. 25 mA

A.F. output powe r at dtot = 10%

P = 18 V; RL = 8 ΩPo>4W

typ. 4,5 W

P = 12 V; RL = 8 ΩPotyp. 1,7 W

P = 8,3 V; RL = 8 ΩPotyp. 0,65 W

P = 20 V; RL = 8 ΩPotyp. 6 W

P = 25 V; RL = 15 ΩPotyp. 5 W

Total harmonic distortion at Po = 2 W dtot typ. 0,3 %

<1%

Frequency response >15kHz

Input impedance |Zi|typ. 45 kΩ(1)

Noise output voltage at RS = 5 kΩ; B = 60 Hz to 15 kHz Vntyp. 0,2 mV

<0,5 mV

Sensitivity for Po = 2,5 W Vityp. 55 mV

44 to 66 mV

November 1982 6

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, full pagewidth

MBL007

220

C1 7

22 μF

(16 V)

0.1 μFC4

470 μF

(16 V)

0.1 μF

3.3 ΩRL = 8 Ω

0.1 μF

TDA2611A

Fig.3 Test circuit; pin 3 not connected.

handbook, halfpage

MBL008

10−11P

(W)

dtot

(%)

(2)(1)

Fig.4 Total harmonic distortion as a function of output power.

Typical values

(1) RL=8Ω; VP=18V.

(2) RL=15Ω; VP=25V.

November 1982 7

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, halfpage

010 Vp (V)

(W)

20 40

MBL009

RL = 15 Ω

RL = 8 Ω

not guaranteed in

view of IORM = 1,5 A

Fig.5 Output power as a function of supply voltage.

Typical values:

f=1kHz.

dtot =10%.

handbook, full pagewidth

MBL010

10 f (Hz)

(MΩ)

102

103104105

Fig.6 Input impedance as a function of frequency; curve a for C = 1 μF, R = 0 Ω; curve b for

C = 1 μF, R = 1 kΩ; circuit of Fig. 3; C2 = 10 pF; typical va lues.

November 1982 8

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, full pagewidth

MBL011

103

102

102103

typ

104105

R (Ω)

(kΩ)

Fig.7 Input impedance as a function of R in circuit o f Fig. 3; C = 1 μF; f = 1 kHz.

handbook, full pagewidth

MBL012

102

dtot

(%)

RS (Ω)

103

typ

104105106

Fig.8 Total harmonic distortion as a function of RS in the circuit of Fig. 3; Po = 3,5 W; f = 1 kHz.

November 1982 9

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, full pagewidth

100

2,5

MBL013

Ptot

(W)

(2)

(1)

10−210−11Po (W)

(%)

(2)

(1)

Fig.9 Total power dissipation and effic i ency as a functio n of output power.

(1) VP=25V; R

L=15Ω; f = 1 khz.

(2) VP=18V; R

L=8Ω; f = 1 khz.

November 1982 10

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

APPLICATION INFORMATION

handbook, full pagewidth

MBL014

R5 R6

tone

C2 10 nF

volume

100

1 μF

22 μFC7

47 μF

100 pF

560 pF

10 Ω

kΩ

8 Ω

1MΩ

(log)

1MΩ

(log)

220 kΩ

kΩ

220 μF

TDA2611A

Fig.10 Ceramic pickup amplifier circuit.

handbook, full pagewidth

2,5

7,5

MBL015

10−210−11Po (W)

dtot

(%)

(1)

(2)

Fig.11 Total harmonic distortion as a function of output power; in circuit of Fig. 10; typical values.

(1) With tone control.

(2) Without tone control.

November 1982 11

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

handbook, full pagewidth

−10

−5

MBL016

(1)

(2)

f (Hz)

102103104

(dB)

Fig.12 Frequency characteristics of the circuit of Fig. 10; Po relative to 0 dB = 3 W; typical values.

(1) Tone control min. high.

(2) Tone control max. high.

handbook, full pagewidth

−5

MBL017

10 f (Hz)

102103104

(dB)

typ

Fig.13 Frequency characteristic of the circuit of Fig. 10; volume control at the top; tone control max. high.

November 1982 12

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

PACKAGE OUTLINE

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

1q1q2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 95-02-25

03-03-12

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

IL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110

-1

November 1982 13

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order code 93 98 652 90011).

Soldering by dipping or by wave

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seatin g plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced c ooling

may be necess ary immediately aft er soldering to ke ep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating p l ane or not

more than 2 mm ab ov e it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document befor e initiating or completing a design.

2. The product s ta tus of device(s ) described in this do cument may have ch anged since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliable.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or cons equential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theo ry.

Notwithstanding an y damages that custome r might incur

for any reason whatsoe ve r, NXP Semic on ductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and prod uct descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publicat ion hereof.

November 1982 14

NXP Semiconductors Product specification

5 W audio power amplifier TDA2611A

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in pe rs onal injury, death or seve re

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modification.

Customers are responsible for the design and operation of

their applications and produc ts using NXP

Semiconductors prod ucts, and NXP Semicond uc tors

accepts no liability for any assistance with applications or

customer produc t des i gn. It is customer’s sole

responsibility to determine whet he r th e NXP

Semiconductors produc t is suitable and fit for the

customer’s applications and products planned, as well as

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design and operating safeg ua rds to minimize the risks

associated wit h the ir applications and pr oducts.

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications

or products, or the applic ation or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors prod ucts in order to

avoid a default of the applications and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductor s pr od ucts are sold subject to the ge ne ra l

terms and conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an

individual agreem ent is concluded only the terms and

conditions of the respective agr eement shall apply. NXP

Semiconductors her eby expressly objects to applying the

customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license ⎯ Nothing in this document

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national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values an d

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive equip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive applications, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be so lely at

customer’s own ris k, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document does not form p art o f an y q uot ation or co ntract, is believed to b e a ccurate and reliable an d may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or in tellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands RM5/02/pp15 Date of release: November 1982