SLVU2.8-8BTG - LITTELFUSE - Product.Network

Speciﬁcations are subject to change without notice.

Revised: 09/20/16

TVS Diode Arrays (SPA

® Diodes)

SP4021

Lightning Surge Protection- SLVU2.8-8 Series

Description

Features

Applications

The SLVU2.8-8 was designed to protect low voltage,

CMOS devices from ESD and lightning induced transients.

There is a compensating diode in series with each low

voltage TVS to present a low loading capacitance to the line

being protected. These robust structures can safely absorb

repetitive ESD strikes at ±30kV (contact discharge) per IEC

61000-4-2 standard and can safely dissipate up to 30A (IEC

61000-4-5 2nd Edition, tP=8/20μs) with very low clamping

voltages.

Pinout

Functional Block Diagram

• ESD, IEC 61000-4-2,

±30kV contact, ±30kV air

• EFT, IEC 61000-4-4, 40A

(5/50ns)

• Lightning, IEC 61000-4-5

2nd Edition, 30A (8/20μs)

• Low capacitance of 2.6pF

per line

• Low leakage current of

0.1μA (MAX) at 2.8V

• SOIC-8 (JEDEC MO-012)

pin conﬁguration allows

for protection of all 4

differential pair for 1GbE

• AEC-Q101 qualiﬁed

• RoHS Compliant and

Lead Free

• Moisture Sensitivity Level

(MSL-1)

• 10/100/1000 Ethernet

• WAN/LAN Equipment

• Switching Systems

• Desktops, Servers, and

Notebooks

• Analog Inputs

• Base Stations

1234

8765

Pin 1.3.5.7

Pin 2.4.6.8

RoHS

GREEN

SLVU2.8-8 Series 2.8V 30A TVS Array

Additional Information

Datasheet Samples

Resources

Speciﬁcations are subject to change without notice.

Revised: 09/20/16

TVS Diode Arrays (SPA

® Diodes)

Lightning Surge Protection- SLVU2.8-8 Series

Absolute Maximum Ratings

Parameter Rating Units

Peak Pulse Power (tP=8/20µs) 750 W

Peak Pulse Current (tP=8/20µs) 30 A

Operating Temperature -40 to 125 ºC

Storage Temperature -55 to 150 ºC

Electrical Characteristics (TOP = 25°C)

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage VRWM IR≤1μA (Each Line) 2.8 V

Reverse Breakdown Voltage VBR IT=2μA (Each Line) 3.0 V

Snapback Voltage VSB ISB=50mA 2.8 V

Reverse Leakage Current ILEAK VR=2.8V (Each Line) 0.1 μA

Clamping Voltage1VC

IPP=5A, tP=8/20μs (Each Line) 8.5 V

IPP=24A, tP=8/20μs (Each Line) 17

ESD Withstand Voltage1VESD

IEC61000-4-2 (Contact) ±30

IEC61000-4-2 (Air) ±30

Dynamic Resistance2RDYN TLP tp=100ns, (Each Line) 0.3 Ω

Diode Capacitance1CDVR=0V, f=1MHz (Each Line) 2.6 3.0 pF

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress only rating and operation of the device

at these or any other conditions above those indicated in the operational sections of this

speciﬁcation is not implied.

Note: 1 Parameter is guaranteed by design and/or device characterization.

2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns

Thermal Information

Parameter Rating Units

Storage Temperature Range -55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature (Soldering

20-40s)

260 °C

Capacitance vs. Reverse Bias (Each line)

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

00.4 0.81.2 1.622.42.8

&DSDFLWDQFHS)

Bias Voltage (V)

Clamping Voltage vs. Peak Pulse Currennt (Each line)

0510 15 20 25 30

Clamp Voltage-VC (V)

Peak Pulse Current-I

(A)

Speciﬁcations are subject to change without notice.

Revised: 09/20/16

TVS Diode Arrays (SPA

® Diodes)

SP4021

Lightning Surge Protection- SLVU2.8-8 Series

Parameter Rating Units

Storage Temperature Range -55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature (Soldering

20-40s)

260 °C

Time

Temperature

TS(max)

TS(min)

time to peak temperature

Preheat

rehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

TL to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (Ts(min)) 150°C

- Temperature Max (Ts(max)) 200°C

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp (TL)

to peak 5°C/second max

TS(max) to TL - Ramp-up Rate 5°C/second max

Reﬂow - Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260+0/-5 °C

Time within 5°C of actual peak

Temperature (tp)20 – 40 seconds

Ramp-down Rate 5°C/second max

Time 25°C to peak Temperature (TP) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

Product Characteristics

Lead Plating Matte Tin

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substrate material Silicon

Body Material V-0 per UL 94 Molded Epoxy

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. All speciﬁcations comply to JEDEC SPEC MO-203 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte ﬁnish VDI 11-13.

Ordering Information

Part Number Package Min. Order Qty.

SLVU2.8-8BTG SOIC-8 2500

Positive Transmission Line Pulsing (TLP) Plot (Each line)

0510 15 20

TLP Current (A)

TLP Volts (V)

Negative Transmission Line Pulsing (TLP) Plot (Each line)

-20-15 -10-50

TLP Current (A)

TLP Volts (V)

8/20 µs Pulse Waveform

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

Percent of I

Speciﬁcations are subject to change without notice.

Revised: 09/20/16

TVS Diode Arrays (SPA

® Diodes)

Lightning Surge Protection- SLVU2.8-8 Series

Embossed Carrier Tape & Reel Speciﬁcation — SOIC Package

User Feeding Direction

Pin 1 Location

Symbol Millimetres Inches

Min Max Min Max

E1.65 1.85 0.065 0.073

F5.4 5.6 0.213 0.22

P2 1. 9 2.1 0.075 0.083

D1. 5 1. 6 0.059 0.063

D1 1.50 Min 0.059 Min

P0 3.9 4.1 0.154 0.161

10P0 40.0 +/- 0.20 1.574 +/- 0.008

W11. 9 12.1 0.468 0.476

P7. 9 8.1 0.311 0.319

A0 6.3 6.5 0.248 0.256

B0 5.1 5.3 0.2 0.209

K0 2 2.2 0.079 0.087

t0.30 +/- 0.05 0.012 +/- 0.002

Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline

Package SOIC-8

Pins 8

JEDEC MS-012

Millimetres Inches

Min Max Min Max

A1.35 1.75 0.053 0.069

A1 0.10 0.25 0.004 0.010

A2 1.25 1.65 0.050 0.065

B0.31 0.51 0.012 0.020

c0.17 0.25 0.007 0.010

D4.80 5.00 0.189 0.197

E5.80 6.20 0.228 0.244

E1 3.80 4.00 0.150 0.157

e1.27 BSC 0.050 BSC

L0.40 1.27 0.016 0.050

Recommended

Soldering Pad Outline

(Reference Only)

Part Numbering System Part Marking System

SLVU2.8 BTG

Series

Package

B = SOIC-8

No. of channels

T= Tape & Reel

-8

G= Green

1234

8765

SLVU2.8-8BTG

xxxxxxxxx

DATE CODE