ADXL335BCPZ-RL7 - Analog Devices Inc.

Small, Low Power, 3-Axis ±3 g

Accelerometer

ADXL335

Rev. B

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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

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Tel: 781.329.4700 www.analog.com

FEATURES

3-axis sensing

Small, low profile package

4 mm × 4 mm × 1.45 mm LFCSP

Low power : 350 μA (typical)

Single-supply operation: 1.8 V to 3.6 V

10,000 g shock survival

Excellent temperature stability

BW adjustment with a single capacitor per axis

RoHS/WEEE lead-free compliant

APPLICATIONS

Cost sensitive, low power, motion- and tilt-sensing

applications

Mobile devices

Gaming systems

Disk drive protection

Image stabilization

Sports and health devices

GENERAL DESCRIPTION

The ADXL335 is a small, thin, low power, complete 3-axis accel-

erometer with signal conditioned voltage outputs. The product

measures acceleration with a minimum full-scale range of ±3 g.

It can measure the static acceleration of gravity in tilt-sensing

applications, as well as dynamic acceleration resulting from

motion, shock, or vibration.

The user selects the bandwidth of the accelerometer using the

CX, CY, and CZ capacitors at the XOUT, YOUT, and ZOUT pins.

Bandwidths can be selected to suit the application, with a

range of 0.5 Hz to 1600 Hz for the X and Y axes, and a range

of 0.5 Hz to 550 Hz for the Z axis.

The ADXL335 is available in a small, low profile, 4 mm ×

4 mm × 1.45 mm, 16-lead, plastic lead frame chip scale package

(LFCSP_LQ).

FUNCTIONAL BLOCK DIAGRAM

7808-001

3-AXIS

SENSOR

AC AMP DEMOD

OUTPUT AMP

COM ST

OUT

ADXL335

~32kΩ

Figure 1.

ADXL335

Rev. B | Page 2 of 16

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Absolute Maximum Ratings ............................................................ 4

ESD Caution .................................................................................. 4

Pin Configuration and Function Descriptions ............................. 5

Typical Performance Characteristics ............................................. 6

Theory of Operation ...................................................................... 10

Mechanical Sensor ...................................................................... 10

Performance ................................................................................ 10

Applications Information .............................................................. 11

Power Supply Decoupling ......................................................... 11

Setting the Bandwidth Using CX, CY, and CZ .......................... 11

Self-Test ....................................................................................... 11

Design Trade-Offs for Selecting Filter Characteristics: The

Noise/BW Trade-Off .................................................................. 11

Use with Operating Voltages Other Than 3 V ........................... 12

Axes of Acceleration Sensitivity ............................................... 12

Layout and Design Recommendations ................................... 13

Outline Dimensions ....................................................................... 14

Ordering Guide .......................................................................... 14

REVISION HISTORY

1/10—Rev. A to Rev. B

Changes to Figure 21 ........................................................................ 9

7/09—Rev. 0 to Rev. A

Changes to Figure 22 ........................................................................ 9

Changes to Outline Dimensions ................................................... 14

1/09—Revision 0: Initial Version

ADXL335

Rev. B | Page 3 of 16

SPECIFICATIONS

TA = 25°C, VS = 3 V, CX = CY = CZ = 0.1 µF, acceleration = 0 g, unless otherwise noted. All minimum and maximum specifications are

guaranteed. Typical specifications are not guaranteed.

Table 1.

Parameter Conditions Min Typ Max Unit

SENSOR INPUT Each axis

Measurement Range ±3 ±3.6 g

Nonlinearity % of full scale ±0.3 %

Package Alignment Error ±1 Degrees

Interaxis Alignment Error ±0.1 Degrees

Cross-Axis Sensitivity1 ±1 %

SENSITIVITY (RATIOMETRIC)2 Each axis

Sensitivity at XOUT, YOUT, ZOUT V

S = 3 V 270 300 330 mV/g

Sensitivity Change Due to Temperature3 V

S = 3 V ±0.01 %/°C

ZERO g BIAS LEVEL (RATIOMETRIC)

0 g Voltage at XOUT, YOUT V

S = 3 V 1.35 1.5 1.65 V

0 g Voltage at ZOUT V

S = 3 V 1.2 1.5 1.8 V

0 g Offset vs. Temperature ±1 mg/°C

NOISE PERFORMANCE

Noise Density XOUT, YOUT 150 µg/√Hz rms

Noise Density ZOUT 300 µg/√Hz rms

FREQUENCY RESPONSE4

Bandwidth XOUT, YOUT5 No external filter 1600 Hz

Bandwidth ZOUT5 No external filter 550 Hz

RFILT Tolerance 32 ± 15% kΩ

Sensor Resonant Frequency 5.5 kHz

SELF-TEST6

Logic Input Low +0.6 V

Logic Input High +2.4 V

ST Actuation Current +60 A

Output Change at XOUT Self-Test 0 to Self-Test 1 −150 −325 −600 mV

Output Change at YOUT Self-Test 0 to Self-Test 1 +150 +325 +600 mV

Output Change at ZOUT Self-Test 0 to Self-Test 1 +150 +550 +1000 mV

OUTPUT AMPLIFIER

Output Swing Low No load 0.1 V

Output Swing High No load 2.8 V

POWER SUPPLY

Operating Voltage Range 1.8 3.6 V

Supply Current VS = 3 V 350 A

Turn-On Time7 No external filter 1 ms

TEMPERATURE

Operating Temperature Range −40 +85 °C

1 Defined as coupling between any two axes.

2 Sensitivity is essentially ratiometric to VS.

3 Defined as the output change from ambient-to-maximum temperature or ambient-to-minimum temperature.

4 Actual frequency response controlled by user-supplied external filter capacitors (CX, CY, CZ).

5 Bandwidth with external capacitors = 1/(2 × π × 32 kΩ × C). For CX, CY = 0.003 µF, bandwidth = 1.6 kHz. For CZ = 0.01 µF, bandwidth = 500 Hz. For CX, CY, CZ = 10 µF,

bandwidth = 0.5 Hz.

6 Self-test response changes cubically with VS.

7 Turn-on time is dependent on CX, CY, CZ and is approximately 160 × CX or CY or CZ + 1 ms, where CX, CY, CZ are in microfarads (µF).

ADXL335

Rev. B | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

Acceleration (Any Axis, Unpowered) 10,000 g

Acceleration (Any Axis, Powered) 10,000 g

VS −0.3 V to +3.6 V

All Other Pins (COM − 0.3 V) to (VS + 0.3 V)

Output Short-Circuit Duration

(Any Pin to Common)

Indefinite

Temperature Range (Powered) −55°C to +125°C

Temperature Range (Storage) −65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

ADXL335

Rev. B | Page 5 of 16

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

07808-003

NOTES

1. EXPOSED PAD IS NOT INTERNALLY

CONNECTED BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY.

NC = NO CONNECT

COM

OUT

COM

OUT

5678

ADXL335

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 3. Pin Function Descriptions

Pin No. Mnemonic Description

1 NC No Connect.1

2 ST Self-Test.

3 COM Common.

4 NC No Connect.1

5 COM Common.

6 COM Common.

7 COM Common.

8 ZOUT Z Channel Output.

9 NC No Connect.1

10 YOUT Y Channel Output.

11 NC No Connect.

12 XOUT X Channel Output.

13 NC No Connect.

14 VS Supply Voltage (1.8 V to 3.6 V).

15 VS Supply Voltage (1.8 V to 3.6 V).

16 NC No Connect.

EP Exposed Pad Not internally connected. Solder for mechanical integrity.

1 NC pins are not internally connected and can be tied to COM pins, unless otherwise noted.

ADXL335

Rev. B | Page 6 of 16

TYPICAL PERFORMANCE CHARACTERISTICS

N > 1000 for all typical performance plots, unless otherwise noted.

1.42 1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58

% OF POPULATION

OUTPUT (V)

07808-005

Figure 3. X-Axis Zero g Bias at 25°C, VS = 3 V

1.42 1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58

% OF POPULATION

OUTPUT (V)

7808-006

Figure 4. Y-Axis Zero g Bias at 25°C, VS = 3 V

1.42 1.44 1.46 1.48 1.50 1.52 1.54 1.56 1.58

% OF POPULATION

OUTPUT (V)

07808-007

Figure 5. Z-Axis Zero g Bias at 25°C, VS = 3 V

% OF POPULATION

VOLTS (V)

07808-008

–0.40 –0.38 –0.36 –0.34 –0.32 –0.30 –0.28 –0.26

Figure 6. X-Axis Self-Test Response at 25°C, VS = 3 V

% OF POPULATION

VOLTS (V)

07808-009

0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40

Figure 7. Y-Axis Self-Test Response at 25°C, VS = 3 V

% OF POPULATION

VOLTS (V)

07808-010

0.48 0.50 0.52 0.54 0.56 0.58 0.60 0.62

Figure 8. Z-Axis Self-Test Response at 25°C, VS = 3 V

ADXL335

Rev. B | Page 7 of 16

% OF POPULATION

TEMPERATURE COEFFICIENT (mg/°C)

–3.0 –2.5 –2.0 –1.5 –1.0 –0.5 0 0.5 1.0 1.5 2.0 2.5 3.0

07808-011

Figure 9. X-Axis Zero g Bias Temperature Coefficient, VS = 3 V

% OF POPULATION

TEMPERATURE COEFFICIENT (mg/°C)

–3.0 –2.5 –2.0 –1.5 –1.0 –0.5 0 0.5 1.0 1.5 2.0 2.5 3.0

07808-012

Figure 10. Y-Axis Zero g Bias Temperature Coefficient, VS = 3 V

% OF POPULATION

TEMPERATURE COEFFICIENT (mg/°C)

–7–6–5–4–3–2–101234567

7808-013

Figure 11. Z-Axis Zero g Bias Temperature Coefficient, VS = 3 V

1.45

1.46

1.47

1.48

1.49

1.50

1.51

1.52

1.53

1.54

1.55

–40–30–20–100 102030405060708090100

N = 8

TEMPERATURE (°C)

OUTPUT (V)

07808-014

Figure 12. X-Axis Zero g Bias vs. Temperature—

Eight Parts Soldered to PCB

1.45

1.46

1.47

1.48

1.49

1.50

1.51

1.52

1.53

1.54

1.55

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100

N = 8

TEMPERATURE (°C)

OUTPUT (V)

07808-015

Figure 13. Y-Axis Zero g Bias vs. Temperature—

Eight Parts Soldered to PCB

1.30

1.32

1.34

1.36

1.38

1.40

1.42

1.44

1.46

1.48

1.50

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100

N = 8

TEMPERATURE (°C)

OUTPUT (V)

07808-016

Figure 14. Z-Axis Zero g Bias vs. Temperature—

Eight Parts Soldered to PCB

ADXL335

Rev. B | Page 8 of 16

% OF POPULATION

SENSITIVITY (V/g)

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

07808-017

Figure 15. X-Axis Sensitivity at 25°C, VS = 3 V

% OF POPULATION

SENSITIVITY (V/g)

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

7808-018

Figure 16. Y-Axis Sensitivity at 25°C, VS = 3 V

% OF POPULATION

SENSITIVITY (V/g)

0.285 0.288 0.291 0.294 0.297 0.300 0.303 0.306 0.309 0.312 0.315

07808-019

Figure 17. Z-Axis Sensitivity at 25°C, VS = 3 V

0.280

0.285

0.290

0.295

0.300

0.305

0.310

0.315

0.320

–40–30–20–100 102030405060708090100

N = 8

TEMPERATURE (°C)

SENSITIVITY (V/g)

07808-020

Figure 18. X-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, VS = 3 V

0.280

0.285

0.290

0.295

0.300

0.305

0.310

0.315

0.320

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

SENSITIVITY (V/g)

N = 8

07808-021

Figure 19. Y-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, VS = 3 V

0.280

0.285

0.290

0.295

0.300

0.305

0.310

0.315

0.320

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100

TEMPERATURE (°C)

SENSITIVITY (V/g)

N = 8

7808-022

Figure 20. Z-Axis Sensitivity vs. Temperature—

Eight Parts Soldered to PCB, VS = 3 V

ADXL335

Rev. B | Page 9 of 16

SUPPLY (V)

CURRENT (µA)

100

150

200

250

300

350

1.5 2.0 2.5 3.0 3.5 4.0

7808-023

Figure 21. Typical Current Consumption vs. Supply Voltage

TIME (1ms/DIV)

CH4: Z

OUT

500mV/DIV

CH3: Y

OUT

500mV/DIV

CH1: POWER,

1V/DIV

CH2: X

OUT

500mV/DIV

OUTPUTS ARE OFFSET FOR CLARITY

= C

= 0.0047µF

07808-024

Figure 22. Typical Turn-On Time, VS = 3 V

ADXL335

Rev. B | Page 10 of 16

THEORY OF OPERATION

The ADXL335 is a complete 3-axis acceleration measurement

system. The ADXL335 has a measurement range of ±3 g mini-

mum. It contains a polysilicon surface-micromachined sensor

and signal conditioning circuitry to implement an open-loop

acceleration measurement architecture. The output signals are

analog voltages that are proportional to acceleration. The

accelerometer can measure the static acceleration of gravity

in tilt-sensing applications as well as dynamic acceleration

resulting from motion, shock, or vibration.

The sensor is a polysilicon surface-micromachined structure

built on top of a silicon wafer. Polysilicon springs suspend the

structure over the surface of the wafer and provide a resistance

against acceleration forces. Deflection of the structure is meas-

ured using a differential capacitor that consists of independent

fixed plates and plates attached to the moving mass. The fixed

plates are driven by 180° out-of-phase square waves. Acceleration

deflects the moving mass and unbalances the differential capacitor

resulting in a sensor output whose amplitude is proportional to

acceleration. Phase-sensitive demodulation techniques are then

used to determine the magnitude and direction of the

acceleration.

The demodulator output is amplified and brought off-chip

through a 32 kΩ resistor. The user then sets the signal

bandwidth of the device by adding a capacitor. This filtering

improves measurement resolution and helps prevent aliasing.

MECHANICAL SENSOR

The ADXL335 uses a single structure for sensing the X, Y, and

Z axes. As a result, the three axes’ sense directions are highly

orthogonal and have little cross-axis sensitivity. Mechanical

misalignment of the sensor die to the package is the chief

source of cross-axis sensitivity. Mechanical misalignment

can, of course, be calibrated out at the system level.

PERFORMANCE

Rather than using additional temperature compensation circui-

try, innovative design techniques ensure that high performance

is built in to the ADXL335. As a result, there is no quantization

error or nonmonotonic behavior, and temperature hysteresis

is very low (typically less than 3 mg over the −25°C to +70°C

temperature range).

ADXL335

Rev. B | Page 11 of 16

APPLICATIONS INFORMATION

POWER SUPPLY DECOUPLING

For most applications, a single 0.1 µF capacitor, CDC, placed

close to the ADXL335 supply pins adequately decouples the

accelerometer from noise on the power supply. However, in

applications where noise is present at the 50 kHz internal clock

frequency (or any harmonic thereof), additional care in power

supply bypassing is required because this noise can cause errors

in acceleration measurement.

If additional decoupling is needed, a 100 Ω (or smaller) resistor

or ferrite bead can be inserted in the supply line. Additionally, a

larger bulk bypass capacitor (1 µF or greater) can be added in

parallel to CDC. Ensure that the connection from the ADXL335

ground to the power supply ground is low impedance because

noise transmitted through ground has a similar effect to noise

transmitted through VS.

SETTING THE BANDWIDTH USING CX, CY, AND CZ

The ADXL335 has provisions for band limiting the XOUT, YOUT,

and ZOUT pins. Capacitors must be added at these pins to imple-

ment low-pass filtering for antialiasing and noise reduction. The

equation for the 3 dB bandwidth is

F−3 dB = 1/(2π(32 kΩ) × C(X, Y, Z ))

or more simply

F–3 dB = 5 F/C(X, Y, Z)

The tolerance of the internal resistor (RFILT) typically varies as

much as ±15% of its nominal value (32 kΩ), and the bandwidth

varies accordingly. A minimum capacitance of 0.0047 F for CX,

CY, and CZ is recommended in all cases.

Table 4. Filter Capacitor Selection, CX, CY, and CZ

Bandwidth (Hz) Capacitor (μF)

1 4.7

10 0.47

50 0.10

100 0.05

200 0.027

500 0.01

SELF-TEST

The ST pin controls the self-test feature. When this pin is set to

VS, an electrostatic force is exerted on the accelerometer beam.

The resulting movement of the beam allows the user to test if

the accelerometer is functional. The typical change in output

is −1.08 g (corresponding to −325 mV) in the X-axis, +1.08 g

(or +325 mV) on the Y-axis, and +1.83 g (or +550 mV) on the

Z-axis. This ST pin can be left open-circuit or connected to

common (COM) in normal use.

Never expose the ST pin to voltages greater than VS + 0.3 V.

If this cannot be guaranteed due to the system design (for

instance, if there are multiple supply voltages), then a low

VF clamping diode between ST and VS is recommended.

DESIGN TRADE-OFFS FOR SELECTING FILTER

CHARACTERISTICS: THE NOISE/BW TRADE-OFF

The selected accelerometer bandwidth ultimately determines

the measurement resolution (smallest detectable acceleration).

Filtering can be used to lower the noise floor to improve the

resolution of the accelerometer. Resolution is dependent on

the analog filter bandwidth at XOUT, YOUT, and ZOUT.

The output of the ADXL335 has a typical bandwidth of greater

than 500 Hz. The user must filter the signal at this point to

limit aliasing errors. The analog bandwidth must be no more

than half the analog-to-digital sampling frequency to minimize

aliasing. The analog bandwidth can be further decreased to

reduce noise and improve resolution.

The ADXL335 noise has the characteristics of white Gaussian

noise, which contributes equally at all frequencies and is

described in terms of g/√Hz (the noise is proportional to the

square root of the accelerometer bandwidth). The user should

limit bandwidth to the lowest frequency needed by the applica-

tion to maximize the resolution and dynamic range of the

accelerometer.

With the single-pole, roll-off characteristic, the typical noise of

the ADXL335 is determined by

)1.6( ××= BWDensityNoiseNoiserms

It is often useful to know the peak value of the noise. Peak-to-

peak noise can only be estimated by statistical methods. Table 5

is useful for estimating the probabilities of exceeding various

peak values, given the rms value.

Table 5. Estimation of Peak-to-Peak Noise

Peak-to-Peak Value

% of Time That Noise Exceeds

Nominal Peak-to-Peak Value

2 × rms 32

4 × rms 4.6

6 × rms 0.27

8 × rms 0.006

ADXL335

Rev. B | Page 12 of 16

USE WITH OPERATING VOLTAGES OTHER THAN 3 V

The ADXL335 is tested and specified at VS = 3 V; however, it

can be powered with VS as low as 1.8 V or as high as 3.6 V. Note

that some performance parameters change as the supply voltage

is varied.

The ADXL335 output is ratiometric, therefore, the output

sensitivity (or scale factor) varies proportionally to the

supply voltage. At VS = 3.6 V, the output sensitivity is typi-

cally 360 mV/g. At VS = 2 V, the output sensitivity is typically

195 mV/g.

The zero g bias output is also ratiometric, thus the zero g

output is nominally equal to VS/2 at all supply voltages.

The output noise is not ratiometric but is absolute in volts;

therefore, the noise density decreases as the supply voltage

increases. This is because the scale factor (mV/g) increases

while the noise voltage remains constant. At VS = 3.6 V,

the X-axis and Y-axis noise density is typically 120 µg/√Hz,

whereas at VS = 2 V, the X-axis and Y-axis noise density is

typically 270 g/√Hz.

Self-test response in g is roughly proportional to the square of

the supply voltage. However, when ratiometricity of sensitivity

is factored in with supply voltage, the self-test response in volts

is roughly proportional to the cube of the supply voltage. For

example, at VS = 3.6 V, the self-test response for the ADXL335

is approximately −560 mV for the X-axis, +560 mV for the

Y-axis, and +950 mV for the Z-axis.

At VS = 2 V, the self-test response is approximately −96 mV for

the X-axis, +96 mV for the Y-axis, and −163 mV for the Z-axis.

The supply current decreases as the supply voltage decreases.

Typical current consumption at VS = 3.6 V is 375 µA, and typi-

cal current consumption at VS = 2 V is 200 µA.

AXES OF ACCELERATION SENSITIVITY

07808-025

Figure 23. Axes of Acceleration Sensitivity; Corresponding Output Voltage

Increases When Accelerated Along the Sensitive Axis.

OUT

= –1g

OUT

= 0g

OUT

= 0g

GRAVITY

OUT

= 0g

OUT

= 1g

OUT

= 0g

OUT

= 0g

OUT

= –1g

OUT

= 0g

OUT

= 1g

OUT

= 0g

OUT

= 0g

OUT

= 0g

OUT

= 0g

OUT

= 1g

OUT

= 0g

OUT

= 0g

OUT

= –1g

TOP

TOP TOP

TOP

07808-026

Figure 24. Output Response vs. Orientation to Gravity

ADXL335

Rev. B | Page 13 of 16

LAYOUT AND DESIGN RECOMMENDATIONS

The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended

PCB layout or solder land drawing is shown in Figure 26.

07808-002

25°C TO PEAK

PREHEAT

CRITICAL ZONE

TO T

TEMPERATURE

TIME

RAMP-DOWN

RAMP-UP

SMIN

SMAX

Figure 25. Recommended Soldering Profile

Table 6. Recommended Soldering Profile

Profile Feature Sn63/Pb37 Pb-Free

Average Ramp Rate (TL to TP) 3°C/sec max 3°C/sec max

Preheat

Minimum Temperature (TSMIN) 100°C 150°C

Maximum Temperature (TSMAX) 150°C 200°C

Time (TSMIN to TSMAX)(tS) 60 sec to 120 sec 60 sec to 180 sec

TSMAX to TL

Ramp-Up Rate 3°C/sec max 3°C/sec max

Time Maintained Above Liquidous (TL)

Liquidous Temperature (TL) 183°C 217°C

Time (tL) 60 sec to 150 sec 60 sec to 150 sec

Peak Temperature (TP) 240°C + 0°C/−5°C 260°C + 0°C/−5°C

Time Within 5°C of Actual Peak Temperature (tP) 10 sec to 30 sec 20 sec to 40 sec

Ramp-Down Rate 6°C/sec max 6°C/sec max

Time 25°C to Peak Temperature 6 minutes max 8 minutes max

EXPOSED PAD IS NOT

INTERNALLY CONNECTED

BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY.

0.50

MAX

0.65 0.325

1.95

0.65

0.325

0.35

MAX

1.95

DIMENSIONS SHOWN IN MILLIMETERS

07808-004

Figure 26. Recommended PCB Layout

ADXL335

Rev. B | Page 14 of 16

OUTLINE DIMENSIONS

051909-A

0.65

BSC

BOTTOM VIEWTOP VIEW

EXPOSED

PAD

PIN1

INDICATOR

2.55

2.40 SQ

2.25

0.55

0.50

0.45

SEATING

PLANE

1.50

1.45

1.40 0.05 MAX

0.02 NOM

0.15 REF

COPLANARITY

0.08

0.15 MAX

PIN 1

INDICATOR

4.15

4.00 SQ

3.85

0.35

0.30

0.25

COMPLIANT

JEDEC STANDARDS MO-220-WGGD.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_LQ]

4 mm × 4 mm Body, 1.45 mm Thick Quad

(CP-16-14)

Dimensions shown in millimeters

ORDERING GUIDE

Model1 Measurement Range Specified Voltage Temperature Range Package Description Package Option

ADXL335BCPZ ±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14

ADXL335BCPZ–RL ±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14

ADXL335BCPZ–RL7 ±3 g 3 V −40°C to +85°C 16-Lead LFCSP_LQ CP-16-14

EVAL-ADXL335Z Evaluation Board

1 Z = RoHS Compliant Part.

ADXL335

Rev. B | Page 15 of 16

NOTES

ADXL335

Rev. B | Page 16 of 16

NOTES

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registered trademarks are the property of their respective owners.

D07808-0-1/10(B)